SY89610L
77.75MHz to 694MHz Jitter Attenuator and
Low Phase Noise Frequency Synthesizer
Precision Edge is a registered trademark of Micrel, Inc.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
July 2008 M9999-071008-D
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General Description
The SY89610L is a 3.3V, fully differential jitter attenuator
and frequency synthesizer that accepts a noise clock
between 19.44MHz and 694MHz, depending on I/O
frequency selection. The output provides an ultra-low
jitter clock frequency between 77.75MHz and 694MHz
covering SONET/SDH, Gigabit Ethernet, Fibre Channel,
SAS, SATA, and many other communication standards.
The output jitter of the SY89610L is typically 1psRMS. It
has a 1kHz to 10kHz programmable loop bandwidth to
accommodate different jitter attenuation applications
and PLL requirements. The auto-tune circuit enables
precision frequency calibration.
The differential input includes Micrel’s unique, 3-pin
input termination architecture that interfaces to LVPECL,
LVDS or CML differential signals, (AC- or DC-coupled)
as small as 100mV without any level-shifting or
termination resistor networks in the signal path. For AC-
coupled input interface applications, an on-board output
reference voltage (VREF-AC) is provided to bias the VT pin.
The outputs are compatible with 400mV typical swing
into 50 loads, with rise/fall times guaranteed to be less
than 250ps.
The SY89610L operates at 3.3V ±10% supply and the
output can accommodate 1.8V to 3.3V operation with
the dedicated output supply. The part is guaranteed to
operate over the full industrial temperature range
(–40°C to +85°C). The SY89610L is part of Micrel’s
Precision Edge® product line.
Datasheets and support documentation can be found on
Micrel’s web site at: www.micrel.com.
Precision Edge®
Features
Accepts high jitter input clock signal and attenuates
it to provide Ultra-Low Jitter and Phase Noise clock
signal at the output
Output Frequency Range: 77.75MHz – 694MHz
Input Frequency Range: 19.44MHz – 694MHz
Phase Noise and Jitter performance:
– <2psRMS Output Jitter Gen (12kHz-20MHz)
– Low Phase Noise: -80dBc/Hz at 1kHz offset
CML compatible output signal
3-pin input accepts an AC- or DC-coupled
differential input (LVDS, LVPECL, and CML)
Unique, Auto-Tune circuitry enables precision
frequency calibration
Internal source termination to minimize round-trip
reflections
Programmable Loop Bandwidth: 1kHz-10kHz
Output Enable/disable function
Only one external component needed for LC VCO
(a filter capacitor)
Includes Loss of Lock (LOL) output pin
Includes Auto-tune Circuit for precision frequency
calibration
1.8V ±5% to 3.3V ±10% output power supply
3.3V ±10% power supply operation
Industrial temperature range: –40°C to +85°C
Available in 32-pin (5mm x 5mm) QFN package
Applications
Covers telecom/datacom/storage standards:
SONET/SDH
GbE and 10GbE LAN PHY (w/FEC)
1/2/4/8G Fibre Channel
High-end routers and switches
Telecom transmission equipment
High speed optical modules
Long haul transport
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Functional Block Diagram
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Ordering Information(1)
Part Number Package
Type Operating
Range Package Marking Lead
Finish
SY89610LMG QFN-32 Industrial SY89610L
with Pb-Free bar-line indicator
NiPdAu
Pb-Free
SY89610LMGTR(2) QFN-32 Industrial SY89610L
with Pb-Free bar-line indicator
NiPdAu
Pb-Free
Notes:
1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC Electricals only.
2. Tape and Reel.
Pin Configur ation
32-Pin QFN
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Pin Description
Pin Number Pin Name Pin Function
2 VT
Input Termination Center-Tap: Each side of the differential input pair terminates to VT pin.
This pin provides a center-tap to a termination network for maximum interface flexibility.
See “Input Interface Applications” subsection.
3 VREF-AC
Reference Output Voltage: This output biases to VDD-1.4V. It is used when AC-coupling
the inputs (IN, /IN). Connect VREF-AC directly to the VT pin. Bypass with 0.01µF low ESR
capacitors to VDD. Maximum current source or sink is ±0.5mA. See “Input Interface
Applications” subsection.
4, 5 REFIN,
/REFIN
Differential Input Pair: This input pair is the differential signal input to the device. Input
accepts AC- or DC-coupled differential signals as small as 100mV (200mVPP). Each pin of
this pair internally terminates with 50 to the VT pin. See Figure 1a.
15 /EN
Single-ended Input: This TTL/CMOS input disables and enables the output. It has an
internal pull-down and will default to a logic LOW state if left open. When HIGH, the
output is forced into the disable state (Q = LOW and /Q = HIGH). The pull-down current
is typically 0.5µA.
8, 9, 18, 23, 24 GND,
Exposed Pad
Ground: These are the ground pins for core and input stage. Exposed pad must be
connected to a ground plane that is the same potential as the ground pin.
12, 13 CLKOUT,
/CLKOUT
CML Differential Output Pair: Differential buffered output copy of the input signal with very
low jitter. The output swing is typically 400mV. The output pair is referenced to VDDO.
Output pair can be terminated 100 across or 50 to VBIAS. See “CML Output
Termination” subsection.
10 GNDO
Ground: This is the ground pin for output stage. GNDO and GND must be connected
together on the PCB.
11, 14 VDDO CML Output Driver Power Pins: VDDO enables the output stage to operate from a lower
supply voltage than the core synthesizer voltage. These outputs can be powered from
1.8V ±5% to 3.3V ±10% power supply. For applications that only require 3.3V reference
output operation, VDDO and VDD pins may be connected to a common power supply.
Connect both VDDO pins to same power supply. Bypass with 0.1µF//0.01µF low ESR
capacitors as close to the VDD pins as possible.
20 RESET
Single-ended Input: Reset is active on the Low-to-High edge of the input pulse. It has an
internal pull-down and will default to a logic LOW state if left open. Resetting the part
starts an auto-tune sequence to provide output frequency closest to input frequency.
Calibration setting is lost on power down. The pull-down current is typically 0.5µA.
19 LOL
Single-ended Output: This LVTTL/CMOS output asserts HIGH when the PLL is out of
phase lock. LOL is asserted if the PLL frequency deviates more than ±1000ppm for more
than 5ms. This prevents false triggering. The Loss of Lock pin can be directly connected
to /EN.
27, 26 FILTERP,
FILTERN
Analog Input: These pins provide reference for PLL loop filter. Connect a LOW ESR
capacitor across these pins as close to the device as possible, clear from any supply lines
or adjacent signal lines. See “External Loop Filter Considerations” for loop filter values.
Loop filter capacitor value depends on I/O frequency selection. Loop filter capacitor
layout should include a quiet ground plane under the loop filter capacitor and loop filter
(FILTP, FILTN) pins. Recommend 1206, X5R, 6.3V ceramic type, ±30%. See “PLL Loop
Filter Capacitor Table”.
31 GNDA
Ground: This is an analog ground pin for the PLL. Connect to “quiet” ground. It is
internally referenced to the VCO. GNDA and Ground must be shorted on the PCB.
25, 28, 29 VDDA Analog Power: Connect to “quiet” 3.3V ±10% power supply. These pins are not internally
connected and must be shorted on the PCB. VDDA internally connects to the VCO.
Bypass with 0.1µF//0.01µF low ESR capacitors as close to the pin as possible
21, 22 BW0, BW1 Single-ended Input: These LVTTL/CMOS inputs determine the loop bandwidth of the jitter
reducing PLL. BWSEL0 and BWSEL1 will default to a logic HIGH state if left open with a
typical pull-up current of 1.3µA. See “Loop Bandwidth Table.”
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Pin Description
Pin Number Pin Name Pin Function
7, 30, 32 FRQSEL0
FRQSEL1
FRQSEL2
Single-ended Input: These LVTTL/CMOS inputs program internal pre- and post-dividers
to determine the I/O synthesis multiplication factor. Each FrqSel has three logic states,
HIGH, LOW, and Float. These pins will default to a mid-rail (float) state (VDD/2) if left
open. These inputs have a pull-up resistor of 180k-to-VDD and a pull-down resistor of
180k-to-GND. See “I/O Frequency Table” for more details.
16, 17 NC No Connect. Solder pins to floating pads.
1, 6 VDDC Positive Power Supply: VDDC pins are connected to core and input stage that connects
to a 3.3V ±10% power supply. Bypass with 0.1uF//0.01uF low ESR capacitors as close to
the VCC pins as possible.
BW1 BW0 Nominal Loop Bandwidth (Hz)
0 0 1k
0 1 2k
1 0 5k
1 1 10k
Table 1. Loop Bandwidth Table
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Input
Frequency
(MHz)
Output
Frequency
(MHz)
FRQSEL2 FRQSEL1 FRQSEL0 P N M Input
Min. Input
Max. Output
Min. Output
Max. Mult.
78 78 0 0 0 1 16 1 77.75 86.75 77.75 86.75 1
78 155 0 0 Float 1 8 2 77.75 86.75 155.5 173.5 2
78 311 0 0 1 1 4 4 77.75 86.75 311 347 4
78 622 0 Float 0 1 2 8 77.75 86.75 622 694 8
155 155 0 Float 1 2 8 2 155.5 173.5 155.5 173.5 1
155 311 0 1 0 2 4 4 155.5 173.5 311 347 2
155 622 0 1 Float 2 2 8 155.5 173.5 622 694 4
311 311 Float 0 1 4 4 4 311 347 311 347 1
311 622 Float Float 0 4 2 8 311 347 622 694 2
622 622 Float 1 Float 8 2 8 622 694 622 694 1
19 78 1 0 0 1 16 4 19.44 21.69 77.75 86.75 4
19 155 1 0 Float 1 8 8 19.44 21.69 155.5 173.5 8
19 311 1 0 1 1 4 16 19.44 21.69 311 347 16
19 622 1 Float 0 1 2 32 19.44 21.69 622 694 32
Table 2. I/O Frequency Table
Input Frequency = 78MHz, 155MHz, 311MHz, 622MHz
BW Code 00 01 10 11
BW (kHz) 1 2 5 10
Cext (uF) 4.7 1 0.22 0.15
Input Frequency = 19MHz
BW Code 00 01 10 11
BW (kHz) 1 2 5 10
Cext (uF) 1 0.33 0.15 0.033
Table 3. PLL Loop Filter Capacitor Tables
Offset/loop BW 1kHz 2kHz 5kHz 10kHz
100Hz offset -50 -55 -70 -75 dBc/Hz
1kHz offset -65 -65 -75 -80 dBc/Hz
10kHz offset -90 -90 -90 -90 dBc/Hz
100kHz offset -115 -110 -110 -115 dBc/Hz
Table 4. Typical Phase Noise Performance (622MHz Input, 622MHz Output)
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Absolute Maximum Ratings(1)
Supply Voltage (VDDA,, VDD, VDDO)............. –0.5V to +4.0V
Input Voltage (VIN) ..........................–0.5V to VDDC + 0.4V
CML Output Voltage (VOUT).............-0.5V to VDDO + 0.4V
CML Output Current (IOUT)
Continuous.......................................................50mA
Surge .............................................................100mA
Current (VT)
Source or sink on VT pin .............................±100mA
Input Current
Source or sink Current on (Ref-IN, /Ref-IN) ..±50mA
Current (VREF)
Source or sink current on VREF-AC
(2) ..............±1.5mA
Maximum Junction Temperature........................... 125°C
Lead Temperature (soldering, 20sec.) .................. 260°C
Storage Temperature (Ts) ....................–65°C to +150°C
ESD (Human Body Model)....................................2000V
Operating Ratings(3)
Supply Voltage (VDDA, VDD) .................+3.0V to +3.60V
Output Supply Voltage (VDDO) ..........+1.71V to +3.60V
Ambient Temperature (TA) ..................–40°C to +85°C
Package Thermal Resistance(4)
QFN
Still-air (θJA) ...........................................35°C/W
Junction-to-board (ψJB)...........................20°C/W
DC Electrical Characteristics(5)
VDD = 3.3V + 10%, GND = 0V; TA = –40°C to +85°C, RL is 100 across the output pair, unless otherwise stated.
Symbol Parameter Condition Min Typ Max Units
VDD Power Supply Voltage Range 3.0 3.3 3.6 V
VDDO Output Voltage Range 1.71 3.6 V
IDDT Total Supply Current No load
Max. VDD, VDDO, VDDA
Max. Frequency
85 120 mA
RDIFF_IN Differential Input Resistance
(Ref-IN-to-/Ref-IN)
85 100 115
VIH Input HIGH Voltage
(Ref-IN-to-/Ref-IN) Ref-IN, /Ref-IN 1.2 VCC V
VIL Input LOW Voltage
(Ref-IN, /Ref-IN) Ref-IN, /Ref-IN 0 VIH–0.1 V
VIN Input Voltage Swing
(Ref-IN, /Ref-IN)
Note 6 0.1 1.7 V
VDIFF_IN Differential Input Voltage Swing
(|Ref-IN – /Ref-IN|)
0.2 V
VREF-AC Output Reference Voltage VDD–1.5 VDD–1.4 VDD–1.3 V
VT_IN Voltage from Input to VT 1.28 V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for
extended periods may affect device reliability.
2. Due to the limited drive capability, use for input of the same package only.
3. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. ψJB and θJA
values are determined for a 4-layer board in still-air number, unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. VIN (max) is specified when VT is floating.
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CML Output DC Electrical Characteristics(7)
VDDA, VDD =+3.3V ±10%, VDDO = +1.71V to 3.6V, GND and GNDO = 0V, RL = 100 across the outputs; TA = –40°C to
+85°C, unless otherwise stated.
Symbol Parameter Condition Min Typ Max Units
VOH Output HIGH Voltage RL = 50 to VDDO V
DDO-0.13 VDDO-0.085 VDDO-0.04 V
VOL Output LOW Voltage RL = 50 to VDDO V
DDO-0.63 VDDO-0.485 VDDO-0.34 V
VOUT Output Voltage Swing See Figure 3a 300 400 500 mV
VDIFF_OUT Differential Output Voltage Swing See Figure 3b 600 800 1000 mV
ROUT Output Source Impedance 40 50 60
LVTTL/CMOS DC Electrical Characteristics(7)
VDDC = 3.3V ±10%, GND = 0V, TA = –40°C to + 85°C, unless otherwise stated.
Symbol Parameter Condition Min Typ Max Units
VIH Input HIGH Voltage 2.5 V
VIL Input LOW Voltage 0.8 V
VOH Output High Voltage IOH/IOL < 4 mA 2.7 V
VOL Output Low Voltage IOH/IOL < 4 mA 0.2 V
IIH Input HIGH Current -1 3 µA
IIL Input LOW Current -5 1 µA
FREQSEL DC Electrical Characteristics(7)
VDDC = 3.3V ±10%, GND = 0V, TA = –40°C to + 85°C, unless otherwise stated.
Symbol Parameter Condition Min Typ Max U
nit
s
VIH Input HIGH Voltage 2.5 V
VIL Input LOW Voltage 0.8 V
VOH Output High Voltage IOH/IOL < 4 mA 2.7 V
VOL Output Low Voltage IOH/IOL < 4 mA 0.2 V
VIM Input MID Voltage Vdd/2 – 0.1 Vdd/2 Vdd/2 + 0.1 V
IIH Input HIGH Current 5 50 µA
IIL Input LOW Current -50 -5 µA
Notes:
7. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
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AC Electrical Characteristics
VDDA, VDDC =+3.3V ±10%, GND and GNDO = 0V, RL = 100 across the outputs; Input tr/tf < 400ps; TA = –40°C to
+85°C, unless otherwise stated.
Symbol Parameter Condition Min Typ Max Units
fIN Input Frequency Range VIN > 100mV
Clock
19.44 694 MHz
fOUT Output Frequency Range VOUT > 200mV
Clock
77.75 694 MHz
fVCO Internal VCO frequency 1244 1388 MHz
LOL Maximum I/O frequency PLL out of Lock, ~4ms sustained
I/O difference
-1000 1000 ppm
I/O frequency = 155MHz 450 ms TLOCK Acquisition Lock Time(8)
Max VCO frequency 550 ms
REFIN
tr, tf
Input Rise/Fall Times
20% to 80% 400 ps
CLKOUT
tr, tf
Output Rise/Fall Times
20% to 80% 110 160 250
ps
RefIn
CDuty Input Duty Cycle 40 60 %
CLKOut
CDuty Output Duty Cycle 48 50 52 %
BW1 = 0, BW0 = 0 750 1000 1250 Hz
BW1 = 0, BW0 = 1 1500 2000 2500 Hz
BW1 = 1, BW0 = 0 3750 5000 6250 Hz
BW Loop Bandwidth, locked
BW1 = 1, BW0 = 1 7500 10000 12500 Hz
Notes:
8. Reset Low-to-High to LOL High-to-Low.
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Jitter Characteristics(9)
VDDA, VDD =+3.3V ±10%, GND= 0V, RL = 100 across the outputs; Input tr/tf < 400ps; TA = –40°C to +85°C, unless
otherwise stated. Contact factory for 1kHz and 2kHz Loop Bandwidth Transfer Characteristics.
BW Setting: 1kHz, BW1:0 = 00
Symbol Parameter Condition Min Typ Max Units
12kHz to 20MHz
(Ideal ref input and supply) 1 2
JGen CLKOUT RMS Jitter Generation
50kHz to 80MHz
(Ideal ref input and supply) 1 2
psRMS
JTOL Jitter Tolerance 10 ns
FBW Jitter Transfer Bandwidth LBW = 1kHz 1000 Hz
JP Jitter Peaking <1kHz 0.1 dB
BW Setting: 2kHz, BW1:0 = 01
Symbol Parameter Condition Min Typ Max Units
JGen CLKOUT RMS Jitter Generation 12kHz to 20MHz
(Ideal ref input and supply)
1 2
psRMS
50kHz to 80MHz
(Ideal ref input and supply) 1 2
JTOL Jitter Tolerance 10 ns
FBW Jitter Transfer Bandwidth LBW = 2kHz 2000 Hz
JP Jitter Peaking <1kHz 0.1 dB
BW Setting: 5kHz, BW1:0 = 10
Symbol Parameter Condition Min Typ Max Units
JGen CLKOUT RMS Jitter Generation 12kHz to 20MHz
(Ideal ref input and supply)
1 2
psRMS
50kHz to 80MHz
(Ideal ref input and supply)
1 2
JTOL Jitter Tolerance 10 ns
FBW Jitter Transfer Bandwidth LBW = 5kHz 5000 Hz
JP Jitter Peaking <1kHz 0.1 dB
BW Setting: 10kHz, BW1:0 = 11
Symbol Parameter Condition Min Typ Max Units
JGen CLKOUT RMS Jitter Generation 12kHz to 20MHz
(Ideal ref input and supply)
1 2
psRMS
50kHz to 80MHz
(Ideal ref input and supply)
1 2
JTOL Jitter Tolerance 10 ns
FBW Jitter Transfer Bandwidth LBW = 10kHz 10,000 Hz
JP Jitter Peaking <1kHz 0.1 dB
Note:
9. 5k and 10k loop bandwidth settings are recommended due to better jitter performance with jitter bandwidth below 12K Hz. The use of 1k and
2k bandwidth settings may be acceptable in certain applications where jitter bandwidth is limited to above 12K Hz. Please contact the factory for
additional information.
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Functional Description
Overall Function
The SY89610L is designed to accept a high-jitter signal
and provide an ultra-low jitter and ultra-low phase noise
CML compatible clock signal. Unlike normal buffers, the
SY89610L is a jitter attenuator since it does not transfer
jitter across from input to output. This makes this
product an ideal solution for precision clock applications.
LC Voltage Control Oscillator (VCO)
The SY89610L uses an extremely low phase noise VCO
to prevent jitter at the output. At low frequencies, the
PLL produces more phase noise. To offset the noise,
the LC VCO provides an extremely low phase noise
signal that feeds to the output circuit. Unlike many
competitive VCOs, this VCO only requires a single
external component, which is a filter capacitor.
External Loop Filter Considerations
The SY89610L features an external PLL loop filter that
allows the user to tailor the PLLs behavior. It is
recommended that ceramic capacitors with NOP or X7R
dielectric be used because they have very low effective
series resistance. All other filter components are on-
chip. Internally, the filter has a resistor in series with the
external capacitor and a much smaller capacitor in
parallel with the series combination of the internal
resistor and external capacitor. The selectable PLL
bandwidths from 1kHz-to-10kHz allows the user to
select between different loop filter values. The external
capacitor must be placed as close to the device pins as
possible. While laying out the board, keep any supply or
signal traces lines away from the capacitor. Loop filter
capacitor layout should include a quiet ground plane
under the loop filter capacitor and loop filter pins.
Power Supply Filtering Techniques
As with any high-speed integrated circuit, power supply
filtering is very important. At a minimum, VDDA, VDD,
and all VDDO pins should be individually connected
using via to the power supply plane, and separate
bypass capacitors should be used for each pin. To
achieve optimal jitter performance, each power supply
pin should use separate instances of the circuit shown in
Power Supply Scheme below.
Power Supply Scheme
Jitter Generation
Jitter generation is the amount of jitter generated by the
part at the output when there is no jitter present at the
input clock. While the VCO and PLL are sources of jitter
in a synthesizer, the different loop bandwidth options aid
in reducing jitter. The SY89610L guarantees less than
2psRMS. See Jitter characteristics subsection.
Phase Noise
The SY89610L has very low phase noise at 1kHz offset
from the center frequency. Phase noise is measured at
the output with a jitter-free signal injected at the input.
The loop bandwidth settings have a minor impact on the
phase noise values. For 10kHz loop bandwidth, we
guarantee the phase noise less than -80dBc/Hz. See
Phase Noise curve.
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Phase Noise Characteristics
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Input and Output Stage
Figure 1a. Simplified Differential Input Buffer
Figure 1b. Simplified CML Output Buffer
Single-Ended and Differential Swings
Figure 2a. Single-Ended Swing
Figure 2b. Differential Swing
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Input Interface Applications
Figure 3a. CML Interface
(DC-Coupled)
Option: May connect VT to VCC
Figure 3b. CML In terface
(AC-Coupled)
Figure 3c. LVPECL Interface
(DC-Coupled)
Figure 3d. LVPECL Interface
(AC-Coupled)
Figure 3e. LVDS Interface
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CML Output Termination
Figure 4a. CML DC-Coupled Termination
Figure 4b. CML DC-Coupled Termination
Figure 4c. CML AC-Coupled Termination
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Package Information
32-Pin (5mm x 5mm) QFN
Packages Notes:
1. Package meets Level 2 Moisture Sensitivity Classification.
2. All parts are dry-packed before shipment.
3. Exposed pad must be soldered to ground for proper thermal management
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PCB Thermal Consideration for 32-pin QFN Package
(Always solder, or eq uivalent, the exposed p ad to the PCB)
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http:/www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its
use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a
product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for
surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury
to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and
Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale.
© 2008 Micrel, Incorporated.