LY Y876
1Version 1.2 | 2018-04-05
Produktdatenblatt | Version 1.1
www.osram-os.com
LY Y876
Micro SIDELED® 3010
Micro SIDELED is a SMT LED with side emission.
Due to its low package height it is ideal for applica-
tions in limited space environments.
Applications
—Electronic Equipment —White Goods
Features:
—Package: white SMT package, colorless clear resin
—Chip technology: InGaAlP
—Typ. Radiation: 120° (Lambertian emitter)
—Color:
λ
dom = 587 nm (● yellow)
—Optical e󰘲cacy: 9 lm/W
—Corrosion Robustness Class: 3B
—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
LY Y876
2Version 1.2 | 2018-04-05
Ordering Information
Type Luminous Intensity 1) Ordering Code
IF = 20 mA
Iv
LY Y876-Q2T1-26-Z 90 ... 355 mcd Q65110A2415
LY Y876
3Version 1.2 | 2018-04-05
Maximum Ratings
Parameter Symbol Values
Operating Temperature Top min.
max.
-40 °C
100 °C
Storage Temperature Tstg min.
max.
-40 °C
100 °C
Junction Temperature Tjmax. 125 °C
Forward current
TS = 25 °C
IFmax. 30 mA
Surge Current
t ≤ 10 µs; D = 0.005 ; TS = 25 °C
IFS max. 200 mA
Reverse voltage 2)
TS = 25 °C
VRmax. 12 V
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
VESD 2 kV
LY Y876
4Version 1.2 | 2018-04-05
Characteristics
IF = 20 mA; TS = 25 °C
Parameter Symbol Values
Peak Wavelength
λ
peak typ. 591 nm
Dominant Wavelength 3)
IF = 20 mA
λ
dom min.
typ.
max.
580 nm
587 nm
595 nm
Spectral Bandwidth at 50% Irel,max
∆λ
typ. 15 nm
Viewing angle at 50 % IV2
φ
typ. 120 °
Forward Voltage 4)
IF = 20 mA
VFmin.
typ.
max.
1.90 V
2.00 V
2.40 V
Reverse current 2)
VR = 12 V
IRtyp.
max.
0.01 µA
10 µA
Temperature Coe󰘲cient of Peak Wavelength
-10°C ≤ T ≤ 100°C
TC
λ
peak typ. 0.13 nm / K
Temperature Coe󰘲cient of Dominant Wavelength
-10°C ≤ T ≤ 100°C
TC
λ
dom typ. 0.1 nm / K
Temperature Coe󰘲cient of Forward Voltage
-10°C ≤ T ≤ 100°C
TCVF typ. -2.5 mV / K
Real thermal resistance junction/ambient 5), 6) RthJA real max. 630 K / W
Real thermal resistance junction/solderpoint 5) RthJS real max. 350 K / W
LY Y876
5Version 1.2 | 2018-04-05
Brightness Groups
Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7)
IF = 20 mA IF = 20 mA IF = 20 mA
min. max. typ.
IvIv
Φ
V
Q2 90 mcd 112 mcd 300 mlm
R1 112 mcd 140 mcd 380 mlm
R2 140 mcd 180 mcd 480 mlm
S1 180 mcd 224 mcd 610 mlm
S2 224 mcd 280 mcd 760 mlm
T1 280 mcd 355 mcd 950 mlm
Wavelength Groups
Group Dominant Wavelength 3) Dominant Wavelength 3)
IF = 20 mA IF = 20 mA
min. max.
λ
dom
λ
dom
2 580 nm 583 nm
3 583 nm 586 nm
4 586 nm 589 nm
5589 nm 592 nm
6592 nm 595 nm
LY Y876
6Version 1.2 | 2018-04-05
Group Name on Label
Example: Q2-2
Brightness Wavelength
Q2 2
LY Y876
7Version 1.2 | 2018-04-05
OHL00235
400
0
20
40
60
80
100
450 500 550 600 650 700nm
%
I
rel
λ
V
λ
yellow
orange
amber
super-red
Relative Spectral Emission 7)
Irel = f (
λ
); IF = 20 mA; TS = 25 °C
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
0˚10˚20˚40˚ 30˚
OHL01660
50˚
60˚
70˚
80˚
90˚
100˚
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
Radiation Characteristics 7)
Irel = f (
ϕ
); TS = 25 °C
LY Y876
8Version 1.2 | 2018-04-05
I
OHL10233
F
V (20 mA)
I
I
V
0
10 1
10 102
mA
1
10
-2
10
100
10-1
super-red
yellow
orange/amber
Relative Luminous Intensity 7), 8)
Iv/Iv(20 mA) = f(IF); TS = 25 °C
OHL00232
10 -1
1.4 1.8 2.2 2.6 3 V 3.4
0
10
1
10
10 2
5
5
mA
5
1
F
V
F
I
Forward current 7)
IF = f(VF); TS = 25 °C
LY Y876
9Version 1.2 | 2018-04-05
T
OHL00238
0
V
I
-200 20 40 60 ˚C 100
orange
j
0.4
0.8
1.2
1.6
2.0
I
V
(25 ˚C)
yellow
amber
super-red
super-red
amber
yellow
orange
Relative Luminous Intensity 7)
Iv/Iv(25 °C) = f(Tj); IF = 20 mA
LY Y876
10 Version 1.2 | 2018-04-05
0
OHL00090
I
F
˚C
020 40 60 80 100
T
temp. solder point
temp. ambient
T
A
T
S
T
S
A
T
mA
5
10
15
20
25
30
35
Max. Permissible Forward Current
IF = f(T)
OHL00690
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
1
0.02
0.04
0.06
0.08
0.12
0.10
Permissible Pulse Handling Capability
IF = f(tp); D: Duty cycle; TS = 85 °C
OHL00689
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
1
0.05
0.10
0.15
0.20
0.25
Permissible Pulse Handling Capability
IF = f(tp); D: Duty cycle; TS = 25 °C
LY Y876
11 Version 1.2 | 2018-04-05
Dimensional Drawing 9)
GPLY6058
0 ... 0.1 (0 ... 0.004)
3.1 (0.122)
2.9 (0.114)
0.7 (0.028)
0.5 (0.020)
1.0 (0.039)
1.2 (0.047)
Cathode
0.3 (0.012)
0.5 (0.020)
(15˚)
2.3 (0.091)
2.1 (0.083)
1.3 (0.051)
1.1 (0.043)
(0.4 (0.016))
(0.6 (0.024))
0.25 (0.010)
0.20 (0.008)
Light emitting area
typ. 1.7 × 0.7
A
C
Approximate Weight: 6.0 mg
Corrosion test: Class: 3B
Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC
60068-2-43)
LY Y876
12 Version 1.2 | 2018-04-05
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not
suitable for ultra sonic cleaning.
Recommended Solder Pad 9)
OHPY1315
0.8 (0.031)
2.2 (0.087)
0.7 (0.028)
Component location on pad
Bauteil positioniert
Padgeometrie für
CA
verbesserte Wärmeableitung
heat dissipation
Paddesign for improved
Lötstopplack
Solder resist
C
A
LY Y876
13 Version 1.2 | 2018-04-05
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
0
0s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Pro󰘰le Feature Symbol Pb-Free (SnAgCu) Assembly Unit
Minimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
2 3 K/s
Time tS
TSmin to TSmax
tS60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL217 °C
Time above liquidus temperature tL80 100 s
Peak temperature TP245 260 °C
Time within 5 °C of the speci󰘰ed peak
temperature TP - 5 K
tP10 20 30 s
Ramp-down rate*
TP to 100 °C
3 6 K/s
Time
25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; ful󰘰llment for the whole T-range
LY Y876
14 Version 1.2 | 2018-04-05
Taping 9)
OHAY1515
1.5 (0.059)
4 (0.157)
2 (0.079)
3.5 (0.138)
1.75 (0.069)
8.1 (0.319)
0.9 (0.035)
2.4 (0.094)
3.3 (0.130)
1.25 (0.049)
0.3 (0.012) max.
1.4 (0.055)
LY Y876
15 Version 1.2 | 2018-04-05
Tape and Reel 10)
Reel dimensions [mm]
A W Nmin W1W2 max Pieces per PU
180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 3000
330 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 10000
LY Y876
16 Version 1.2 | 2018-04-05
Barcode-Product-Label (BPL)
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
Dry Packing Process and Materials 9)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%
bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
LY Y876
17 Version 1.2 | 2018-04-05
Transportation Packing and Materials 9)
OHA02044
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
02
4 5
(Q)QTY:2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY:
2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
OSRAM
Packing
Sealing label
Barcode label
Moisture Level 3 Floor time 168 Hours Moisture Level 6Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Barcode label
Dimensions of transportation box in mm
Width Length Height
200 ± 5 mm 195 ± 5 mm 30 ± 5 mm
352 ± 5 mm 352 ± 5 mm 33 ± 5 mm
LY Y876
18 Version 1.2 | 2018-04-05
Chip Technology:
6: Standard InGalP
C: ATON
F: Thinfilm InGaAlP
G: ThinGaN (Thinfilm InGaN)
(Subcon: Sapphire)
S: standard InGaN low current
´
Encapsulant Type / Lens Properties
7: Colorless clear or white volume conversion
(resin encapsulation)
S: Silicone (with or without diffuser)
(λdom typ.) CIE 1931/Emission color:
B: 470 nm blue W: white
S: 633 nm super red
T: 528 nm true green
Y: 587 nm yellow
R: 625 nm red
O: 606 nm orange
G: 570 nm green
CP: 560 nm pure green
L: Light
emitting
diode
Package Type
Y: Micro SIDELED
Lead / Package Properties
1: 2808 height: 0,8 mm
8: Reflector Standard
Type Designation System
L B Y 8 7 C
LY Y876
19 Version 1.2 | 2018-04-05
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED speci󰘰ed in this
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from
these devices. As a matter of principle, however, it should be mentioned that intense light sources have a
high secondary exposure potential due to their blinding e󰘯ect. As is also true when viewing other bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this LED contain, in addition to other substances, metal 󰘰lled materials including silver.
Metal 󰘰lled materials can be a󰘯ected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize LED exposure to aggressive substances during storage, pro-
duction, and use. LEDs that showed visible discoloration when tested using the described tests above did
show no performance deviations within failure limits during the stated test duration. Respective failure limits
are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes
LY Y876
20 Version 1.2 | 2018-04-05
Disclaimer
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language word-
ings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please 󰘰nd the latest version on the OSRAM OS webside.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales o󰘲ce.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.
Product safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-
nate the customer-speci󰘰c request between OSRAM OS and Buyer and/or Customer.
LY Y876
21 Version 1.2 | 2018-04-05
Glossary
1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of
k = 3).
2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-
tion is not allowed.
3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-
ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k =
3).
4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an
internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage
factor of k = 3).
5) Thermal Resistance: Rth max is based on statistic values (6
σ
).
6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad)
7) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data
or calculated correlations of technical parameters can only re󰘱ect statistical 󰘰gures. These do not nec-
essarily correspond to the actual parameters of each single product, which could di󰘯er from the typical
data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical
improvements, these typ. data will be changed without any further notice.
8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher di󰘯er-
ences between single LEDs within one packing unit.
9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are speci󰘰ed with ±0.1 and
dimensions are speci󰘰ed in mm.
10) Tape and Reel: All dimensions and tolerances are speci󰘰ed acc. IEC 60286-3 and speci󰘰ed in mm.
LY Y876
22 Version 1.2 | 2018-04-05
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.