This document is a general product descriptio n and is subject to change wit hout noti ce. Hyni x does no t assume an y respon sibilit y for
use of circuits described. No patent licenses are implied.
Rev. 1.0 / June. 2007 1
128Mb Synchronous DRAM based on 2M x 4Bank x16 I/O
Document Title
4Bank x 2M x 16bits Synchronous DRAM
Revision History
Revision No. History Draft Date Remark
1.0 First Version Release June. 2007
Rev. 1.0 / June. 2007 2
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY5V26F(L)F(P)-x(I) Series
DESCRIPTION
The Hynix HY5V26F(L)F(P)-x(I) series is a 134,217,728bit CMOS Synchronous DRAM, ideally suited for the memory
applications which require wide data I/O and high bandwidth. HY5V26F(L)F(P)-xx(I) series is organized as 4banks of
2,097,152 x 16.
HY5V26E(L)F(P)-x(I) is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and
outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve
very high bandwidth. All input and output voltage levels are compatible with LVTTL.
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write
cycles initiated by a single control command (Burst length of 1,2,4,8 or full page), and the burst count sequence(se-
quential or interleave). A burst of r ead or write cycles in progress can be terminated by a burst terminate command or
can be interrupted and replaced by a new burst read or write command on any cycle. (This pipelined design is not re-
stricted by a '2N' rule)
FEATURES
ORDERING INFORMATION
Note: 1. HY5V26FF-x(I) Series: Normal power, Leaded.
2. HY5V26FLF-x(I) Series: Low power, Leaded
3. HY5V26FFP-x(I) Series: Normal power, Lead Free.
4. HY5V26FLFP-x(I) Series: Low power, Lead Free.
5. Commercial (0 ~ 70oC)
6. Industrial (-40 ~ 85oC)
Part No. Clock Frequency Organization Interface Operation
Temp. Package
HY5V26F(L)F(P)-5(I) 200MHz
4Banks x
2Mbits x16 LVTTL 0 ~ 70oC5)
40 ~ 85oC6) 54 Ball FBGA
HY5V26F(L)F(P)-6(I) 166MHz
HY5V26F(L)F(P)-7(I) 143MHz
HY5V26F(L)F(P)-H(I) 133MHz
• Voltage: VDD and VDDQ 3.3V supply voltage
• All device pins are compatible with LVTTL interface
• 54 Ball FBGA (Lead or Lead Free Package)
• All inputs and outputs referenced to positive edge of
system clock
• Data mask function by UDQM, LDQM
• Internal four banks operation
• Auto refresh and self refresh
• 4096 Refresh cycles / 64ms
• Programmable Burst Length and Burst Type
- 1, 2, 4, 8 or full page for Sequential Burst
- 1, 2, 4 or 8 for Interleave Burst
• Programmable CAS Latency; 2, 3 Clocks
• Burst Read Single Write operation
• Operation temperature
HY5V26F(L)F(P)-XX Series: 0 ~ 70oC
HY5V26F(L)F(P)-X(I) Series: -40 ~ 85oC
Rev. 1.0 / June. 2007 3
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY5V26F(L)F(P)-x(I) Series
BALL CONFIGURATION
54 Ball
FBGA
0.8mm
Ball Pitch
<Bo tto m View>
987321
A
B
C
D
E
F
G
H
J
54 Ball
FBGA
0.8mm
Ball Pitch
<Bo tto m View>
987321
A
B
C
D
E
F
G
H
J
H
J
B
C
D
A
G
F
E
VSS
DQ14
DQ12
DQ10
DQ8
UDQM
NC
A8
VSS
DQ15
DQ13
DQ11
DQ9
NC
CLK
A11
A7
A5
VSSQ
VDDQ
VSSQ
VDDQ
VSS
CKE
A9
A6
A4
VDDQ
VSSQ
VDDQ
VSSQ
VDD
/CAS
BA0
A0
A3
DQ0
DQ2
DQ4
DQ6
LDQM
/RAS
BA1
A1
A2
VDD
DQ1
DQ3
DQ5
DQ7
/WE
/CS
A10
VDD
1 2 3 7 8 9
< Top View >
Rev. 1.0 / June. 2007 4
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY5V26F(L)F(P)-x(I) Series
FUNCTIONAL BLOCK DIAGRAM
2Mbit x 4banks x 16 I/O Synchronous DRAM
Intern al R ow
Counter
Column
Pre
Decoder
Column Add
Counter
Self refresh
lo g ic & time r
Sense AMP & I/O Gate
I/O Buffer & Logic
Address
Register Burst
Counter
Mode Register
Sta te Mac h ine Address Buffers
Bank Select
Column
Active
Row Active
CAS Latency
CLK
CKE
CS
RAS
CAS
WE
U/LDQM
A0
A1
BA1
BA0
A11
Row
Pre
Decoder
Refresh
DQ0
DQ15
X-Decoder
X-Decoder
X-Decoder
X-Decoder
Y-Decoder
2Mx16 BANK 0
2Mx16 BAN K 1
2Mx16 BANK 2
2Mx16 BANK 3
Memory
Cell
Array
Data Out Control
Pipe Line
Control
Rev. 1.0 / June. 2007 5
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY5V26F(L)F(P)-x(I) Series
BASIC FUNCTIONAL DESCRIPTION
Mode Register
BA1 BA0 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
0 0 0 0 OP Code 0 0 CAS Latency BT Burst Length
OP Code
A9 Write Mode
0Burst Read and Burst Write
1 Burst Read and Single Write Burst Type
A3 Burst Type
0 Sequential
1 Interleave
Burst Length
A2 A1 A0 Burst Length
A3 = 0 A3=1
000 11
001 22
010 4 4
011 88
100 Reserved Reserved
101 Reserved Reserved
1 10 Reserved Reserved
1 11 Full Page Reserved
CAS Latency
A6 A5 A4 CAS Latency
0 0 0 Res e r v ed
0 0 1 1
0 1 0 2
0 1 1 3
1 0 0 Reserved
1 0 1 R e s e r v e d
1 1 0 R e s e r v e d
1 1 1 Reserved
Rev. 1.0 / June. 2007 6
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY5V26F(L)F(P)-x(I) Series
ABSOLUTE MAXIMUM RATING
Notes:
1. Commercial (0 ~ 70oC)
2. Industrial (-40 ~ 85oC)
DC OPERATING CONDITION
Notes:
1. All voltages are referenced to VSS = 0V
2. VIH(max) is acceptable 5.6V AC pulse width with <=3ns of duration.
3. VIL(min) is acceptable -2.0V AC puls e width with <=3ns of durati on
AC OPERATING TEST CONDITION (VDD=3.3±0.3V, VSS=0V)
Note: 1.
Parameter Symbol Rating Unit Note
Ambient Temperature TA 0 ~ 70oCoC1
-40 ~ 85oCoC2
Storage Temperature TSTG -55 ~ 125 oC
Voltage on Any Pin relative to VSS VIN, VOUT -1.0 ~ 4.6 V
Voltage on VDD relative to VSS VDD, VDDQ -1.0 ~ 4.6 V
Short Circuit Output Current IOS 50 mA
Power Dissipation PD1W
Soldering Temperature / Time TSOLDER 260 / 10 oC / Sec
Parameter Symbol Min. Typ Max Unit Note
Power Supply Voltage VDD, VDDQ 3.0 3.3 3.6 V 1
Input High Voltage VIH 2.0 3.0 VDDQ + 0.3 V 1, 2
Input Low Voltage VIL -0.3 - 0.8 V 1, 3
Parameter Symbol Value Unit Note
AC Input High / Low Level Voltage VIH / VIL 2.4 / 0.4 V
Input Timing Measurement Reference Level Voltage Vtrip 1.4 V
Input Rise / Fall Time tR / tF 1 ns
Output Timing Measurement Reference Level Voltage Voutref 1.4 V
Output Load Capacitance for Access Time Measurement CL 50 pF 1
Z0 = 50 Output Output
Vtt = 1.4V
50pF
RT = 50
Vtt = 1.4V
50pF
DC O utput Load Circuit AC O utput Loa d Circuit
RT = 500
Ω
Ω
Ω
Rev. 1.0 / June. 2007 7
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY5V26F(L)F(P)-x(I) Series
CAPACITANCE (f=1MHz, VDD=3.3V)
DC CHARACTERISTICS I
Notes:
1. VIN = 0 to 3.3V, All other balls are not tested under VIN =0V
2. DOUT is disabled, VOUT=0 to 3.6
Parameter Pin Symbol Min Max Unit
Input capacitance
CLK CI1 2.0 4.0 pF
A0 ~ A11, BA0, BA1, CKE, CS, RAS, CAS,
WE, LDQM, UDQM CI2 2.0 4.0 pF
Data input / output capacitance DQ0 ~ DQ15 CI/O 3.0 5.5 pF
Parameter Symbol Min Max Unit Note
Input Leakage Current ILI -1 1 uA 1
Output Leakage Current ILO -1 1 uA 2
Output Hig h Volta g e VOH 2.4 - V IOH = -2mA
Output Low Voltage VOL -0.4VIOL = +2mA
Rev. 1.0 / June. 2007 8
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY5V26F(L)F(P)-x(I) Series
DC CHARACTERISTICS II
Notes:
1. IDD1 and IDD4 depend on output loading and cycle rates. Specified values are measured with the output open
2. Min. of tRRC (Refresh RAS cycle time) is shown at AC CHARACTERISTICS II
3. HY5V26FF(P) Series: Normal Power
HY5V26FLF(P) Series: Low Power
Parameter Symbol Test Condition Speed Unit Note
5 6 7 H
Operating Current IDD1 Burst length=1, One bank active
tRC ≥ tRC(min), IOL=0mA 120 110 100 100 mA 1
Precharge Standby Current
in Power Down Mode
IDD2P CKE ≤ VIL(max), tCK = 15ns 2 mA
IDD2PS CKE ≤ VIL(max), tCK = ∞ 2mA
Precharge Standby Current
in Non Power Down Mode
IDD2N
CKE ≥ VIH(min), CS ≥ VIH(min), tCK =
15ns
Input signals are changed one time
during 2clks.
All other pins ≥ VDD-0.2V or ≤ 0.2V
18
mA
IDD2NS CKE ≥ VIH(min), tCK = ∞
Input signals are stable. 15
Active Standby Current
in Power Down Mode
IDD3P CKE ≤ VIL(max), tCK = 15ns 5 mA
IDD3PS CKE ≤ VIL(max), tCK = ∞ 5
Active Standby Current
in Non Power Down Mode
IDD3N
CKE ≥ VIH(min), CS ≥ VIH(min), tCK =
15ns
Input signals are changed one time
during 2clks.
All other pins ≥ VDD-0.2V or ≤ 0.2V
40
mA
IDD3NS CKE ≥ VIH(min), tCK = ∞
Input signals are stable. 35
Burst Mode Operating Cur-
rent IDD4 tCK ≥ tCK(min), IOL=0mA
All banks active 120 110 100 100 mA 1
Auto Refresh Current IDD5 tRC ≥ tRC(min), All banks active 210 200 190 190 mA 2
Self Refresh Current IDD6 CKE ≤ 0.2V
Normal 2 mA
3
Low
power 800 uA
Rev. 1.0 / June. 2007 9
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY5V26F(L)F(P)-x(I) Series
AC CHARACTERISTICS I (AC operating conditions unless otherwise noted)
Notes:
1. Assume tR / tF (input rise and fall time) is 1ns. If tR & tF > 1ns, then [(tR+tF)/2-1]ns should be added to the parameter.
2. Access time to be measured with input signals of 1V/ns edge rate, from 0.8V to 0.2V. If tR > 1ns,
then (tR/2-0.5)ns should be ad ded to the para m e ter.
Parameter Sym-
bol
5 6 7 H Unit Note
Min Max Min Max Min Max Min Max
System Clock Cycle Time CL = 3 tCK3 5.0 1000 6.0 1000 7.0 1000 7.5 1000 ns
CL = 2 tCK2 10 10 10 10 ns
Clock High Pulse Width tCHW 1.75-2.0-2.0-2.5-ns 1
Clock Low Pulse Width tCLW 1.75-2.0-2.0-2.5-ns 1
Access Time From Clock CL = 3 tAC3 -4.5-5.4-5.4-5.4ns 2
CL = 2 tAC2 -6.0-6.0-6.0-6.0ns
Data-out Hold Time tOH 2.0 - 2.0 - 2.5 - 2.7 - ns
Data-Input Setup Time tDS 1.5 - 1.5 - 1.5 - 1.5 - ns 1
Data-Input Hold Time tDH 0.8 - 0.8 - 0.8 - 0.8 - ns 1
Address Setup Time tAS 1.5 - 1.5 - 1.5 - 1.5 - ns 1
Address Hold Time tAH 0.8 - 0.8 - 0.8 - 0.8 - ns 1
CKE Setup Time tCKS 1.5 - 1.5 - 1.5 - 1.5 - ns 1
CKE Hold Time tCKH 0.8 - 0.8 - 0.8 - 0.8 - ns 1
Command Setup Time tCS 1.5 - 1.5 - 1.5 - 1.5 - ns 1
Command Hold Time tCH 0.8 - 0.8 - 0.8 - 0.8 - ns 1
CLK to Data Output in Low-Z Time tOLZ 1.0 - 1.0 - 1.5 - 1.5 - ns
CLK to Data Output
in High-Z Time
CL = 3 tOHZ3 -4.5-5.4-5.4-5.4ns
CL = 2 tOHZ2 -6.0-6.0-6.0-6.0ns
Rev. 1.0 / June. 2007 10
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY5V26F(L)F(P)-x(I) Series
AC CHARACTERISTICS II (AC operating conditions unless otherwise noted)
Note:
1. A new command can be given tRRC after self refresh exit.
Parameter Symbol 5 6 7 H Uni
tNot
e
Min Max Min Max Min Max Min Max
RAS Cycle Time Operation tRC 55 - 60 - 63 - 63 - ns
RAS Cycle Time Auto
Refresh tRRC 55 - 60 - 63 - 63 - ns
RAS to CAS Delay tRCD 15 - 18 - 20 - 20 - ns
RAS Active Time tRAS 38.7 100K 42 100K 42 100K 42 120
Kns
RAS Precharge Time tRP 15 - 18 - 20 - 20 - ns
RAS to RAS Bank Active Delay tRRD 10 - 12 - 14 - 15 - ns
CAS to CAS Delay tCCD 1-1-1-1-CLK
Write Command to
Data-In Delay tWTL 0 - 0 - 0 - 0 - CLK
Data-in to Precharge Command tDPL 2-2-2-2-CLK
Data-In to Active Command tDAL tDPL + tRP
DQM to Data-Out Hi-Z tDQZ 2-2-2-2-CLK
DQM to Data-In Mask tDQM 0-0-0-0-CLK
MRS to New Command tMRD 2-2-2-2-CLK
Precharge to Data
Output High-Z CL = 3 tPROZ3 3-3-3-3-CLK
CL = 2 tPROZ2 2-2-2-2-CLK
Power Down Exit Time tDPE 1-1-1-1-CLK
Self Refresh Exit Time tSRE 1-1-1-1-CLK1
Refresh Time tREF -64-64-64-64ms
Rev. 1.0 / June. 2007 11
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY5V26F(L)F(P)-x(I) Series
COMMAND TRUTH TABLE
Command CKEn-1 CKEn CS RAS CAS WE DQM ADDR A10/AP BA Note
Mode Register Set H X L L L L X OP code
No Operation H X HXXXXX
LHHH
Bank Active H X L L H H X RA V
Read HXLHLHXCALV
Read with Autoprecharge H
Write H X LHLLXCA LV
Write with Autoprecharge H
Precharge All Banks HXLLHLXX HX
Precharge selected Bank LV
Burst Stop H X L H H L X X
DQM H X V X
Auto Refresh H H L L L H X X
Burst-Read-Single-WRITEH X LLLLX A9 ball High
(Other balls OP code) MRS
Mode
Self Refresh1
Entry H L L L L H X
X
Exit L H HXXXX
LHHH
Precharge
power down
Entry H L HXXXX
X
LHHH
Exit L H HXXXX
LHHH
Clock Suspend Entry H L HXXXXXLVVV
Exit L H X X
Rev. 1.0 / June. 2007 12
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY5V26F(L)F(P)-x(I) Series
PACKAGE INFORMATION
54 Ball FBGA 8.0mm x 8.0mm
Unit [mm]
1.20 max
0.340
±0.05
0.450
±0.05
8.0
6.40 BSC
0.80(Typ) A1 INDEX MARK
8.00
0.80(Typ)
6.40
4.00 ±0.05
Bottom
View
0.8
3.20 ±0.05
