ZiLOG Worldwide Headquarters • 532 Race Street • San Jose, CA 95126-3432
www.ZiLOG.com
Product Specification
PS021802-1005
ZHX2022
FIR Transceiver
PS021802-1005
This publication is subject to replacement by a later edition. To determine whether
a later edition exists, or to request copies of publications, contact:
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532 Race Street
San Jose, CA 95126-3432
www.ZiLOG.com
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products and/or service names mentioned herein may be trademarks of the companies with which
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©2005 by ZiLOG, Inc. All rights reserved. Information in this publication concerning the devices,
applications, or technology described is intended to suggest possible uses and may be superseded.
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ZHX2022
FIR Transceiver
PS021802-1005
iii
Table of Contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Parts Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinout and Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical and Timing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended Circuit Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
I/O and Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Mode Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Setting to the High Bandwidth Mode (0.576 Mbit/s to 4.0 Mbit/s) . . . . . . . . 14
Setting to the Lower Bandwidth Mode (2.4 kbit/s to 115.2 kbit/s) . . . . . . . . 15
Recommended SMD Pad Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
ZHX2022 Soldering and Cleaning Recommendations . . . . . . . . . . . . . . . . . . . 16
Reflow Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Manual Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Current Derating Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Mechanical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Taping Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Customer Feedback Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Customer Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Product Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Return Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Problem Description or Suggestion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
ZHX2022
FIR Transceiver
PS021802-1005
iv
List of Figures
Figure 1. FIR Transceiver Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Figure 2. Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Figure 3. Application Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 4. Mode Switching Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 5. Pad Layout (mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 6. Temperature Derating Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 7. Package Dimensions in mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 8. Reel Dimensions in mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 9. Tape Dimensions in mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 10. Tape Dimensions in mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
List of Tables
Table 1. Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 2. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Eye Safety Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Electrical Characteristics—Transceiver . . . . . . . . . . . . . . . . . . . . . . . 6
Table 5. Optoelectronic Characteristics—Receiver . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Optoelectronic Characteristics—Transmitter . . . . . . . . . . . . . . . . . . . 9
Table 7. Recommended Application Circuit Components . . . . . . . . . . . . . . . 13
Table 8. Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
ZHX2022
FIR Transceiver
PS021802-1005
1
Description
Whether you need to mount the IrDA transceiver so that its communication is par-
allel or perpendicular to the plane of the PCB, the ZiLOG ZHX2022 is the solution
for applications in portable products, such as USB Adapters, notebook PCs, print-
ers, mobile phones, digital cameras, handheld devices, or personal data assis-
tants (PDAs). Designed to support all IrDA data rates up to 4 Mbits/second as well
as LocalTalk™ and Sharp ASK™ modes, the transceiver combines an infrared
emitting diode (IRED) emitter, a PIN photodiode detector, an IRED driver, and an
integrated AGC (Automatic Gain Control) and amplification receive circuit in a sin-
gle, miniature package.
The ZiLOG ZHX2022 provides an efficient implementation of the IrDA-Data 1.4
standard in a small footprint format. Application circuit space is also minimized, as
only three external components (current-limiting resistor, terminating resistor, and
a decoupling capacitor) are required to implement a complete IrDA transceiver
solution.
The ZHX2022 is capable of both mode select and legacy-mode bandwidth
switching.
Features
•
Supply voltage 2.7 V to 5.5 V, operating idle current (receive mode) < 3 mA,
shutdown current < 5 µA over full temperature range
•
Surface mount package, top and side view, 9.7 mm x 4.7 mm x 4.0 mm
•
Operating temperature: –30 °C to 85 °C
•
Storage temperature: –40 °C to 85 °C
•
Transmitter wavelength typically 886 nm, supporting IrDA® and Remote
Control
•
Tri-state-receiver output, floating in shut down with a weak pull-up
•
Eye safety class 1 (IEC60825-1, ed. 2001), limited LED on-time, LED current
is controlled, no single fault to be considered
ZHX2022
FIR Transceiver
PS021802-1005
2
Applications
•
Notebook computers, desktop PCs, palmtop computers (Win CE, Palm PC),
PDAs
•
Digital still and video cameras
•
Printers, fax machines, photocopiers, screen projectors
•
Telecommunication products (cellular phones, pagers)
•
Internet TV boxes, video conferencing systems
•
External infrared adapters (dongles)
•
Medical and industrial data collection
Parts Table
All ZiLOG devices are available lead free. ZHX2022 has
always been lead free. These devices meet or exceed RoHS
Directive 2002/95/EC. For additional information, please
see the ZiLOG Quality and Reliability web page at
http://www.zilog.com/quality/index.asp.
Part Description
Quantity/
Reel
ZHX2022MV040THTR Oriented in carrier tape for side-view surface
mounting
1,000 pieces
ZHX2022TV040THTR Oriented in carrier tape for top-view surface
mounting
1,000 pieces
Note:
ZHX2022
FIR Transceiver
PS021802-1005
4
Table 1. Pin Description
Pin Number Function Description I/O Active
1V
CC2 LEDA Connect LEDA directly to either VCC1 (regulated) or
to VCC2 (unregulated) or battery. For voltages higher
than 3.6 V, an external resistor might be necessary
for reducing the internal power dissipation.
2 LEC IRED cathode, internally connected to driver
transistor. Do not connect.
3 Txd This input is used to transmit serial data when SD is
low. An on-chip protection circuit disables the LED
driver if the Txd pin is asserted for longer than 80 µs.
When used in conjunction with the SD pin, this pin is
also used to receiver speed mode.
IHIGH
4 Rxd Received Data Output, push-pull CMOS driver output
capable of driving a standard CMOS or TTL load. No
external pull-up or pull-down resistor is required.
Floating with a weak pull-up of 500 kΩ (typical) in
shutdown mode.
OLOW
5 SD Shutdown, also used for dynamic mode switching.
Setting this pin active places the module into
shutdown mode. On the falling edge of this signal, the
state of the Txd pin is sampled and used to set
receiver low bandwidth (Txd=Low, SIR) or high
bandwidth (Txd=High, MIR and FIR) mode. Will be
overwritten by the mode pin input, which must float,
when dynamic programming is used.
IHIGH
6V
CC1 Supply voltage (regulated)
7 Mode HIGH: High speed mode, MIR and FIR; LOW: Low
speed mode, SIR only (see “Mode Switching” on
page 13).
I
7 Mode The mode pin can also be used to indicate the
dynamically programmed mode. The maximum load
is limited to 50 pF. High indicates FIR/MIR mode, low
indicates SIR mode
O
8 GND Ground
ZHX2022
FIR Transceiver
PS021802-1005
5
Electrical and Timing Specifications
Reference point: Ground Pin 8, unless otherwise noted
Typical values are for design aid only, not guaranteed nor
subject to production testing.
Table 2. Absolute Maximum Ratings
Parameter Test Conditions Symbol Min Typical Max Unit
Supply voltage range, transceiver 0 V < VCC2 < 6 V VCC1 –0.5 +6 V
Supply voltage range, transmitter 0 V < VCC1 < 6 V VCC2 –0.5 +6.5 V
Input currents For all pins, except IRED
anode pin
10 mA
Output sinking current 25 mA
Power dissipation See derating curve
(Figure 6).
PD500 mW
Junction temperature TJ125 °C
Ambient temperature range
(operating)
Tamb –30 +85 °C
Storage temperature range Tstg –40 +85 °C
Soldering temperature See “ZHX2022 Soldering
and Cleaning
Recommendations” on
page 16.
240 °C
Average output current IRED(DC) 125 mA
Repetitive pulse output current < 90 µs, ton < 20% IRED(RP) 600 mA
IRED anode voltage VIREDA –0.5 +6.5 V
Voltage at all inputs and outputs Vin > VCC1 is allowed VIN 5.5 V
Load at mode pin when used as
mode indicator
50 pF
Notes:
ZHX2022
FIR Transceiver
PS021802-1005
6
Reference point pin: GND, unless otherwise noted
Typical values are for design aid only, not guaranteed nor
subject to production testing.
Tamb=25 °C, VCC=2.7 V to 5.5 V, unless otherwise noted.
Typical values are for design aid only, not guaranteed nor
subject to production testing.
Table 3. Eye Safety Information
Parameter Test Conditions Symbol Min Typical Max Unit
Virtual source size Method: (1 - 1/e)
encircled energy
d2.5 2.8 mm
Maximum Intensity for Class 1 IEC60825-1 or
EN60825-1,
edition January 2001
Ie*
500**
mW/sr
* Due to the internal limitation measures, the device is a “class1” device.
** IrDA specifies the maximum intensity with 500 mW/sr.
Table 4. Electrical Characteristics—Transceiver
Parameter Test Conditions Symbol Min Typical Max Unit
Supply voltage VCC 2.7 5.5 V
Dynamic supply current
(Idle)1SD=Low, Ee=0 klx ICC 23mA
Dynamic supply current
(Idle)1SD=Low, E =1 klx2ICC 23mA
1) Receive mode only. In transmit mode, add additional 85 mA (typical) for IRED current. Add Rxd output
current depending on Rxd load.
2) Standard Illuminant A
3) The typical threshold level is between 0.5 x VCC2 (VCC=3 V) and 0.4 x VCC (VCC=5.5 V). It is
recommended to use the specified min/max values to avoid increased operating current.
ESD > 4000 V (HBM), Latchup > 200 mA
EMI immunity > 550 V/m for GSM frequency and other mobile telephone bands / (700 MHz to 2000 MHz,
no external shield)
Notes:
Notes:
ZHX2022
FIR Transceiver
PS021802-1005
7
Shutdown supply current SD=High, Mode=Floating
Ee=0 klx
ISD 2.0 µA
SD=High, Mode=Floating
Ee=1 klx2ISD 2.5 µA
SD=High, T=85 °C,
Mode=Floating, not ambient
light sensitive
ISD 5µA
Operating temperature range TA–25 +85 °C
Output voltage low IOL=1 mA, Cload=15 pF VOL 0.4 V
Output voltage high IOH=500 µA, Cload=15 pF VOH 0.8 x VCC V
IOH=250 µA, Cload=15 pF VOH 0.9 x VCC V
Output Rxd current limitation
high state
Short to Ground 20 mΑ
Output Rxd current limitation
low state
Short to VCC1 20 mΑ
Rxd to VCC1 impedance SD=High RRxd 400 500 600 kΩ
Input voltage low
(Txd, SD, Mode)
VIL 0.5 0.5 V
Input voltage high
(Txd, SD, Mode)
CMOS level3VIH VCC – 0.5 VCC+0.5 V
TTL level, VCC1=4.5 V VIH 2.4 V
Input leakage current
(Txd, SD)
IL–10 +10 µA
Input leakage current
Mode
IICH –2 +2 µA
Input capacitance
(Txd, SD, Mode)
CI5pF
Table 4. Electrical Characteristics—Transceiver (Continued)
Parameter Test Conditions Symbol Min Typical Max Unit
1) Receive mode only. In transmit mode, add additional 85 mA (typical) for IRED current. Add Rxd output
current depending on Rxd load.
2) Standard Illuminant A
3) The typical threshold level is between 0.5 x VCC2 (VCC=3 V) and 0.4 x VCC (VCC=5.5 V). It is
recommended to use the specified min/max values to avoid increased operating current.
ESD > 4000 V (HBM), Latchup > 200 mA
EMI immunity > 550 V/m for GSM frequency and other mobile telephone bands / (700 MHz to 2000 MHz,
no external shield)
ZHX2022
FIR Transceiver
PS021802-1005
8
Tamb=25 °C, VCC=2.7 V to 5.5 V, unless otherwise noted.
Typical values are for design aid only, not guaranteed nor
subject to production testing.
Table 5. Optoelectronic Characteristics—Receiver
Parameter Test Conditions Symbol Min Typical Max Unit
Minimum detection threshold
irradiance, SIR mode
9.6 kbit/s to 115.2 kbit/s
λ=850 nm to 900 nm
Ee25
(2.5)
35
(3.5)
mW/m2
(µW/cm2)
Minimum detection threshold
irradiance, MIR mode
1.152 Mbit/s
λ=850 nm to 900 nm
Ee65
(6.5)
mW/m2
(µW/cm2)
Minimum detection threshold
irradiance, FIR mode
4.0 Mbit/s
λ=850 nm to 900 nm
Ee80
(8.0)
90
(9.0)
mW/m2
(µW/cm2)
Maximum detection
threshold irradiance
λ=850 nm to 900 nm Ee5
(500)
kW/m2
(mW/cm2)
No detection receiver input
irradiance
*E
e4
(0.4)
mW/m2
(µW/cm2)
Rise time of output signal 10% to 90%, 15 pF tr (Rxd) 10 40 ns
Fall time of output signal 90% to 10%, 15 pF tf (Rxd) 10 40 ns
Rxd pulse width of output
signal, 50% SIR mode
input pulse length
1.4 µs < PWopt < 25 µs
tPW 1.5 1.8 2.1 µs
Rxd pulse width of output
signal, 50% MIR mode
input pulse length
PWopt=217 ns,
1.152 kbit/s
tPW 110 250 270 ns
Rxd pulse width of output
signal, 50% FIR mode
input pulse length
PWopt=125 ns,
4.0 Mbit/s
tPW 100 140 ns
input pulse length
PWopt=250 ns,
4.0 Mbit/s
tPW 225 275 ns
Stochastic jitter, leading edge input irradiance=100 mW/m2,
4.0 Mbit/s
20 ns
Note: All timing data measured with 4 Mbit/s are measured using the IrDA® FIR transmission header.
The data given here are valid 5 µs after starting the preamble.
*This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity
against light from fluorescent lamps.
Notes:
ZHX2022
FIR Transceiver
PS021802-1005
9
Tamb=25 °C, VCC=2.7 V to 5.5 V, unless otherwise noted.
Typical values are for design aid only, not guaranteed nor
subject to production testing.
input irradiance=100 mW/m2,
1.152 Mbit/s
40 ns
input irradiance=100 mW/m2,
576 kbit/s
80 ns
input irradiance=100 mW/m2,
< 115.2 kbit/s
350 ns
Receiver start up time After completion of shutdown
programming sequence
Power on delay
500 µs
Latency tL170 300 µs
Table 6. Optoelectronic Characteristics—Transmitter
Parameter Test Conditions Symbol Min Typical Max Unit
IRED operating current,
switched current limiter
See derating curve
(Figure 6). For 3.3 V
operations, no external
resistor needed. For 5 V
application, that might be
necessary depending on
operating temperature
range.
ID500 550 600 mA
Output leakage IRED current IIRED –1 1 µA
*Typically, the output pulse duration will follow the input pulse duration t and will be identical in length t.
However, at pulse duration larger than 80 µs, the optical output pulse duration is limited to 85 µs. This
pulse duration limitation can already start at 20 µs.
Table 5. Optoelectronic Characteristics—Receiver (Continued)
Parameter Test Conditions Symbol Min Typical Max Unit
Note: All timing data measured with 4 Mbit/s are measured using the IrDA® FIR transmission header.
The data given here are valid 5 µs after starting the preamble.
*This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity
against light from fluorescent lamps.
Notes:
ZHX2022
FIR Transceiver
PS021802-1005
10
Output radiant intensity
recommended application
circuit
α=0 °, 15 °
Txd=High, SD=Low,
VCC1=VCC2=3.3 V
Internally current-controlled,
no external resistor
Ie120 170 350 mW/m2
(µW/cm2)
Output radiant intensity VCC1=5.0 V, a=0 °, 15 °
Txd=Low or SD=High,
(Receiver is inactive as long
as SD=High)
Ie0.04 kW/m2
(mW/cm2)
Output radiant intensity,
angle of half intensity
α+24 mW/m2
(µW/cm2)
Peak - emission wavelength λP880 900 ns
Spectral bandwidth ∆λ 40 ns
Optical rise time, fall time tropt,
tfopt
10 40 µs
Optical output pulse duration input pulse width 217 ns,
1.152 kbit/s
topt 207 217 227 ns
input pulse width 125 ns,
4.0 Mbit/s
topt 117 125 133 ns
input pulse width 250 ns,
4.0 Mbit/s
topt 242 250 258 ns
input pulse width
0.1 µs < tTxd < 80 µs *
topt tTxd ns
input pulse width tTxd > 80 µs
*
topt 20 85 ns
Optical overshoot 25 ns
Table 6. Optoelectronic Characteristics—Transmitter (Continued)
Parameter Test Conditions Symbol Min Typical Max Unit
*Typically, the output pulse duration will follow the input pulse duration t and will be identical in length t.
However, at pulse duration larger than 80 µs, the optical output pulse duration is limited to 85 µs. This
pulse duration limitation can already start at 20 µs.
ZHX2022
FIR Transceiver
PS021802-1005
11
Recommended Circuit Diagram
ZiLOG transceivers integrate a sensitive receiver and a built-in power driver. The
combination of both needs a careful circuit board layout. The use of thin, long,
resistive, and inductive wiring should be avoided. The inputs (Txd, SD, Mode) and
the output Rxd should be directly (DC) coupled to the I/O circuit. See Figure 3 and
Table 7.
The resistor R1 is only necessary for higher operating voltages and elevated tem-
peratures (see derating curve in Figure 6) to avoid too high internal power dissipa-
tion.
The capacitor C1 combined with the resistor R2 is the low pass filter for smoothing
the supply voltage. R2 and C1 are optional and dependent on the quality of the
supply voltage VCCx and injected noise. An unstable power supply with dropping
voltage during transmission may reduce sensitivity (and transmission range) of
the transceiver.
The placement of these parts is critical. It is strongly recommended to position C1
as near as possible to the transceiver power supply pins.
In addition, when connecting the described circuit to the power supply, low imped-
ance wiring should be used.
Keep in mind that basic RF-design rules for circuit design should be taken into
account. Especially longer signal lines should not be used without termination. For
example, see The Art of Electronics, Paul Horowitz, Wienfield Hill, 1989, Cam-
bridge University Press, ISBN: 0521370957.
ZHX2022
FIR Transceiver
PS021802-1005
12
Figure 3. Application Block Diagram
Note: Lands to Pins 1, 6, 3, 4, 5, and 7 should
be 0.38 mm min. wide. Connect ground plane
within 1.58 mm of pins.
(Note that LEDA may be powered from a
separate unregulated voltage supply.)
FR4
S
.254 mm
.762 mm (min)
4 oz. copper; 0.0356
mm thicknes
Ground Plane
Length, L, is not important.
Maintain land width constant without intermediate vias.
Make corners rounded not sharp.
Values for R2
S .38 mm (.015”) .76 mm (.030”)
R2 68 91
Vcc= 3.4 to 5.5 V
3
5
4
8
GND
RxD
SD
TxD
LEDA Vcc
IRTxD
IRSD
IRRxD
ZHX2022
16
R2
Place within 3 mm of pin.
1.0 µF ceramic
R1
L
IrDA enabled
I/O Controller,
Microcontroller,
ENDEC, or
ASIC
Vss
Vcc= 2.7 to 3.3 V
3
5
4
8
GND
RxD
SD
TxD
LEDA Vcc
IRTxD
IRSD
IRRxD
ZHX2022
16
R2
Place within 3 mm of pin.
1.0 µF ceramic
L
IrDA enabled
I/O Controller,
Microcontroller,
ENDEC, or
ASIC
Vss
Value for R 1- For Vcc </= 3.3 V, use 0 ohm.
For Vcc > 3.3 V, use 2 ohm.
7
MODE
7
MODE
C1
C1
ZHX2022
FIR Transceiver
PS021802-1005
13
I/O and Software
In the description, already different I/Os are mentioned. Different combinations are
tested and the function verified with the special drivers available from the I/O sup-
pliers. In special cases, refer to the I/O manual, the ZiLOG application notes, or
contact directly ZiLOG Sales, Marketing or Application.
Mode Switching
The ZHX2022 is in the SIR mode after power on as a default mode; therefore, the
FIR data transfer rate has to be set by a programming sequence using the Txd
and SD inputs as described in the following sections or selected by setting the
Mode Pin. The Mode Pin can be used to statically set the mode (Mode Pin: LOW:
SIR, HIGH: 0.576 Mbit/s to 4.0 Mbit/s). If not used or in standby mode, the mode
input should float or should not be loaded with more than 50 pF. The low fre-
quency mode covers speeds up to 115.2 kbit/s. Signals with higher data rates
should be detected in the high frequency mode. Lower frequency data can also be
received in the high frequency mode but with reduced sensitivity. See Figure 4
and Table 8.
Table 7. Recommended Application Circuit Components
Component Recommended Value
C1 1.0 µF, Ceramic
R1 5 V supply voltage: 2 Ω, 0.25 W (recommended using two 1 Ω, 0.125
W resistor in series)
3.3 V supply voltage: no resistors necessary; the internal controller is
able to control the current
R2 68 or 91 Ω, 0.125 W
ZHX2022
FIR Transceiver
PS021802-1005
14
Figure 4. Mode Switching Timing Diagram
To switch the transceivers from low frequency mode to the high frequency mode
and vice versa, the programming sequences described in the following sections
are required.
Setting to the High Bandwidth Mode (0.576 Mbit/s to 4.0 Mbit/s)
1. Set SD input to logic “HIGH”.
2. Set Txd input to logic “HIGH”. Wait ts > 200 ns.
3. Set SD to logic “LOW” (this negative edge latches state of Txd, which
determines the speed setting).
Table 8. Truth Table
Inputs Outputs
SD Txd Optical Input Irradiance mW/m2Rxd Transmitter
high x x weakly pulled
(500 kΩ to VCC1)
0
low high x high Ie
low high > 80 µsx high0
low low < 4 high 0
low low > Min. Detection Threshold Irradiance
< Max. Detection Threshold Irradiance
low (active) 0
low low > Max. Detection Threshold Irradiance x 0
ZHX2022
FIR Transceiver
PS021802-1005
15
4. After waiting th > 200 ns, Txd can be set to logic “LOW”. The hold time of Txd
is limited by the maximum allowed pulse length.
After that, Txd is enabled as normal Txd input, and the transceiver is set for the
high bandwidth (576 kbit/s to 4 Mbit/s) mode.
Setting to the Lower Bandwidth Mode (2.4 kbit/s to 115.2 kbit/s)
1. Set SD input to logic “HIGH”.
2. Set Txd input to logic “LOW”. Wait ts > 200 ns.
3. Set SD to logic “LOW” (this negative edge latches state of Txd, which
determines speed setting).
4. Txd must be held for th > 200 ns.
After that Txd is enabled as normal Txd input and the transceiver is set for the
lower bandwidth (9.6 kbit/s to 115.2 kbit/s) mode.
Recommended SMD Pad Layout
The leads of the device should be soldered in the center position of the pads. For
more configurations, see inside the device drawing.
Figure 5. Pad Layout (mm)
Leads of the device should be at least 0.3 mm within the ends of the pads.
Note:
ZHX2022
FIR Transceiver
PS021802-1005
16
ZHX2022 Soldering and Cleaning Recommendations
Follow these recommendations to maintain the performance of the ZHX2022
transceivers.
Reflow Soldering
Please refer to ZiLOG’s Lead-Free Solder Reflow: Packaging
Application Note (AN0161, http://www.zilog.com/docstools.asp)
for more information about the solder profile.
Manual Soldering
•
Use 63/37 or silver solder.
•
Temperature at solder iron tip: no more than 280 °C
•
Finish soldering within 3 seconds.
•
Handle only after the ZHX2022 transceivers have cooled off.
Cleaning
Perform cleaning under the following conditions:
•
Cleaning agent: alcohol
•
Temperature and time 30 seconds below 50 °C or 3 minutes below 30 °C
•
Ultrasonic cleaning: below 20 W
Note:
ZHX2022
FIR Transceiver
PS021802-1005
17
Current Derating Diagram
Figure 6 shows the maximum operating temperature when the device is operated
without external current limiting resistor. A power dissipating resistor of 2 Ω is rec-
ommended from the cathode of the IRED to Ground for supply voltages above
4 V. In that case the device can be operated up to 85 °C, too.
Figure 6. Temperature Derating Diagram
ZHX2022
FIR Transceiver
PS021802-1005
18
Mechanical Specifications
Figure 7. Package Dimensions in mm
2022
ZHX2022
FIR Transceiver
PS021802-1005
19
Taping Specifications
Figure 8. Reel Dimensions in mm
Version Tape Width A max. N W1 min. W2 max. W3 min. W3 max.
mm mm mm mm mm mm mm mm
C 24 330 60 24.4 30.4 23.9 27.4
ZHX2022
FIR Transceiver
PS021802-1005
20
Figure 9. Tape Dimensions in mm
18269
ZHX2022
FIR Transceiver
PS021802-1005
21
Figure 10. Tape Dimensions in mm
18283
2022
ZHX2022
FIR Transceiver
PS021802-1005
22
Customer Feedback Form
If you experience any problems while operating this product, or if you note any inaccura-
cies while reading this product specification, please copy and complete this form, then
mail it to ZiLOG (see Return Information, below). We also welcome your suggestions!
Customer Information
Product Information
Return Information
ZiLOG
System Test/Customer Support
532 Race Street
San Jose, CA 95126-3432
Web site: www.zilog.com
Problem Description or Suggestion
Provide a complete description of the problem or your suggestion. If you are reporting a
specific problem, include all steps leading up to the occurrence of the problem. Attach
additional pages as necessary.
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