Contents
Intel® Arria® 10 Device Overview....................................................................................... 3
Key Advantages of Intel Arria 10 Devices........................................................................ 4
Summary of Intel Arria 10 Features................................................................................4
Intel Arria 10 Device Variants and Packages.....................................................................7
Intel Arria 10 GX.................................................................................................7
Intel Arria 10 GT............................................................................................... 11
Intel Arria 10 SX............................................................................................... 14
I/O Vertical Migration for Intel Arria 10 Devices.............................................................. 17
Adaptive Logic Module................................................................................................ 17
Variable-Precision DSP Block........................................................................................18
Embedded Memory Blocks........................................................................................... 20
Types of Embedded Memory............................................................................... 21
Embedded Memory Capacity in Intel Arria 10 Devices............................................ 21
Embedded Memory Configurations for Single-port Mode......................................... 22
Clock Networks and PLL Clock Sources.......................................................................... 22
Clock Networks.................................................................................................22
Fractional Synthesis and I/O PLLs........................................................................22
FPGA General Purpose I/O...........................................................................................23
External Memory Interface.......................................................................................... 24
Memory Standards Supported by Intel Arria 10 Devices......................................... 24
PCIe Gen1, Gen2, and Gen3 Hard IP.............................................................................26
Enhanced PCS Hard IP for Interlaken and 10 Gbps Ethernet............................................. 26
Interlaken Support............................................................................................ 26
10 Gbps Ethernet Support.................................................................................. 26
Low Power Serial Transceivers......................................................................................27
Transceiver Channels......................................................................................... 28
PMA Features................................................................................................... 29
PCS Features....................................................................................................30
SoC with Hard Processor System.................................................................................. 32
Key Advantages of 20-nm HPS............................................................................33
Features of the HPS...........................................................................................35
FPGA Configuration and HPS Booting................................................................... 37
Hardware and Software Development.................................................................. 37
Dynamic and Partial Reconfiguration............................................................................. 37
Dynamic Reconfiguration....................................................................................37
Partial Reconfiguration....................................................................................... 37
Enhanced Configuration and Configuration via Protocol....................................................38
SEU Error Detection and Correction.............................................................................. 39
Power Management.................................................................................................... 39
Incremental Compilation............................................................................................. 40
Document Revision History for Intel Arria 10 Device Overview.......................................... 40
Contents
Intel® Arria® 10 Device Overview Send Feedback
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Intel® Arria® 10 Device Overview
The Intel® Arria® 10 device family consists of high-performance and power-efficient
20 nm mid-range FPGAs and SoCs.
Intel Arria 10 device family delivers:
• Higher performance than the previous generation of mid-range and high-end
FPGAs.
• Power efficiency attained through a comprehensive set of power-saving
technologies.
The Intel Arria 10 devices are ideal for high performance, power-sensitive, midrange
applications in diverse markets.
Table 1. Sample Markets and Ideal Applications for Intel Arria 10 Devices
Market Applications
Wireless • Channel and switch cards in remote radio heads
• Mobile backhaul
Wireline • 40G/100G muxponders and transponders
• 100G line cards
• Bridging
• Aggregation
Broadcast • Studio switches
• Servers and transport
• Videoconferencing
• Professional audio and video
Computing and Storage • Flash cache
• Cloud computing servers
• Server acceleration
Medical • Diagnostic scanners
• Diagnostic imaging
Military • Missile guidance and control
• Radar
• Electronic warfare
• Secure communications
Related Information
•Intel Arria 10 Device Handbook: Known Issues
Lists the planned updates to the Intel Arria 10 Device Handbook chapters.
•Intel Arria 10 GX/GT Device Errata and Design Recommendations
•Intel Arria 10 SX Device Errata and Design Recommendations
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customers are advised to obtain the latest version of device specifications before relying on any published
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Key Advantages of Intel Arria 10 Devices
Table 2. Key Advantages of the Intel Arria 10 Device Family
Advantage Supporting Feature
Enhanced core architecture • Built on TSMC's 20 nm process technology
• 60% higher performance than the previous generation of mid-range FPGAs
• 15% higher performance than the fastest previous-generation FPGA
High-bandwidth integrated
transceivers
• Short-reach rates up to 25.8 Gigabits per second (Gbps)
• Backplane capability up to 12.5 Gbps
• Integrated 10GBASE-KR and 40GBASE-KR4 Forward Error Correction (FEC)
Improved logic integration and
hard IP blocks
• 8-input adaptive logic module (ALM)
• Up to 65.6 megabits (Mb) of embedded memory
• Variable-precision digital signal processing (DSP) blocks
• Fractional synthesis phase-locked loops (PLLs)
• Hard PCI Express Gen3 IP blocks
• Hard memory controllers and PHY up to 2,400 Megabits per second (Mbps)
Second generation hard
processor system (HPS) with
integrated ARM* Cortex*-A9*
MPCore* processor
• Tight integration of a dual-core ARM Cortex-A9 MPCore processor, hard IP, and an
FPGA in a single Intel Arria 10 system-on-a-chip (SoC)
• Supports over 128 Gbps peak bandwidth with integrated data coherency between
the processor and the FPGA fabric
Advanced power savings • Comprehensive set of advanced power saving features
• Power-optimized MultiTrack routing and core architecture
• Up to 40% lower power compared to previous generation of mid-range FPGAs
• Up to 60% lower power compared to previous generation of high-end FPGAs
Summary of Intel Arria 10 Features
Table 3. Summary of Features for Intel Arria 10 Devices
Feature Description
Technology • TSMC's 20-nm SoC process technology
• Allows operation at a lower VCC level of 0.82 V instead of the 0.9 V standard VCC core voltage
Packaging • 1.0 mm ball-pitch Fineline BGA packaging
• 0.8 mm ball-pitch Ultra Fineline BGA packaging
• Multiple devices with identical package footprints for seamless migration between different
FPGA densities
• Devices with compatible package footprints allow migration to next generation high-end
Stratix® 10 devices
• RoHS, leaded(1), and lead-free (Pb-free) options
High-performance
FPGA fabric
• Enhanced 8-input ALM with four registers
• Improved multi-track routing architecture to reduce congestion and improve compilation time
• Hierarchical core clocking architecture
• Fine-grained partial reconfiguration
Internal memory
blocks
• M20K—20-Kb memory blocks with hard error correction code (ECC)
• Memory logic array block (MLAB)—640-bit memory
continued...
(1) Contact Intel for availability.
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Feature Description
Embedded Hard IP
blocks
Variable-precision DSP • Native support for signal processing precision levels from 18 x 19 to
54 x 54
• Native support for 27 x 27 multiplier mode
• 64-bit accumulator and cascade for systolic finite impulse responses
(FIRs)
• Internal coefficient memory banks
• Preadder/subtractor for improved efficiency
• Additional pipeline register to increase performance and reduce
power
• Supports floating point arithmetic:
— Perform multiplication, addition, subtraction, multiply-add,
multiply-subtract, and complex multiplication.
— Supports multiplication with accumulation capability, cascade
summation, and cascade subtraction capability.
— Dynamic accumulator reset control.
— Support direct vector dot and complex multiplication chaining
multiply floating point DSP blocks.
Memory controller DDR4, DDR3, and DDR3L
PCI Express* PCI Express (PCIe*) Gen3 (x1, x2, x4, or x8), Gen2 (x1, x2, x4, or x8)
and Gen1 (x1, x2, x4, or x8) hard IP with complete protocol stack,
endpoint, and root port
Transceiver I/O • 10GBASE-KR/40GBASE-KR4 Forward Error Correction (FEC)
• PCS hard IPs that support:
— 10-Gbps Ethernet (10GbE)
— PCIe PIPE interface
— Interlaken
— Gbps Ethernet (GbE)
— Common Public Radio Interface (CPRI) with deterministic latency
support
— Gigabit-capable passive optical network (GPON) with fast lock-
time support
• 13.5G JESD204b
• 8B/10B, 64B/66B, 64B/67B encoders and decoders
• Custom mode support for proprietary protocols
Core clock networks • Up to 800 MHz fabric clocking, depending on the application:
— 667 MHz external memory interface clocking with 2,400 Mbps DDR4 interface
— 800 MHz LVDS interface clocking with 1,600 Mbps LVDS interface
• Global, regional, and peripheral clock networks
• Clock networks that are not used can be gated to reduce dynamic power
Phase-locked loops
(PLLs)
• High-resolution fractional synthesis PLLs:
— Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)
— Support integer mode and fractional mode
— Fractional mode support with third-order delta-sigma modulation
• Integer PLLs:
— Adjacent to general purpose I/Os
— Support external memory and LVDS interfaces
FPGA General-purpose
I/Os (GPIOs)
• 1.6 Gbps LVDS—every pair can be configured as receiver or transmitter
• On-chip termination (OCT)
• 1.2 V to 3.0 V single-ended LVTTL/LVCMOS interfacing
External Memory
Interface
• Hard memory controller— DDR4, DDR3, and DDR3L support
— DDR4—speeds up to 1,200 MHz/2,400 Mbps
— DDR3—speeds up to 1,067 MHz/2,133 Mbps
• Soft memory controller—provides support for RLDRAM 3(2), QDR IV(2), and QDR II+
continued...
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Feature Description
Low-power serial
transceivers
• Continuous operating range:
— Intel Arria 10 GX—1 Gbps to 17.4 Gbps
— Intel Arria 10 GT—1 Gbps to 25.8 Gbps
• Backplane support:
— Intel Arria 10 GX—up to 12.5
— Intel Arria 10 GT—up to 12.5
• Extended range down to 125 Mbps with oversampling
• ATX transmit PLLs with user-configurable fractional synthesis capability
• Electronic Dispersion Compensation (EDC) support for XFP, SFP+, QSFP, and CFP optical
module
• Adaptive linear and decision feedback equalization
• Transmitter pre-emphasis and de-emphasis
• Dynamic partial reconfiguration of individual transceiver channels
HPS
(Intel Arria 10 SX
devices only)
Processor and system • Dual-core ARM Cortex-A9 MPCore processor—1.2 GHz CPU with
1.5 GHz overdrive capability
• 256 KB on-chip RAM and 64 KB on-chip ROM
• System peripherals—general-purpose timers, watchdog timers, direct
memory access (DMA) controller, FPGA configuration manager, and
clock and reset managers
• Security features—anti-tamper, secure boot, Advanced Encryption
Standard (AES) and authentication (SHA)
• ARM CoreSight* JTAG debug access port, trace port, and on-chip
trace storage
External interfaces • Hard memory interface—Hard memory controller (2,400 Mbps DDR4,
and 2,133 Mbps DDR3), Quad serial peripheral interface (QSPI) flash
controller, NAND flash controller, direct memory access (DMA)
controller, Secure Digital/MultiMediaCard (SD/MMC) controller
• Communication interface— 10/100/1000 Ethernet media access
control (MAC), USB On-The-GO (OTG) controllers, I2C controllers,
UART 16550, serial peripheral interface (SPI), and up to 62
HPS GPIO interfaces (48 direct-share I/Os)
Interconnects to core • High-performance ARM AMBA* AXI bus bridges that support
simultaneous read and write
• HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and
lightweight HPS-to-FPGA bridges that allow the FPGA fabric to issue
transactions to slaves in the HPS, and vice versa
• Configuration bridge that allows HPS configuration manager to
configure the core logic via dedicated 32-bit configuration port
• FPGA-to-HPS SDRAM controller bridge—provides configuration
interfaces for the multiport front end (MPFE) of the HPS SDRAM
controller
Configuration • Tamper protection—comprehensive design protection to protect your valuable IP investments
• Enhanced 256-bit advanced encryption standard (AES) design security with authentication
• Configuration via protocol (CvP) using PCIe Gen1, Gen2, or Gen3
continued...
(2) Intel Arria 10 devices support this external memory interface using hard PHY with soft
memory controller.
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Feature Description
• Dynamic reconfiguration of the transceivers and PLLs
• Fine-grained partial reconfiguration of the core fabric
• Active Serial x4 Interface
Power management • SmartVID
• Low static power device options
• Programmable Power Technology
• Intel Quartus® Prime integrated power analysis
Software and tools • Intel Quartus Prime design suite
• Transceiver toolkit
• Platform Designer system integration tool
• DSP Builder for Intel FPGAs
• OpenCL™ support
• Intel SoC FPGA Embedded Design Suite (EDS)
Related Information
Intel Arria 10 Transceiver PHY Overview
Provides details on Intel Arria 10 transceivers.
Intel Arria 10 Device Variants and Packages
Table 4. Device Variants for the Intel Arria 10 Device Family
Variant Description
Intel Arria 10 GX FPGA featuring 17.4 Gbps transceivers for short reach applications with 12.5 backplane driving
capability.
Intel Arria 10 GT FPGA featuring:
• 17.4 Gbps transceivers for short reach applications with 12.5 backplane driving capability.
• 25.8 Gbps transceivers for supporting CAUI-4 and CEI-25G applications with CFP2 and CFP4
modules.
Intel Arria 10 SX SoC integrating ARM-based HPS and FPGA featuring 17.4 Gbps transceivers for short reach
applications with 12.5 backplane driving capability.
Intel Arria 10 GX
This section provides the available options, maximum resource counts, and package
plan for the Intel Arria 10 GX devices.
The information in this section is correct at the time of publication. For the latest
information and to get more details, refer to the Intel FPGA Product Selector.
Related Information
Intel FPGA Product Selector
Provides the latest information on Intel products.
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Available Options
Figure 1. Sample Ordering Code and Available Options for Intel Arria 10 GX Devices
Family Signature
Transceiver Count
Transceiver
Speed Grade
Package Type
Package Code
Operating Temperature
FPGA Fabric
Speed Grade
Optional Suffix
Indicates specific device
options or shipment method
X : GX variant
17.4 Gbps transceivers
10A : Intel Arria 10
016 : 160K logic elements
022 : 220K logic elements
027 : 270K logic elements
032 : 320K logic elements
048 : 480K logic elements
057 : 570K logic elements
066 : 660K logic elements
090 : 900K logic elements
115 : 1,150K logic elements
N : 48
R : 66
S : 72
U : 96
C : 6
E : 12
H : 24
K : 36
1 (fastest)
4
2
3
F : FineLine BGA (FBGA), 1.0 mm pitch
U : Ultra FineLine BGA (UBGA), 0.8 mm pitch
FBGA Package Type
27 : 672 pins, 27 mm x 27 mm
29 : 780 pins, 29 mm x 29 mm
34 : 1,152 pins, 35 mm x 35 mm
35 : 1,152 pins, 35 mm x 35 mm
36 : 1,152 pins, 35 mm x 35 mm
40 : 1,517 pins, 40 mm x 40 mm
45 : 1,932 pins, 45 mm x 45 mm
UBGA Package Type
19 : 484 pins, 19 mm x 19 mm
I : Industrial (TJ = -40° C to 100° C)
E : Extended (T J = 0° C to 100° C)
M : Military (TJ = -55° C to 125° C)
1 (fastest)
2
3
Power Option
S : Standard
H : High performance
L : Low
SmartVID (speed grades 2 and 3 only)V :
RoHS
G : RoHS6
N : RoHS5
P : Leaded
ES : Engineering sample
10A X F
066 K2S35 I 2ESG
Logic Density
Family Variant
}Contact Altera
for availability
Related Information
Transceiver Performance for Intel Arria 10 GX/SX Devices
Provides more information about the transceiver speed grade.
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Maximum Resources
Table 5. Maximum Resource Counts for Intel Arria 10 GX Devices (GX 160, GX 220, GX
270, GX 320, and GX 480)
Resource Product Line
GX 160 GX 220 GX 270 GX 320 GX 480
Logic Elements (LE) (K) 160 220 270 320 480
ALM 61,510 80,330 101,620 119,900 183,590
Register 246,040 321,320 406,480 479,600 734,360
Memory (Kb) M20K 8,800 11,740 15,000 17,820 28,620
MLAB 1,050 1,690 2,452 2,727 4,164
Variable-precision DSP Block 156 192 830 985 1,368
18 x 19 Multiplier 312 384 1,660 1,970 2,736
PLL Fractional
Synthesis
6 6 8 8 12
I/O 6 6 8 8 12
17.4 Gbps Transceiver 12 12 24 24 36
GPIO (3)288 288 384 384 492
LVDS Pair (4)120 120 168 168 222
PCIe Hard IP Block 1 1 2 2 2
Hard Memory Controller 6 6 8 8 12
(3) The number of GPIOs does not include transceiver I/Os. In the Intel Quartus Prime software,
the number of user I/Os includes transceiver I/Os.
(4) Each LVDS I/O pair can be used as differential input or output.
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Table 6. Maximum Resource Counts for Intel Arria 10 GX Devices (GX 570, GX 660, GX
900, and GX 1150)
Resource Product Line
GX 570 GX 660 GX 900 GX 1150
Logic Elements (LE) (K) 570 660 900 1,150
ALM 217,080 251,680 339,620 427,200
Register 868,320 1,006,720 1,358,480 1,708,800
Memory (Kb) M20K 36,000 42,620 48,460 54,260
MLAB 5,096 5,788 9,386 12,984
Variable-precision DSP Block 1,523 1,687 1,518 1,518
18 x 19 Multiplier 3,046 3,374 3,036 3,036
PLL Fractional
Synthesis
16 16 32 32
I/O 16 16 16 16
17.4 Gbps Transceiver 48 48 96 96
GPIO (3)696 696 768 768
LVDS Pair (4)300 300 384 384
PCIe Hard IP Block 2 2 4 4
Hard Memory Controller 16 16 16 16
Package Plan
Table 7. Package Plan for Intel Arria 10 GX Devices (U19, F27, and F29)
Refer to I/O and High Speed I/O in Intel Arria 10 Devices chapter for the number of 3 V I/O, LVDS I/O, and
LVDS channels in each device package.
Product Line U19
(19 mm × 19 mm,
484-pin UBGA)
F27
(27 mm × 27 mm,
672-pin FBGA)
F29
(29 mm × 29 mm,
780-pin FBGA)
3 V I/O LVDS I/O XCVR 3 V I/O LVDS I/O XCVR 3 V I/O LVDS I/O XCVR
GX 160 48 192 6 48 192 12 48 240 12
GX 220 48 192 6 48 192 12 48 240 12
GX 270 — — — 48 192 12 48 312 12
GX 320 — — — 48 192 12 48 312 12
GX 480 — — — — — — 48 312 12
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Table 8. Package Plan for Intel Arria 10 GX Devices (F34, F35, NF40, and KF40)
Refer to I/O and High Speed I/O in Intel Arria 10 Devices chapter for the number of 3 V I/O, LVDS I/O, and
LVDS channels in each device package.
Product Line F34
(35 mm × 35 mm,
1152-pin FBGA)
F35
(35 mm × 35 mm,
1152-pin FBGA)
KF40
(40 mm × 40 mm,
1517-pin FBGA)
NF40
(40 mm × 40 mm,
1517-pin FBGA)
3 V
I/O
LVDS
I/O
XCVR 3 V
I/O
LVDS
I/O
XCVR 3 V
I/O
LVDS
I/O
XCVR 3 V
I/O
LVDS
I/O
XCVR
GX 270 48 336 24 48 336 24 — — — — — —
GX 320 48 336 24 48 336 24 — — — — — —
GX 480 48 444 24 48 348 36 — — — — — —
GX 570 48 444 24 48 348 36 96 600 36 48 540 48
GX 660 48 444 24 48 348 36 96 600 36 48 540 48
GX 900 — 504 24 — — — — — — — 600 48
GX 1150 — 504 24 — — — — — — — 600 48
Table 9. Package Plan for Intel Arria 10 GX Devices (RF40, NF45, SF45, and UF45)
Refer to I/O and High Speed I/O in Intel Arria 10 Devices chapter for the number of 3 V I/O, LVDS I/O, and
LVDS channels in each device package.
Product Line
RF40
(40 mm × 40 mm,
1517-pin FBGA)
NF45
(45 mm × 45 mm)
1932-pin FBGA)
SF45
(45 mm × 45 mm)
1932-pin FBGA)
UF45
(45 mm × 45 mm)
1932-pin FBGA)
3 V
I/O
LVDS
I/O
XCVR 3 V
I/O
LVDS
I/O
XCVR 3 V
I/O
LVDS
I/O
XCVR 3 V
I/O
LVDS
I/O
XCVR
GX 900 — 342 66 — 768 48 — 624 72 — 480 96
GX 1150 — 342 66 — 768 48 — 624 72 — 480 96
Related Information
I/O and High-Speed Differential I/O Interfaces in Intel Arria 10 Devices chapter, Intel
Arria 10 Device Handbook
Provides the number of 3 V and LVDS I/Os, and LVDS channels for each Intel Arria
10 device package.
Intel Arria 10 GT
This section provides the available options, maximum resource counts, and package
plan for the Intel Arria 10 GT devices.
The information in this section is correct at the time of publication. For the latest
information and to get more details, refer to the Intel FPGA Product Selector.
Related Information
Intel FPGA Product Selector
Provides the latest information on Intel products.
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Available Options
Figure 2. Sample Ordering Code and Available Options for Intel Arria 10 GT Devices
Family Signature
Transceiver Count
Transceiver
Speed Grade
Package Type
Package Code
Operating Temperature
FPGA Fabric
Speed Grade
Optional Suffix
Indicates specific device
options or shipment method
T : GT variant
25.8 Gbps transceivers
10A : Intel Arria 10
090 : 900K logic elements
115 : 1,150K logic elements
S : 72
1 (fastest)
2
F : FineLine BGA (FBGA), 1.0 mm pitch
45 :1,932 pins, 45 mm x 45 mm
E
:
1 (fastest)
2
Power Option
S
: Standard
RoHS
G : RoHS6
N : RoHS5
P : Leaded
ES : Engineering sample
10A TF
115 S2S
40 I2ESG
Logic Density
Family Variant
}Contact Intel
for availability
Extended (TJ = 0° C to 100° C)
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Maximum Resources
Table 10. Maximum Resource Counts for Intel Arria 10 GT Devices
Resource Product Line
GT 900 GT 1150
Logic Elements (LE) (K) 900 1,150
ALM 339,620 427,200
Register 1,358,480 1,708,800
Memory (Kb) M20K 48,460 54,260
MLAB 9,386 12,984
Variable-precision DSP Block 1,518 1,518
18 x 19 Multiplier 3,036 3,036
PLL Fractional Synthesis 32 32
I/O 16 16
Transceiver 17.4 Gbps 72 (5)72 (5)
25.8 Gbps 6 6
GPIO(6) 624 624
LVDS Pair(7) 312 312
PCIe Hard IP Block 4 4
Hard Memory Controller 16 16
Related Information
Intel Arria 10 GT Channel Usage
Configuring GT/GX channels in Intel Arria 10 GT devices.
Package Plan
Table 11. Package Plan for Intel Arria 10 GT Devices
Refer to I/O and High Speed I/O in Intel Arria 10 Devices chapter for the number of 3 V I/O, LVDS I/O, and
LVDS channels in each device package.
Product Line
SF45
(45 mm × 45 mm, 1932-pin FBGA)
3 V I/O LVDS I/O XCVR
GT 900 — 624 72
GT 1150 — 624 72
(5) If all 6 GT channels are in use, 12 of the GX channels are not usable.
(6) The number of GPIOs does not include transceiver I/Os. In the Intel Quartus Prime software,
the number of user I/Os includes transceiver I/Os.
(7) Each LVDS I/O pair can be used as differential input or output.
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Related Information
I/O and High-Speed Differential I/O Interfaces in Intel Arria 10 Devices chapter, Intel
Arria 10 Device Handbook
Provides the number of 3 V and LVDS I/Os, and LVDS channels for each Intel Arria
10 device package.
Intel Arria 10 SX
This section provides the available options, maximum resource counts, and package
plan for the Intel Arria 10 SX devices.
The information in this section is correct at the time of publication. For the latest
information and to get more details, refer to the Intel FPGA Product Selector.
Related Information
Intel FPGA Product Selector
Provides the latest information on Intel products.
Available Options
Figure 3. Sample Ordering Code and Available Options for Intel Arria 10 SX Devices
Family Signature
Transceiver Count
Transceiver
Speed Grade
Package Type
Package Code
Operating Temperature
FPGA Fabric
Speed Grade
Optional Suffix
Indicates specific device
options or shipment method
S : SX variant
(SoC with 17.4 Gbps transceivers)
10A : Intel Arria 10
016 : 160K logic elements
022 : 220K logic elements
027 : 270K logic elements
032 : 320K logic elements
048 : 480K logic elements
057 : 570K logic elements
066 : 660K logic elements
K : 36
N : 48
C : 6
E : 12
H : 24
1 (fastest)
2
3
4
F : FineLine BGA (FBGA), 1.0 mm pitch
U : Ultra FineLine BGA (UBGA), 0.8 mm pitch
FBGA Package Type
27 : 672 pins, 27 mm x 27 mm
29 : 780 pins, 29 mm x 29 mm
34 : 1,152 pins, 35 mm x 35 mm
35 : 1,152 pins, 35 mm x 35 mm
40 : 1,517 pins, 40 mm x 40 mm
UBGA Package Type
19 : 484 pins, 19 mm x 19 mm
I :
E :
M :
1 (fastest)
2
3
Power Option
S : Standard
L : Low
RoHS
G : RoHS6
N : RoHS5
P : Leaded
ES : Engineering sample
10A S F
066 K2S35 I 2ESG
Logic Density
Family Variant
}Contact Intel
for availability
Industrial (TJ = -40° C to 100° C)
Extended (TJ = 0° C to 100° C)
Military (TJ = -55° C to 125° C)
V : SmartVID (speed grades 2 and 3 only)
H : High performance
Related Information
Transceiver Performance for Intel Arria 10 GX/SX Devices
Provides more information about the transceiver speed grade.
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Maximum Resources
Table 12. Maximum Resource Counts for Intel Arria 10 SX Devices
Resource Product Line
SX 160 SX 220 SX 270 SX 320 SX 480 SX 570 SX 660
Logic Elements (LE) (K) 160 220 270 320 480 570 660
ALM 61,510 80,330 101,620 119,900 183,590 217,080 251,680
Register 246,040 321,320 406,480 479,600 734,360 868,320 1,006,720
Memory (Kb) M20K 8,800 11,740 15,000 17,820 28,620 36,000 42,620
MLAB 1,050 1,690 2,452 2,727 4,164 5,096 5,788
Variable-precision DSP Block 156 192 830 985 1,368 1,523 1,687
18 x 19 Multiplier 312 384 1,660 1,970 2,736 3,046 3,374
PLL Fractional
Synthesis
6 6 8 8 12 16 16
I/O 6 6 8 8 12 16 16
17.4 Gbps Transceiver 12 12 24 24 36 48 48
GPIO (8) 288 288 384 384 492 696 696
LVDS Pair (9) 120 120 168 168 174 300 300
PCIe Hard IP Block 1 1 2 2 2 2 2
Hard Memory Controller 6 6 8 8 12 16 16
ARM Cortex-A9 MPCore
Processor
Yes Yes Yes Yes Yes Yes Yes
Package Plan
Table 13. Package Plan for Intel Arria 10 SX Devices (U19, F27, F29, and F34)
Refer to I/O and High Speed I/O in Intel Arria 10 Devices chapter for the number of 3 V I/O, LVDS I/O, and
LVDS channels in each device package.
Product Line U19
(19 mm × 19 mm,
484-pin UBGA)
F27
(27 mm × 27 mm,
672-pin FBGA)
F29
(29 mm × 29 mm,
780-pin FBGA)
F34
(35 mm × 35 mm,
1152-pin FBGA)
3 V
I/O
LVDS
I/O
XCVR 3 V
I/O
LVDS
I/O
XCVR 3 V
I/O
LVDS
I/O
XCVR 3 V
I/O
LVDS
I/O
XCVR
SX 160 48 144 6 48 192 12 48 240 12 — — —
SX 220 48 144 6 48 192 12 48 240 12 — — —
SX 270 — — — 48 192 12 48 312 12 48 336 24
SX 320 — — — 48 192 12 48 312 12 48 336 24
continued...
(8) The number of GPIOs does not include transceiver I/Os. In the Intel Quartus Prime software,
the number of user I/Os includes transceiver I/Os.
(9) Each LVDS I/O pair can be used as differential input or output.
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Product Line U19
(19 mm × 19 mm,
484-pin UBGA)
F27
(27 mm × 27 mm,
672-pin FBGA)
F29
(29 mm × 29 mm,
780-pin FBGA)
F34
(35 mm × 35 mm,
1152-pin FBGA)
3 V
I/O
LVDS
I/O
XCVR 3 V
I/O
LVDS
I/O
XCVR 3 V
I/O
LVDS
I/O
XCVR 3 V
I/O
LVDS
I/O
XCVR
SX 480 — — — — — — 48 312 12 48 444 24
SX 570 — — — — — — — — — 48 444 24
SX 660 — — — — — — — — — 48 444 24
Table 14. Package Plan for Intel Arria 10 SX Devices (F35, KF40, and NF40)
Refer to I/O and High Speed I/O in Intel Arria 10 Devices chapter for the number of 3 V I/O, LVDS I/O, and
LVDS channels in each device package.
Product Line F35
(35 mm × 35 mm,
1152-pin FBGA)
KF40
(40 mm × 40 mm,
1517-pin FBGA)
NF40
(40 mm × 40 mm,
1517-pin FBGA)
3 V I/O LVDS I/O XCVR 3 V I/O LVDS I/O XCVR 3 V I/O LVDS I/O XCVR
SX 270 48 336 24 — — — — — —
SX 320 48 336 24 — — — — — —
SX 480 48 348 36 — — — — — —
SX 570 48 348 36 96 600 36 48 540 48
SX 660 48 348 36 96 600 36 48 540 48
Related Information
I/O and High-Speed Differential I/O Interfaces in Intel Arria 10 Devices chapter, Intel
Arria 10 Device Handbook
Provides the number of 3 V and LVDS I/Os, and LVDS channels for each Intel Arria
10 device package.
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I/O Vertical Migration for Intel Arria 10 Devices
Figure 4. Migration Capability Across Intel Arria 10 Product Lines
• The arrows indicate the migration paths. The devices included in each vertical migration path are shaded.
Devices with fewer resources in the same path have lighter shades.
• To achieve the full I/O migration across product lines in the same migration path, restrict I/Os and
transceivers usage to match the product line with the lowest I/O and transceiver counts.
• An LVDS I/O bank in the source device may be mapped to a 3 V I/O bank in the target device. To use
memory interface clock frequency higher than 533 MHz, assign external memory interface pins only to
banks that are LVDS I/O in both devices.
• There may be nominal 0.15 mm package height difference between some product lines in the same
package type.
• Some migration paths are not shown in the Intel Quartus Prime software Pin Migration View.
Variant Product
Line
Package
U19 F27 F29 F34 F35 KF40 NF40 RF40 NF45 SF45 UF45
Intel® Arria® 10 GX
GX 160
GX 220
GX 270
GX 320
GX 480
GX 570
GX 660
GX 900
GX 1150
Intel Arria 10 GT GT 900
GT 1150
Intel Arria 10 SX
SX 160
SX 220
SX 270
SX 320
SX 480
SX 570
SX 660
Note: To verify the pin migration compatibility, use the Pin Migration View window in the
Intel Quartus Prime software Pin Planner.
Adaptive Logic Module
Intel Arria 10 devices use a 20 nm ALM as the basic building block of the logic fabric.
The ALM architecture is the same as the previous generation FPGAs, allowing for
efficient implementation of logic functions and easy conversion of IP between the
device generations.
The ALM, as shown in following figure, uses an 8-input fracturable look-up table (LUT)
with four dedicated registers to help improve timing closure in register-rich designs
and achieve an even higher design packing capability than the traditional two-register
per LUT architecture.
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Figure 5. ALM for Intel Arria 10 Devices
FPGA Device
1
2
3
4
5
6
7
8
Adaptive
LUT
Full
Adder
Reg
Reg
Full
Adder
Reg
Reg
The Intel Quartus Prime software optimizes your design according to the ALM logic
structure and automatically maps legacy designs into the Intel Arria 10 ALM
architecture.
Variable-Precision DSP Block
The Intel Arria 10 variable precision DSP blocks support fixed-point arithmetic and
floating-point arithmetic.
Features for fixed-point arithmetic:
• High-performance, power-optimized, and fully registered multiplication operations
• 18-bit and 27-bit word lengths
• Two 18 x 19 multipliers or one 27 x 27 multiplier per DSP block
• Built-in addition, subtraction, and 64-bit double accumulation register to combine
multiplication results
• Cascading 19-bit or 27-bit when pre-adder is disabled and cascading 18-bit when
pre-adder is used to form the tap-delay line for filtering applications
• Cascading 64-bit output bus to propagate output results from one block to the
next block without external logic support
• Hard pre-adder supported in 19-bit and 27-bit modes for symmetric filters
• Internal coefficient register bank in both 18-bit and 27-bit modes for filter
implementation
• 18-bit and 27-bit systolic finite impulse response (FIR) filters with distributed
output adder
• Biased rounding support
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Features for floating-point arithmetic:
• A completely hardened architecture that supports multiplication, addition,
subtraction, multiply-add, and multiply-subtract
• Multiplication with accumulation capability and a dynamic accumulator reset
control
• Multiplication with cascade summation capability
• Multiplication with cascade subtraction capability
• Complex multiplication
• Direct vector dot product
• Systolic FIR filter
Table 15. Variable-Precision DSP Block Configurations for Intel Arria 10 Devices
Usage Example Multiplier Size (Bit) DSP Block Resources
Medium precision fixed point Two 18 x 19 1
High precision fixed or Single precision
floating point
One 27 x 27 1
Fixed point FFTs One 19 x 36 with external adder 1
Very high precision fixed point One 36 x 36 with external adder 2
Double precision floating point One 54 x 54 with external adder 4
Table 16. Resources for Fixed-Point Arithmetic in Intel Arria 10 Devices
The table lists the variable-precision DSP resources by bit precision for each Intel Arria 10 device.
Variant Product Line Variable-
precision
DSP Block
Independent Input and Output
Multiplications Operator
18 x 19
Multiplier
Adder Sum
Mode
18 x 18
Multiplier
Adder
Summed with
36 bit Input
18 x 19
Multiplier
27 x 27
Multiplier
AIntel Arria 10
GX
GX 160 156 312 156 156 156
GX 220 192 384 192 192 192
GX 270 830 1,660 830 830 830
GX 320 984 1,968 984 984 984
GX 480 1,368 2,736 1,368 1,368 1,368
GX 570 1,523 3,046 1,523 1,523 1,523
GX 660 1,687 3,374 1,687 1,687 1,687
GX 900 1,518 3,036 1,518 1,518 1,518
GX 1150 1,518 3,036 1,518 1,518 1,518
Intel Arria 10
GT
GT 900 1,518 3,036 1,518 1,518 1,518
GT 1150 1,518 3,036 1,518 1,518 1,518
Intel Arria 10
SX
SX 160 156 312 156 156 156
SX 220 192 384 192 192 192
SX 270 830 1,660 830 830 830
continued...
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Variant Product Line Variable-
precision
DSP Block
Independent Input and Output
Multiplications Operator
18 x 19
Multiplier
Adder Sum
Mode
18 x 18
Multiplier
Adder
Summed with
36 bit Input
18 x 19
Multiplier
27 x 27
Multiplier
SX 320 984 1,968 984 984 984
SX 480 1,368 2,736 1,368 1,368 1,368
SX 570 1,523 3,046 1,523 1,523 1,523
SX 660 1,687 3,374 1,687 1,687 1,687
Table 17. Resources for Floating-Point Arithmetic in Intel Arria 10 Devices
The table lists the variable-precision DSP resources by bit precision for each Intel Arria 10 device.
Variant Product Line Variable-
precision
DSP Block
Single
Precision
Floating-Point
Multiplication
Mode
Single-Precision
Floating-Point
Adder Mode
Single-
Precision
Floating-Point
Multiply
Accumulate
Mode
Peak
Giga Floating-
Point
Operations
per Second
(GFLOPs)
Intel Arria 10
GX
GX 160 156 156 156 156 140
GX 220 192 192 192 192 173
GX 270 830 830 830 830 747
GX 320 984 984 984 984 886
GX 480 1,369 1,368 1,368 1,368 1,231
GX 570 1,523 1,523 1,523 1,523 1,371
GX 660 1,687 1,687 1,687 1,687 1,518
GX 900 1,518 1,518 1,518 1,518 1,366
GX 1150 1,518 1,518 1,518 1,518 1,366
Intel Arria 10
GT
GT 900 1,518 1,518 1,518 1,518 1,366
GT 1150 1,518 1,518 1,518 1,518 1,366
Intel Arria 10
SX
SX 160 156 156 156 156 140
SX 220 192 192 192 192 173
SX 270 830 830 830 830 747
SX 320 984 984 984 984 886
SX 480 1,369 1,368 1,368 1,368 1,231
SX 570 1,523 1,523 1,523 1,523 1,371
SX 660 1,687 1,687 1,687 1,687 1,518
Embedded Memory Blocks
The embedded memory blocks in the devices are flexible and designed to provide an
optimal amount of small- and large-sized memory arrays to fit your design
requirements.
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Types of Embedded Memory
The Intel Arria 10 devices contain two types of memory blocks:
• 20 Kb M20K blocks—blocks of dedicated memory resources. The M20K blocks are
ideal for larger memory arrays while still providing a large number of independent
ports.
• 640 bit memory logic array blocks (MLABs)—enhanced memory blocks that are
configured from dual-purpose logic array blocks (LABs). The MLABs are ideal for
wide and shallow memory arrays. The MLABs are optimized for implementation of
shift registers for digital signal processing (DSP) applications, wide and shallow
FIFO buffers, and filter delay lines. Each MLAB is made up of ten adaptive logic
modules (ALMs). In the Intel Arria 10 devices, you can configure these ALMs as
ten 32 x 2 blocks, giving you one 32 x 20 simple dual-port SRAM block per MLAB.
Embedded Memory Capacity in Intel Arria 10 Devices
Table 18. Embedded Memory Capacity and Distribution in Intel Arria 10 Devices
Variant
Product
Line
M20K MLAB
Total RAM Bit
(Kb)Block RAM Bit (Kb) Block RAM Bit (Kb)
Intel Arria 10 GX GX 160 440 8,800 1,680 1,050 9,850
GX 220 587 11,740 2,703 1,690 13,430
GX 270 750 15,000 3,922 2,452 17,452
GX 320 891 17,820 4,363 2,727 20,547
GX 480 1,431 28,620 6,662 4,164 32,784
GX 570 1,800 36,000 8,153 5,096 41,096
GX 660 2,131 42,620 9,260 5,788 48,408
GX 900 2,423 48,460 15,017 9,386 57,846
GX 1150 2,713 54,260 20,774 12,984 67,244
Intel Arria 10 GT GT 900 2,423 48,460 15,017 9,386 57,846
GT 1150 2,713 54,260 20,774 12,984 67,244
Intel Arria 10 SX SX 160 440 8,800 1,680 1,050 9,850
SX 220 587 11,740 2,703 1,690 13,430
SX 270 750 15,000 3,922 2,452 17,452
SX 320 891 17,820 4,363 2,727 20,547
SX 480 1,431 28,620 6,662 4,164 32,784
SX 570 1,800 36,000 8,153 5,096 41,096
SX 660 2,131 42,620 9,260 5,788 48,408
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Embedded Memory Configurations for Single-port Mode
Table 19. Single-port Embedded Memory Configurations for Intel Arria 10 Devices
This table lists the maximum configurations supported for single-port RAM and ROM modes.
Memory Block Depth (bits) Programmable Width
MLAB 32 x16, x18, or x20
64 (10) x8, x9, x10
M20K 512 x40, x32
1K x20, x16
2K x10, x8
4K x5, x4
8K x2
16K x1
Clock Networks and PLL Clock Sources
The clock network architecture is based on Intel's global, regional, and peripheral
clock structure. This clock structure is supported by dedicated clock input pins,
fractional clock synthesis PLLs, and integer I/O PLLs.
Clock Networks
The Intel Arria 10 core clock networks are capable of up to 800 MHz fabric operation
across the full industrial temperature range. For the external memory interface, the
clock network supports the hard memory controller with speeds up to 2,400 Mbps in a
quarter-rate transfer.
To reduce power consumption, the Intel Quartus Prime software identifies all unused
sections of the clock network and powers them down.
Fractional Synthesis and I/O PLLs
Intel Arria 10 devices contain up to 32 fractional synthesis PLLs and up to 16 I/O PLLs
that are available for both specific and general purpose uses in the core:
• Fractional synthesis PLLs—located in the column adjacent to the transceiver blocks
• I/O PLLs—located in each bank of the 48 I/Os
Fractional Synthesis PLLs
You can use the fractional synthesis PLLs to:
• Reduce the number of oscillators that are required on your board
• Reduce the number of clock pins that are used in the device by synthesizing
multiple clock frequencies from a single reference clock source
(10) Supported through software emulation and consumes additional MLAB blocks.
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The fractional synthesis PLLs support the following features:
• Reference clock frequency synthesis for transceiver CMU and Advanced Transmit
(ATX) PLLs
• Clock network delay compensation
• Zero-delay buffering
• Direct transmit clocking for transceivers
• Independently configurable into two modes:
— Conventional integer mode equivalent to the general purpose PLL
— Enhanced fractional mode with third order delta-sigma modulation
• PLL cascading
I/O PLLs
The integer mode I/O PLLs are located in each bank of 48 I/Os. You can use the I/O
PLLs to simplify the design of external memory and high-speed LVDS interfaces.
In each I/O bank, the I/O PLLs are adjacent to the hard memory controllers and LVDS
SERDES. Because these PLLs are tightly coupled with the I/Os that need to use them,
it makes it easier to close timing.
You can use the I/O PLLs for general purpose applications in the core such as clock
network delay compensation and zero-delay buffering.
Intel Arria 10 devices support PLL-to-PLL cascading.
FPGA General Purpose I/O
Intel Arria 10 devices offer highly configurable GPIOs. Each I/O bank contains 48
general purpose I/Os and a high-efficiency hard memory controller.
The following list describes the features of the GPIOs:
• Consist of 3 V I/Os for high-voltage application and LVDS I/Os for differential
signaling
— Up to two 3 V I/O banks, available in some devices, that support up to 3 V I/O
standards
— LVDS I/O banks that support up to 1.8 V I/O standards
• Support a wide range of single-ended and differential I/O interfaces
• LVDS speeds up to 1.6 Gbps
• Each LVDS pair of pins has differential input and output buffers, allowing you to
configure the LVDS direction for each pair.
• Programmable bus hold and weak pull-up
• Programmable differential output voltage (VOD) and programmable pre-emphasis
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• Series (RS) and parallel (RT) on-chip termination (OCT) for all I/O banks with OCT
calibration to limit the termination impedance variation
• On-chip dynamic termination that has the ability to swap between series and
parallel termination, depending on whether there is read or write on a common
bus for signal integrity
• Easy timing closure support using the hard read FIFO in the input register path,
and delay-locked loop (DLL) delay chain with fine and coarse architecture
External Memory Interface
Intel Arria 10 devices offer massive external memory bandwidth, with up to seven 32-
bit DDR4 memory interfaces running at up to 2,400 Mbps. This bandwidth provides
additional ease of design, lower power, and resource efficiencies of hardened high-
performance memory controllers.
The memory interface within Intel Arria 10 FPGAs and SoCs delivers the highest
performance and ease of use. You can configure up to a maximum width of 144 bits
when using the hard or soft memory controllers. If required, you can bypass the hard
memory controller and use a soft controller implemented in the user logic.
Each I/O contains a hardened DDR read/write path (PHY) capable of performing key
memory interface functionality such as read/write leveling, FIFO buffering to lower
latency and improve margin, timing calibration, and on-chip termination.
The timing calibration is aided by the inclusion of hard microcontrollers based on
Intel's Nios® II technology, specifically tailored to control the calibration of multiple
memory interfaces. This calibration allows the Intel Arria 10 device to compensate for
any changes in process, voltage, or temperature either within the Intel Arria 10 device
itself, or within the external memory device. The advanced calibration algorithms
ensure maximum bandwidth and robust timing margin across all operating conditions.
In addition to parallel memory interfaces, Intel Arria 10 devices support serial memory
technologies such as the Hybrid Memory Cube (HMC). The HMC is supported by the
Intel Arria 10 high-speed serial transceivers which connect up to four HMC links, with
each link running at data rates up to 15 Gbps.
Related Information
External Memory Interface Spec Estimator
Provides a parametric tool that allows you to find and compare the performance of
the supported external memory interfaces in IntelFPGAs.
Memory Standards Supported by Intel Arria 10 Devices
The I/Os are designed to provide high performance support for existing and emerging
external memory standards.
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Table 20. Memory Standards Supported by the Hard Memory Controller
This table lists the overall capability of the hard memory controller. For specific details, refer to the External
Memory Interface Spec Estimator and Intel Arria 10 Device Datasheet.
Memory Standard Rate Support Ping Pong PHY Support Maximum Frequency
(MHz)
DDR4 SDRAM Quarter rate Yes 1,067
— 1,200
DDR3 SDRAM Half rate Yes 533
— 667
Quarter rate Yes 1,067
— 1,067
DDR3L SDRAM Half rate Yes 533
— 667
Quarter rate Yes 933
— 933
LPDDR3 SDRAM Half rate — 533
Quarter rate — 800
Table 21. Memory Standards Supported by the Soft Memory Controller
Memory Standard Rate Support Maximum Frequency
(MHz)
RLDRAM 3 (11)Quarter rate 1,200
QDR IV SRAM(11)Quarter rate 1,067
QDR II SRAM Full rate 333
Half rate 633
QDR II+ SRAM Full rate 333
Half rate 633
QDR II+ Xtreme SRAM Full rate 333
Half rate 633
Table 22. Memory Standards Supported by the HPS Hard Memory Controller
The hard processor system (HPS) is available in Intel Arria 10 SoC devices only.
Memory Standard Rate Support Maximum Frequency
(MHz)
DDR4 SDRAM Half rate 1,200
DDR3 SDRAM Half rate 1,067
DDR3L SDRAM Half rate 933
(11) Intel Arria 10 devices support this external memory interface using hard PHY with soft
memory controller.
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Related Information
Intel Arria 10 Device Datasheet
Lists the memory interface performance according to memory interface standards,
rank or chip select configurations, and Intel Arria 10 device speed grades.
PCIe Gen1, Gen2, and Gen3 Hard IP
Intel Arria 10 devices contain PCIe hard IP that is designed for performance and
ease-of-use:
• Includes all layers of the PCIe stack—transaction, data link and physical layers.
• Supports PCIe Gen3, Gen2, and Gen1 Endpoint and Root Port in x1, x2, x4, or x8
lane configuration.
• Operates independently from the core logic—optional configuration via protocol
(CvP) allows the PCIe link to power up and complete link training in less than
100 ms while the Intel Arria 10 device completes loading the programming file for
the rest of the FPGA.
• Provides added functionality that makes it easier to support emerging features
such as Single Root I/O Virtualization (SR-IOV) and optional protocol extensions.
• Provides improved end-to-end datapath protection using ECC.
• Supports FPGA configuration via protocol (CvP) using PCIe at Gen3, Gen2, or
Gen1 speed.
Related Information
PCS Features on page 30
Enhanced PCS Hard IP for Interlaken and 10 Gbps Ethernet
Interlaken Support
The Intel Arria 10 enhanced PCS hard IP provides integrated Interlaken PCS
supporting rates up to 25.8 Gbps per lane.
The Interlaken PCS is based on the proven functionality of the PCS developed for
Intel’s previous generation FPGAs, which demonstrated interoperability with Interlaken
ASSP vendors and third-party IP suppliers. The Interlaken PCS is present in every
transceiver channel in Intel Arria 10 devices.
Related Information
PCS Features on page 30
10 Gbps Ethernet Support
The Intel Arria 10 enhanced PCS hard IP supports 10GBASE-R PCS compliant with
IEEE 802.3 10 Gbps Ethernet (10GbE). The integrated hard IP support for 10GbE and
the 10 Gbps transceivers save external PHY cost, board space, and system power.
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The scalable hard IP supports multiple independent 10GbE ports while using a single
PLL for all the 10GBASE-R PCS instantiations, which saves on core logic resources and
clock networks:
• Simplifies multiport 10GbE systems compared to XAUI interfaces that require an
external XAUI-to-10G PHY.
• Incorporates Electronic Dispersion Compensation (EDC), which enables direct
connection to standard 10 Gbps XFP and SFP+ pluggable optical modules.
• Supports backplane Ethernet applications and includes a hard 10GBASE-KR
Forward Error Correction (FEC) circuit that you can use for 10 Gbps and 40 Gbps
applications.
The 10 Gbps Ethernet PCS hard IP and 10GBASE-KR FEC are present in every
transceiver channel.
Related Information
PCS Features on page 30
Low Power Serial Transceivers
Intel Arria 10 FPGAs and SoCs include lowest power transceivers that deliver high
bandwidth, throughput and low latency.
Intel Arria 10 devices deliver the industry's lowest power consumption per transceiver
channel:
• 12.5 Gbps transceivers at as low as 242 mW
• 10 Gbps transceivers at as low as 168 mW
• 6 Gbps transceivers at as low as 117 mW
Intel Arria 10 transceivers support various data rates according to application:
• Chip-to-chip and chip-to-module applications—from 1 Gbps up to 25.8 Gbps
• Long reach and backplane applications—from 1 Gbps up to 12.5 with advanced
adaptive equalization
• Critical power sensitive applications—from 1 Gbps up to 11.3 Gbps using lower
power modes
The combination of 20 nm process technology and architectural advances provide the
following benefits:
• Significant reduction in die area and power consumption
• Increase of up to two times in transceiver I/O density compared to previous
generation devices while maintaining optimal signal integrity
• Up to 72 total transceiver channels—you can configure up to 6 of these channels
to run as fast as 25.8 Gbps
• All channels feature continuous data rate support up to the maximum rated speed
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Figure 6. Intel Arria 10 Transceiver Block Architecture
ATX
PLL
fPLL
fPLL
ATX
PLL
FPGA
Fabric
PCS
PCS
PCS
PCS
PCS
PCS
Transceiver PMA TX/RX
Transceiver PMA TX/RX
Transceiver PMA TX/RX
Transceiver PMA TX/RX
Transceiver PMA TX/RX
Transceiver PMA TX/RX
Flexible Clock Distribution Network
Transceiver Channels
All transceiver channels feature a dedicated Physical Medium Attachment (PMA) and a
hardened Physical Coding Sublayer (PCS).
• The PMA provides primary interfacing capabilities to physical channels.
• The PCS typically handles encoding/decoding, word alignment, and other pre-
processing functions before transferring data to the FPGA core fabric.
A transceiver channel consists of a PMA and a PCS block. Most transceiver banks have
6 channels. There are some transceiver banks that contain only 3 channels.
A wide variety of bonded and non-bonded data rate configurations is possible using a
highly configurable clock distribution network. Up to 80 independent transceiver data
rates can be configured.
The following figures are graphical representations of top views of the silicon die,
which correspond to reverse views for flip chip packages. Different Intel Arria 10
devices may have different floorplans than the ones shown in the figures.
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Figure 7. Device Chip Overview for Intel Arria 10 GX and GT Devices
Core Logic Fabric
M20K Internal Memory Blocks
Transceiver Channels
Hard IP Per Transceiver: Standard PCS and Enhanced PCS Hard IPs
PCI Express Gen3 Hard IP
Fractional PLLs
M20K Internal Memory Blocks
PCI Express Gen3 Hard IP
Variable Precision DSP Blocks
I/O PLLs
Hard Memory Controllers, General-Purpose I/O Cells, LVDS
M20K Internal Memory BlocksM20K Internal Memory Blocks
Variable Precision DSP Blocks
Core Logic Fabric
I/O PLLs
Hard Memory Controllers, General-Purpose I/O Cells, LVDS
M20K Internal Memory BlocksM20K Internal Memory Blocks
Variable Precision DSP Blocks
Transceiver Channels
Hard IP Per Transceiver: Standard PCS and Enhanced PCS Hard IPs
PCI Express Gen3 Hard IP
Fractional PLLs
PCI Express Gen3 Hard IP
Hard PCS
Hard PCS
Hard PCS
Hard PCS
Hard PCS
Hard PCS
Hard PCS
Hard PCS
Hard PCS Transceiver PMA
Transceiver PMA
Transceiver PMA
Transceiver PMA
Transceiver PMA
Transceiver PMA
Transceiver PMA
Transceiver PMA
Transceiver PMA
Transceiver Clock Networks
fPLL
ATX (LC)
Transmit
PLL
fPLL
ATX (LC)
Transmit
PLL
fPLL
ATX (LC)
Transmit
PLL
Unused transceiver channels
can be used as additional
transceiver transmit PLLs
Figure 8. Device Chip Overview for Intel Arria 10 SX Devices
Core Logic Fabric
M20K Internal Memory Blocks
Transceiver Channels
Hard IP Per Transceiver: Standard PCS and Enhanced PCS Hard IPs
PCI Express Gen3 Hard IP
Fractional PLLs
M20K Internal Memory Blocks
PCI Express Gen3 Hard IP
Variable Precision DSP Blocks
I/O PLLs
Hard Memory Controllers, General-Purpose I/O Cells, LVDS
Hard Processor
Subsystem, Dual-Core
ARM Cortex A9
M20K Internal Memory BlocksM20K Internal Memory Blocks
Variable Precision DSP Blocks
Core Logic Fabric
I/O PLLs
Hard Memory Controllers, General-Purpose I/O Cells, LVDS
M20K Internal Memory BlocksM20K Internal Memory Blocks
Variable Precision DSP Blocks
Transceiver Channels
Hard IP Per Transceiver: Standard PCS and Enhanced PCS Hard IPs
PCI Express Gen3 Hard IP
Fractional PLLs
PCI Express Gen3 Hard IP
Hard PCS
Hard PCS
Hard PCS
Hard PCS
Hard PCS
Hard PCS
Hard PCS
Hard PCS
Hard PCS Transceiver PMA
Transceiver PMA
Transceiver PMA
Transceiver PMA
Transceiver PMA
Transceiver PMA
Transceiver PMA
Unused transceiver channels
can be used as additional
transceiver transmit PLLs
Transceiver PMA
Transceiver PMA
Transceiver Clock Networks
fPLL
ATX (LC)
Transmit
PLL
fPLL
ATX (LC)
Transmit
PLL
fPLL
ATX (LC)
Transmit
PLL
PMA Features
Intel Arria 10 transceivers provide exceptional signal integrity at data rates up to
25.8 Gbps. Clocking options include ultra-low jitter ATX PLLs (LC tank based), clock
multiplier unit (CMU) PLLs, and fractional PLLs.
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Each transceiver channel contains a channel PLL that can be used as the CMU PLL or
clock data recovery (CDR) PLL. In CDR mode, the channel PLL recovers the receiver
clock and data in the transceiver channel. Up to 80 independent data rates can be
configured on a single Intel Arria 10 device.
Table 23. PMA Features of the Transceivers in Intel Arria 10 Devices
Feature Capability
Chip-to-Chip Data Rates 1 Gbps to 17.4 Gbps (Intel Arria 10 GX devices)
1 Gbps to 25.8 Gbps (Intel Arria 10 GT devices)
Backplane Support Drive backplanes at data rates up to 12.5 Gbps
Optical Module Support SFP+/SFP, XFP, CXP, QSFP/QSFP28, CFP/CFP2/CFP4
Cable Driving Support SFP+ Direct Attach, PCI Express over cable, eSATA
Transmit Pre-Emphasis 4-tap transmit pre-emphasis and de-emphasis to compensate for system channel loss
Continuous Time Linear
Equalizer (CTLE)
Dual mode, high-gain, and high-data rate, linear receive equalization to compensate for
system channel loss
Decision Feedback Equalizer
(DFE)
7-fixed and 4-floating tap DFE to equalize backplane channel loss in the presence of
crosstalk and noisy environments
Variable Gain Amplifier Optimizes the signal amplitude prior to the CDR sampling and operates in fixed and
adaptive modes
Altera Digital Adaptive
Parametric Tuning (ADAPT)
Fully digital adaptation engine to automatically adjust all link equalization parameters—
including CTLE, DFE, and variable gain amplifier blocks—that provide optimal link margin
without intervention from user logic
Precision Signal Integrity
Calibration Engine (PreSICE)
Hardened calibration controller to quickly calibrate all transceiver control parameters on
power-up, which provides the optimal signal integrity and jitter performance
Advanced Transmit (ATX)
PLL
Low jitter ATX (LC tank based) PLLs with continuous tuning range to cover a wide range of
standard and proprietary protocols
Fractional PLLs On-chip fractional frequency synthesizers to replace on-board crystal oscillators and reduce
system cost
Digitally Assisted Analog
CDR
Superior jitter tolerance with fast lock time
Dynamic Partial
Reconfiguration
Allows independent control of the Avalon memory-mapped interface of each transceiver
channel for the highest transceiver flexibility
Multiple PCS-PMA and PCS-
PLD interface widths
8-, 10-, 16-, 20-, 32-, 40-, or 64-bit interface widths for flexibility of deserialization width,
encoding, and reduced latency
PCS Features
This table summarizes the Intel Arria 10 transceiver PCS features. You can use the
transceiver PCS to support a wide range of protocols ranging from 1 Gbps to
25.8 Gbps.
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PCS Description
Standard PCS • Operates at a data rate up to 12 Gbps
• Supports protocols such as PCI-Express, CPRI 4.2+, GigE, IEEE 1588 in Hard PCS
• Implements other protocols using Basic/Custom (Standard PCS) transceiver
configuration rules.
Enhanced PCS • Performs functions common to most serial data industry standards, such as word
alignment, encoding/decoding, and framing, before data is sent or received off-chip
through the PMA
• Handles data transfer to and from the FPGA fabric
• Handles data transfer internally to and from the PMA
• Provides frequency compensation
• Performs channel bonding for multi-channel low skew applications
PCIe Gen3 PCS • Supports the seamless switching of Data and Clock between the Gen1, Gen2, and Gen3
data rates
• Provides support for PIPE 3.0 features
• Supports the PIPE interface with the Hard IP enabled, as well as with the Hard IP
bypassed
Related Information
•PCIe Gen1, Gen2, and Gen3 Hard IP on page 26
•Interlaken Support on page 26
•10 Gbps Ethernet Support on page 26
PCS Protocol Support
This table lists some of the protocols supported by the Intel Arria 10 transceiver PCS.
For more information about the blocks in the transmitter and receiver data paths,
refer to the related information.
Protocol Data Rate
(Gbps)
Transceiver IP PCS Support
PCIe Gen3 x1, x2, x4, x8 8.0 Native PHY (PIPE) Standard PCS and PCIe
Gen3 PCS
PCIe Gen2 x1, x2, x4, x8 5.0 Native PHY (PIPE) Standard PCS
PCIe Gen1 x1, x2, x4, x8 2.5 Native PHY (PIPE) Standard PCS
1000BASE-X Gigabit Ethernet 1.25 Native PHY Standard PCS
1000BASE-X Gigabit Ethernet with
IEEE 1588v2
1.25 Native PHY Standard PCS
10GBASE-R 10.3125 Native PHY Enhanced PCS
10GBASE-R with IEEE 1588v2 10.3125 Native PHY Enhanced PCS
10GBASE-R with KR FEC 10.3125 Native PHY Enhanced PCS
10GBASE-KR and 1000BASE-X 10.3125 1G/10GbE and 10GBASE-KR PHY Standard PCS and
Enhanced PCS
Interlaken (CEI-6G/11G) 3.125 to 17.4 Native PHY Enhanced PCS
SFI-S/SFI-5.2 11.2 Native PHY Enhanced PCS
10G SDI 10.692 Native PHY Enhanced PCS
continued...
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Protocol Data Rate
(Gbps)
Transceiver IP PCS Support
CPRI 6.0 (64B/66B) 0.6144 to
10.1376
Native PHY Enhanced PCS
CPRI 4.2 (8B/10B) 0.6144 to
9.8304
Native PHY Standard PCS
OBSAI RP3 v4.2 0.6144 to 6.144 Native PHY Standard PCS
SD-SDI/HD-SDI/3G-SDI 0.143(12) to
2.97
Native PHY Standard PCS
Related Information
Intel Arria 10 Transceiver PHY User Guide
Provides more information about the supported transceiver protocols and PHY IP,
the PMA architecture, and the standard, enhanced, and PCIe Gen3 PCS
architecture.
SoC with Hard Processor System
Each SoC device combines an FPGA fabric and a hard processor system (HPS) in a
single device. This combination delivers the flexibility of programmable logic with the
power and cost savings of hard IP in these ways:
• Reduces board space, system power, and bill of materials cost by eliminating a
discrete embedded processor
• Allows you to differentiate the end product in both hardware and software, and to
support virtually any interface standard
• Extends the product life and revenue through in-field hardware and software
updates
(12) The 0.143 Gbps data rate is supported using oversampling of user logic that you must
implement in the FPGA fabric.
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Figure 9. HPS Block Diagram
This figure shows a block diagram of the HPS with the dual ARM Cortex-A9 MPCore processor.
ARM Cortex-A9 QSPI Flash
Control
UART
(x2)
ARM Cortex-A9
512 KB L2 Cache
EMAC (x3)
JTAG Debug/
Trace
USB OTG
(x2)
I2C
(x5)
Hard Processor System (HPS)
256 KB
RAM
Timers
(x11)
LW HPS to
Core Bridge
HPS to Core
Bridge
Core to HPS
Bridge MPFE
32 KB L1 Cache 32 KB L1 Cache
NEON FPU NEON FPU
AXI 32 AXI 32/64/128 AXI 32/64/128
A
C
P
SPI
(x2)
NAND Flash
with ECC
With integrated DMA
To hard memory
controller
SD/SDIO/
MMC
DMA
(8 Channels)
Dedicated
HPS I/O
FPGA
Configuration
Key Advantages of 20-nm HPS
The 20-nm HPS strikes a balance between enabling maximum software compatibility
with 28-nm SoCs while still improving upon the 28-nm HPS architecture. These
improvements address the requirements of the next generation target markets such
as wireless and wireline communications, compute and storage equipment, broadcast
and military in terms of performance, memory bandwidth, connectivity via backplane
and security.
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Table 24. Improvements in 20 nm HPS
This table lists the key improvements of the 20 nm HPS compared to the 28 nm HPS.
Advantages/
Improvements
Description
Increased performance and
overdrive capability
While the nominal processor frequency is 1.2 GHz, the 20 nm HPS offers an “overdrive”
feature which enables a higher processor operating frequency. This requires a higher supply
voltage value that is unique to the HPS and may require a separate regulator.
Increased processor memory
bandwidth and DDR4
support
Up to 64-bit DDR4 memory at 2,400 Mbps support is available for the processor. The hard
memory controller for the HPS comprises a multi-port front end that manages connections
to a single port memory controller. The multi-port front end allows logic core and the HPS
to share ports and thereby the available bandwidth of the memory controller.
Flexible I/O sharing An advanced I/O pin muxing scheme allows improved sharing of I/O between the HPS and
the core logic. The following types of I/O are available for SoC:
• 17 dedicated I/Os—physically located inside the HPS block and are not accessible to
logic within the core. The 17 dedicated I/Os are used for HPS clock, resets, and
interfacing with boot devices, QSPI, and SD/MMC.
• 48 direct shared I/O—located closest to the HPS block and are ideal for high speed HPS
peripherals such as EMAC, USB, and others. There is one bank of 48 I/Os that supports
direct sharing where the 48 I/Os can be shared 12 I/Os at a time.
• Standard (shared) I/O—all standard I/Os can be shared by the HPS peripherals and any
logic within the core. For designs where more than 48 I/Os are required to fully use all
the peripherals in the HPS, these I/Os can be connected through the core logic.
EMAC core Three EMAC cores are available in the HPS. The EMAC cores enable an application to
support two redundant Ethernet connections; for example, backplane, or two EMAC cores
for managing IEEE 1588 time stamp information while allowing a third EMAC core for debug
and configuration. All three EMACs can potentially share the same time stamps, simplifying
the 1588 time stamping implementation. A new serial time stamp interface allows core
logic to access and read the time stamp values. The integrated EMAC controllers can be
connected to external Ethernet PHY through the provided MDIO or I2C interface.
On-chip memory The on-chip memory is updated to 256 KB support and can support larger data sets and
real time algorithms.
ECC enhancements Improvements in L2 Cache ECC management allow identification of errors down to the
address level. ECC enhancements also enable improved error injection and status reporting
via the introduction of new memory mapped access to syndrome and data signals.
HPS to FPGA Interconnect
Backbone
Although the HPS and the Logic Core can operate independently, they are tightly coupled
via a high-bandwidth system interconnect built from high-performance ARM AMBA AXI bus
bridges. IP bus masters in the FPGA fabric have access to HPS bus slaves via the FPGA-to-
HPS interconnect. Similarly, HPS bus masters have access to bus slaves in the core fabric
via the HPS-to-FPGA bridge. Both bridges are AMBA AXI-3 compliant and support
simultaneous read and write transactions. Up to three masters within the core fabric can
share the HPS SDRAM controller with the processor. Additionally, the processor can be used
to configure the core fabric under program control via a dedicated 32-bit configuration port.
FPGA configuration and HPS
booting
The FPGA fabric and HPS in the SoCs are powered independently. You can reduce the clock
frequencies or gate the clocks to reduce dynamic power.
You can configure the FPGA fabric and boot the HPS independently, in any order, providing
you with more design flexibility.
Security New security features have been introduced for anti-tamper management, secure boot,
encryption (AES), and authentication (SHA).
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Features of the HPS
The HPS has the following features:
• 1.2-GHz, dual-core ARM Cortex-A9 MPCore processor with up to 1.5-GHz via
overdrive
— ARMv7-A architecture that runs 32-bit ARM instructions, 16-bit and 32-bit
Thumb instructions, and 8-bit Java byte codes in Jazelle style
— Superscalar, variable length, out-of-order pipeline with dynamic branch
prediction
— Instruction Efficiency 2.5 MIPS/MHz, which provides total performance of 7500
MIPS at 1.5 GHz
• Each processor core includes:
— 32 KB of L1 instruction cache, 32 KB of L1 data cache
— Single- and double-precision floating-point unit and NEON media engine
— CoreSight debug and trace technology
— Snoop Control Unit (SCU) and Acceleration Coherency Port (ACP)
• 512 KB of shared L2 cache
• 256 KB of scratch RAM
• Hard memory controller with support for DDR3, DDR4 and optional error
correction code (ECC) support
• Multiport Front End (MPFE) Scheduler interface to the hard memory controller
• 8-channel direct memory access (DMA) controller
• QSPI flash controller with SIO, DIO, QIO SPI Flash support
• NAND flash controller (ONFI 1.0 or later) with DMA and ECC support, updated to
support 8 and 16-bit Flash devices and new command DMA to offload CPU for fast
power down recovery
• Updated SD/SDIO/MMC controller to eMMC 4.5 with DMA with CE-ATA digital
command support
• 3 10/100/1000 Ethernet media access control (MAC) with DMA
• 2 USB On-the-Go (OTG) controllers with DMA
• 5 I2C controllers (3 can be used by EMAC for MIO to external PHY)
• 2 UART 16550 Compatible controllers
• 4 serial peripheral interfaces (SPI) (2 Master, 2 Slaves)
• 62 programmable general-purpose I/Os, which includes 48 direct share I/Os that
allows the HPS peripherals to connect directly to the FPGA I/Os
• 7 general-purpose timers
• 4 watchdog timers
• Anti-tamper, Secure Boot, Encryption (AES) and Authentication (SHA)
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System Peripherals and Debug Access Port
Each Ethernet MAC, USB OTG, NAND flash controller, and SD/MMC controller module
has an integrated DMA controller. For modules without an integrated DMA controller,
an additional DMA controller module provides up to eight channels of high-bandwidth
data transfers. Peripherals that communicate off-chip are multiplexed with other
peripherals at the HPS pin level. This allows you to choose which peripherals interface
with other devices on your PCB.
The debug access port provides interfaces to industry standard JTAG debug probes
and supports ARM CoreSight debug and core traces to facilitate software development.
HPS–FPGA AXI Bridges
The HPS–FPGA bridges, which support the Advanced Microcontroller Bus Architecture
(AMBA) Advanced eXtensible Interface (AXI™) specifications, consist of the following
bridges:
• FPGA-to-HPS AMBA AXI bridge—a high-performance bus supporting 32, 64, and
128 bit data widths that allows the FPGA fabric to issue transactions to slaves in
the HPS.
• HPS-to-FPGA Avalon/AMBA AXI bridge—a high-performance bus supporting 32,
64, and 128 bit data widths that allows the HPS to issue transactions to slaves in
the FPGA fabric.
• Lightweight HPS-to-FPGA AXI bridge—a lower latency 32 bit width bus that allows
the HPS to issue transactions to soft peripherals in the FPGA fabric. This bridge is
primarily used for control and status register (CSR) accesses to peripherals in the
FPGA fabric.
The HPS–FPGA AXI bridges allow masters in the FPGA fabric to communicate with
slaves in the HPS logic, and vice versa. For example, the HPS-to-FPGA AXI bridge
allows you to share memories instantiated in the FPGA fabric with one or both
microprocessors in the HPS, while the FPGA-to-HPS AXI bridge allows logic in the
FPGA fabric to access the memory and peripherals in the HPS.
Each HPS–FPGA bridge also provides asynchronous clock crossing for data transferred
between the FPGA fabric and the HPS.
HPS SDRAM Controller Subsystem
The HPS SDRAM controller subsystem contains a multiport SDRAM controller and DDR
PHY that are shared between the FPGA fabric (through the FPGA-to-HPS SDRAM
interface), the level 2 (L2) cache, and the level 3 (L3) system interconnect. The
FPGA-to-HPS SDRAM interface supports AMBA AXI and Avalon® Memory-Mapped
(Avalon-MM) interface standards, and provides up to six individual ports for access by
masters implemented in the FPGA fabric.
The HPS SDRAM controller supports up to 3 masters (command ports), 3x 64-bit read
data ports and 3x 64-bit write data ports.
To maximize memory performance, the SDRAM controller subsystem supports
command and data reordering, deficit round-robin arbitration with aging, and
high-priority bypass features.
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FPGA Configuration and HPS Booting
The FPGA fabric and HPS in the SoC FPGA must be powered at the same time. You can
reduce the clock frequencies or gate the clocks to reduce dynamic power.
Once powered, the FPGA fabric and HPS can be configured independently thus
providing you with more design flexibility:
• You can boot the HPS independently. After the HPS is running, the HPS can fully or
partially reconfigure the FPGA fabric at any time under software control. The HPS
can also configure other FPGAs on the board through the FPGA configuration
controller.
• Configure the FPGA fabric first, and then boot the HPS from memory accessible to
the FPGA fabric.
Hardware and Software Development
For hardware development, you can configure the HPS and connect your soft logic in
the FPGA fabric to the HPS interfaces using the Platform Designer system integration
tool in the Intel Quartus Prime software.
For software development, the ARM-based SoC FPGA devices inherit the rich software
development ecosystem available for the ARM Cortex-A9 MPCore processor. The
software development process for Intel SoC FPGAs follows the same steps as those for
other SoC devices from other manufacturers. Support for Linux*, VxWorks*, and other
operating systems are available for the SoC FPGAs. For more information on the
operating systems support availability, contact the Intel FPGA sales team.
You can begin device-specific firmware and software development on the Intel SoC
FPGA Virtual Target. The Virtual Target is a fast PC-based functional simulation of a
target development system—a model of a complete development board. The Virtual
Target enables the development of device-specific production software that can run
unmodified on actual hardware.
Dynamic and Partial Reconfiguration
The Intel Arria 10 devices support dynamic and partial reconfiguration. You can use
dynamic and partial reconfiguration simultaneously to enable seamless reconfiguration
of both the device core and transceivers.
Dynamic Reconfiguration
You can reconfigure the PMA and PCS blocks while the device continues to operate.
This feature allows you to change the data rates, protocol, and analog settings of a
channel in a transceiver bank without affecting on-going data transfer in other
transceiver banks. This feature is ideal for applications that require dynamic
multiprotocol or multirate support.
Partial Reconfiguration
Using partial reconfiguration, you can reconfigure some parts of the device while
keeping the device in operation.
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Instead of placing all device functions in the FPGA fabric, you can store some functions
that do not run simultaneously in external memory and load them only when required.
This capability increases the effective logic density of the device, and lowers cost and
power consumption.
In the Intel solution, you do not have to worry about intricate device architecture to
perform a partial reconfiguration. The partial reconfiguration capability is built into the
Intel Quartus Prime design software, making such time-intensive task simple.
Intel Arria 10 devices support partial reconfiguration in the following configuration
options:
• Using an internal host:
— All supported configuration modes where the FPGA has access to external
memory devices such as serial and parallel flash memory.
— Configuration via Protocol [CvP (PCIe)].
• Using an external host—passive serial (PS), fast passive parallel (FPP) x8,
FPP x16, and FPP x32 I/O interfaces.
Enhanced Configuration and Configuration via Protocol
Table 25. Configuration Schemes and Features of Intel Arria 10 Devices
Intel Arria 10 devices support 1.8 V programming voltage and several configuration schemes.
Scheme Data
Width
Max Clock
Rate
(MHz)
Max Data
Rate
(Mbps)
(13)
Decompression Design
Security (
14)
Partial
Reconfiguration
(15)
Remote
System
Update
JTAG 1 bit 33 33 — — Yes (16)—
Active Serial (AS)
through the
EPCQ-L
configuration
device
1 bit,
4 bits
100 400 Yes Yes Yes (16)Yes
Passive serial (PS)
through CPLD or
external
microcontroller
1 bit 100 100 Yes Yes Yes (16)Parallel
Flash
Loader
(PFL)
Intel
FPGA IP
core
Fast passive
parallel (FPP)
8 bits 100 3200 Yes Yes Yes (17)PFL Intel
FPGA IP
continued...
(13) Enabling either compression or design security features affects the maximum data rate. Refer
to the Intel Arria 10 Device Datasheet for more information.
(14) Encryption and compression cannot be used simultaneously.
(15) Partial reconfiguration is an advanced feature of the device family. If you are interested in
using partial reconfiguration, contact Intel for support.
(16) Partial configuration can be performed only when it is configured as internal host.
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Scheme Data
Width
Max Clock
Rate
(MHz)
Max Data
Rate
(Mbps)
(13)
Decompression Design
Security (
14)
Partial
Reconfiguration
(15)
Remote
System
Update
through CPLD or
external
microcontroller
16 bits coreYes Yes
32 bits Yes Yes
Configuration via
HPS
16 bits 100 3200 Yes Yes Yes (17)—
32 bits Yes Yes
Configuration via
Protocol [CvP
(PCIe*)]
x1, x2,
x4, x8
lanes
— 8000 Yes Yes Yes (16)—
You can configure Intel Arria 10 devices through PCIe using Configuration via Protocol
(CvP). The Intel Arria 10 CvP implementation conforms to the PCIe 100 ms
power-up-to-active time requirement.
Related Information
Configuration via Protocol (CvP) Implementation in Intel FPGAs User Guide
Provides more information about the CvP configuration scheme.
SEU Error Detection and Correction
Intel Arria 10 devices offer robust and easy-to-use single-event upset (SEU) error
detection and correction circuitry.
The detection and correction circuitry includes protection for Configuration RAM
(CRAM) programming bits and user memories. The CRAM is protected by a
continuously running CRC error detection circuit with integrated ECC that
automatically corrects one or two errors and detects higher order multi-bit errors.
When more than two errors occur, correction is available through reloading of the core
programming file, providing a complete design refresh while the FPGA continues to
operate.
The physical layout of the Intel Arria 10 CRAM array is optimized to make the majority
of multi-bit upsets appear as independent single-bit or double-bit errors which are
automatically corrected by the integrated CRAM ECC circuitry. In addition to the CRAM
protection, the M20K memory blocks also include integrated ECC circuitry and are
layout-optimized for error detection and correction. The MLAB does not have ECC.
Power Management
Intel Arria 10 devices leverage the advanced 20 nm process technology, a low 0.9 V
core power supply, an enhanced core architecture, and several optional power
reduction techniques to reduce total power consumption by as much as 40%
compared to Arria V devices and as much as 60% compared to Stratix V devices.
(13) Enabling either compression or design security features affects the maximum data rate. Refer
to the Intel Arria 10 Device Datasheet for more information.
(14) Encryption and compression cannot be used simultaneously.
(15) Partial reconfiguration is an advanced feature of the device family. If you are interested in
using partial reconfiguration, contact Intel for support.
(17) Supported at a maximum clock rate of 100 MHz.
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The optional power reduction techniques in Intel Arria 10 devices include:
•SmartVID—a code is programmed into each device during manufacturing that
allows a smart regulator to operate the device at lower core VCC while maintaining
performance
•Programmable Power Technology—non-critical timing paths are identified by
the Intel Quartus Prime software and the logic in these paths is biased for low
power instead of high performance
•Low Static Power Options—devices are available with either standard static
power or low static power while maintaining performance
Furthermore, Intel Arria 10 devices feature Intel’s industry-leading low power
transceivers and include a number of hard IP blocks that not only reduce logic
resources but also deliver substantial power savings compared to soft
implementations. In general, hard IP blocks consume up to 90% less power than the
equivalent soft logic implementations.
Incremental Compilation
The Intel Quartus Prime software incremental compilation feature reduces compilation
time and helps preserve performance to ease timing closure. The incremental
compilation feature enables the partial reconfiguration flow for Intel Arria 10 devices.
Incremental compilation supports top-down, bottom-up, and team-based design flows.
This feature facilitates modular, hierarchical, and team-based design flows where
different designers compile their respective design sections in parallel. Furthermore,
different designers or IP providers can develop and optimize different blocks of the
design independently. These blocks can then be imported into the top level project.
Document Revision History for Intel Arria 10 Device Overview
Document
Version
Changes
2020.10.20 Corrected the maximum count of LVDS pairs for the Intel Arria 10 GX 570, GX 660, SX 570, and SX
660 product lines from 324 pairs to 300 pairs.
2018.12.06 • Added links to Intel Arria 10 device errata documents.
• Removed automotive temperature option from the Intel Arria 10 GX devices.
• Removed –3 fabric speed grade from the Intel Arria 10 GT devices.
• Updated power options for the Intel Arria 10 GX and GT devices.
2018.04.09 Updated the lowest VCC from 0.83 V to 0.82 V in the topic listing a summary of the device features.
Date Version Changes
January 2018 2018.01.17 • Updated the maximum data rate for HPS (Intel Arria 10 SX devices
external memory interface DDR3 controller from 2,166 Mbps to 2,133
Mbps.
• Updated maximum frequency supported for half rate QDRII and QDRII
+ SRAM to 633 MHz in Memory Standards Supported by the Soft
Memory Controller table.
• Updated transceiver backplane capability to 12.5 Gbps.
• Removed transceiver speed grade 5 in Sample Ordering Core and
Available Options for Intel Arria 10 GX Devices figure.
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Date Version Changes
• Removed package code 40, low static power, SmartVID, industrial, and
military operating temperature support from Sample Ordering Core and
Available Options for Intel Arria 10 GT Devices figure.
• Updated short reach transceiver rate for Intel Arria 10 GT devices to
25.8 Gbps.
• Removed On-Die Instrumentation — EyeQ and Jitter Margin Tool
support from PMA Features of the Transceivers in Intel Arria 10 Devices
table.
September 2017 2017.09.20 Updated the maximum speed of the DDR4 external memory interface from
1,333 MHz/2,666 Mbps to 1,200 MHz/2,400 Mbps.
July 2017 2017.07.13 Corrected the automotive temperature range in the figure showing the
available options for the Intel Arria 10 GX devices from "-40°C to 100°C"
to "-40°C to 125°C".
July 2017 2017.07.06 Added automotive temperature option to Intel Arria 10 GX device family.
May 2017 2017.05.08 • Corrected protocol names with "1588" to "IEEE 1588v2".
• Updated the vertical migration table to remove vertical migration
between Intel Arria 10 GX and Intel Arria 10 SX device variants.
• Removed all "Preliminary" marks.
March 2017 2017.03.15 • Removed the topic about migration from Intel Arria 10 to Intel Stratix
10 devices.
• Rebranded as Intel.
October 2016 2016.10.31 • Removed package F36 from Intel Arria 10 GX devices.
• Updated Intel Arria 10 GT sample ordering code and maximum GX
transceiver count. Intel Arria 10 GT devices are available only in the
SF45 package option with a maximum of 72 transceivers.
May 2016 2016.05.02 • Updated the FPGA Configuration and HPS Booting topic.
• Remove VCC PowerManager from the Summary of Features, Power
Management and Arria 10 Device Variants and packages topics. This
feature is no longer supported in Arria 10 devices.
• Removed LPDDR3 from the Memory Standards Supported by the HPS
Hard Memory Controller table in the Memory Standards Supported by
Intel Arria 10 Devices topic. This standard is only supported by the
FPGA.
• Removed transceiver speed grade 5 from the Device Variants and
Packages topic for Arria 10 GX and SX devices.
February 2016 2016.02.11 • Changed the maximum Arria 10 GT datarate to 25.8 Gbps and the
minimum datarate to 1 Gbps globally.
• Revised the state for Core clock networks in the Summary of Features
topic.
• Changed the transceiver parameters in the "Summary of Features for
Arria 10 Devices" table.
• Changed the transceiver parameters in the "Maximum Resource Counts
for Arria 10 GT Devices" table.
• Changed the package availability for GT devices in the "Package Plan
for Arria 10 GT Devices" table.
• Changed the package configurations for GT devices in the "Migration
Capability Across Arria 10 Product Lines" figure.
• Changed transceiver parameters in the "Low Power Serial Transceivers"
section.
• Changed the transceiver descriptions in the "Device Variants for the
Arria 10 Device Family" table.
• Changed the "Sample Ordering Code and Available Options for Arria 10
GT Devices" figure.
• Changed the datarates for GT devices in the "PMA Features" section.
• Changed the datarates for GT devices in the "PCS Features" section.
continued...
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Date Version Changes
December 2015 2015.12.14 • Updated the number of M20K memory blocks for Arria 10 GX 660 from
2133 to 2131 and corrected the total RAM bit from 48,448 Kb to
48,408 Kb.
• Corrected the number of DSP blocks for Arria 10 GX 660 from 1688 to
1687 in the table listing floating-point arithmetic resources.
November 2015 2015.11.02 • Updated the maximum resources for Arria 10 GX 220, GX 320, GX 480,
GX 660, SX 220, SX 320, SX 480, and SX 660.
• Updated resource count for Arria 10 GX 320, GX 480, GX 660, SX 320,
SX 480, a SX 660 devices in Number of Multipliers in Intel Arria 10
Devices table.
• Updated the available options for Arria 10 GX, GT, and SX.
• Changed instances of Quartus II to Quartus Prime.
June 2015 2015.06.15 Corrected label for Intel Arria 10 GT product lines in the vertical migration
figure.
May 2015 2015.05.15 Corrected the DDR3 half rate and quarter rate maximum frequencies in the
table that lists the memory standards supported by the Intel Arria 10 hard
memory controller.
May 2015 2015.05.04 • Added support for 13.5G JESD204b in the Summary of Features table.
• Added a link to Arria 10 GT Channel Usage in the Arria 10 GT Package
Plan topic.
• Added a note to the table, Maximum Resource Counts for Arria 10 GT
devices.
• Updated the power requirements of the transceivers in the Low Power
Serial Transceivers topic.
January 2015 2015.01.23 • Added floating point arithmetic features in the Summary of Features
table.
• Updated the total embedded memory from 38.38 megabits (Mb) to
65.6 Mb.
• Updated the table that lists the memory standards supported by Intel
Arria 10 devices.
• Removed support for DDR3U, LPDDR3 SDRAM, RLDRAM 2, and DDR2.
• Moved RLDRAM 3 support from hard memory controller to soft memory
controller. RLDRAM 3 support uses hard PHY with soft memory
controller.
• Added soft memory controller support for QDR IV.
• Updated the maximum resource count table to include the number of
hard memory controllers available in each device variant.
• Updated the transceiver PCS data rate from 12.5 Gbps to 12 Gbps.
• Updated the max clock rate of PS, FPP x8, FPP x16, and Configuration
via HPS from 125 MHz to 100 MHz.
• Added a feature for fractional synthesis PLLs: PLL cascading.
• Updated the HPS programmable general-purpose I/Os from 54 to 62.
September 2014 2014.09.30 • Corrected the 3 V I/O and LVDS I/O counts for F35 and F36 packages
of Arria 10 GX.
• Corrected the 3 V I/O, LVDS I/O, and transceiver counts for the NF40
package of the Arria GX 570 and 660.
• Removed 3 V I/O, LVDS I/O, and transceiver counts for the NF40
package of the Arria GX 900 and 1150. The NF40 package is not
available for Arria 10 GX 900 and 1150.
continued...
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Date Version Changes
August 2014 2014.08.18 • Updated Memory (Kb) M20K maximum resources for Arria 10 GX 660
devices from 42,660 to 42,620.
• Added GPIO columns consisting of LVDS I/O Bank and 3V I/O Bank in
the Package Plan table.
• Added how to use memory interface clock frequency higher than 533
MHz in the I/O vertical migration.
• Added information to clarify that RLDRAM3 support uses hard PHY with
soft memory controller.
• Added variable precision DSP blocks support for floating-point
arithmetic.
June 2014 2014.06.19 Updated number of dedicated I/Os in the HPS block to 17.
February 2014 2014.02.21 Updated transceiver speed grade options for GT devices in Figure 2.
February 2014 2014.02.06 Updated data rate for Arria 10 GT devices from 28.1 Gbps to 28.3 Gbps.
December 2013 2013.12.10 • Updated the HPS memory standards support from LPDDR2 to LPDDR3.
• Updated HPS block diagram to include dedicated HPS I/O and FPGA
Configuration blocks as well as repositioned SD/SDIO/MMC, DMA, SPI
and NAND Flash with ECC blocks .
December 2013 2013.12.02 Initial release.
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