Ver. 201207
※Rated Current: DC current value when the self-generation of heat risesto 40℃(Reference ambient temperature:25℃)
※Operating temperature range: –40 to +125°C (Including self-temperature rise)
※Test equipment: Agilent :E4991A+16092A
1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.)
FEATURES
APPLICATION
CHARACTERISTIC DATA
Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter
DIMENSION
TYPE Dimension [mm]
L W T D
10 1.6±0.15 0.8±0.15 0.5 max. 0.3±0.2
DESCRIPTION
Part no. Size
(inch/mm) Inductance
(uH)@1MHz DC
Resistance(Ω)Rated Current (A)
Max.
CIG10FR47MNC 0603/1608 0.47±20% 0.20±30 % 0.80
CIG10F1R0MNC 0603/1608 1.0±20% 0.30±30 % 0.70
CIG10F1R5MNC 0603/1608 1.5±20% 0.35±30 % 0.60
CIG10F2R2MNC 0603/1608 2.2±20% 0.45±30 % 0.50
Multilayer Power Inductor
RECOMMENDED LAND PATTERN
CIG10F Series (1608/ EIA 0603)
The smallest multilayer power inductor (1.6mm×0.8mm)
Much lower Profile than any other series (0.5mm max)
Low DC resistance
Magnetically shielded structure
Free of all RoHS-regulated substances
Monolithic structure for high reliability
Ver. 201207
CI G 10 F 2R2 M N C
(1) (2) (3) (4) (5) (6) (7) (8)
(1) Chip Inductor (2) Power Inductor
(3) Dimension (4) Product Series (F:Low Profile Type)
(5) Inductance (R47:0.47uH, 2R2:2.2uH) (6) Tolerance (M:±20%)
(7) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(8) Packaging(C:paper tape, E:embossed tape)
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
PACKAGING
Packaging Style Quantity(pcs/reel)
Card Board Taping 4,000
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING FLOW SOLDERING
PRODUCT IDENTIFICATION
