A Subsidiary of
TT electronics plc
General Note
IRC reserves the right to make changes in product specifi cation without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Metal Element
Current Sense Resistor
Issue December 2008 Sheet 1 of 6
IRC Type Coating1Power rating
at 80°C (Watts)
Standard Resistance
Values (mΩ)2
TCR
(±ppm/°C)
Tolerance
(±%)
Dielectric
Withstanding Voltage
(Volts)
1206 Chip Size
ULR-1 Green 1 1, 2, 3, 5, 7, 10 50 1, 5 100
2010 Chip Size
ULR-15 Green 1.5 1, 2, 3, 5, 7, 10 50 1, 5 100
2512 Chip Size
ULR-1
Green
1 11 - 20 50
1, 5 200
ULR-2 2 7 - 10 50
ULR-25 2.5 4 - 6 50
ULR-3 3 0.5 - 0.75 100
1 - 3 50
ULR-1 Black 12.5 - 3 150
4 - 5 100
ULR-2 2 0.5 - 2 50
Test
Short Term Overload (5x rated power for 5 seconds) ∆R/R ≤ ± 0.5% + 0.5 mΩ (black); ∆R/R ≤ ± 1% (green)
Load at rated power (1000 hours cyclic load @ 70°C)∆R/R ≤ ± 1% + 0.5 mΩ (black); ∆R/R ≤ ± 1% (green)
Temperatature Cycling (-55°C to +150°C; 100 cycles) ∆R/R ≤ ± 0.5% + 0.5 mΩ (black); ∆R/R ≤ ± 1% (green)
Dry Heat (+155°C, no load; 96 hours) ∆R/R ≤ ± 1% + 0.5 mΩ (black); ∆R/R ≤ ± 1% (green)
Resistance to Solder Heat (260°C for 10 seconds) ∆R/R ≤ ± 0.5% + 0.5 mΩ (black); ∆R/R ≤ ± 1% (green)
Solderability (235°C for 2 seconds) Minimum 95% coverage
Resistance to Solvents No deterioration of protective coating or marking
Operating Temperature -55°C to 170°C
ULR Series
Robust metal strip able to withstand high temperature and high current.•
Low TCR and Inductance•
Resistance Range from 0.5 mΩ to 20 mΩ•
Power ratings from 1W to 3W in 1206, 2010 and 2512 chip size•
Designed for current sense circuits in power electronic systems•
Higher wattage devices feature PCB clearance gap to maximize thermal •
performance
Electrical Data
Notes:
1.Black coating = wave or IR refl ow soldering; Green coating = IR refl ow solder. Wave refl ow - solder mask must match the W and D dimensions on page 2
of data sheet. 2Non-standard resistance values available (contact factory). For resistance values above 20 mΩ, please refer to our LRC / LRF series.
3 Package sizes 2010 and 1206 with the green coating are uncoated on the top surface and unmarked for resistance value.
Environmental Data
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Issue December 2008 Sheet 2 of 6
D
W
T
L
Coating Resistance
Value (mΩ)
LWT D
1206 Chip Size (1 Watt)
Green 1.0 - 10 3.2 ± 0.25 1.6 ± 0.10 0.6 ± 0.2 0.98 ± 0.38
2010 Chip Size (1.5 Watt)
Green 1.0 - 10 5.08 ± 0.25 2.54 ± 0.15 0.6 ± 0.2 1.67 ± 0.63
2512 Chip Size (2 Watt, 2.5 Watt, and 3 Watt)
Green
0.5
6.35 ± 0.25 3.18 ± 0.35 0.6 ± 0.2
2.68 ± 0.25
0.75 2.48 ± 0.25
1 - 1.5 1.43 ± 0.25
2 - 3 1.18 ± 0.25
4 2.18 ± 0.25
5 - 6 1.93 ± 0.25
7 1.43 ± 0.25
8 - 20 1.18 ± 0.25
Black
0.5
6.35 ± 0.25 3.18 ± 0.25
1.4 ± 0.2 1
1.43 ± 0.38
0.75 1.0 ± 0.2 1
1 0.8 ± 0.2 1
1.5 0.65 ± 0.2 1
2 0.5 ± 0.2 1
2.5 1.0 ± 0.2 1
3 0.7 ± 0.2 1
4 0.6 ± 0.2 1
5 0.5 ± 0.2 1
Physical Data
Note:
1 Dimensions are for reference only
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Issue December 2008 Sheet 3 of 6
1.8
1.0
4.75
1.45
4-wire pad layout
1.8
4.75 3.6
2-wire pad layout
1.5
5.4
4-wire precision measurement points
unit: mm unit: mm unit: mm
0.5
1.44
0.8 3.8
1.16
4-wire pad layout
1.44
3.8 3.12
2-wire pad layout
1.2
4.32
4-wire precision measurement points
unit: mm unit: mm unit: mm
0.5
0.9
0.5 2.38
0.725
4-wire pad layout 2-wire pad layout 4-wire precision measurement points
unit: mm unit: mm unit: mm
0.9
2.38 1.95 0.75
2.7
0.25
2512 Package
2010 Package
1206 Package
Electrical Connections
Note:
1 Green parts require the use of “D” dimensions on page 2 for parts being assembled in a wave refl ow processes.
Ambient Temperature (°C)
Rated Power (%)
100
50
85 170
0
0
Power Derating Curve
Note:
The power derating curve is a guidance based on a conserva-
tive design model. The ULR is a solid metal alloy construc-
tion that can withstand signifi cantly greater operating temper-
atures than the conservative model permits. The protective
coating will operate up to 260°C and the alloy can withstand
in exess of 350°C. Therefore, the system thermal design will
be a more signifi cant design parameter due to the heat limita-
tions of the solder joint.
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Issue December 2008 Sheet 4 of 6
W
E
F
ψ D
0
P
1
P
2
P
0
direction of unreeling
A
B
Top Tape
Resistor
Emboss Tape
T
ψ D
1
1.4Min.
Size Resistance
(mΩ)ABWEFP
0P1P2Φ D0T
2512 0.5 - 7 3.4±0.1 6.73±0.1 12±0.1 1.75±0.1 5.5±0.05 4±0.1 4±0.1 2±0.05 1.5±0.1 0.81±0.1
0.5 - 20 6.75±0.1 1.55±0.1 0.80±0.1
2010 1 - 10 2.85±0.1 5.55±0.1 12±0.1 1.75±0.1 5.5±0.1 4±0.1 4±0.1 2±0.05 1.55±0.1 0.85±0.1
1206 1 - 10 1.9±0.1 3.6±0.1 8±0.2 1.75±0.1 3.5±0.1 4±0.1 4±0.1 2±0.05 1.55±0.1 0.87±0.1
Product Marking
Part resistance is indicated by using two marking notation syles:
4-digit: R002 = 2 mΩ; R designates the decimal location in ohms.•
3-digit: 1M5 = 1.5 mΩ; M designates the decimal location in milli-ohm.•
Black Type Green Type
Black Type
A low TCR resistance alloy plate with plated connection bands is protectively coated and numerically marked with the resistance value,
as described in Product Marking. This version has standard plated connection and is suitable for wave or IR refl ow soldering processes.
Green Type
A low TCR alloy plate is grooved to set the fi nal resistance. The lower faces are solder plated for connections, and the top surface is pro-
tectively coated and numerically marked with the resistance value, as described in Product Marking. This part is suitable for wave and IR
refl ow soldering processes. Wave refl ow requires the solder mask to be dimensioned according to page 2 using the W and D dimensions
of the part.
Construction
Plastic Tape Specifi cation
Note:
The cumulative tolerance of 10 sprocket hole pitch is ± 0.2 mm.1.
Carrier camber shall not be more than 1 mm per 100 mm through a length of 250 mm.2.
A & B measured 0.3 mm from the bottom of the packet.3.
T measured at a point on the inside bottom of the packet to the top surface of the carrier.4.
Pocket position relative to sprocket hole is measured as the true position of the pocket and not the pocket hole.5.
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Issue December 2008 Sheet 5 of 6
Note 1: Package volume excludes external
terminals (balls, bumps, lands, leads) and/or non-
integral heat sinks.
Note 2: The maximum component temperature
reached during refl ow depends on package thick-
ness and volume. The use of convection refl ow
processess reduces the thermal gradients be-
tween packages. However, thermal gradients due
to differences in thermal mass of SMD packages
may still exist.
Note 3: Components intended for use in “lead-
free” assembly process shall be evaluated using
the “lead-free” peak temperature and profi les
defi ned in Table 1, 2 and refl ow profi le whether or
not lead-free.
Tabel 1: SnPb Eutectic Process -
Package Peak Refl ow Temperatures
Package
Thickness Volume mm3 < 350 Volume mm3 ≥ 350
< 2.5 mm 240 +0/-5°C 225 +0/-5°C
≥ 2.5 mm 225 +0/-5°C 225 +0/-5°C
Tabel 2: Pb-free Process -
Package Peak Refl ow Temperatures
Package
Thickness
Volume mm3
< 350
Volume mm3
350 - 2000
Volume mm3
> 2000
< 1.6 mm 260°C * 260°C * 260°C *
1.6 mm - 2.5 mm 260°C * 250°C * 245°C *
≥ 2.5 mm 250°C * 245°C * 245°C *
* Tolerance: The device manufacturer/supplier shall assure process
compatibility up to and including the stated classifi cation temperature
at the rated MSL level.
Note 1: All temperatures refer
to topside of the package,
measured on the package body
surface.
Note 2: Time within 5 °C of
actual peak temperature (tp)
specifi ed for the refl ow profi les
is a “supplier” minimum and a
“user” maximum.
Profi le Feature Sn-Pb Eutectic
Assembly
Pb-Free
Assembly
Average Ramp-up rate (Tsmax to Tp) 3°C / second max. 3°C / second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100°C
150°C
60 -120 seconds
150°C
200°C
60 -180 seconds
Time maintained above
- Temperature (TL)
- Time (tL)
183°C
60 - 150 seconds
217°C
60 - 150 seconds
Peak Temperature (TP) See Table 1 See Table 2
Time within 5°C of actual Peak Temperature (tp)210 - 30 seconds 20 - 40 seconds
Ramp-down Rate 6°C / second max. 6°C / second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.
IRC Solder Refl ow Recommendations
Sn-Pb Eutectic and Pb-Free Reflow Profiles
Time
Temperature
Critical Zone
TL to TP
Ramp-down
Ramp-up
t 25°C to Peak
TP
TL
Tsmax
Tsmin
ts
Preheat
tL
25
tP
* Based on Industry Standards and IPC recommendations
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Issue December 2008 Sheet 6 of 6
IRC Type
Coating Color Code
G = Green, B = Black
Power Rating
(see specs table)
Package Size
Resistance Value (EIA 4-digit code)
Example: 0.010 = R010
Tolerance (EIA format)
F = 1%
J = 5%
RoHS - Compliance
LF = RoHS compliant Construction
Packaging
SLT = Standard Lead Tape
Ordering Data
Specify type, resistance, tolerance, ROHS compliance and packaging.
Example: Metal Element Current Sense Resistor, 1-watt, 10 mΩ resistor.
ULR 1 2512 R010 F LF SLTSample Part No.
Packaging Quantity
Series Emboss Plastic Tape
2512 2,000
2010 2,000
1206 2,000
G
