FLLD261
HIGH CONDUCTANCE LOW LEAKAGE DIODE P8A
PD . . . .350 mW @ TA = 25 Deg C
BV . . . .200 V (MIN) @ IR = 5 uA
ABSOLUTE MAXIMUM RATINGS (NOTE 1)
TEMPERATURES
Storage Temperature -55 to +150 Degrees C
Operating Junction Temperature -55 to +150 Degrees C
POWER DISSIPATION (NOTES 2 & 3)
Total Device Dissipation at TA = 25 Deg C 350 mW
Derating Factor per Degree C 2.8 mW
VOLTAGES & CURRENTS
WIV Working Inverse Voltage 100 V
IO Average Rectified Current 250 mA
IF DC Forward Current 600 mA
if Recurrent Peak Forward Current 700 mA
if (surge) Peak Forward Surge Current
Pulse width = 1 second 1.0 A
Pulse width = 1 microsec 3.0 A
PACKAGE
TO-236AB (Low)
3
1 2
NOTES:
1. These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
2. These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
SYM CHARACTERISTICS MIN MAX UNITS TEST CONDITIONS
BVBreakdown Voltage 200 V IR = 5.0 uA
IRReverse Voltage Leakage Current 5.0 nA VR = 100 V
5.0 uA VR = 100 V TA = 150 Deg C
VFForward Voltage 1.40 VIF = 200 mA
CTDiode Capacitance 4.0 pF VR = 1.0 V f = 1.0 MHZ
TRR Reverse Recovery Time 400 ns IF = IR = 50 to 400 mA
IRR = 10% IRRL = 100 ohms
TFR Forward Recovery Time 10 ns IF = 10 mA
VFM Peak Forward Voltage 0.9 VIF = 10 mA
Typ Rise Time = 5 ns +/-20%
ELECTRICAL CHARACTERISTICS (25 Degrees C Ambient Temperature unless otherwise stated)
3
21
CONNECTION DIAGRAMS
SOT-23 (DIODE)
TO-236AB (LOW PROFILE)
11-March-1997
0.098 (2.489)
0.083 (2.108) 0.055 (1.397)
0.047 (1.194)
0.024 (0.810)
0.018 (0.457)
3 CHARACTERS MAX
LOW PROFILE 0.0040 (0.102)
(49) 0.0005 (0.013)
0.120 (3.048)
0.110 (2.794)
0.040 (1.016)
0.035 (0.889) 0.080 (2.032)
0.070 (1.778)
0.019 (0.483)
0.015 (0.381)
0.0059 (0.150)
0.0035 (0.089)
2
3
1
LOW PROFILE 0.041 (1.041)
(49) 0.030 (0.762)
0.035” TYPICAL
(0.889)
0.060” +/- 0.005”
(1.524 +/- 0.127)
0.120” MINIMUM
(3.048)
0.030” +/- 0.005”
(0.762 +/- 0.127)
RECOMMENDED SOLDER PADS
FOR
SOT-23
0.037” +/- 0.005”
(0.950 +/- 0.127 )
0.099” +/- 0.005”
(2.524 +/- 0.127 )
0.039” +/- 0.005”
(1.000 +/- 0.127)
RECOMMENDED SOLDER PADS
FOR
U.S., European & Japanese (SC-59)
SOT-23
0.031” +/- 0.005”
(0.800 +/- 0.127)
0.060” +/- 0.005”
(1.524 +/- 0.127)
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Advance Information
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Obsolete
This datasheet contains the design specifications for
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that has been discontinued by Fairchild semiconductor.
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