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Features and Benefits
Geartooth Sensor
Zero Speed Detection
Insensitive to Orientation
Short Circuit Protection
Self-Adjusting Magnetic Range
On-chip 10 bit A/D Converter
High Speed Operation
No Chopper Delay
Applications
Geartooth Sensor
Speed Sensor
Camshaft Sensor
Direction Detection*
*See applications example
Ordering Code
Product Code Temperature Code Package Code Option Code Packing Form Code
MLX90217 L UA CAA-000 BU
MLX90217 L UA CCA-000 BU
Legend:
Temperature Code: L for Temperature Range -40°C to 150°C
Package Code: UA for UA package
Option Code: AAA-xxx: Die version
xxx-000: Standard version
Packing Form: BU for Bulk
Ordering example: MLX90217LUA-CAA-000-BU
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10-Bit
ADC
4-Bit
ADC
Functional Diagram
Hall
Plate
Amplifier
Description
The MLX90217 is a self adjusting digital output
rotary position gear tooth sensor designed for use
in automotive camshaft sensing as well as other
speed sensing applications. It is designed to be
used with a bias magnet south facing the back
(non-marked) side of the IC. The device has an
open collector output which is short circuit
protected.
Voltage
Regulator
Logic
Protected
Output
The MLX90217 is a sophisticated IC featuring an
on-chip 10-bit A/D Converter and logic that acts
as a digital sample and hold circuit. A separate 4-
bit A/D converter provides a fixed hysteresis. The
90217 does not have a chopper delay. The 90217
uses a single Hall plate which is immune to rotary
alignment problems. The bias magnet can be
from 50 to 400mT.
1 2
3
Pin 1 - V
DD
(Supply)
Pin 2 - V
SS
(Ground)
Pin 3 - Output
Note: Static sensitive device, please observe ESD
precautions.
As the signal is sampled, the logic recognizes an
increasing or decreasing flux density. The output
will turn on (B
OP
) after the flux has reached its
peak and decreased by an amount equal to the
hysteresis. Similarly the output will turn off (B
RP
)
after the flux has reached its minimum value and
increased by an amount equal to the hysteresis.
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MLX90217 Electrical Specifications
DC Operating Parameters TA = -40oC to 150oC, VDD = 3.5V to 24V (unless otherwise specified).
Parameter Symbol Test
Conditions Min
Typ
Max
U
ni
t
s
S
upp
l
y
V
o
l
t
a
g
e
V
DD
O
p
e
r
a
t
i
ng
3.5
-
24
V
S
upp
l
y
Current
I
DD
V
DD
=
12
V
1.5
3.0
4.5
m
A
S
upp
l
y
Current
I
DD
V
DD
= 3.5V to
24
V
1
-
6
m
A
L
ea
k
a
g
e
Current
I
LEAK
V
OUT
= 3.5V to
24
V
-
-
10
μA
Output Current
I
OUT
O
p
e
r
a
t
i
ng
-
-
25
m
A
Output
S
a
t
u
r
a
t
i
on
V
o
l
t
a
g
e
V
SAT
V
DD
= 12V, I
OUT
=
25
m
A
-
-
600
m
V
Output Short C
i
r
c
u
i
t
Current
I
FAULT
F
a
u
l
t
50
100
150
m
A
Output Short C
i
r
c
u
i
t
Shutdown T
FAULT
F
a
u
l
t
100
-
200
S
C
l
o
c
k
Frequency
f
CLK
O
p
e
r
a
t
i
ng
300
500
800
kH
z
Output
R
i
s
e
T
i
m
e
t
r
V
DD
=12V
R
1
= 880
Ω
C
1
=
20p
f
-
400
n
S
Output
F
a
ll
T
i
m
e
t
f
V
DD
=12V
R
1
= 880
Ω
C
1
=
20p
f
-
400
n
S
B
a
nd
w
i
d
t
h
BW
O
p
e
r
a
t
i
ng
-
-
15
kH
z
T
h
e
r
m
a
l
R
e
s
i
s
t
a
n
c
e
R
TH
O
p
e
r
a
t
i
ng
-
-
200
o
C
/W
a
tt
MLX90217 Magnetic Specifications
DC Operating Parameters TA = -40oC to 150oC, VDD = 3.5V to 24V (Unless otherwise specified)
Parameter Symbol Test
Conditions Min
Typ
Max
U
ni
t
s
Back
B
i
a
s
Range
B
BIAS
O
p
e
r
a
t
i
ng
-
30
-
400
m
T
L
i
n
ea
r
R
e
g
i
on
V
DD
=
12
V
50
-
500
m
T
Hy
s
t
e
r
e
s
i
s
B
hys
(CAA-000)
1.8
3.5
10
m
T
(CCA-000)
3.8 5.5 12
mT
Note:
1mT=10Gauss
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Performance Graphs
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Absolute Maximum
S
upp
l
y
V
o
l
t
a
g
e
(
O
p
e
r
a
t
i
ng
)
,
V
DD
S
upp
l
y
Current
(
F
a
u
l
t)
,
I
DD
Output Current
(
F
a
u
l
t)
,
I
O
UT
Output Current
(
F
a
u
l
t)
,
I
f
a
u
l
t
Output
V
o
l
t
a
g
e
,
V
O
UT
Power
D
i
ss
i
p
a
t
i
on,
P
D
O
p
e
r
a
t
i
ng
Temperature Range,
T
A
Storage Temperature Range,
T
S
M
a
x
i
m
un
J
un
c
t
i
on
Temp,
T
J
Mar/12
9
0217
t Geartooth Sensor
R
atings
30
V
50
m
A
30
m
A
50
m
A
30
V
100
m
W
- 40°C to
150°C
- 65°C to
150°C
175
°
C
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Application Notes
Maximum dynamic range is 500 mT. The
hysteresis is fixed at 5.0 mT. Best angular
accuracy will be obtained when the magnetic
circuit provides peak magnetic flux at the chip
near the high end of the linear range of 500 mT.
EMC protection using external components are
recommended. Two possibilities are shown on
the following page. Normally the South pole faces
the unbranded side of the device. A North pole
will enable a test sequence used in factory
testing.
Unique Features
The output is reset to the high state at power on
(output driver is off) whatever the field is. The
output only changes after the first min is detected.
The reset state holds no information about the
field. If the supply of the chip is raised slowly, the
reset state is not stable. This has been observed
at 0 field but it should be the same with small and
large fields.
Gear tooth sensors often need to be adjusted
after the module is assembled to align the
magnet with differential Hall plates or orient with
teeth. However the MLX90217 is “self adjusting”
over a wide range of back bias flux eliminating
the need for any trimming in the application. The
magnet may be glued to the back surface (non
branded side) of the IC using a cyanoacrylate
adhesive or suitable epoxy.
3901090217
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MLX90217
Hall-Effect Cam Sensor
Applications
Examples
3901090217
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MLX90217
Hall-Effect Cam Sensor
Physical
Characteristics
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Standard information regarding manufacturability of Melexis products
with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
• IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
• EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
• EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
• EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
• EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
• EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and
qualification tests have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding
assurance of adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For
more information on qualifications of RoHS compliant products (RoHS = European directive on the
Restriction Of the use of certain Hazardous Substances) please visit the quality page on our
website: http://www.melexis.com/quality.aspx
ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor
products.
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Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions
appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by
description regarding the information set forth herein or regarding the freedom of the described
devices from patent infringement. Melexis reserves the right to change specifications and prices at
any time and without notice. Therefore, prior to designing this product into a system, it is
necessary to check with Melexis for current information. This product is intended for use in normal
commercial applications. Applications requiring extended temperature range, unusual
environmental requirements, or high reliability applications, such as military, medical life-support or
life-sustaining equipment are specifically not recommended without additional processing by
Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis
shall not be liable to recipient or any third party for any damages, including but not limited to
personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect,
special incidental or consequential damages, of any kind, in connection with or arising out of the
furnishing, performance or use of the technical data herein. No obligation or liability to recipient or
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© 2012 Melexis NV. All rights reserved.
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