TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Business Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 VOIDLESS - HERMETICALLY- SEALED ULTRAFAST RECOVERY GLASS RECTIFIERS Qualified per MIL-PRF-19500/477 DEVICES Leaded Surface Mount LEVELS 1N5807 1N5807US 1N5807URS 1N5809 1N5809US 1N5809URS 1N5811 1N5811US 1N5811URS JAN JANTX JANTXV JANS DESCRIPTION This "Ultrafast Recovery" rectifier diode series is military qualified to MIL-PRF-19500/477 and is ideal for high-reliability applications where a failure cannot be tolerated. These industryrecognized 6.0 Amp rated rectifiers for working peak reverse voltages from 50 to 150 volts are hermetically sealed with voidless-glass construction using an internal "Category I" metallurgical bond. These devices are available in both leaded and surface mount MELF package configurations. Microsemi also offers numerous other rectifier products to meet higher and lower current ratings with various recovery time speed requirements including standard, fast and ultrafast device types in both through-hole and surface mount packages. IMPORTANT: For the most current data, consult MICROSEMI's website: http://www.microsemi.com B-Body Leaded Package FEATURES Popular JEDEC registered 1N5807, 1N5809, 1N5811 Voidless hermetically sealed glass package Extremely robust construction Internal "Category I" Metallurgical bonds JAN, JANTX, JANTXV, and JANS available per MIL-PRF-19500/477 Surface mount versions available in a square end-cap MELF configuration with "US" B-Body Surface Mount MELF PACKAGE suffix T4-LDS-0168 Rev. 2 (111089) Page 1 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Bussiness Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 APPLICATIONS / BENEFITS Ultrafast recovery 6 Amp rectifier series 50 to 150V Military Space and other high-reliability applications Switching power supplies or other applications requiring extremely fast switching & low forward loss High forward surge current capability Low thermal resistance Controlled avalanche with peak reverse power capability Inherently radiation hard as described in Microsemi MicroNote 050 MAXIMUM RATINGS Junction Temperature: -65oC to +175oC Storage Temperature: -65oC to +175oC Average Rectified Forward Current (IO): 6 A @ TL = 75C at 3/8 inch lead length (see note 1) Thermal Resistance: 22 C/W junction to lead (L=.375 in) Thermal Impedance: 1.5 C/W @ 10 ms heating time Forward Surge Current (8.3 ms half sine) 125 Amps Capacitance: 60 pF at 10 volts, f = 1 MHz Solder temperature: 260C for 10 s (maximum) MECHANICAL AND PACKAGING CASE: Hermetically sealed voidless hard glass with Tungsten slugs TERMINATIONS: Axial-leads are Tin/Lead (Sn/Pb) over Ni plate over Copper. MARKING: Body painted and part number, etc. POLARITY: Cathode indicated by band Tape & Reel option: Standard per EIA-296 Weight: 750 mg See package dimensions on last page T4-LDS-0168 Rev. 2 (111089) Page 2 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Bussiness Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 ELECTRICAL CHARACTERISTICS @ TA = 25C WORKING BREAKDOWN AVERAGE AVERAGE VOLTAGE RECTIFIED RECTIFIED PEAK (MIN.) CURRENT CURRENT REVERSE IO1 IO2 VOLTAGE @ 100A @TL=75C @TA=-65C VRWM VBR (Note 1) Note 2 TYPE VOLTS VOLTS AMPS MAXIMUM FORWARD VOLTAGE @ 4A (8.3 ms pulse) VF REVERSE CURRENT (MAX) @ VRWM IR A VOLTS o o o SURGE REVERSE CURRENT RECOVERY (MAX) TIME (MAX) IFSM (NOTE 4) (NOTE 3) trr AMPS ns o 25 C 125 C 25 C 125 C 1N5807, US, URS 50 60 6.0 3.0 0.875 0.800 5 525 125 30 1N5809, US, URS 100 110 6.0 3.0 0.875 0.800 5 525 125 30 1N5811, US, URS 150 160 6.0 3.0 0.875 0.800 5 525 125 30 NOTE 1: Leaded: Rated at TL = 75C at 3/8 inch lead length. Derate at 60 mA/C for TL above 75C. Surface mount: Rated at TEC = 75C. Derate at 60 mA/C for TEC above 75C. NOTE 2: Derate linearly at 25 mA/C above TA = 55C. This rating is typical for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where TJ(max) does not exceed 175C NOTE 3: TA = 25oC @ IO = 3.0 A and VRWM for ten 8.3 ms surges at 1 minute intervals NOTE 4: IF = 1.0 A, IRM = 1.0 A, IR(REC) = 0.10 A and di/dt = 100 A/s min SYMBOLS & DEFINITIONS Symbol Definition VBR Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current. VRWM Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature range. VF Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current. IR Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and temperature. C Capacitance: The capacitance in pF at a frequency of 1 MHz and specified voltage trr Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from the forward direction to the reverse direction and a specified recovery decay point after a peak reverse current is reached. T4-LDS-0168 Rev. 2 (111089) Page 3 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Bussiness Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 GRAPHS FIGURE 1 TYPICAL FORWARD CURRENT vs. FORWARD VOLTAGE FIGURE 2 TYPICAL REVERSE CURRENT vs. VOLTAGE FIGURE 3 OUTPUT CURRENT vs LEAD TEMPERATURE FIGURE 4 FORWARD PULSE CURRENT vs. DURATION FIGURE 6 MAXIMUM LEAD TEMP. vs. PD FIGURE 7 MULTIPLE SURGE CURRENT vs. DURATION T4-LDS-0168 Rev. 2 (111089) Page 4 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Bussiness Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 PACKAGE DIMENSIONS Ltr BD BL LD LL Dimensions 1N5807, 1N5809, 1N5811 Inches Millimeters Min Max Min Max .115 .142 2.92 3.61 .130 .300 3.30 7.62 .036 .042 0.91 1.07 .900 1.30 22.86 33.02 Notes 4 3 3 NOTE: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Dimension BL shall include the entire body including slugs and sections of the lead over which the diameter is uncontrolled. This uncontrolled area is defined as the zone between the edge of the diode body and extending .050 inch (1.27 mm) onto the leads. 4. Dimension BD shall be measured at the largest diameter. 5. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. Lead Tolerance = + .002 -.003 in *Includes sections of the lead or fillet over which the lead diameter is uncontrolled. FIGURE 1. Physical Dimensions T4-LDS-0168 Rev. 2 (111089) Page 5 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Bussiness Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 PACKAGE DIMENSIONS PAD LAYOUT Ltr BD BL ECT S Dimensions 1N5807US, 1N5809US, 1N5811US Inches Millimeters Min Max Min Max .137 .148 3.84 3.76 .200 .225 5.08 5.72 .019 .028 0.48 0.71 .003 0.08 Notes INCHES mm 0.288 7.32 A 0.070 1.78 B 0.155 3.94 C Note: If mounting requires adhesive separate from the solder, an additional 0.080 inch diameter contact may be placed in the center between the pads as an optional spot for cement. NOTE 1: 1. 2. 3. 4. 5. 6. Dimensions are in inches. Millimeters are given for general information only. Dimensions are pre-solder dip. Minimum clearance of glass body to mounting surface on all orientations. Cathode marking to be either in color band, three dots spaced equally, or a color dot on the face of the end tab. Color dots will be .020 inch (0.51 mm) diameter minimum and those on the face of the end tab shall not lie within .020 inch (0.51 mm) of the mounting surface. 7. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. NOTE 2: This Package Outline has also previously been identified as "D-5B" FIGURE 2A. Physical dimensions of US surface mount family T4-LDS-0168 Rev. 2 (111089) Page 6 of 7 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Bussiness Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 PACKAGE DIMENSIONS Ltr BD BL ECT S Dimensions 1N5802URS, 1N5804URS, 1N5806URS Inches Millimeters Min Max Min Max .091 .103 2.31 2.62 .168 .200 4.27 5.08 .019 .028 0.48 0.71 .003 0.08 Notes 8 8 NOTES: 1. 2. 3. 4. 5. Dimensions are in inches. Millimeters are given for general information only. Dimensions are pre-solder dip. Minimum clearance of glass body to mounting surface on all orientations. 5. Cathode marking to be either in color band, three dots spaced equally, or a color dot on the face of the end tab. 6. Color dots will be .020 inch (0.51 mm) diameter minimum and those on the face of the end tab shall not lie within .020 inch (0.51 mm) of the mounting surface. 7. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. 8. One endcap shall be square and the other endcap shall be round. FIGURE 2B. Physical dimensions of URS surface mount family. T4-LDS-0168 Rev. 2 (111089) Page 7 of 7