Ver 201208 Chip Bead For EMI Suppression CIB32/41 Series (3225/4516 / EIA 1210/1806) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN Perfect shape for automatic mounting, with no directionality. Excellent solderability and high heat resistance for either flow or reflow soldering Monolithic inorganic material construction for high reliability Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. 2.7mm 1.9mm 3.9mm (3225 land Pattern) DIMENSION Type Dimension [mm] L W t d 32 3.20.2 2.50.2 1.30.2 41 4.50.2 1.60.2 1.60.2 0.5+0.3 -0.3 0.5+0.3 -0.3 DESCRIPTION Thickness Impedance DC Resistance Rated Current (mm) ()25%@100MHz () Max. (mA) Max. CIB32P310 1.30.2 31 0.02 3000 CIB32P600 1.30.2 60 0.02 1500 CIB41P800 1.60.2 80 0.03 1000 CIB41P151 1.60.2 150 0.05 1000 Part no. Ver 201208 CHARACTERISTIC DATA Ver 201208 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (6) (7) B (2) 32 (3) P (4) 310 (5) N (6) E (7) Chip Beads (2) M: Multi-layer type B:Mono-layer type Dimension (4) Material Code Nominal impedance (310:31) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Size Packaging Style Quantity(pcs/reel) 3225 Embossed Taping 2,500 4516 Embossed Taping 2,000 NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications.