PHOTOCOUPLER
PS8821-1,-2
1 Mbps ANALOG OUTPUT TYPE
8-PIN SSOP (SO-8)
HIGH-SPEED PHOTOCOUPLER
Document No. PN10591EJ03V0DS (3rd edition)
Date Published August 2008 NS
−NEPOC Series−
DESCRIPTION
The PS8821-1, -2 are optically coupled isolators containing a GaAlAs LED on the light emitting diode (input side)
and a PIN photodiode a nd a high-speed amplifie r transistor on the output side on one chip .
The PS8821-2 is suitable for h igh density applicatio ns.
FEATURES
• 40% reduction of mounting area (5-pin SOP × 2)
• Low power consumption (VCC = 3.3 V)
PIN CONNECTION
(Top View)
1. NC
2. Anode
3. Cathode
4. NC
5. GND
6. VO
7. NC
8. VCC
1234
8765
PS8821-1
1. Anode1
2. Cathode1
3. Cathode2
4. Anode2
5. GND
6. VO2
7. VO1
8. VCC
PS8821-2
1234
8765
• High isolation voltage (BV = 2 500 Vr.m.s.)
• High-speed response (tPHL = 0.6
μ
s MAX., tPLH = 0.9
μ
s MAX.)
• Ordering number of tape product: PS8821-1- F 3, F 4: 1 500 pcs/reel
: PS8821-2-F3, F4: 1 500 pcs/reel
• Pb-Free product
• Safety standards
• UL approved: File No. E72422
• DIN EN60747-5-2 (VDE0884 Part2) approved (Option)
APPLICATIONS
• Power over Ethernet
• Computer and peripheral manufactures
• Substitutions for relays and pulse transformers
• Power supply
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
2006, 2008
PS8821-1,-2
PACKAGE DIMENSIONS (UNIT: mm)
1.27
0.4+0.10
–0.05 0.25 M
0.1±0.1
3.95±0.1
6.0±0.2
0.5±0.3
0.15+0.10
–0.05
5.21±0.25
3.27±0.2
0.10 S
Data Sheet PN10591EJ03V0DS
2
PS8821-1,-2
MARKING EXAMPLE
<R>
SnBi PLATING
No. 1 pin Mark
Initial of NEC
(Engraved mark)
PS8821-1 PS8821-2
No. 1 pin Mark
Initial of NEC
(Engraved mark)
N
8821-2
NL831
Week Assembled
N
8821-1
NL831
831
Year Assembled
(Last 1 Digit)
LN
Rank Code
In-house Code
(L: Pb-Free)
831
Year Assembled
(Last 1 Digit)
LN
Rank Code
In-house Code
(L: Pb-Free)
Week Assembled
Type Number
Assembly Lot
Type Number
Assembly Lot
Ni/Pd/Au PLATING
No. 1 pin Mark
Initial of NEC
(Engraved mark)
PS8821-1 PS8821-2
No. 1 pin Mark
Initial of NEC
(Engraved mark)
N
8821-2
NT831
Week Assembled
N
8821-1
NT831
831
Year Assembled
(Last 1 Digit)
TN
Rank Code
In-house Code
(T: Pb-Free)
831
Year Assembled
(Last 1 Digit)
TN
Rank Code
In-house Code
(T: Pb-Free)
Week Assembled
Type Number
Assembly Lot
Type Number
Assembly Lot
Data Sheet PN10591EJ03V0DS 3
PS8821-1,-2
ORDERING INFORMATION
<R>
Part Number Order Number Solder Plating
Specification Packing Style Safety Standard
Approval Application
Part Number*1
PS8821-1 PS8821-1-A Pb-Free 20 pcs (Tape 20 pcs cut) Standard products PS8821-1
PS8821-1-F3 PS8821-1-F3-A (SnBi) Embossed Tape 1 500 pcs/reel (UL approved)
PS8821-1-F4 PS8821-1-F4-A
PS8821-2 PS8821-2-A 20 pcs (Tape 20 pcs cut) PS8821-2
PS8821-2-F3 PS8821-2-F3-A Embossed Tape 1 500 pcs/reel
PS8821-2-F4 PS8821-2-F4-A
PS8821-1-V PS8821-1-V-A 20 pcs (Tape 20 pcs cut) DIN EN60747-5-2 PS8821-1
PS8821-1-V-F3 PS8821-1-V-F3-A Embossed Tape 1 500 pcs/reel (VDE0884 Part2)
PS8821-1-V-F4 PS8821-1-V-F4-A Approved (Option)
PS8821-2-V PS8821-2-V-A 20 pcs (Tape 20 pcs cut) PS8821-2
PS8821-2-V-F3 PS8821-2-V-F3-A Embossed Tape 1 500 pcs/reel
PS8821-2-V-F4 PS8821-2-V-F4-A
PS8821-1 PS8821-1-AX Pb-Free 20 pcs (Tape 20 pcs cut) Standard products PS8821-1
PS8821-1-F3 PS8821-1-F3-AX (Ni/Pd/Au) Embossed Tape 1 500 pcs/reel (UL approved)
PS8821-1-F4 PS8821-1-F4-AX
PS8821-2 PS8821-2-AX 20 pcs (Tape 20 pcs cut) PS8821-2
PS8821-2-F3 PS8821-2-F3-AX Embossed Tape 1 500 pcs/reel
PS8821-2-F4 PS8821-2-F4-AX
PS8821-1-V PS8821-1-V-AX 20 pcs (Tape 20 pcs cut) DIN EN60747-5-2 PS8821-1
PS8821-1-V-F3 PS8821-1-V-F3-AX Embossed Tape 1 500 pcs/reel (VDE0884 Part2)
PS8821-1-V-F4 PS8821-1-V-F4-AX Approved (Option)
PS8821-2-V PS8821-2-V-AX 20 pcs (Tape 20 pcs cut) PS8821-2
PS8821-2-V-F3 PS8821-2-V-F3-AX Embossed Tape 1 500 pcs/reel
PS8821-2-V-F4 PS8821-2-V-F4-AX
*1 For the application of the Safety Standard, following part number should be used.
Data Sheet PN10591EJ03V0DS
4
PS8821-1,-2
ABSOLUTE MAXIMUM RATINGS (T A = 25°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Diode Forward Current IF 25 mA/ch
Reverse Voltage VR 5.0 V/ch
Power Dissipation*1 PD 45 mW/ch
Detector Supply Voltage VCC 7 V
Output Voltage VO 7 V/ch
Output Current IO 8.0 mA/ch
Power Dissipation*2 PC 100 mW/ch
Isolation Voltage*3 BV 2 500 Vr.m.s.
Operating Ambient Temperature TA –55 to +100 °C
Storage Temperature Tstg –55 to +125 °C
*1 Reduced to 0.45 mA/°C at TA = 25°C or more.
*2 Reduced to 1.00 mA/°C at TA = 25°C or more.
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-4 shorted together, 5-8 shorted together.
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol MIN. TYP. MAX. Unit
Supply Voltage VCC 3.0 3.3 3.6 V
Forward Current (ON) IF (ON) 16 20 mA
Input Voltage (OFF) VF (OFF) 0 0.8 V
Data Sheet PN10591EJ03V0DS 5
PS8821-1,-2
ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Diode Forward Voltage VF IF = 16 mA 1.7 2.2 V
Reverse Current IR VR = 3 V 10
μ
A
Forward Voltage
Temperature Coefficient
Δ
VF/
Δ
TA IF = 16 mA −2.1 mV/°C
Terminal Capacitance Ct V = 0 V, f = 1 MHz 30 pF
Detector High Level Output Current IOH IF = 0 mA, VCC = VO = 3.3 V 0.01 1
μ
A
L ow Le vel O utp ut Volta ge VOL IF = 16 mA, VCC = 3.3 V, IOL = 1.2 mA 0.1 0.4 V
High Le vel Supply Current
(PS8821-1) ICCH IF = 0 mA, VO = open, VCC = 3.3 V 0.1 10
μ
A
High Le vel Supply Current
(PS8821-2) 0.2 20
Low Level Supply Current
(PS882 1- 1) ICCL IF = 16 mA, VO = open, VCC = 3.3 V 100
Low Level Supply Current
(PS882 1- 2) 200
Coupled Current Transfer Ratio CTR IF = 16 mA, VCC = 3.3 V, VO = 0.4 V 20 40 %
Input-Output
Isolation Resistance RI-O VI-O = 1 kVDC, RH = 40 to 60% 1011 Ω
Insulation Resistance
(Input-Input), (PS8821-2) RI-I VI-I = 5 VDC, RH = 40 to 60% 107
Input-Output
Isolation Capacitance CI-O V = 0 V, f = 1 MHz 0.6 pF
Insulation Capacitance
(Input-Input), (PS8821-2) CI-I 0.3
Propagation Delay Time
(H → L)*1 tPHL IF = 10 mA, VCC = 3.3 V, RL = 1.8 kΩ,
CL = 15 pF, VTHHL = VTHLH = 1.5 V,
TA = 0 to 100°C
0.3 0.6
μ
s
Propagation Delay Time
(L → H)*1 tPLH 0.5 0.9
Common Mode
Transient Immunity at
High Level Output*2
CMH IF = 0 mA, VCC = 3.3 V, RL = 4.1 kΩ,
VCM = 1 kV 1 kV/
μ
s
Common Mode
Transient Immunity at
Low Level Output*2
CML IF = 10 mA, VCC = 3.3 V, RL = 4.1 kΩ,
VCM = 1 kV −1
Data Sheet PN10591EJ03V0DS
6
PS8821-1,-2
*1 Test circuit for propagation delay time
Input
Output
50%
1.5 V
V
OL
t
PHL
t
PLH
Pulse input (I
F
)
(PW = 1 s,
Duty cycle = 1/10) V
O
(Monitor)
V
CC
= 3.3 V
Input
(Monitor)
0.1 F
C
L
= 15 pF
47 Ω
R
L
= 1.8 kΩ
PS8821-1
μ
μ
Pulse input (I
F
)
(PW = 1 s,
Duty cycle = 1/10) V
O
(Monitor)
V
CC
= 3.3 V
Input
(Monitor) 0.1 F C
L
= 15 pF
47 Ω
R
L
= 1.8 kΩ
PS8821-2
μ
μ
(I
F
= 10 mA)
Remark CL is approximatel y 15 pF which includes probe and stra y wiring capacitance.
*2 Test circuit for common mode transient immunit y
V
O
(Monitor)
V
CC
= 3.3 V
0.1 F
R
L
= 4.1 kΩ
PS8821-1
V
CM
μ
C
L
= 15 pF
I
F
V
O
(Monitor)
V
CC
= 3.3 V
0.1 F
R
L
= 4.1 kΩ
PS8821-2
V
CM
SW
μ
C
L
= 15 pF
I
F
90%
10% 0 V
V
OH
2 V
0.8 V
V
OL
V
CM
V
O
(I
F
= 0 mA)
V
O
(I
F
= 10 mA)
t
r
t
f
1 kV
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect ag ainst static
electricity when handling.
2. By-pass capaci tor of 0.1
μ
F is used bet ween VCC and GND near device. Also, ensur e that the distance between
the leads of the photocoupler and capacitor i s no more than 10 mm.
3. Avoid storage at a high temperature and high humidity.
Data Sheet PN10591EJ03V0DS 7
PS8821-1,-2
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
50
30
20
10
0
40
25 50 75 100
Ambient Temperature TA (˚C)
Diode Power Dissipation PD (mW)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE 120
100
60
20
0
80
40
25 50 75 100
Ambient Temperature TA (˚C)
Transistor Power Dissipation PC (mW)
TRANSISTOR POWER DISSIPATION vs.
AMBIENT TEMPERATURE
100
0.01
0.1
10
1
1.4 1.8 2.0 2.41.0 1.2 1.6 2.2
Forward Voltage VF (V)
Forward Current IF (mA)
FORWARD CURRENT vs.
FORWARD VOLTAGE
TA = +100˚C
+50˚C
+25˚C
0˚C
–25˚C
Forward Current IF (mA)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
Current Transfer Ratio CTR (
%
)
1.6
0.0
1.2
0.4
1.4
1.0
0.8
0.6
0.2
0 50 100–50 –25 25 75
Ambient Temperature TA (˚C)
Normalized Current Transfer Raio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
Normalized to 1.0
at TA = 25˚C, IF = 10 mA,
VCC = 3.3 V, VO = 0.4 V
Ambient Temperature TA (˚C)
High Level Output Current IOH (nA)
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
1 000.0
100.0
10.0
1.0 50 100–50 –25 0 25 75
IF = 0 mA,
VCC = VO = 3.3 V
70.0
60.0
50.0
40.0
30.0
20.0
10.0
010 501
VCC = 3.3 V,
VO = 0.4 V
Remark The graphs indicate nominal characteristics.
Data Sheet PN10591EJ03V0DS
8
PS8821-1,-2
5
4
2
0
3
1
–50 0 50 100
–25 7525
Ambient Temperature T
A
(˚C)
NORMALIZED PROPAGATION DELAY TIME
vs. AMBIENT TEMPERATURE
Normalized Propagation Delay Time t
PHL
, t
PLH
Normalized to 1.0
at T
A
= 25˚C,
I
F
= 10 mA, V
CC
= 3.3 V,
V
O
= 0.4 V, R
L
= 1.8 kΩ
t
PLH
t
PHL
Forward Current I
F
(mA)
PROPAGATION DELAY TIME vs.
FORWARD CURRENT
Propagation Delay Time t
PHL
, t
PLH
( s)
μ
2.0
1.0
012 14 18
108 16
t
PHL
t
PLH
V
CC
= 3.3 V,
R
L
= 1.8 kΩ
Remark The graphs indicate nominal characteristics.
Data Sheet PN10591EJ03V0DS 9
PS8821-1,-2
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Reel)
Packing: 1 500 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
φ
100±1.0
φ
2.0±0.5
11.9 to 15.4
Outer edge of
flange
17.5±1.0
13.5±1.0
13.0±0.2
φ
1.7±0.1
2.0±0.05
4.0±0.1
1.75±0.1
6.4±0.1
5.56±0.1
0.3±0.05
8.0±0.1
1.5
+0.1
–0
5.5±0.1
12.0±0.2
3.6±0.1
4.05 MAX.
Outline and Dimensions (Tape)
Taping Direction
PS8821-1-F3
PS8821-2-F3 PS8821-1-F4
PS8821-2-F4
Data Sheet PN10591EJ03V0DS
10
PS8821-1,-2
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: m m)
1.45
0.81.27
5.25
Remark All dimensions in this figure must be evaluated before use.
Data Sheet PN10591EJ03V0DS 11
PS8821-1,-2
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260°C or below (package surface temperat ure)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220˚C
180˚C
Package Surface Temperature T (˚C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260˚C MAX.
120˚C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package sur face temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlori ne
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (T he flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
Data Sheet PN10591EJ03V0DS
12
PS8821-1,-2
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and ch lorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
USAGE CAUTIONS
<R>
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10591EJ03V0DS 13
PS8821-1,-2
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
<R>
Parameter Symbol Speck Unit
Application classification (DIN EN 60664-1 VDE0110 Part 1)
for rated line voltages ≤ 300 Vr.m.s.
for rated line voltages ≤ 600 Vr.m.s.
IV
III
Climatic test class (DIN EN 60664-1 VDE0110) 55/100/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.5 × UIORM, Pd < 5 pC
UIORM
Upr
566
849
Vpeak
Vpeak
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 × UIORM, Pd < 5 pC Upr 1 061 Vpeak
Highest permissible overvoltage UTR 4 000 Vpeak
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) 2
Clearance distance >4.0 mm
Creepage distance >4.0 mm
Comparative tracking index (DIN IEC 112/VDE 0303 Part 1) CTI 175
Material group (DIN EN 60664-1 VDE0110 Part 1) III a
Storage temperature range Tstg –55 to +125 °C
Operating temperature range TA –55 to +100 °C
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
VIO = 500 V dc at TA MAX. at least 100°C
Ris MIN.
Ris MIN.
1012
1011
Ω
Ω
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
VIO = 500 V dc at TA = Tsi
Tsi
Isi
Psi
Ris MIN.
150
150
600
109
°C
mA
mW
Ω
Data Sheet PN10591EJ03V0DS
14
Data Sheet PN10591EJ03V0DS 15
PS8821-1,-2
The information in this document is current as of August, 2008. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
•
•
•
•
•
•
M8E 02. 11-1
(1)
(2)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
"Standard":
"Special":
"Specific":
PS8821-1,-2
Caution GaAs Products This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
