Wireless Components ASK/FSK 915MHz Single Conversion Receiver TDA 5212 Version 1.3 Specification December 2006 Revision History Current Version: 1.3 as of 12.12.06 Previous Version: 1.2 Page (in previous Version) Page (in current Version) Subjects (major changes since last revision) 3-4, 5-12 3-4, 5-12 Correction of some typing mistakes Product Info, 2-3 Product Info, 2-3 Change of package name to PG-TSSOP-28 ABM(R), AOP(R), ARCOFI(R), ARCOFI(R)-BA, ARCOFI(R)-SP, DigiTape(R), EPIC(R)-1, EPIC(R)-S, ELIC(R), FALC(R)54, FALC(R)56, FALC(R)-E1, FALC(R)-LH, IDEC(R), IOM(R), IOM(R)-1, IOM(R)-2, IPAT(R)-2, ISAC(R)-P, ISAC(R)-S, ISAC(R)-S TE, ISAC(R)-P TE, ITAC(R), IWE(R), MUSAC(R)-A, OCTAT(R)-P, QUAT(R)-S, SICAT(R), SICOFI(R), SICOFI(R)2, SICOFI(R)-4, SICOFI(R)-4C, SLICOFI(R) are registered trademarks of Infineon Technologies AG. ACETM, ASMTM, ASPTM, POTSWIRETM, QuadFALCTM, SCOUTTM are trademarks of Infineon Technologies AG. Edition 12.06 Published by Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg (c) Infineon Technologies AG December 2006. All Rights Reserved. Attention please! As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies AG is an approved CECC manufacturer. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components1 of the Infineon Technologies AG, may only be used in life-support devices or systems2 with the express written approval of the Infineon Technologies AG. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that lifesupport device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. TDA 5212 Product Info Product Info General Description Features Application The IC is a very low power consump- Package tion single chip FSK/ASK Superheterodyne Receiver (SHR) for the receive frequency range between 902 and 928 MHz that is pin compatible to the ASK Receiver TDA5202. The IC offers a high level of integration and needs only a few external components. The device contains a low noise amplifier (LNA), a double balanced mixer, a fully integrated VCO, a PLL synthesiser, a crystal oscillator, a limiter with RSSI generator, a PLL FSK demodulator, a data filter, a data comparator (slicer) and a peak detector. Additionally there is a power down feature to save battery life. Low supply current (Is = 5.4 mA typ. in FSK mode, Is = 4.8 mA typ. in ASK mode) Supply voltage range 5 V 10% Power down mode with very low supply current (90 nA typ.) FSK and ASK demodulation capability Fully integrated VCO and PLL Synthesiser ASK sensitivity better than -109 dBm over specified temperature range (- 40 to +85C) Keyless Entry Systems Remote Control Systems Receive frequency range 902 to 928 MHz Limiter with RSSI generation, operating at 10.7 MHz Selectable reference frequency 2nd order low pass data filter with external capacitors Data slicer with self-adjusting threshold FSK sensitivity better than -102 dBm over specified temperature range (- 40 to +85C) Low Bitrate ISM-band Communication Systems Ordering Information Type Ordering Code Package TDA 5212 SP000013430 PG-TSSOP-28 samples available Wireless Components Product Info Specification, December 2006 1 Table of Contents 1 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-i 2 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 2.2 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 2.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 2.4 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 3.1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 3.2 Pin Definition and Function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 3.3 Functional Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9 3.4 Functional Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10 3.4.1 Low Noise Amplifier (LNA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10 3.4.2 Mixer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10 3.4.3 PLL Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10 3.4.4 Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11 3.4.5 Limiter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11 3.4.6 FSK Demodulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11 3.4.7 Data Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12 3.4.8 Data Slicer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12 3.4.9 Peak Detector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12 3.4.10 Bandgap Reference Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13 4 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 4.1 Choice of LNA Threshold Voltage and Time Constant. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 4.2 Data Filter Design. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4 4.3 Crystal Load Capacitance Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5 4.4 Crystal Frequency Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6 4.5 Data Slicer Threshold Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7 4.6 ASK/FSK Switch Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8 4.6.1 FSK Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8 4.6.2 ASK Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10 4.7 Principle of the Precharge Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11 5 Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 5.1 Electrical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 5.1.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 5.1.2 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 5.1.3 AC/DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4 5.2 Test Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9 5.3 Test Board Layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10 5.4 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12 6 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-i 7 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-i 2 Product Description Contents of this Chapter 2.1 2.2 2.3 2.4 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 TDA 5212 Product Description 2.1 Overview The IC is a very low power consumption single chip FSK/ASK Superheterodyne Receiver (SHR) for receive frequencies between 902 and 928 MHz that is pin compatible to the ASK Receiver TDA5202. The IC offers a high level of integration and needs only a few external components. The device contains a low noise amplifier (LNA), a double balanced mixer, a fully integrated VCO, a PLL synthesiser, a crystal oscillator, a limiter with RSSI generator, a PLL FSK demodulator, a data filter, a data comparator (slicer) and a peak detector. Additionally there is a power down feature to save battery life. 2.2 Application Keyless Entry Systems Remote Control Systems Low Bitrate ISM-band Communication Systems 2.3 Features Wireless Components Low supply current (Is = 5.4 mA typ.FSK mode, 4.8 mA typ. ASK mode) Supply voltage range 5V 10% Power down mode with very low supply current (90nA typ.) FSK and ASK demodulation capability Fully integrated VCO and PLL Synthesiser RF input sensitivity ASK -112dBm typ. at 25C, better than -109dBm over complete specified operating temperature range (-40 to +85C) RF input sensitivity FSK -105dBm typ. at 25C, better than -102dBm over complete specified operating temperature range (-40 to +85C) Receive frequency range between 902 and 928 MHz Selectable reference frequency Limiter with RSSI generation, operating at 10.7MHz 2nd order low pass data filter with external capacitors Data slicer with self-adjusting threshold 2-2 Specification, December 2006 TDA 5212 Product Description 2.4 Package Outlines P_TSSOP_28.EPS Figure 2-1 Wireless Components PG-TSSOP-28 package outlines 2-3 Specification, December 2006 3 Functional Description Contents of this Chapter 3.1 3.2 3.3 3.4 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Pin Definition and Function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 Functional Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9 Functional Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10 TDA 5212 Functional Description 3.1 Pin Configuration CRST1 1 28 CRST2 VCC 2 27 PDWN LNI 3 26 PDO TAGC 4 25 DATA AGND 5 24 3VOUT LNO 6 23 THRES VCC 7 22 FFB MI 8 21 OPP MIX 9 20 SLN AGND 10 19 SLP FSEL 11 18 LIMX IFO 12 17 LIM DGND 13 16 CSEL VDD 14 15 MSEL TDA 5212 Pin_Configuration_5212_V1.0.wmf Figure 3-1 Wireless Components IC Pin Configuration 3-2 Specification, December 2006 TDA 5212 Functional Description 3.2 Pin Definition and Function Table 3-1 Pin Definition and Function Pin No. Symbol 1 CRST1 Equivalent I/O-Schematic Function External Crystal Connector 1 4.15V 1 50uA 2 VCC 5V Supply 3 LNI LNA Input 57uA 3 500uA 4k 1k Wireless Components 3-3 Specification, December 2006 TDA 5212 Functional Description 4 TAGC AGC Time Constant Control 4.3V 4.2uA 4 1k 1.5uA 1.7V 5 AGND 6 LNO Analogue Ground Return LNA Output 5V 5V 1k 1k 6 6 7 VCC 8 MI 5V Supply Mixer Input 1.7V 2k 9 2k MIX Complementary Mixer Input 8 9 400uA 10 AGND Analogue Ground Return 11 BUF Mixer Buffer Ground Wireless Components 3-4 Specification, December 2006 TDA 5212 Functional Description 12 IFO 10.7 MHz IF Mixer Output 300uA 2.2V 60 12 4.5k 13 DGND 14 VDD 15 MSEL Digital Ground Return 300uA 5V Supply (PLL Counter Circuitry) 2.2V ASK/FSK Modulation Format Selector 60 12 1.2V 4.5k 3.6k 15 16 CSEL 7.xx or 14.xx MHz Quartz Selector 1.2V 80k 16 Wireless Components 3-5 Specification, December 2006 TDA 5212 Functional Description 17 LIM Limiter Input 2.4V 15k 17 18 LIMX Complementary Limiter Input 75uA 330 18 15k 19 SLP Data Slicer Positive Input 15uA 100 3k 19 80A 20 SLN Data Slicer Negative Input 5uA 10k 20 Wireless Components 3-6 Specification, December 2006 TDA 5212 Functional Description 21 OPP OpAmp Noninverting Input 5uA 200 21 22 FFB Data Filter Feedback Pin 5uA 100k 22 23 THRES AGC Threshold Input 5uA 10k 23 24 3VOUT 3V Reference Output 24 20k 3.1V Wireless Components 3-7 Specification, December 2006 TDA 5212 Functional Description 25 DATA Data Output 500 25 40k 26 PDO Peak Detector Output 200 26 27 PDWN Power Down Input 27 220k 220k 28 CRST2 External Crystal Connector 2 4.15V 28 50uA Wireless Components 3-8 Specification, December 2006 TDA 5212 Functional Description 3.3 Functional Block Diagram VCC IF Filter MSEL LNO MI 6 LNI RF 3 MIX 8 9 IFO LIM 12 FFB LIMX 17 18 15 OPP 22 SLP 21 SLN 19 20 LNA + FSK - ASK + - TAGC FSK PLL Demod SLICER + + LIMITER OP 25 DATA 4 PEAK 26 PDO DETECTOR TDA 5212 OTA BUF VCC VCO : 128 / 64 DET UREF CRYSTAL OSC AGC Reference 23 THRES 24 3VOUT 14 Bandgap Reference Loop Filter DGND 13 2,7 5,10 VCC AGND 11 BUF 16 1 28 27 PDWN CSEL Crystal Functional_diagram_5212.wmf Figure 3-2 Wireless Components Main Block Diagram 3-9 Specification, December 2006 TDA 5212 Functional Description 3.4 Functional Blocks 3.4.1 Low Noise Amplifier (LNA) The LNA is an on-chip cascode amplifier with a voltage gain of 15 to 20dB. The gain figure is determined by the external matching networks situated ahead of LNA and between the LNA output LNO (Pin 6) and the Mixer Inputs MI and MIX (Pins 8 and 9). The noise figure of the LNA is approximately 2dB, the current consumption is 500A. The gain can be reduced by approximately 18dB. The switching point of this AGC action can be determined externally by applying a threshold voltage at the THRES pin (Pin 23). This voltage is compared internally with the received signal (RSSI) level generated by the limiter circuitry. In case that the RSSI level is higher than the threshold voltage the LNA gain is reduced and vice versa. The threshold voltage can be generated by attaching a voltage divider between the 3VOUT pin (Pin 24) which provides a temperature stable 3V output generated from the internal bandgap voltage and the THRES pin as described in Section 4.1. The time constant of the AGC action can be determined by connecting a capacitor to the TAGC pin (Pin 4) and should be chosen along with the appropriate threshold voltage according to the intended operating case and interference scenario to be expected during operation. The optimum choice of AGC time constant and the threshold voltage is described in Section 4.1. 3.4.2 Mixer The Double Balanced Mixer downconverts the input frequency (RF) in the range of 902 to 928 MHz to the intermediate frequency (IF) at 10.7MHz with a voltage gain of approximately 18 dB. A low pass filter with a corner frequency of 20MHz is built on chip in order to suppress RF signals to appear at the IF output ( IFO pin). The IF output is internally consisting of an emitter follower that has a source impedance of approximately 330 to facilitate interfacing the pin directly to a standard 10.7MHz ceramic filter without additional matching circuitry. 3.4.3 PLL Synthesizer The Phase Locked Loop synthesiser consists of a VCO, an asynchronous divider chain, a phase detector with charge pump and a loop filter and is fully implemented on-chip. The VCO is including spiral inductors and varactor diodes. The oscillator signal is fed both to the synthesiser divider chain and to the downconverting mixer via a buffer amplifier. The BUF pin (Pin 11) has to be tied to ground. No additional components are necessary. The loop filter is also realised fully on-chip. Using high side injection of the local oscillator (L0) for receiving frequencies below 921MHz and low side injection for frequencies above 921MHz, the receiving frequency band of 902 to 928MHz can be covered due to the L0 fre- Wireless Components 3 - 10 Specification, December 2006 TDA 5212 Functional Description quency band of 910 to 932MHz. But please note that using high side injetion of the L0 yields a sign inversion of the demodulated data signal in case of FSK. See also Section 4.4. 3.4.4 Crystal Oscillator The on-chip crystal oscillator circuitry allows for utilisation of quartzes both in the 7 and 14MHz range as the overall division ratio of the PLL can be switched between 64 and 128 via the CSEL (Pin 16 ) pin according to the following table. Table 3-2 CSEL Pin Operating States CSEL Crystal Frequency Open 7.xx MHz Shorted to ground 14.xx MHz The calculation of the value of the necessary quartz load capacitance is shown in Section 4.3, the quartz frequency calculation is expained in Section 4.4. 3.4.5 Limiter The Limiter is an AC coupled multistage amplifier with a cumulative gain of approximately 80dB that has a bandpass-characteristic centred around 10.7MHz. It has an input impedance of 330 to allow for easy interfacing to a 10.7MHz ceramic IF filter. The limiter circuit acts as a Receive Signal Strength Indicator (RSSI) generator which produces a DC voltage that is directly proportional to the input signal level as can be seen in Figure 4.2. This signal is used to demodulate the ASK receive signal in the subsequent baseband circuitry and to turn down the LNA gain by approximately 18dB in case the input signal strength is too strong as described in Section 3.4.1 and Section 4.1. 3.4.6 FSK Demodulator To demodulate frequency shift keyed (FSK) signals a PLL circuit is used that is contained fully on chip. The Limiter output differential signal is fed to the linear phase detector as is the output of the 10.7MHz center frequency VCO. The demodulator gain is typically 200V/kHz. The passive loop filter output that is comprised fully on chip is fed to both the VCO and the modulation format switch.This signal is representing the demodulated signal. This switch is actually a switchable amplifier with an AC gain of 11 that is controlled by the MSEL Wireless Components 3 - 11 Specification, December 2006 TDA 5212 Functional Description pin (Pin 15) as shown in the following table. This gain was chosen to facilitate detection in the subsequent circuits. Table 3-3 MSEL Pin Operating States MSEL Modulation Format Open ASK Shorted to ground FSK The DC gain is 1 in order not to saturate the subsequent Data Filter wih the DC offset produced by the demodulator in case of large frequency offsets of the IF signal. The resulting frequency characteristic and details on the principle of operation of the switch are described in Section 4.6. The demodulator circuit is switched off in case of reception of ASK signals. 3.4.7 Data Filter The data filter comprises an OP-Amp with a bandwidth of 100kHz used as a voltage follower and two 100k on-chip resistors. Along with two external capacitors a 2nd order Sallen-Key low pass filter is formed. The selection of the capacitor values is described in Section 4.2. 3.4.8 Data Slicer The data slicer is a fast comparator with a bandwidth of 100 kHz. This allows for a maximum receive data rate of approximately 120kBaud. The maximum achievable data rate also depends on the IF Filter bandwidth and the local oscillator tolerance values. Both inputs are accessible. The output delivers a digital data signal (CMOS-like levels) for the detector. The self-adjusting threshold on pin 20 its generated by RC-term or peak detector depending on the baseband coding scheme. The data slicer threshold generation alternatives are described in more detail in Section 4.5. 3.4.9 Peak Detector The peak detector generates a DC voltage which is proportional to the peak value of the receive data signal. An external RC network is necessary. The input is connected to the output of the RSSI-output of the Limiter, the output is connected to the PDO pin (Pin 26 ). This output can be used as an indicator for the received signal strength to use in wake-up circuits and as a reference for the data slicer in ASK mode. Note that the RSSI level is also output in case of FSK mode. Wireless Components 3 - 12 Specification, December 2006 TDA 5212 Functional Description 3.4.10 Bandgap Reference Circuitry A Bandgap Reference Circuit provides a temperature stable reference voltage for the device. A power down mode is available to switch off all subcircuits which is controlled by the PWDN pin (Pin 27) as shown in the following table. The supply current drawn in this case is typically 90nA. Table 3-4 PDWN Pin Operating States PDWN Operating State Open or tied to ground Powerdown Mode Receiver On Tied to Vs Wireless Components 3 - 13 Specification, December 2006 4 Applications Contents of this Chapter 4.1 4.2 4.3 4.4 4.5 4.6 4.7 Choice of LNA Threshold Voltage and Time Constant . . . . . . . . . . . . 4-2 Data Filter Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4 Crystal Load Capacitance Calculation . . . . . . . . . . . . . . . . . . . . . . . . 4-5 Crystal Frequency Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6 Data Slicer Threshold Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7 ASK/FSK Switch Functional Description . . . . . . . . . . . . . . . . . . . . . . 4-8 Principle of the Precharge Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11 TDA 5212 Applications 4.1 Choice of LNA Threshold Voltage and Time Constant In the following figure the internal circuitry of the LNA automatic gain control is shown. R1 R2 Uthr e s h o ld Pins: 23 24 RSSI (0.8 - 2.8V) 20k VCC OTA +3.1 V Ilo ad LNA Gain control voltage RSSI > Uthr e s h o ld : Iloa d =4.2A RSSI < Uthr e s h o ld : Iloa d = -1.5A 4 UC C Uc :< 2.6V : Gain high Uc :> 2.6V : Gain low Uc max = VC C - 0.7V Uc min = 1.67V LNA_autom.wmf Figure 4-1 LNA Automatic Gain Control Circuitry The LNA automatic gain control circuitry consists of an operational transimpedance amplifier that is used to compare the received signal strength signal (RSSI) generated by the Limiter with an externally provided threshold voltage Uthres. As shown in the following figure the threshold voltage can have any value between approximately 0.8 and 2.8V to provide a switching point within the receive signal dynamic range. This voltage Uthres is applied to the THRES pin (Pin 23) The threshold voltage can be generated by attaching a voltage divider between the 3VOUT pin (i.e. Pin 24) which provides a temperature stable 3V output generated from the internal bandgap voltage and the THRES pin. If the RSSI level generated by the Limiter is higher than Uthres, the OTA generates a positive current Iload. This yields a voltage rise on the TAGC pin (Pin 4). Otherwise, the OTA generates a negative current. These currents do not have the same values in order to achieve a fast-attack and slow-release action of the AGC and are used to charge an external capacitor which finally generates the LNA gain control voltage. Wireless Components 4-2 Specification, December 2006 TDA 5212 Applications LNA always in high gain mode 3 2 RSSI Level Range UTHRES Voltage Range 2.5 RSSI Level 1.5 1 LNA always in low gain mode 0.5 0 -120 -110 -100 -90 -80 -70 -60 -50 -40 -30 Input Level at LNA Input [dBm] RSSI-AGC.wmf Figure 4-2 RSSI Level and Permissive AGC Threshold Levels The switching point should be chosen according to the intended operating scenario. The determination of the optimum point is described in the accompanying Application Note, a threshold voltage level of 1.8V is apparently a viable choice. It should be noted that the output of the 3VOUT pin is capable of driving up to 50A, but that the THRES pin input current is only in the region of 40nA. As the current drawn out of the 3VOUT pin is directly related to the receiver power consumption, the power divider resistors should have high impedance values. The sum of R1 and R2 has to be 600k in order to yield 3V at the 3VOUT pin. R1 can thus be chosen as 240k, R2 as 360k to yield an overall 3VOUT output current of 5A1 and a threshold voltage of 1.8V Note: If the LNA gain shall be kept in either high or low gain mode this has to be accomplished by tying the THRES pin to a fixed voltage. In order to achieve high gain mode operation, a voltage higher than 2.8V shall be applied to the THRES pin, such as a short to the 3VOLT pin. In order to achieve low gain mode operation a voltage lower than 0.7V shall be applied to the THRES, such as a short to ground. As stated above the capacitor connected to the TAGC pin is generating the gain control voltage of the LNA due to the charging and discharging currents of the OTA and thus is also responsible for the AGC time constant. As the charging and discharging currents are not equal two different time constants will result. The time constant corresponding to the charging process of the capacitor shall be chosen according to the data rate. According to measurements performed at Infineon the capacitor value should be greater than 47nF. 1. note the 20k resistor in series with the 3.1V internal voltage source Wireless Components 4-3 Specification, December 2006 TDA 5212 Applications 4.2 Data Filter Design Utilising the on-board voltage follower and the two 100k on-chip resistors a 2nd order Sallen-Key low pass data filter can be constructed by adding 2 external capacitors between pins 19 (SLP) and 22 (FFB) and to pin 21 (OPP) as depicted in the following figure and described in the following formulas1. C1 Pins: C2 22 21 R R 100k 100k 19 Filter_Design.wmf Figure 4-3 Data Filter Design C1 = 2Q b R 2f 3dB C2 = b 4QRf 3dB with Q= b a the quality factor of the poles where in case of a Bessel filter a = 1.3617, b = 0.618 and thus Q = 0.577 and in case of a Butterworth filter a = 1.141, b = 1 and thus Q = 0.71 Example: Butterworth filter with f3dB = 5kHz and R = 100k: C1 = 450pF, C2 = 225pF 1. taken from Tietze/Schenk: Halbleiterschaltungstechnik, Springer Berlin, 1999 Wireless Components 4-4 Specification, December 2006 TDA 5212 Applications 4.3 Crystal Load Capacitance Calculation The value of the capacitor necessary to achieve that the crystal oscillator is operating at the intended frequency is determined by the reactive part of the negative resistance of the oscillator circuit as shown in Section 5.1.3 and by the crystal specifications given by the crystal manufacturer. CS Pin 28 Crystal Input impedance Z1-28 TDA5212 Pin 1 Quartz_load_5212.wmf Figure 4-4 Determination of Series Capacitance Value for the Crystal Oscillator Crystal specified with load capacitance CS = 1 1 + 2 f X L CL with CL the load capacitance (refer to the crystal specification). Examples: 7.2 MHz: CL = 12 pF XL=500 CS = 9.5 pF 14.5 MHz: CL = 12 pF XL=1050 CS = 5.6 pF These values may be obtained in high accuracy by putting two capacitors in series to the quartz, such as 18pF and 20pF in the 7.2MHz case and 18pF and 8.2pF in the 14.5MHz case. But please note that the calculated value for CS includes also all parasitic capacitors. Wireless Components 4-5 Specification, December 2006 TDA 5212 Applications 4.4 Crystal Frequency Calculation As mentioned in Section 3.4.3 the local oscillator (UHF PLL) signal has to be high-side injected for a RF below 921MHz and low-side injected for a RF above 921MHz into the downconverting mixer. Thus the crystal frequency is calculated by using the following formula: f QU = with f RF 10.7 r RF .... receive frequency LO .... local oscillator (PLL) frequency (RF 10.7) QU .... crystal oscillator frequency r .... ratio of local oscillator (PLL) frequency and crystal frequency as shown in the subsequent table. Table 4-1 PLL Division Ratio Dependence on States of CSEL CSEL Ratio r = (fLO/fQU) open 128 GND 64 This yields the following calculation for a RF of 915MHz for instance: CSEL tied to GND1: f QU = 915MHz + 10.7 MHz = 14.4641MHz 64 1.In the Infineon Evalboard the L0 is used in low side injection mode and therefore crystal with 14.1296875MHz is used. But to guarantee the function over the whole temperature range the L0 has to be used in high side injection mode for a RF of 915MHz (see also VDO frequency range). Wireless Components 4-6 Specification, December 2006 TDA 5212 Applications 4.5 Data Slicer Threshold Generation The threshold of the data slicer can be generated in two ways, depending on the signal coding scheme used. In case of a signal coding scheme without DC content such as Manchester coding the threshold can be generated using an external R-C integrator as shown in Figure 4-5. The time constant TA of the RC integrator has to be significantly larger than the longest period of no signal change TL within the data sequence. For the calculation of the time constant TA please see Application Note TDA521X_ANV1.1." chapter 4.11. Data Slicer". In order to keep distortion low, the minimum value for R is 20k. R C Pins: 19 data out 25 20 Uthreshold data filter data slicer Data_slice1.wmf Figure 4-5 Data Slicer Threshold Generation with External R-C Integrator Another possibility for threshold generation is to use the peak detector in connection with two resistors and one capacitor as shown in the following figure. The component values are depending on the coding scheme and the protocol used. R C R Pins: peak detector 26 19 data out 25 20 Uthreshold data slicer data filter Data_slice2.wmf Figure 4-6 Wireless Components Data Slicer Threshold Generation Utilising the Peak Detector 4-7 Specification, December 2006 TDA 5212 Applications 4.6 ASK/FSK Switch Functional Description The TDA5211 is containing an ASK/FSK switch which can be controlled via Pin 15 (MSEL). This switch is actually consisting of 2 operational amplifiers that are having a gain of 1 in case of the ASK amplifier and a gain of 11 in case of the FSK amplifier in order to achieve an appropriate demodulation gain characteristic. In order to compensate for the DC-offset generated especially in case of the FSK PLL demodulator there is a feedback connection between the threshold voltage of the bit slicer comparator (Pin 20) to the negative input of the FSK switch amplifier. This is shown in the figure below: 15 MSEL RSSI (ASK signal) ASK/FSK Switch Data Filter FSK PLL Demodulator R1=100k + ASK DATA Out R2=100k + v=1 Comp + FSK AC 0.18 mV/kHz 25 - R3=300k 1.5 V......2.5 V DC typ. 2 V R4=30k FFB 22 21 OPP SLP 19 20 SLN ASK mode : v=1 FSK mode : v=11 C1 C2 R C ask_fsk_datapath.WMF Figure 4-7 4.6.1 ASK/FSK mode datapath FSK Mode The FSK datapath has a bandpass characterisitc due to the feedback shown above (highpass) and the data filter (lowpass). The lower cutoff frequency f2 is determined by the external RC-combination. The upper cutoff frequency f3 is determined by the data filter bandwidth. The demodulation gain of the FSK PLL demodulator is 200V/kHz. This gain is increased by the gain v of the FSK switch, which is 11. Therefore the resulting dynamic gain of this circuit is 2.2mV/kHz round about within the bandpass. The Wireless Components 4-8 Specification, December 2006 TDA 5212 Applications gain for the DC content of FSK signal remains at 200V/kHz. The cutoff frequencies of the bandpass have to be chosen such that the spectrum of the data signal is influenced in an acceptable amount. In case that the user data is containing long sequences of logical zeros the effect of the drift-off of the bit slicer threshold voltage can be lowered if the offset voltage inherent at the negative input of the slicer comparator (Pin20) is used. The comparator has no hysteresis built in. This offset voltage is generated by the bias current of the negative input of the comparator (i.e. 20nA) running over the external resistor R. This voltage raises the voltage appearing at pin 20 (e.g. 1mV with R = 100k). In order to obtain benefit of this asymmetrical offset for the demodulation of long zeros the lower of the two FSK frequencies should be chosen in the transmitter as the zerosymbol frequency. In the following figure the shape of the above mentioned bandpass is shown. gain (pin19) v v-3dB 20dB/dec -40dB/dec 3dB 0dB f DC f1 f2 0.18mV/kHz f3 2mV/kHz frequenzgang.WMF Figure 4-8 Frequency characterstic in case of FSK mode The cutoff frequencies are calculated with the following formulas: f1 = Wireless Components 4-9 1 R 330k 2 xC R + 330k Specification, December 2006 TDA 5212 Applications f 2 = v f1 = 11 f1 f 3 = f 3dB f3 is the 3dB cutoff frequency of the data filter - see Section 4.2. Example: R = 100k C = 47nF This leads to f1 = 44Hz and 4.6.2 f2 = 485Hz ASK Mode In case the receiver is operated in ASK mode the datapath frequency charactersitic is dominated by the data filter alone, thus it is lowpass shaped.The cutoff frequency is determined by the external capacitors C12 and C14 and the internal 100k resistors as described in Section 4.2 0dB -3dB -40dB/dec f f3dB freq_ask.WMF Figure 4-9 Wireless Components Frequency charcteristic in case of ASK mode 4 - 10 Specification, December 2006 TDA 5212 Applications 4.7 Principle of the Precharge Circuit In case the data slicer threshold shall be generated with an external RC network as described in Section 4.5 it is necessary to use large values for the capacitor C attached to the SLN pin (pin 20) in order to achieve long time constants. This results also from the fact that the choice of the value for R connected between the SLP and SLN pins (pins 19 and 20) is limited by the 330k resistor appearing in parallel to R as can be seen in Figure 4-6. Apart from this a resistor value of 100k leads to a voltage offset of 1mv at the comparator input as described in Section 4.6.1. The resulting startup time constant 1 can be calculated with: 1 = (R || 330k ) x C In case R is chosen to be 100k and C is chosen as 47nF this leads to 1 = (100k || 330k ) x 47 nF = 77 k x 47 nF = 3.6ms When the device is turned on this time constant dominates the time necessary for the device to be able to demodulate data properly. In the powerdown mode the capacitor is only discharged by leakage currents. In order to reduce the turn-on time in the presence of large values of C a precharge circuit was included in the TDA5210 as shown in the following figure. C2 R1+R2=600k R1 R2 C R Uth r es h o ld 24 20 23 Uc>Us Uc<Us 19 Uc I load Data Filter ASK/FSK Switch - U2 0 / 240uA + Us OTA + - U2<2.4V : I=240uA U2>2.4V : I=0 20k +3.1V +2.4V precharge.WMF Figure 4-10 Wireless Components Principle of the precharge circuit 4 - 11 Specification, December 2006 TDA 5212 Applications This circuit charges the capacitor C with an inrush current Iload of 240A for a duration of T2 until the voltage Uc appearing on the capacitor is equal to the voltage Us at the input of the data filter. This voltage is limited to 2.5V. As soon as these voltages are equal or the duration T2 is exceeded the precharge circuit is disabled. 2 is the time constant of the charging process of C which can be calculated as 2 20k x C 2 as the sum of R1 and R2 is sufficiently large and thus can be neglected. T2 can then be calculated according to the following formula: T2 = 2 1 ln 2 . 4V 1- 3V 2 1 .6 The voltage transient during the charging of C2 is shown in the following figure: U2 3V 2.4V 2 T2 e-fkt1.WMF Figure 4-11 Voltage appearing on C2 during precharging process The voltage appearing on the capacitor C connected to pin 20 is shown in the following figure. It can be seen that due to the fact that it is charged by a constant current source it exhibits is a linear increase in voltage which is limited to Wireless Components 4 - 12 Specification, December 2006 TDA 5212 Applications USmax = 2.5V which is also the approximate operating point of the data filter input. The time constant appearing in this case can be denoted as T3, which can be calculated with T3 = U S max x C 2.5V = xC 240 A 240A Uc Us T3 e-Fkt2.WMF Figure 4-12 Voltage transient on capacitor C attached to pin 20 As an example the choice of C2 = 20nF and C = 47nF yields 2 = 0.4ms T2 = 0.64ms T3 = 0.49ms This means that in this case the inrush current could flow for a duration of 0.64ms but stops already after 0.49ms when the USmax limit has been reached. T3 should always be chosen to be shorter than T2. It has to be noted finally that during the turn-on duration T2 the overall device power consumption is increased by the 240A needed to charge C. The precharge circuit may be disabled if C2 is not equipped. This yields a T2 close to zero. Note that the sum of R4 and R5 has to be 600k in order to produce 3V at the THRES pin as this voltage is internally used also as the reference for the FSK demodulator. Wireless Components 4 - 13 Specification, December 2006 5 Reference Contents of this Chapter 5.1 5.2 5.3 5.4 Electrical Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 Test Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9 Test Board Layouts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12 TDA 5212 Reference 5.1 Electrical Data 5.1.1 Absolute Maximum Ratings WARNING The maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent damage to the IC may result. Table 5-1 Absolute Maximum Ratings, Ambient temperature TAMB=-40C ... + 85C # Parameter Symbol Limit Values min max Unit 1 Supply Voltage Vs -0.3 5.5 V 2 Junction Temperature Tj -40 +125 C 3 Storage Temperature Ts -40 +150 C 4 Thermal Resistance RthJA 114 K/W 5 ESD integrity, all pins VESD +1 kV Wireless Components 5-2 -1 Remarks HBM according to MIL STD 883D, method 3015.7 Specification, December 2006 TDA 5212 Reference 5.1.2 Operating Range Within the operating range the IC operates as explained in the circuit description. The AC/DC characteristic limits are not guaranteed. Supply voltage: VCC = 4.5V .. 5.5V Table 5-2 Operating Range, Ambient temperature TAMB= -40C ... + 85C # Parameter Symbol Limit Values min 1 Supply Current 2 Receiver Input Level ASK FSK, frequ. dev. 50kHz Unit Test Conditions/Notes 6 5.4 mA mA fRF = 915MHz, FSK Mode fRF = 915MHz, ASK Mode L Item max ISF ISA RFin -109 -102 -13 -13 dBm dBm 3 LNI Input Frequency fRF 902 928 MHz 4 MI/X Input Frequency fMI 902 928 MHz 6 UHF Local Oscillator Frequency Range fLO 910 932 MHz 7 3dB IF Frequency Range fIF -3dB 5 23 MHz 8 Powerdown Mode On PWDNON 0 0.8 V 9 Powerdown Mode Off PWDNOFF 2 VS V 10 Gain Control Voltage, LNA high gain state VTHRES 2.8 VS V 11 Gain Control Voltage, LNA low gain state VTHRES 0 0.7V V @ source impedance 50, BER 2E-3, average power level, Manchester encoded datarate 4kBit, 280kHz IF Bandwidth Not part of the production test - either verified by design or measured in an Infineon Evalboard as described in Section 5.2. Wireless Components 5-3 Specification, December 2006 TDA 5212 Reference 5.1.3 AC/DC Characteristics AC/DC characteristics involve the spread of values guaranteed within the specified voltage and ambient temperature range. Typical characteristics are the median of the production. The device performance parameters marked with are not part of the production test, but verified by design or measured in an Infineon Evalboard as described in Section 5.2. Table 5-3 AC/DC Characteristics with TA 25 C, VVCC = 4.5 ... 5.5 V # Parameter Symbol Limit Values min Unit Test Conditions/ Notes typ max IS PDWN 90 120 nA Pin 27 (PDWN) open or tied to 0 V L Item Supply Supply Current 1 Supply current, standby mode 2 Supply current, device operating in FSK mode ISF 5.4 5.7 mA Pin 11 (FSEL) open, Pin 15 (MSEL) tied to GND 3 Supply current, device operating in ASK mode ISA 4.8 5.1 mA Pin 11 (FSEL) open, Pin 15 (MSEL) open dBm Manchester encoded datarate 4kBit, 280kHz IF Bandwidth LNA Signal Input LNI (PIN 3), VTHRES > 2.8V, high gain mode 1 2 Average Power Level at BER = 2E-3 (Sensitivity) ASK RFin -112 Average Power Level at BER = 2E-3 (Sensitivity) FSK RFin -105 dBm Manchester enc. datarate 4kBit, 280kHz IF Bandw., 50kHz pk. dev. 3 Input impedance, fRF = 915 MHz S11 LNA 4 Input level @ 1dB C.P. fRF=915 MHz P1dBLNA -15 dBm 5 Input 3rd order intercept point fRF = 915 MHz IIP3LNA -14 dBm 6 LO signal feedthrough at antenna port LOLNI 0.717 / -78.4 deg 73 dBm fin = 914 & 916MHz Signal Output LNO (PIN 6), VTHRES > 2.8V, high gain mode 1 Gain fRF = 915 MHz S21 LNA 1.401 / 98.4 deg 2 Output impedance, fRF = 915 MHz S22 LNA 0.869 / -25.7 deg Wireless Components 5-4 Specification, December 2006 TDA 5212 Reference Table 5-3 AC/DC Characteristics with TA 25 C, VVCC = 4.5 ... 5.5 V (continued) # Parameter Symbol Limit Values min 3 Voltage Gain Antenna to IFO fRF = 915 MHz GAntMI typ Unit Test Conditions/ Notes L Item max 40 dB Signal Input LNI, VTHRES = GND, low gain mode 1 Input impedance, fRF = 915 MHz S11 LNA 2 Input level @ 1dB C. P. fRF = 915 MHz P1dBLNA 0.753 / -86.26 deg -6 dBm -5 dBm Signal Input LNI, VTHRES = GND, low gain mode 3 Input 3rd order intercept point fRF = 915 MHz IIP3LNA fin = 914 & 916MHz Signal Output LNO, VTHRES = GND, low gain mode 1 Gain fRF = 915 MHz S21 LNA 0.174 / 107.4 deg 2 Output impedance, fRF = 915 MHz S22 LNA 0.868 / -28.1 deg 3 Voltage Gain Antenna to IFO fRF = 915 MHz GAntMI 19 dB Signal 3VOUT (PIN 24) 1 Output voltage V3VOUT 2 Current out I3VOUT 2.9 3 3.1 V 50 A VS-1 V I3Vout = 5A Signal THRES (PIN 23) 1 Input Voltage range VTHRES 0 2 LNA low gain mode VTHRES 0 3 LNA high gain mode VTHRES 3 4 Current in ITHRES_in 5 see Section 4.1 V VS-1 V or shorted to Pin 24 nA Signal TAGC (PIN 4) 1 Current out, LNA low gain state ITAGC_out 3.8 4.2 4.8 A RSSI > VTHRES 2 Current in, LNA high gain state ITAGC_in 1 1.5 2 A RSSI < VTHRES MIXER Signal Input MI/MIX (PINS 8/9) 1 Input impedance, fRF = 915 MHz S11 MIX 2 Input 3rd order intercept point IIP3MIX Wireless Components 0.912 / -30.13 deg -25 5-5 dBm Specification, December 2006 TDA 5212 Reference Table 5-3 AC/DC Characteristics with TA 25 C, VVCC = 4.5 ... 5.5 V (continued) Parameter Symbol Limit Values min typ Unit Test Conditions/ Notes L Item max Signal Output IFO (PIN 12) 1 Output impedance ZIFO 330 2 Conversion Voltage Gain fRF=915 MHz GMIX 18 dB LIMITER Signal Input LIM/X (PINS 17/18) 1 Input Impedance ZLIM 264 2 RSSI dynamic range DRRSSI 60 3 RSSI linearity LINRSSI 4 Operating frequency (3dB points) fLIM 330 396 80 dB dB 23 MHz 100 kHz 100 kHz 20 pF 0 0.1 V 1 5 10.7 DATA FILTER 1 Useable bandwidth BWBB FILT SLICER Signal Output DATA (PIN 25) 1 Useable bandwith BWBB SLIC 2 Capacitive loading of output Cmax SLIC 3 LOW output voltage VSLIC_L 4 HIGH output voltage VSLIC_H VS1.3 VS-1 VS-0.7 V IPCH_SLN -100 -220 -300 A 0 0.1 V 3 3.1 V Output current= 200A Slicer, SLN (PIN 20) 1 Precharge Current Out see Section 4.7 PEAK DETECTOR Signal Output PDO (PIN 26) 1 LOW output voltage VSLIC_L 2 HIGH output voltage VSLIC_H 2.9 3 Load current Iload -500 4 Leakage current Ileakage 580 Wireless Components A 700 5-6 820 Static output current must not exceed -500A nA Specification, December 2006 TDA 5212 Reference Table 5-3 AC/DC Characteristics with TA 25 C, VVCC = 4.5 ... 5.5 V (continued) Parameter Symbol Limit Values min typ Unit Test Conditions/ Notes MHz fundamental mode, series resonance L Item max CRYSTAL OSCILLATOR Signals CRSTL1, CRISTL 2, (PINS 1/28) 1 Operating frequency 2 Input Impedance @ ~7.2MHz Z1-28 - 860 + j500 3 Input Impedance @ ~14.5MHz Z1-28 - 550 + j1050 4 Serial Capacity @ ~7.2MHz CS7=C1 9.5 pF 5 Serial Capacity @ ~14.5MHz CS14=C1 5.6 pF fCRSTL 6 15 ASK/FSK Signal Switch Signal MSEL (PIN 15) 1 ASK Mode VMSEL 1.4 4 V 2 FSK Mode VMSEL 0 0.2 V or open FSK DEMODULATOR 1 Demodulation Gain GFMDEM 2 Useable IF Bandwidth BWIFPLL 10.2 200 10.7 V/ kHz 11.2 MHz POWER DOWN MODE Signal PDWN (PIN 27) 1 Powerdown Mode On PWDNON 0 0.8 V 2 Powerdown Mode Off PWDNOff 2.8 VS V 3 Input bias current PDWN IPDWN 19 A 4 Start-up Time until valid IF signal is detected TSU <1 ms note: startup - time is also depends on the used crystal PLL DIVIDER Signal CSEL (PIN 16) 1 fCRSTL range 7.xxMHz Wireless Components VCSEL 1.4 4 5-7 V or open Specification, December 2006 TDA 5212 Reference Table 5-3 AC/DC Characteristics with TA 25 C, VVCC = 4.5 ... 5.5 V (continued) Parameter Symbol Limit Values min 2 fCRSTL range 14.xxMHz VCSEL 3 Input bias current CSEL ICSEL typ 0 Unit L Item max 0.2 5 Test Conditions/ Notes V A CSEL tied to GND Not part of the production test - either verified by design or measured in an Infineon Evalboard as described in Section 5.2. Wireless Components 5-8 Specification, December 2006 TDA 5212 Reference 5.2 Test Circuit DATE: Jul.19, 1999 TDA52xx Evaluation Board FILE: -10 V 2.0 TITLE: Infineon Technologies The device performance parameters marked with in Section 5.1.3 were either verified by design or measured on an Infineon evaluation board. Test_circuit.wmf Figure 5-1 Wireless Components Schematic of the Evaluation Board 5-9 Specification, December 2006 TDA 5212 Reference 5.3 Test Board Layouts Wireless Components Figure 5-2 Top Side of the Evaluation Board Figure 5-3 Bottom Side of the Evaluation Board 5 - 10 Specification, December 2006 TDA 5212 Reference Figure 5-4 Wireless Components Component Placement on the Evaluation Board 5 - 11 Specification, December 2006 TDA 5212 Reference 5.4 Bill of Materials The following components are necessary for evaluation of the TDA5212 at 915 MHz without use of a Microchip HCS515 decoder. Table 5-4 Bill of Materials Ref Value Specification R1 100k 0805, 5% R2 100k 0805, 5% R3 820k 0805, 5% R4 240k 0805, 5% R5 360k 0805, 5% R6 10k 0805, 5% L1 3.3nH Toko, PTL2012-F3N3C L2 3.9nH Toko, PTL2012-F3N9C C1 1pF 0805, COG, 0.1pF C2 3.3pF 0805, COG, 0.1pF C3 4.7pF 0805, COG, 0.1pF C4 100pF 0805, COG, 5% C5 47nF 1206, X7R, 10% C6 3.3pF 0805, COG, 0.1pF C7 100pF 0805, COG, 5% C8 22pF 0805, COG, 5% C9 100pF 0805, COG, 5% C10 10nF 0805, X7R, 10% C11 10nF 0805, X7R, 10% C12 220pF 0805, COG, 5% C13 47nF 0805, X7R, 10% C14 470pF 0805, COG, 5% C15 47nF 0805, X7R, 10% C16 8.2pF 0805, COG, 1% C17 18pF 0805, COG, 0.25pF Q1 14.129690MHz1 Jauch Q 14.129690-S1 Q2 SFE10.7MA5-A Murata X2, X3 142-0701-801 Johnson X1, X4, S1, S5 STL_2POL 2-pole pin connector S4 STL_3POL 3-pole pin connector, or not equipped IC1 TDA 5212 Infineon 1. 14.129690MHz crystals are used in the Infineon Evalboard, which means that the L0 is in low side injection mode (L0-frequency=904.3MHz). But to guarantee the function of the IC over the whole temperature range the L0 has to be used in high side rejection mode (L0-frequency=925.7MHz), therefore 14.4640625MHz crystals have to be used for a RF of 915MHz (see also VCO-frequency range). Wireless Components 5 - 12 Specification, December 2006 TDA 5212 Reference The following components are necessary in addition to the above mentioned ones for evaluation of the TDA5212 in conjunction with a Microchip HCS512 decoder. Table 5-5 Bill of Materials Addendum Ref Value Specification R21 22k 0805, 5% R22 10k 0805, 5% R23 22k 0805, 5% R24 820k 0805, 5% R25 560k 0805, 5% C21 100nF 1206, X7R, 10% C22 100nF 1206, X7R, 10% IC2 HCS512 Microchip T1 BC 847B Infineon D1 LS T670-JL Infineon Wireless Components 5 - 13 Specification, December 2006 TDA 5212 List of Figures 6 List of Figures Figure 2-1 PG-TSSOP-28 package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Figure 3-1 IC Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Figure 3-2 Main Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9 Figure 4-1 LNA Automatic Gain Control Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 Figure 4-2 RSSI Level and Permissive AGC Threshold Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 Figure 4-3 Data Filter Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4 Figure 4-4 Determination of Series Capacitance Value for the Crystal Oscillator . . . . . . . . . . . . . 4-5 Figure 4-5 Data Slicer Threshold Generation with External R-C Integrator . . . . . . . . . . . . . . . . . . 4-7 Figure 4-6 Data Slicer Threshold Generation Utilising the Peak Detector . . . . . . . . . . . . . . . . . . . 4-7 Figure 4-7 ASK/FSK mode datapath . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8 Figure 4-8 Frequency characterstic in case of FSK mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-9 Figure 4-9 Frequency charcteristic in case of ASK mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10 Figure 4-10 Principle of the precharge circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11 Figure 4-11 Voltage appearing on C2 during precharging process . . . . . . . . . . . . . . . . . . . . . . . . . 4-12 Figure 4-12 Voltage transient on capacitor C attached to pin 20 . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-13 Figure 5-1 Schematic of the Evaluation Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9 Figure 5-2 Top Side of the Evaluation Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10 Figure 5-3 Bottom Side of the Evaluation Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10 Figure 5-4 Component Placement on the Evaluation Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11 Wireless Components List of Figures - i Specification, December 2006 TDA 5212 List of Tables 7 List of Tables Table 3-1 Pin Definition and Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 Table 3-2 CSEL Pin Operating States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11 Table 3-3 MSEL Pin Operating States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12 Table 3-4 PDWN Pin Operating States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13 Table 5-1 Absolute Maximum Ratings, Ambient temperature TAMB=-40C ... + 85C . . . . . . . . . 5-2 Table 5-2 Operating Range, Ambient temperature TAMB= -40C ... + 85C . . . . . . . . . . . . . . . . . 5-3 Table 5-3 AC/DC Characteristics with TA 25 C, VVCC = 4.5 ... 5.5 V . . . . . . . . . . . . . . . . . . . . . 5-4 AC/DC Characteristics with TA 25 C, VVCC = 4.5 ... 5.5 V (continued) 5-5 AC/DC Characteristics with TA 25 C, VVCC = 4.5 ... 5.5 V (continued) 5-6 AC/DC Characteristics with TA 25 C, VVCC = 4.5 ... 5.5 V (continued) 5-7 AC/DC Characteristics with TA 25 C, VVCC = 4.5 ... 5.5 V (continued) 5-8 Table 5-4 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12 Table 5-5 Bill of Materials Addendum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13 Wireless Components List of Tables - i Specification, December 2006