10/100 PC CARD LAN
MAGNETICS SOLUTIONS
Application Notes
The Pulse 10/100 PC Card modules provide isolation, impedance
matching and noise attenuation in very low profile surface mount
packages. This series provides various transmit turns ratios
designed for use with the IC physical layer solutions offered by
TDK, ICS, QSI and others.
Electrical Functions
Data integrity
- The low profile magnetics modules are 100% tested
to provide high reliable connectivity.
Equipment isolation
– Each module is designed and 100% tested
to provide 1500 Vrms minimum isolation per IEEE 802.3
requirements.
EMI suppression
– High impedance common mode chokes
attenuate signal harmonics which may contribute to radiated and
conducted emissions. Transformer center-taps, when grounded,
provide noise-shunting paths. The H0022 provides a shunt inductor
on the transmit channel for additional noise suppression. Please
note the recommended values and ratings of the bypass capacitors
shown in the application circuit.
Mechanical Attributes
Design Flexibility
– The H0005 is a half port design that offers
additional flexibility in PCB layout. H0010 and H0013 are complete
10/100 single port solutions, offering the smallest over all board
usage. Each device has a .078" (1,98 mm) maximum height
package for use in the most height-restrictive applications. The
H0022 maximum height is .085" (2,16 mm) to facilitate additional
EMI performance with minimal sacrifice in footprint dimensions.
The H0026 provides the industry’s smallest IEEE compliant,
five core design.
Process and Quality Standards
Process Integrity
– The PE-69012, H0001 and H0002 offer
IC-grade transfer molded packages and the H0005 through H0013
offer a bottom fill, leaded header type design. Both designs are
suitable for high temperature IR reflow operations with peak
temperature profiles up to 235°C.
Reliable Solder Connections
– Compliant lead design provides
a flexible lead resulting in excellent solder-joint reliability with
±.004" (0,10 mm) coplanarity.
All leads are solder-plated after final assembly to adhere to
MIL-STD-202 (method 208) for solderability.
Note: All modules are packaged in tubes, unless Tape & Reel is specified.
Please add the suffix “T” such as H0009Tfor Tape & Reel orders.
4 H304.B (1/02)