austriamicrosystems AG is now ams AG The technical content of this austriamicrosystems datasheet is still valid. Contact information: Headquarters: ams AG Tobelbaderstrasse 30 8141 Unterpremstaetten, Austria Tel: +43 (0) 3136 500 0 e-Mail: ams_sales@ams.com Please visit our website at www.ams.com AS1744 , AS1745 Data Sheet H i g h - Sp e e d , L o w - Vo l ta g e , D u a l , S i n g l e - S u p p l y, 4 , S P D T A n a l o g S w i t c h e s 2 Key Features Fast switching speeds, low ON-resistance, and low power-consumption make these devices ideal for singlecell battery powered applications. These highly-reliable devices operate from a +1.8 to +5.5V supply, are differentiated by inverted logic, and support break-before-make switching. ! ON-Resistance: - 4 (+5V supply) - 5.5 (+3V supply) ! RON Matching: 0.2 (+5V supply) ! RON Flatness: 1 (+5V supply) ! Supply Voltage Range: +1.8 to +5.5V ! 1.8V Operation: - 9.5 ON-Resistance over Temperature - 38ns Turn On Time - 12ns Turn Off Time am lc s on A te G nt st il With low ON-resistance (RON), RON matching, and RON flatness, the devices can accurately switch signals for sample and hold circuits, digital filters, and op-amp gain switching networks. al id The AS1744/AS1745 are high-speed, low-voltage, dual single-pole/double-throw (SPDT) analog switches. lv 1 General Description The devices are available in a 10-pin MSOP package and a 10-pin TDFN package. ! Current-Handling: 100mA Continuous ! Break-Before-Make Switching ! Rail-to-Rail Signal Handling ! Crosstalk: -90dB at 1MHz ! Off-Isolation: -85dB at 1MHz ! Total Harmonic Distortion: 0.1% ! Operating Temperature Range: -40 to +85C ! Package Types: - 10-pin MSOP - 10-pin TDFN 3 Applications ca The devices are ideal for use in power routing systems, cordless and mobile phones, MP3 players, CD and DVD players, PDAs, handheld computers, digital cameras, and any other application where high-speed signal switching is required. ch 1 ni Figure 1. Block Diagrams IN1 2 Te NO1 3 GND AS1744 4 NO2 5 IN2 www.austriamicrosystems.com 1 10 COM1 Truth Table 9 NC1 INx 8 Low V+ 7 NC2 High NOx to NCx to COMx COMx Off On 10 IN1 2 3 Off GND 4 NC2 5 6 IN2 COM2 Revision 1.53 9 NC1 On Switches shown for low input. COM1 NO1 AS1745 8 V+ 7 NO2 6 COM2 1 - 16 AS1744/AS1745 Data Sheet - P i n o u t 4 Pinout Pin Assignments Figure 2. Pin Assignments (Top View) NO1 2 AS1744 GND 3 NO2 4 Pin Descriptions 10 COM1 9 NC1 NC1 2 9 NO1 8 V+ GND 3 7 NC2 NC2 4 6 COM2 8 V+ AS1745 7 NO2 IN2 5 6 COM2 am lc s on A te G nt st il IN2 5 IN1 1 al id 10 COM1 lv IN1 1 Table 1. Pin Descriptions Pin Number Pin Name Description AS1744 AS1745 10 10 COM1 Analog Switch 1 Common 6 6 COM2 Analog Switch 2 Common 3 3 1 1 5 5 9 2 7 4 2 9 4 7 GND Analog Switch 1 Logic Control Input IN2 Analog Switch 2 Logic Control Input NC1 Analog Switch 1 Normally Closed Terminal NC2 Analog Switch 2 Normally Closed Terminal NO1 Analog Switch 1 Normally Open Terminal NO2 Analog Switch 2 Normally Open Terminal ca IN1 8 V+ Input Supply Voltage. +1.8 to +5.5V Te ch ni 8 Ground www.austriamicrosystems.com Revision 1.53 2 - 16 AS1744/AS1745 Data Sheet - A b s o l u t e Maximum Ratings 5 Absolute Maximum Ratings Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings Min Max Units V+, IN1, IN2 to GND -0.3 +7 V -0.3 V+ + 0.3 V COMx, NOx, NCx Continuous Current -100 +100 mA COMx, NOx, NCx Peak Current -150 +150 mA Pulsed at 1ms, 10% duty cycle Continuous Power Dissipation (TAMB = +70C) 330 mW Derate at 4.7mW/C above +70C Electro-Static Discharge 1000 V HBM Mil-Std883E 3015.7 methods Latch Up Immunity Operating Temperature Range -40 Junction Temperature Storage Temperature Range Package Body Temperature -65 100 mA +85 C 150 C +150 C +260 C Norm: JEDEC 17 The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD-020C "Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices" Signals on pins COM1, COM2, NO1, NO2, NC1, or NC2 that exceed V+ or GND are clamped by internal diodes. Limit forward-diode current to the maximum current rating. Te ch ni ca lv am lc s on A te G nt st il COMx, NOx, NCx to GND Comments al id Parameter www.austriamicrosystems.com Revision 1.53 3 - 16 AS1744/AS1745 Data Sheet - E l e c t r i c a l Characteristics 6 Electrical Characteristics V+ = +4.5 to 5.5V, VIH = +2.4V, VIL = +0.8V, TAMB = TMIN to TMAX (unless otherwise specified). Typ Values @TAMB = +25C. Table 3. +5V Supply Electrical Characteristics ON-Resistance Min 0 V+ = 4.5V, ICOMx = 10mA, VNOx or VNCx = 0 to V+ ON-Resistance V+ = 4.5V, ICOMx = 10mA, Match Between VNOx or VNCx = 0 to V+ 1 Channels ON-Resistance V+ = 4.5V, ICOMx = 10mA, RFLAT(ON) 2 VNOx or VNCx = 0 to V+ Flatness INOx(OFF), NOx or NCx OffV+ = 5.5V, VCOMx = 1 or 4.5V, INCx(OFF) Leakage Current 3 VNOx or VNCx = 4.5 or 1V COMx OffV+ = 5.5V, VCOMx = 1 or 4.5V, ICOMx(OFF) 3 VNOx or VNCx = 4.5 or 1V Leakage Current COMx OnV+ = 5.5V, VCOMx = 4.5 or 1V, ICOMx(ON) 3 VNOx or VNCx = 4.5 or 1V Leakage Current Logic Input: INx VIH Input Logic High VIL Input Logic Low Input Leakage IIH, IIL VINx = 0 or +5.5V Current Switch Dynamic Characteristics TAMB = TMIN to TMAX TAMB = +25C TAMB = TMIN to TMAX TAMB = +25C TAMB = TMIN to TMAX TAMB = +25C TAMB = TMIN to TMAX TAMB = +25C TAMB = TMIN to TMAX tON Turn On Time tOFF Turn Off Time 3 3 Break-Before3 Make Q Charge Injection CNOx(OFF), NOx, NCx OffCNCx(OFF) Capacitance COMx OnCCOMx(ON) Capacitance TAMB = +25C VNOx or VNCx = 3V, RLOAD = 300, CLOAD = 35pF, Figure 12 TAMB = TMIN to TMAX TAMB = +25C VNOx or VNCx = 3V, RLOAD = 300, CLOAD = 35pF, Figure 12 TAMB = TMIN to TMAX TAMB = +25C VNOx or VNCx = 3V, RLOAD = 300, CLOAD = 35pF, Figure 13 TAMB = TMIN to TMAX VGEN = 2V, RGEN = 0, CLOAD = 1.0nF, Figure 14 Unit V+ V 2.5 0.1 4 4.5 0.2 0.4 Te VCT Crosstalk 5 Total Harmonic Distortion Power Supply Positive Supply I+ Current THD www.austriamicrosystems.com 0.5 -0.1 -0.3 -0.1 -3 -0.4 -4 0.01 1 1.2 0.1 0.3 0.1 3 0.4 4 0.01 0.1 2.4 -100 nA nA nA 0.8 V V 5 100 nA 14 17 18 6 8 4 10 1 ns ns ns pC VNOx or VNCx = GND, f = 1MHz, Figure 15 20 pF VCOMx = GND, f = 1MHz, Figure 15 56 pF f = 10MHz, RLOAD = 50, CLOAD = 5pF, Figure 16 f = 1MHz, RLOAD = 50, CLOAD = 5pF, Figure 16 f = 10MHz, RLOAD = 50, CLOAD = 5pF, Figure 16 f = 1MHz, RLOAD = 50, CLOAD = 5pF, Figure 16 -52 f = 20Hz to 20kHz, VNOx = 5Vp-p, RLOAD = 600 0.1 ni ch Off-Isolation 4 7 ca tBBM VISO Max am lc s on A te G nt st il RON TAMB = +25C TAMB = TMIN to TMAX TAMB = +25C Typ lv RON Conditions al id Symbol Parameter Analog Switch VCOMx, Analog Signal VNOx, Range VNCx V+ = 5.5V, VINx = 0 or V+ Revision 1.53 dB -85 -52 dB -90 0.01 % 1.0 A 4 - 16 AS1744/AS1745 Data Sheet - E l e c t r i c a l Characteristics V+ = +2.7 to 3.6V, VIH = +2.0V, VIL = +0.4V, TAMB = TMIN to TMAX (unless otherwise specified). Typ values @ TAMB = +25C. Table 4. +3V Supply Electrical Characteristics Symbol Parameter Analog Switch VCOMx, VNOx, Analog Signal Range VNCx Conditions Min Typ Max Unit 0 RON ON-Resistance Match Between 1 Channels V+ = 2.7V, ICOMx = 10mA, VNOx or VNCx = 0 to V+ RFLAT(ON) ON-Resistance 2 Flatness V+ = 2.7V, ICOMx = 10mA, VNOx or VNCx = 0 to V+ INOx(OFF), INCx(OFF) NOx or NCx Off3 Leakage Current V+ = 3.3V, VCOMx = 1 or 3V, VNOx or VNCx = 3 or 1V ICOMx(OFF) COMx Off-Leakage 3 Current V+ = 3.3V, VCOMx = 1 or 3V, VNOx or VNCx = 3 or 1V COMx On-Leakage 3 Current Logic Input: (INx) VIH Input Logic High V+ = 3.3V, VCOMx = 1 or 3V, VNOx or VNCx = 1 or 3V TAMB = +25C 5 TAMB = TMIN to TMAX 8 TAMB = +25C 0.1 TAMB = TMIN to TMAX TAMB = +25C TAMB = TMIN to TMAX TAMB = +25C TAMB = TMIN to TMAX 5.5 ICOMx(ON) VIL 0.2 0.4 1.5 2 2.5 -0.1 0.01 0.1 -0.3 0.3 TAMB = +25C -0.1 TAMB = TMIN to TMAX -3 TAMB = +25C -0.4 TAMB = TMIN to TMAX -4 0.01 0.1 3 tOFF Turn Off Time tBBM Break-Before-Make 3 3 3 0.4 4 nA nA nA V 0.4 V 5 100 nA TAMB = +25C VNOx or VNCx = 2V, RLOAD = 300, CLOAD = 35pF, Figure 12 TAMB = TMIN to TMAX 17 23 TAMB = +25C VNOx or VNCx = 2V, RLOAD = 300, CLOAD = 35pF, Figure 12 TAMB = TMIN to TMAX 6 TAMB = +25C VNOx or VNCx = 2V, RLOAD = 300, CLOAD = 35pF, Figure 13 TAMB = TMIN to TMAX 11 Input Leakage IIH,IIL Current Switch Dynamic Characteristics Turn On Time 0.1 2.0 Input Logic Low tON al id V+ = 2.7V, ICOMx = 10mA, VNOx or VNCx = 0 to V+ V lv ON-Resistance am lc s on A te G nt st il RON V+ VINx = 0 or +5.5V -100 28 8 10 ns ns ns 1 Charge Injection VGEN = 1.5V, RGEN = 0, CLOAD = 1.0nF, Figure 14 0 pC CNOx(OFF), CNCx(OFF) NOx, NCx OffCapacitance VNOx or VNCx = GND, f = 1MHz, Figure 15 20 pF CCOMx(ON) COMx OnCapacitance VCOMx = GND, f = 1MHz, Figure 15 56 pF f = 10MHz, RLOAD = 50, CLOAD = 5pF, Figure 16 -52 f = 1MHz, RLOAD = 50, CLOAD = 5pF, Figure 16 -85 f = 10MHz, RLOAD = 50, CLOAD = 5pF, Figure 16 -52 f = 1MHz, RLOAD = 50, CLOAD = 5pF, Figure 16 -90 V+ = 3.6V, VIN = 0 or +3.6V 0.01 ni Off-Isolation ch VISO ca Q VCT Crosstalk 4 5 dB dB Te Power Supply I+ Positive Supply Current 1.0 A 1. RON = RON(MAX) - RON(MIN). 2. Flatness is defined as the difference between the maximum and the minimum value of ON-resistance as measured over the specified analog signal ranges. 3. Guaranteed by design. 4. Off-Isolation = 20log10(VCOMx/VNOx), VCOMx = output, VNOx = input to off switch. 5. Between any two switches. www.austriamicrosystems.com Revision 1.53 5 - 16 AS1744/AS1745 Data Sheet - Ty p i c a l Operating Characteristics 7 Typical Operating Characteristics Figure 3. Frequency Response Figure 4. THD vs. Frequency 10 0.12 Bandwidth 0 0.1 -10 Isolation -40 Crosstalk -50 -60 al id 0.08 -30 THD (%) 0.06 0.04 -70 -80 lv Loss (dB) -20 0.02 -90 0.1 10 0 1000 1000 10000 100000 am lc s on A te G nt st il -100 0.001 Frequency (MHz) Frequency (Hz) Figure 5. RON vs. VCOM and Temperature (VDD = 5V) Figure 6. RON vs. VCOM and Temperature (VDD = 3V) 3.5 4.5 4.0 2.5 2.0 Temp = +85C 3.5 Temp = +25C 3.0 RON() RON () 3.0 Temp = -40C 1.5 Temp = +85C Temp = +25C 2.5 Temp = -40C 2.0 1.5 1.0 0 1 2 3 4 1.0 5 0.0 VCOM (V) ca 25 20 tON/tOFF (ns) VDD = 1.8V 8 VDD = 2.5V 6 Te RON () ch 10 VDD = 3V 4 3.0 Figure 8. tON/tOFF vs. Temperature (V+ = 5V) ni 12 2.0 VCOM (V) Figure 7. RON vs. VCOM 14 1.0 tON 15 10 VDD = 4.5V tOFF 5 2 VDD = 5V 0 0 0 1 2 3 4 5 -40 VCOM (V) www.austriamicrosystems.com 25 85 Temperature (C) Revision 1.53 6 - 16 AS1744/AS1745 Data Sheet - D e t a i l e d Description Figure 9. tON/tOFF vs. Supply Voltage Figure 10. Charge Injection 35 40 30 25 20 20 tON 15 al id Q(pC) 10 5 10 tOFF 0 VDD = 3V VDD = 5V -5 0 1.5 2.5 3.5 4.5 0 5.5 1 2 3 VCOM (V) 4 5 am lc s on A te G nt st il Supply Voltage (V) lv tON/tOFF (ns) 30 8 Detailed Description The AS1744/AS1745 are low ON-resistance, low-voltage, dual analog SPDT switches that operate from a single +1.8 to +5.5V supply. CMOS process technology allows switching of analog signals that are within the supply voltage range (GND to V+). ON-Resistance When powered from a +5V supply, the low RON (4 max) allows high continuous currents to be switched in a wide range of applications. All devices have low RON flatness (1, max) so they can meet or exceed the low-distortion audio requirements of modern portable audio devices. Bi-Directional Switching Pins NOx, NCx, and COMx are bi-directional, thus they can be used as inputs or outputs. ca Analog Signal Levels Analog signals ranging over the entire supply voltage (V+ to GND) can be passed with very little change in ON-resistance (see Typical Operating Characteristics on page 6). ni Logic Inputs Te ch The AS1744/AS1745 logic inputs (INx) can be driven up to +5.5V regardless of the supply voltage value. For example, with a +3.3V supply, IN+ may be driven low to GND and high to +5.5V. This allows the devices to interface with +5V systems using a supply of less than 5V. www.austriamicrosystems.com Revision 1.53 7 - 16 AS1744/AS1745 Data Sheet - A p p l i c a t i o n Information 9 Application Information Power-Supply Sequencing Proper power-supply sequencing is critical for proper operation. The recommended sequence is as follows: al id 1. V+ 2. NOx, NCx, COMx Always apply V+ before applying analog signals, especially if the analog signal is not current-limited. If the above sequence is not possible, and if the analog inputs are not current-limited to less than 30mA, add a small-signal diode as shown in Figure 11 (D1). If the analog signal can dip below GND, add diode D2. Adding these diodes will reduce the analog range to a diode-drop (about 0.7V) below V+ (for D1), and a diode-drop above ground (for D2). Note: Operation beyond the absolute maximum ratings (see page 3) may permanently damage the devices. lv Overvoltage Protection ON-resistance increases slightly at lower supply voltages. am lc s on A te G nt st il Figure 11. Overvoltage Protection Using 2 External Blocking Diodes AS1744/AS1745 V+ D1 V+ NOx COMx VGEN GND D2 Adding diode D2 to the circuit shown in Figure 11 causes the logic threshold to be shifted relative to GND. Diodes D1 and D2 also protect against overvoltage conditions. ca For example, in the circuit shown in Figure 11, if the supply voltage goes below the absolute maximum rating, and if a fault voltage up to the absolute maximum rating is applied to an analog signal pin, no damage will result. Note: The supply voltage (V+) must not exceed the absolute maximum rating of +7V. ni Power Supply Bypass ch Power supply connections to the devices must maintain a low impedance to ground. This can be done using a bypass capacitor, which will also improve noise margin and prevent switching noise propagation from the V+ supply to other components. Layout Considerations High-speed switches require proper layout and design procedures for optimum performance. Reduce stray inductance and capacitance by keeping traces short and wide. ! Ensure that bypass capacitors are as close to the device as possible. ! Use large ground planes where possible. Te ! www.austriamicrosystems.com Revision 1.53 8 - 16 AS1744/AS1745 Data Sheet - A p p l i c a t i o n Information Timing Diagrams and Test Setups Figure 12. Switching Time NOx or NCx COMx VOUT NCx or NOx RLOAD CLOAD INx 50% 50% tOFF VOUT Switch Output 0 0.9 x VOUT tON Logic Input GND Logic input waveforms inverted for switches that have the opposite logic sense. Includes stray capacitance and fixture capacitance. am lc s on A te G nt st il 0.9 x VOUT lv V+ VIN tR < 5ns tF < 5ns VIH + 0.5V Logic Input 0 al id V+ AS1744/ AS1745 Figure 13. Break-Before-Make Interval V+ V+ VIN NOx or NCx NCx or NOx INx tR < 5ns tF < 5ns AS1744/ AS1745 VIH + 0.5V COMx RLOAD VOUT CLOAD Logic Input 50% 0 0.9 x VOUT VOUT Logic Input GND Includes stray capacitance and fixture capacitance. tD ca Figure 14. Charge Injection ni AS1744/ AS1745 V+ V+ VOUT ch INx VINL to VINH COMx NCx or NOx VOUT INx Off VOUT On Off Te RGEN VGEN GND CLOAD Off On Off INx INx depends on switch configuration; input polarity is determined by the sense of the switches. Q = VOUT x CLOAD www.austriamicrosystems.com Revision 1.53 9 - 16 AS1744/AS1745 Data Sheet - A p p l i c a t i o n Information Figure 15. NOx, NCx, and COMx Capacitance AS1744/ AS1745 V+ V+ COMx 10nF INx GND NCx or NOx lv VINH or VINL al id 1MHz Capacitance Analyzer am lc s on A te G nt st il Figure 16. Off-Isolation, On-Loss, and Crosstalk Network Analyzer COMx V+ VIN 50 VOUT Measure 50 V+ 10nF AS1744/ AS1745 NCx V+ NOx Reference INx GND 50 50 Notes: 50 Te ch ni ca 1. Measurements are standardized against short-circuit at all terminals. 2. Off-isolation is measured between COMx and the off NCx/NOx terminal of each switch. Off-isolation = 20log(VOUT/VIN). 3. Crosstalk is measured from one channel to all other channels. 4. Signal direction through the switch is reversed; worst values are recorded. www.austriamicrosystems.com Revision 1.53 10 - 16 AS1744/AS1745 Data Sheet - A p p l i c a t i o n Information Package Drawings and Markings The devices are available in a 10-pin MSOP package and a 10-pin TDFN package. Typ 1.10 0.10 0.86 3.00 2.95 4.90 3.00 2.95 0.51 0.51 0.15 0.15 0.31 0.41 Tol Max 0.05 0.08 0.10 0.10 0.15 0.10 0.10 0.13 0.13 +0.15/-0.08 +0.15/-0.08 0.08 0.08 Te ch ni ca Symbol A A1 A2 D D2 E E1 E2 E3 E4 R R1 t1 t2 am lc s on A te G nt st il lv al id Figure 17. 10-pin MSOP Package www.austriamicrosystems.com Symbol b b1 c c1 1 2 3 L L1 aaa bbb ccc e S Revision 1.53 Typ 0.23 0.20 0.18 0.15 3.0 12.0 12.0 0.55 0.95BSC 0.10 0.08 0.25 0.50 BSC 0.50 BSC Tol +0.07/-0.08 0.05 0.08 +0.03/-0.02 3.0 3.0 3.0 0.15 - 11 - 16 AS1744/AS1745 Data Sheet - A p p l i c a t i o n Information All dimensions are in millimeters, angles in degrees, unless otherwise specified. Datums B and C to be determined at datum plane H. Dimensions D and E1 are to be determined at datum plane H. Dimensions D2 and E2 are for top package; dimensions D and E1 are for bottom package. Cross section A-A to be determined at 0.13 to 0.25mm from lead tip. Dimensions D and D2 do not include mold flash, protrusion, or gate burrs. Dimensions E1 and E2 do not include interlead flash or protrusion. Te ch ni ca am lc s on A te G nt st il lv 1. 2. 3. 4. 5. 6. 7. al id Notes: www.austriamicrosystems.com Revision 1.53 12 - 16 AS1744/AS1745 Data Sheet - A p p l i c a t i o n Information Figure 18. 10-pin TDFN Package (3.0x3.0mm) D2 SEE DETAIL B -A- D D/2 D2/2 PIN 1 MARKER aaa C 2x E E2 al id E2/2 E/2 NXL -B- INDEX AREA (D/2 xE/2) 4 NXb e aaa C 2x INDEX AREA (D/2 xE/2) 4 6 TOP VIEW lv NXK N N-1 10 (ND-1) X e 5 bbb ddd C C A B 8 ccc C 10 A 7 am lc s on A te G nt st il BOTTOM VIEW NX 0.08 C SEATING PLANE -C- A3 A1 SIDE VIEW Datum A or B E L2 L1 D e Terminal Tip DETAIL B TYPE A Max 0.80 0.05 ca Typ 0.75 0.02 0.20 REF 0.15 0.13 14 ni Min 0.70 0.00 0 0.20 0.17 0.18 Te ch Symbol A A1 A3 L1 L2 K K2 b e aaa bbb ccc ddd eee ggg 0.25 0.5 0.15 0.10 0.10 0.05 0.08 0.10 www.austriamicrosystems.com 0.30 Notes 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2, 5 Symbol D BSC E BSC D2 E2 L N ND 5 ODD TERMINAL SIDE Min 2.20 1.40 0.30 Variations Typ 3.00 3.00 0.40 10 5 Max 2.70 1.75 0.50 Notes 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2, 5 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 Revision 1.53 13 - 16 AS1744/AS1745 Data Sheet - A p p l i c a t i o n Information Notes: Dimensioning and tolerancing are compliant with ASME Y14.5M-1994. Dimensions are in millimeters, angles in degrees (). N is the total number of terminals. The terminal 1 identifier and terminal numbering convention shall conform to JESD 95-1 SPP-012. Details of terminal 1 identifier are optional, but must be located within the zone indicated. The terminal 1 identifier may be either a mold, embedded metal or mark feature. 5. Dimension b applies to metallized terminal and is measured between 0.15 and 0.30mm from terminal tip. 6. ND refers to the maximum number of terminals on D side. 7. Variation shown in Figure 18 is for illustration purposes only. 8. For variation identifier dimension details, refer to the Dimensions table. 9. For a complete set of dimensions for each variation, refer to the Variations table. 10. Unilateral coplanarity zone applies to the exposed heat sink slug and the terminals. 11. For a rectangular package, the terminal side of the package is determined by: - Type 1: Terminals are on the short side of the package. - Type 2: Terminals are on the long side of the package. 12. Variations specified as NJR (non JEDEC registered), with an additional dash number (e.g., -1, -2) are packages currently not registered with JEDEC. 13. When more than one variations exist for the same profile height, body size (DxE), and pitch, then those variations will be denoted by an additional dash number (i.e., -1,-2) for identification. The new variations shall be created based on any or all of the following factors: terminal count, terminal length, and exposed pad sizes. Te ch ni ca am lc s on A te G nt st il lv al id 1. 2. 3. 4. www.austriamicrosystems.com Revision 1.53 14 - 16 AS1744/AS1745 Data Sheet - O r d e r i n g Information 10 Ordering Information The devices are available as the standard products shown in Table 5. Table 5. Ordering Information Description Delivery Form Package AS1744G Dual SPDT Switch Tube 10-pin MSOP Dual SPDT Switch Tape and Reel 10-pin MSOP Dual SPDT Switch Tape and Reel 10-pin TDFN Dual SPDT Switch Tube 10-pin MSOP Dual SPDT Switch Tape and Reel 10-pin MSOP Dual SPDT Switch Tape and Reel 10-pin TDFN AS1744V-T AS1745G AS1745G-T AS1745V-T Available upon request. Contact austriamicrosystems, AG for details. Te ch ni ca am lc s on A te G nt st il lv AS1744G-T al id Type www.austriamicrosystems.com Revision 1.53 15 - 16 AS1744/AS1745 Data Sheet Copyrights Copyright (c) 1997-2007, austriamicrosystems AG, Schloss Premstaetten, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered (R). All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. All products and companies mentioned are trademarks or registered trademarks of their respective companies. al id Disclaimer am lc s on A te G nt st il lv Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or lifesustaining equipment are specifically not recommended without additional processing by austriamicrosystems AG for each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard production flow, such as test flow or test location. ni ca The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However, austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of austriamicrosystems AG rendering of technical or other services. ch Contact Information Te Headquarters austriamicrosystems AG A-8141 Schloss Premstaetten, Austria Tel: +43 (0) 3136 500 0 Fax: +43 (0) 3136 525 01 For Sales Offices, Distributors and Representatives, please visit: http://www.austriamicrosystems.com/contact www.austriamicrosystems.com Revision 1.53 16 - 16