IS63LV1024
IS63LV1024L ISSI®
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
1
Rev. A
10/14/03
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
128K x 8 HIGH-SPEED CMOS STATIC RAM
3.3V REVOLUTIONARY PINOUT
FEATURES
• High-speed access times:
8, 10, 12 ns
• High-performance, low-power CMOS process
• Multiple center power and ground pins for
greater noise immunity
• Easy memory expansion with CE and OE
options
•CE power-down
• Fully static operation: no clock or refresh
required
• TTL compatible inputs and outputs
• Single 3.3V power supply
• Packages available:
– 32-pin 300-mil SOJ
– 32-pin 400-mil SOJ
– 32-pin TSOP (Type II)
– 32-pin STSOP (Type I)
– 36-pin BGA (8mmx10mm)
DESCRIPTION
The ISSI IS63LV1024/IS63LV1024L is a very high-speed,
low power, 131,072-word by 8-bit CMOS static RAM in
revolutionary pinout. The IS63LV1024/IS63LV1024L is fab-
ricated using ISSI's high-performance CMOS technology.
This highly reliable process coupled with innovative circuit
design techniques, yields higher performance and low
power consumption devices.
When CE is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down to 250 µW (typical) with CMOS input levels.
The IS63LV1024/IS63LV1024L operates from a single 3.3V
power supply and all inputs are TTL-compatible.
FUNCTIONAL BLOCK DIAGRAM
A0-A16
CE
OE
WE
128K X 8
MEMORY ARRAY
DECODER
COLUMN I/O
CONTROL
CIRCUIT
GND
VDD
I/O
DATA
CIRCUIT
I/O0-I/O7
OCTOBER 2003
2
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. A
10/14/03
IS63LV1024
IS63LV1024L ISSI
®
PIN CONFIGURATION
32-Pin SOJ
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A0
A1
A2
A3
CE
I/O0
I/O1
VDD
GND
I/O2
I/O3
WE
A4
A5
A6
A7
A16
A15
A14
A13
OE
I/O7
I/O6
GND
VDD
I/O5
I/O4
A12
A11
A10
A9
A8
PIN DESCRIPTIONS
A0-A16 Address Inputs
CE Chip Enable Input
OE Output Enable Input
WE Write Enable Input
I/O0-I/O7 Data Inputs/Outputs
VDD Power
GND Ground
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A0
A1
A2
A3
CE
I/O0
I/O1
VDD
GND
I/O2
I/O3
WE
A4
A5
A6
A7
A16
A15
A14
A13
OE
I/O7
I/O6
GND
VDD
I/O5
I/O4
A12
A11
A10
A9
A8
PIN CONFIGURATION
32-Pin TSOP (Type II) (T)
32-Pin STSOP (Type I) (H)
PIN CONFIGURATION
36-mini BGA (B) (8 mm x 10 mm)
1 2 3 4 5 6
A
B
C
D
E
F
G
H
A0 A1 NC A3 A6 A8
I/O4 A2 WE A4 A7 I/O0
I/O5 NC A5 I/O1
GND VDD
VDD GND
I/O6 NC NC I/O2
I/O7 OE CE A16 A15 I/O3
A9 A10 A11 A12 A13 A14
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3
Rev. A
10/14/03
IS63LV1024
IS63LV1024L ISSI
®
ABSOLUTE MAXIMUM RATINGS(1)
Symbol Parameter Value Unit
VTERM Terminal Voltage with Respect to GND –0.5 to VDD + 0.5 V
TBIAS Temperature Under Bias –55 to +125 °C
TSTG Storage Temperature –65 to +150 ° C
PTPower Dissipation 1.0 W
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
TRUTH TABLE
Mode WEWE
WEWE
WE CECE
CECE
CE OEOE
OEOE
OE I/O Operation VDD Current
Not Selected X H X High-Z ISB1, ISB2
(Power-down)
Output Disabled H L H High-Z ICC1, ICC2
Read H L L DOUT ICC1, ICC2
Write L L X DIN ICC1, ICC2
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol Parameter Test Conditions Min. Max. Unit
VOH Output HIGH Voltage VDD = Min., IOH = –4.0 mA 2.4 — V
VOL Output LOW Voltage VDD = Min., IOL = 8.0 mA — 0.4 V
VIH Input HIGH Voltage 2.2 VDD + 0.3 V
VIL Input LOW Voltage(1) –0.3 0.8 V
ILI Input Leakage GND ≤ VIN ≤ VDD Com. –1 1 µA
Ind. –5 5
ILO Output Leakage GND ≤ VOUT ≤ VDD, Outputs Disabled Com. –1 1 µA
Ind. –5 5
Notes:
1. VIL = –3.0V for pulse width less than 10 ns.
OPERATING RANGE
Range Ambient Temperature VDD
Commercial 0°C to +70°C 3.3V ± 0.3V
Industrial –40°C to +85°C 3.3V ± 0.15V
4
Integrated Silicon Solution, Inc. — www.issi.com —
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Rev. A
10/14/03
IS63LV1024
IS63LV1024L ISSI
®
CAPACITANCE(1,2)
Symbol Parameter Conditions Max. Unit
CIN Input Capacitance VIN = 0V 6 pF
CI/O Input/Output Capacitance VOUT = 0V 8 p F
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: TA = 25°C, f = 1 MHz, VDD = 3.3V.
IS63LV1024L POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
-8 ns -10 ns -12 ns
Symbol Parameter Test Conditions Min. Max. Min. Max. Min. Max. Unit
ICC1VDD Operating VDD = Max., CE = VIL Com. — 100 — 95 — 90 mA
Supply Current IOUT = 0 mA, f = Max. Ind. — 110 — 105 — 100
typ.
(2)
—75 —70 —65
ISB TTL Standby VDD = Max., Com. — 35 — 30 — 25 mA
Current VIN = VIH or VIL Ind. — 40 — 35 — 30
(TTL Inputs) CE ≥ VIH, f = Max
ISB1TTL Standby VDD = Max., Com. — 15 — 15 — 15 mA
Current VIN = VIH or VIL Ind. — 20 — 20 — 20
(TTL Inputs) CE ≥ VIH, f = 0
ISB2CMOS Standby VDD = Max., Com. — 1 — 1 — 1 mA
Current CE ≥ VDD – 0.2V, Ind. — 1.5 — 1.5 — 1.5
typ.
(2)
— 0.05 — 0.05 — 0.05
(CMOS Inputs) VIN ≥ VDD – 0.2V, or
VIN ≤ 0.2V, f = 0
Notes:
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
2. Typical values are measured at VDD = 3.3V, TA = 25oC. Not 100% tested.
IS63LV1024 POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
-8 ns -10 ns -12 ns
Symbol Parameter Test Conditions Min. Max. Min. Max. Min. Max. Unit
ICC1VDD Operating VDD = Max., CE = VIL Com. — 160 — 150 — 130 mA
Supply Current IOUT = 0 mA, f = Max. Ind. — 170 — 160 — 140
typ.
(2)
— 105 — 95 — 75
ISB TTL Standby VDD = Max., Com. — 55 — 45 — 40 mA
Current VIN = VIH or VIL Ind. — 55 — 45 — 40
(TTL Inputs) CE ≥ VIH, f = Max
ISB1TTL Standby VDD = Max., Com. — 25 — 25 — 25 mA
Current VIN = VIH or VIL Ind. — 30 — 30 — 30
(TTL Inputs) CE ≥ VIH, f = 0
ISB2CMOS Standby VDD = Max., Com. — 5 — 5 — 5 mA
Current CE ≥ VDD – 0.2V, Ind. — 10 — 10 — 10
typ.
(2)
— 0.5 — 0.5 — 0.5
(CMOS Inputs) VIN ≥ VDD – 0.2V, or
VIN ≤ 0.2V, f = 0
Notes:
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
2. Typical values are measured at VDD = 3.3V, TA = 25oC. Not 100% tested.
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5
Rev. A
10/14/03
IS63LV1024
IS63LV1024L ISSI
®
AC TEST LOADS
AC TEST CONDITIONS
Parameter Unit
Input Pulse Level 0V to 3.0V
Input Rise and Fall Times 3 ns
Input and Output Timing 1.5V
and Reference Levels
Output Load See Figures 1 and 2
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
-8 ns -10 ns -12 ns
Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
tRC Read Cycle Time 8 — 10 — 12 — n s
tAA Address Access Time — 8 — 10 — 12 ns
tOHA Output Hold Time 2 — 2 — 2 — n s
tACE CE Access Time — 8 — 10 — 12 ns
tDOE OE Access Time — 4 — 5 — 6 ns
tLZOE
(2)
OE to Low-Z Output 0 — 0 — 0 — ns
tHZOE
(2)
OE to High-Z Output 0 4 0 5 0 6 n s
tLZCE
(2)
CE to Low-Z Output 3 — 3 — 3 — ns
tHZCE
(2)
CE to High-Z Output 0 4 0 5 0 6 n s
tPU CE to Power Up Time 0 — 0 — 0 — ns
tPD CE to Power Down Time — 8 — 10 — 12 n s
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V
loading specified in Figure 1.
2. Tested with the loading specified in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
Figure 1
OUTPUT
VT = 1.5V
ZOUT = 50 Ω
50 Ω
317 Ω
5 pF
Including
jig and
scope
351 Ω
OUTPUT
3.3V
Figure 2
6
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. A
10/14/03
IS63LV1024
IS63LV1024L ISSI
®
DATA VALID
READ1.eps
PREVIOUS DATA VALID
t AA
t OHA t OHA
t RC
D
OUT
ADDRESS
t
RC
t
OHA
t
AA
t
DOE
t
LZOE
t
ACE
t
LZCE
t
HZOE
HIGH-Z DATA VALID
CE_RD2.eps
ADDRESS
OE
CE
DOUT
t
HZCE
READ CYCLE NO. 2(1,3)
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CE = VIL.
3. Address is valid prior to or coincident with CE LOW transitions.
AC WAVEFORMS
READ CYCLE NO. 1(1,2)
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Rev. A
10/14/03
IS63LV1024
IS63LV1024L ISSI
®
WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range)
-8 ns -10 ns -12 ns
Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
tWC Write Cycle Time 8 — 1 0 — 1 2 — ns
tSCE CE to Write End 7 — 7 — 8 — ns
tAW Address Setup Time to 8 — 8 — 8 — ns
Write End
tHA Address Hold from 0 — 0 — 0 — ns
Write End
tSA Address Setup Time 0 — 0 — 0 — ns
tPWE
1(1)
WE Pulse Width (OE High) 7 — 7 — 8 — ns
tPWE
2(2)
WE Pulse Width (OE Low) 8 — 10 — 12 — ns
tSD Data Setup to Write End 5 — 5 — 6 — ns
tHD Data Hold from Write End 0 — 0 — 0 — ns
tHZWE
(2)
WE LOW to High-Z Output — 4 — 5 — 6 n s
tLZWE
(2)
WE HIGH to Low-Z Output 3 — 3 — 3 — ns
Notes:
1. Test conditions assume signal transition times of 3ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and
output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
3. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write, but
any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of
the signal that terminates the Write.
AC WAVEFORMS
WRITE CYCLE NO. 1(1,2 (CE Controlled, OE = HIGH or LOW)
DATA UNDEFINED
t
WC
VALID ADDRESS
t
SCE
t
PWE1
t
PWE2
t
AW
t
HA
HIGH-Z
t
HD
t
SA
t
HZWE
ADDRESS
CE
WE
D
OUT
D
IN DATA
IN
VALID
t
LZWE
t
SD
CE_WR1.eps
8
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. A
10/14/03
IS63LV1024
IS63LV1024L ISSI
®
AC WAVEFORMS
WRITE CYCLE NO. 2(1)
(WE Controlled, OE = HIGH during Write Cycle)
WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle)
Notes:
1. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write,
but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling
edge of the signal that terminates the Write.
2. I/O will assume the High-Z state if OE > VIH.
DATA UNDEFINED
LOW
t
WC
VALID ADDRESS
t
PWE1
t
AW
t
HA
HIGH-Z
t
HD
t
SA
t
HZWE
ADDRESS
CE
WE
DOUT
DIN
OE
DATA
IN
VALID
t
LZWE
t
SD
CE_WR2.eps
DATA UNDEFINED
t
WC
VALID ADDRESS
LOW
LOW
t
PWE2
t
AW
t
HA
HIGH-Z
t
HD
t
SA
t
HZWE
ADDRESS
CE
WE
D
OUT
D
IN
OE
DATA
IN
VALID
t
LZWE
t
SD
CE_WR3.eps
Integrated Silicon Solution, Inc. — www.issi.com —
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9
Rev. A
10/14/03
IS63LV1024
IS63LV1024L ISSI
®
DATA RETENTION WAVEFORM (CE Controlled)
DATA RETENTION SWITCHING CHARACTERISTICS
Symbol Parameter Test Condition Options Min. Typ.
(1)
Max. Unit
VDR VDD for Data Retention See Data Retention Waveform 2 .0 — 3 . 6 V
IDR Data Retention Current VDD = 2.0V, CE ≥ VDD – 0.2V IS63LV1024 — 0.5 10 mA
IS63LV1024L — 0.05 1.5
tSDR Data Retention Setup Time See Data Retention Waveform 0 — — n s
tRDR Recovery Time See Data Retention Waveform tRC ——ns
Note 1: Typical values are measured at V
DD
= 3.0V, T
A
= 25
O
C and not 100% tested.
V
DD
CE ≥ VDD
- 0.2V
tSDR tRDR
VDR
CE
GND
Data Retention Mode
10
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. A
10/14/03
IS63LV1024
IS63LV1024L ISSI
®
IS63LV1024 ORDERING INFORMATION
Commercial Range: 0°C to +70°C
Speed (ns) Order Part No. Package
8 IS63LV1024-8T TSOP (Type II)
IS63LV1024-8J 300-mil Plastic SOJ
IS63LV1024-8K 400-mil Plastic SOJ
1 0 IS63LV1024-10T TSOP (Type II)
IS63LV1024-10J 300-mil Plastic SOJ
IS63LV1024-10K 400-mil Plastic SOJ
1 2 IS63LV1024-12T TSOP (Type II)
IS63LV1024-12J 300-mil Plastic SOJ
IS63LV1024-12K 400-mil Plastic SOJ
Industrial Range: –40°C to +85°C
Speed (ns) Order Part No. Package
8 IS63LV1024-8TI TSOP (Type II)
IS63LV1024-8JI 300-mil Plastic SOJ
IS63LV1024-8KI 400-mil Plastic SOJ
1 2 IS63LV1024-12TI TSOP (Type II)
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11
Rev. A
10/14/03
IS63LV1024
IS63LV1024L ISSI
®
IS63LV1024L ORDERING INFORMATION
Commercial Range: 0°C to +70°C
Speed (ns) Order Part No. Package
8 IS63LV1024L-8T TSOP (Type II)
IS63LV1024L-8H STSOP (Type I) (8mm x13.4mm)
IS63LV1024L-8J 300-mil Plastic SOJ
IS63LV1024L-8K 400-mil Plastic SOJ
IS63LV1024L-8B mBGA(8mmx10mm)
1 0 IS63LV1024L-10T TSOP (Type II)
1 2 IS63LV1024L-12T TSOP (Type II)
IS63LV1024L-12H STSOP (Type I) (8mm x13.4mm)
IS63LV1024L-12J 300-mil Plastic SOJ
IS63LV1024L-12B mBGA(8mmx10mm)
Industrial Range: –40°C to +85°C
Speed (ns) Order Part No. Package
8 IS63LV1024L-8TI TSOP (Type II)
IS63LV1024L-8JI 300-mil Plastic SOJ
IS63LV1024L-8KI 400-mil Plastic SOJ
IS63LV1024L-8BI mBGA(8mmx10mm)
1 0 IS63LV1024L-10TI TSOP (Type II)
IS63LV1024L-10HI STSOP (Type I) (8mm x13.4mm)
IS63LV1024L-10JI 300-mil Plastic SOJ
IS63LV1024L-10KI 400-mil Plastic SOJ
IS63LV1024L-10BI mBGA(8mmx10mm)
12 IS63LV1024L-12BI mBGA(8mmx10mm)
PACKAGING INFORMATION ISSI®
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. E
01/15/03
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Mini Ball Grid Array
Package Code: B (36-pin)
Notes:
1. Controlling dimensions are in millimeters.
mBGA - 6mm x 8mm
MILLIMETERS INCHES
Sym. Min. Typ. Max. Min. Typ. Max.
N0.
Leads 36 36
A — — 1.20 — — 0.047
A1 0.24 — 0.30 0.009 — 0.012
A2 0.60 — — 0.024 — —
D 7.90 8.00 8.10 0.311 0.315 0.319
D1 5.25BSC 0.207BSC
E 5.90 6.00 6.10 0.232 0.236 0.240
E1 3.75BSC 0.148BSC
e 0.75BSC 0.030BSC
b 0.30 0.35 0.40 0.012 0.014 0.016
mBGA - 8mm x 10mm
MILLIMETER INCHES
Sym. Min. Typ. Max. Min. Typ. Max.
N0.
Leads 36 36
A — — 1.20 — — 0.047
A1 0.24 — 0.30 0.009 — 0.012
A2 0.60 — — 0.024 — —
D 9.90 10.00 10.10 0.390 0.394 0.398
D1 5.25BSC .207BSC
E 7.90 8.00 8.10 0.311 0.315 0.319
E1 3.75BSC 0.148BSC
e 0.75BSC 0.030BSC
b 0.30 0.35 0.40 0.012 0.014 0.016
SEATING PLANE
A
A1
A2
A
B
C
D
E
F
G
H
e
e
D1
E1E
D
φ b (36x)
Top View Bottom View
6 5 4 3 2 11 2 3 4 5 6
A
B
C
D
E
F
G
H
PACKAGING INFORMATION ISSI®
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. F
10/29/03
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
400-mil Plastic SOJ
Package Code: K
Notes:
1. Controlling dimension:
millimeters.
2. BSC = Basic lead spacing
between centers.
3. Dimensions D and E1 do not
include mold flash protrusions
and should be measured from
the bottom of the package.
4. Reference document: JEDEC
MS-027.
SEATING PLANE
1
N
E1
D
E2
E
B
eA1
A
C
A2
b
N/2+1
N/2
Millimeters Inches Millimeters Inches Millimeters Inches
Symbol Min Max Min Max Min Max Min Max Min Max Min Max
No. Leads (N) 28 32 36
A 3.25 3.75 0.128 0.148 3.25 3.75 0.128 0.148 3.25 3.75 0.128 0.148
A1 0.64 — 0.025 — 0.64 — 0.025 — 0.64 — 0.025 —
A2 2.08 — 0.082 — 2.08 — 0.082 — 2.08 — 0.082 —
B 0.38 0.51 0.015 0.020 0.38 0.51 0.015 0.020 0.38 0.51 0.015 0.020
b 0.66 0.81 0.026 0.032 0.66 0.81 0.026 0.032 0.66 0.81 0.026 0.032
C 0.18 0.33 0.007 0.013 0.18 0.33 0.007 0.013 0.18 0.33 0.007 0.013
D 18.29 18.54 0.720 0.730 20.82 21.08 0.820 0.830 23.37 23.62 0.920 0.930
E 11.05 11.30 0.435 0.445 11.05 11.30 0.435 0.445 11.05 11.30 0.435 0.445
E1 10.03 10.29 0.395 0.405 10.03 10.29 0.395 0.405 10.03 10.29 0.395 0.405
E2 9.40 BSC 0.370 BSC 9.40 BSC 0.370 BSC 9.40 BSC 0.370 BSC
e 1.27 BSC 0.050 BSC 1.27 BSC 0.050 BSC 1.27 BSC 0.050 BSC
PA CKA GING INFORMATION ISSI
®
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
2
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. F
10/29/03
Millimeters Inches Millimeters Inches Millimeters Inches
Symbol Min Max Min Max Min Max Min Max Min Max Min Max
No. Leads (N) 40 42 44
A 3.25 3.75 0.128 0.148 3.25 3.75 0.128 0.148 3.25 3.75 0.128 0.148
A1 0.64 — 0.025 — 0.64 — 0.025 — 0.64 — 0.025 —
A2 2.08 — 0.082 — 2.08 — 0.082 — 2.08 — 0.082 —
B 0.38 0.51 0.015 0.020 0.38 0.51 0.015 0.020 0.38 0.51 0.015 0.020
b 0.66 0.81 0.026 0.032 0.66 0.81 0.026 0.032 0.66 0.81 0.026 0.032
C 0.18 0.33 0.007 0.013 0.18 0.33 0.007 0.013 0.18 0.33 0.007 0.013
D 25.91 26.16 1.020 1.030 27.18 27.43 1.070 1.080 28.45 28.70 1.120 1.130
E 11.05 11.30 0.435 0.445 11.05 11.30 0.435 0.445 11.05 11.30 0.435 0.445
E1 10.03 10.29 0.395 0.405 10.03 10.29 0.395 0.405 10.03 10.29 0.395 0.405
E2 9.40 BSC 0.370 BSC 9.40 BSC 0.370 BSC 9.40 BSC 0.370 BSC
e 1.27 BSC 0.050 BSC 1.27 BSC 0.050 BSC 1.27 BSC 0.050 BSC
PACKAGING INFORMATION ISSI®
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. D
02/25/03
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
300-mil Plastic SOJ
Package Code: J
Notes:
1. Controlling dimension: inches, unless otherwise
specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash
protrusions and
should be measured from the bottom of
the package
.
4. Formed leads shall be planar with respect to one
another within 0.004 inches at the seating plane.
MILLIMETERS INCHES
Sym. Min. Typ. Max. Min. Typ. Max.
N0.
Leads 24/26
A — — 3.56 — — 0.140
A1 0.64 — — 0.025 — —
A2 2.41 — 2.67 0.095 — 0.105
b 0.41 — 0.51 0.016 — 0.020
B 0.66 — 0.81 0.026 — 0.032
C 0.20 — 0.25 0.008 — 0.010
D 17.02 — 17.27 0.670 — 0.680
E 8.26 — 8.76 0.325 — 0.345
E1 7.49 — 7.75 0.295 — 0.305
E2 6.27 — 7.29 0.247 — 0.287
e 1.27 BSC 0.050 BSC
SEATING PLANE
1
N
E1
D
E2
E
b
eA1
A
BC
A2
PACKAGING INFORMATION ISSI®
2
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. D
02/25/03
MILLIMETERS INCHES
Sym. Min. Typ. Max. Min. Typ. Max.
N0.
Leads 28
A — — 3.56 — — 0.140
A1 0.64 — — 0.025 — —
A2 2.41 — 2.67 0.095 — 0.105
b 0.41 — 0.51 0.016 — 0.020
B 0.66 — 0.81 0.026 — 0.032
C 0.20 — 0.25 0.008 — 0.010
D 18.29 — 18.54 0.720 — 0.730
E 8.26 — 8.76 0.325 — 0.345
E1 7.49 — 7.75 0.295 — 0.305
E2 6.27 — 7.29 0.247 — 0.287
e 1.27 BSC 0.050 BSC
MILLIMETERS INCHES
Sym. Min. Typ. Max. Min. Typ. Max.
N0.
Leads 32
A — — 3.56 — — 0.140
A1 0.64 — — 0.025 — —
A2 2.41 — 2.67 0.095 — 0.105
b 0.41 — 0.51 0.016 — 0.020
B 0.66 — 0.81 0.026 — 0.032
C 0.20 — 0.25 0.008 — 0.010
D 20.83 — 21.08 0.820 — 0.830
E 8.26 — 8.76 0.325 — 0.345
E1 7.49 — 7.75 0.295 — 0.305
E2 6.27 — 7.29 0.247 — 0.287
e 1.27 BSC 0.050 BSC
300-mil Plastic SOJ
Package Code: J
Integrated Silicon Solution, Inc.
PACKAGING INFORMATION ISSI®
Plastic STSOP - 32 pins
Package Code: H (Type I)
Notes:
1. Controlling dimension: millimeters, unless otherwise
specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E do not include mold flash protru-
sions and
should be measured from the bottom of the package
.
4. Formed leads shall be planar with respect to one another
within 0.004 inches at the seating plane.
Plastic STSOP (H - Type I)
Millimeters Inches
Symbol Min Max Min Max
Ref. Std.
N 32
A — 1.25 — 0.049
A1 0.05 — 0.002 —
A2 0.95 1.05 0.037 0.041
b 0.17 0.23 0.007 0.009
C 0.14 0.16 0.0055 0.0063
D 13.20 13.60 0.520 0.535
D1 11.70 11.90 0.461 0.469
E 7.90 8.10 0.311 0.319
e 0.50 BSC 0.020 BSC
L 0.30 0.70 0.012 0.028
S 0.28 Typ. 0.011 Typ.
α0° 5° 0° 5°
PK13197H32 Rev. B 04/21/03
D1 SEATING PLANE
C
D
1N
e
S
b
A1
A
A2
E
Lα
PACKAGING INFORMATION ISSI®
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
06/18/03
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Plastic TSOP
Package Code: T (Type II)
D
SEATING PLANE
b
eC
1N/2
N/2+1N
E1
A1
A
E
Lα
ZD
.
Notes:
1. Controlling dimension: millimieters,
unless otherwise specified.
2. BSC = Basic lead spacing
between centers.
3. Dimensions D and E1 do not
include mold flash protrusions and
should be measured from the
bottom of the package.
4. Formed leads shall be planar with
respect to one another within
0.004 inches at the seating plane.
Plastic TSOP (T - Type II)
Millimeters Inches Millimeters Inches Millimeters Inches
Symbol Min Max Min Max Min Max Min Max Min Max Min Max
Ref. Std.
No. Leads (N) 32 44 50
A — 1.20 — 0.047 — 1.20 — 0.047 — 1.20 — 0.047
A1 0.05 0.15 0.002 0.006 0.05 0.15 0.002 0.006 0.05 0.15 0.002 0.006
b 0.30 0.52 0.012 0.020 0.30 0.45 0.012 0.018 0.30 0.45 0.012 0.018
C 0.12 0.21 0.005 0.008 0.12 0.21 0.005 0.008 0.12 0.21 0.005 0.008
D 20.82 21.08 0.820 0.830 18.31 18.52 0.721 0.729 20.82 21.08 0.820 0.830
E1 10.03 10.29 0.391 0.400 10.03 10.29 0.395 0.405 10.03 10.29 0.395 0.405
E 11.56 11.96 0.451 0.466 11.56 11.96 0.455 0.471 11.56 11.96 0.455 0.471
e 1.27 BSC 0.050 BSC 0.80 BSC 0.032 BSC 0.80 BSC 0.031 BSC
L 0.40 0.60 0.016 0.024 0.41 0.60 0.016 0.024 0.40 0.60 0.016 0.024
ZD 0.95 REF 0.037 REF 0.81 REF 0.032 REF 0.88 REF 0.035 REF
α0° 5° 0° 5° 0° 5° 0° 5° 0° 5° 0° 5°
