ASMT-QWB2-NHLDE - Avago Technologies

ASMT-QWB2-Nxxxx

Super 0.5W White Power PLCC-4

Surface Mount LED Indicator

Data Sheet

CAUTION: ASMT-QWB2-Nxxxx LEDs are Class 1C ESD sensitive. Please observe appropriate precautions

during handling and processing. Refer to Avago Application Note AN-1142 for additional details.

Features

x Industry Standard PLCC 4 platform (3.2 x 2.8 x 1.9mm)

x High reliability package with enhanced silicone resin

encapsulation

x High brightness with optimum ﬂux performance

using InGaN chip technologies

x Available in Cool White

x High optical eﬃciency 30lm/W

x Available in 8mm carrier tape and 7 inch reel

x Low Thermal Resistance 60 qC/W

x Super wide viewing angle at 120q

x JEDEC MSL 2a

Applications

1. Interior automotive

a. Instrument panel backlighting

b. Central console backlighting

c. Navigation and audio system backlighting

d. Dome/Map lighting

e. Push button backlighting

f. Puddle lamp

g. Glove compartment illumination

2. Exterior automotive

a. Number plate illumination

b. Rear reverse lamp indicator

3. Electronic signs and signals

a. Decorative lighting

4. Oﬃce automation, home appliances, industrial

equipment

a. Panel/button backlighting

b. Display backlighting

Description

The Super 0.5W White Power PLCC-4 SMT LED is ﬁrst

white mid-Power PLCC-4 SMT LEDs using InGaN chip

technology. The package can be driven at high current

due to its superior package design. The product is able

to dissipate the heat more eﬃciently compared to the

Power PLCC-4 SMT LEDs. These LEDs produce higher light

output with better ﬂux performance compared to the

Power PLCC-4 SMT LED.

The Super 0.5W White Power PLCC-4 SMT LEDs are

designed for higher reliability, better performance, and

operate under a wide range of environmental conditions.

The performance characteristics of these new mid-power

LEDs make them uniquely suitable for use in harsh condi-

tions such as in automotive applications, and in electron-

ics signs and signals.

To facilitate easy pick and place assembly, the LEDs are

packed in EIA-compliant tape and reel. Every reel is

shipped in single intensity and color bin, to provide close

uniformity.

Package Drawing

Note:

1. All Dimensions in millimeters.

2. Lead Polarity as shown in Figure 11.

3. Terminal Finish: Ag plating

4. Encapsulation material: Silicone resin

Figure 1. Package Drawing

Table 1. Device Selection Guide (TJ = 25 °C)

Color Part Number

Luminous Flux, )V [1] (lm)

Dice TechnologyMin. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test Current (mA)

White ASMT-QWB2-NEF0E 11.5 17.0 19.5 150 InGaN

Notes:

1. )V is the total luminous ﬂux output as measured with an integrating sphere at mono pulse conditions.

2. Tolerance = ±12%

A S M T – Q X1 B 2 – N X2 X3 X4 X5

Packaging Option

Colour Bin Selection

Max. Flux Bin Selection

Min. Flux Bin Selection

Color

W - Cool White

Part Numbering System

3.6 ± 0.2

0.7

3.2 ± 0.2

2.8 ± 0.2

2.2 ± 0.2 1.9 ± 0.2 0.6 ± 0.3

0.79 ± 0.3

CATHODE

MARKING

I 2.4

1.15 ± 0.2

0.41 (TYP.)

0.56 (TYP.)

0.97

Table 2. Absolute Maximum Ratings (TA = 25 °C)

Parameters ASMT-QWB2-Nxxxx

DC Forward Current [1] 150 mA

Peak Forward Current [2] 300 mA

Power Dissipation 513 mW

Reverse Voltage Not Recommended for Reverse Bias

Junction Temperature 125 °C

Operating Temperature -40 °C to +110 °C

Storage Temperature -40 °C to +110 °C

Notes:

1. Derate Linearly as shown in Figure 6.

2. Duty Factor = 10%, Frequency = 1kHz

Table 3. Optical Characteristics (TJ = 25 °C)

Color Part Number

Dice

Technology

Typical

Chromaticity

Coordinates [1]

Viewing Angle

2O½[1]

(Degrees)

Luminous

Eﬃciency

Ke (lm/W)

Total Flux / Luminous

Intensity

FV (lm) / IV (cd)

x y Typ. Typ. Typ.

White ASMT-QWB2-Nxxxx InGaN 0.31 0.31 120 30 2.85

Notes:

1. T½ is the oﬀ-axis angle where the luminous intensity is ½ the peak intensity.

Table 4. Electrical Characteristics (TJ = 25 °C)

Part Number

Forward Voltage

VF (Volts) @ IF = 150 mA Thermal

Resistance

RTJ-P (°C/W)Typ. Max.

ASMT-QWB2-Nxxxx 3.6 4.1 60

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

380 400 420 440460 480 500 520 540 560 580 600 620 640 660 680 700 720 740 760 780

WAVELENGTH - nm

RELATIVE INTENSITY

Figure 2. Relative Intensity Vs. Wavelength Figure 3. Forward Current Vs. Forward Voltage.

100

150

200

250

300

350

012345

FORWARD VOLTAGE - V

FORWARD CURRENT - mA

0.2

0.4

0.6

0.8

1.0

1.2

0255075100 125 150

DC FORWARD CURRENT - mA

RELATIVE LUMINOUS FLUX

(NORMALIZATION AT 150mA)

Figure 4. Relative Flux vs. Forward Current Figure 5. Relative Intensity Vs. Temperature

Figure 6a. Maximum Forward Current Vs. Ambient Temperature.

Derated Based on TJMAX = 125°C, RTJ-A = 90°C/W and 110 °C/W.

Figure 8. Radiation Pattern

Figure 7. Forward Voltage Shift Vs. Temperature.

-0.15

-0.1

-0.05

0.05

0.1

0.15

0.2

0.25

-50 -25 0 25 50 75 100

JUNCTION TEMPERATURE - °C

FORWARD VOLTAGE SHIFT - V

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

-90 -60 -300 306090

ANGULAR DISPLACEMENT - DEGREES

NORMALIZED INTENSITY

Figure 6b. Maximum forward current vs. solder point temperature.

Derated Based on TJMAX = 125°C, RTJP=60°C/W

100

120

140

160

020406080100 120

SOLDER POINT TEMPERATURE - °C

MAXIMUM FORWARD CURRENT - mA

RθJP = 60°C/W

100

120

140

160

020406080100 120

AMBIENT TEMPERATURE - °C

MAXIMUM FORWARD CURRENT - mA

RθJA = 90°C/W

RθJA = 110°C/W

0.2

0.4

0.6

0.8

1.2

1.4

-50 -250 255075100 125

JUNCTION TEMPERATURE - °C

NORMALIZED LUMINOUS INTENSITY

Figure 9. Recommended Pick and Place Nozzle Size

Figure 10. Recommended Pb-free Reﬂow Soldering Proﬁle

Figure 11. Recommended Soldering Pad Pattern

Note: For detail information on reﬂow soldering of Avago surface mount

LEDs, do refer to Avago Application Note AN 1060 Surface Mounting

SMT LED Indicator Components

Note: Diameter "D" should be smaller than 2.2mm

D217 ° C

200 ° C

60 - 120 SEC.

6 °C/SEC. MAX.

3 °C/SEC. MAX.

150 ° C

255 - 260 °C

100 SEC. MAX.

10 to 30 SEC.

TIME

(Acc. to J - STD-020C)

TEMPERATURE

CATHODE

MARKING

CATHODE

MARKING

A A

C C

SOLDER MASK

ANODE

CATHODE

0.4

0.3

MINIMUM 55 mm2 OF CATHODE PAD

FOR IMPROVED HEAT DISSIPATION

2.4

0.6

0.9 X 6

4.6

1.1

1.3 x 6

Figure 12. Tape Leader and Trailer Dimensions

Figure 13. Tape Dimensions

Figure 14. Reeling Orientation

200 mm MIN. FOR Ø180 REEL.

200 mm MIN. FOR Ø330 REEL.

TRAILER COMPONENTLEADER

480 mm MIN. FOR Ø180 REEL.

960 mm MIN. FOR Ø330 REEL.

USER FEED DIRECTION

3.8 ± 0.1

2.29 ± 0.1

0.229 ± 0.01

ALL DIMENSIONS IN mm.

2 ± 0.054 ± 0.14 ± 0.1

3.05 ± 0.1

3.5 ± 0.05

8+0.3

–0.1

1.75 ± 0.1

Ø1.5 +0.1

–0

8°

Ø1+0.1

–0

CATHODE SIDE

PRINTED LABEL

USER FEED DIRECTION

Handling Precaution

The encapsulation material of the product is made of

silicone for better reliability of the product. As silicone is a

soft material, please do not press on the silicone or poke

a sharp object onto the silicone. These might damage the

product and cause premature failure. During assembly

or handling, the unit should be held on the body only.

Please refer to Avago Application Note AN 5288 for detail

information.

Moisture Sensitivity

This product is qualiﬁed as Moisture Sensitive Level 2a

per Jedec J-STD-020. Precautions when handling this

moisture sensitive product is important to ensure the reli-

ability of the product. Do refer to Avago Application Note

AN5305 Handling of Moisture Sensitive Surface Mount

Devices for details.

A. Storage before use

- Unopen moisture barrier bag (MBB) can be stored

at <40°C/90%RH for 12 months. If the actual shelf

life has exceeded 12 months and the HIC indicates

that baking is not required, then it is safe to reﬂow

the LEDs per the original MSL rating.

- It is not recommended to open the MBB prior to

assembly (e.g. for IQC).

B. Control after opening the MBB

- The humidity indicator card (HIC) shall be read

immediately upon opening of MBB.

- The LEDs must be kept at <30°C / 60%RH at all time

and all high temperature related process including

soldering, curing or rework need to be completed

within 672 hours.

C. Control for unﬁnished reel

- For any unuse LEDs, they need to be stored in

sealed MBB with desiccant or desiccator at <5%RH.

D. Control of assembled boards

- If the PCB soldered with the LEDs is to be subjected

to other high temperature processes, the PCB

need to be stored in sealed MBB with desiccant

or desiccator at <5%RH to ensure no LEDs have

exceeded their ﬂoor life of 672 hours.

E. Baking is required if:

- “10%” is Not blue and “5%” HIC indicator turns pink.

- The LEDs are exposed to condition of >30°C / 60%

RH at any time.

- The LEDs ﬂoor life exceeded 672 hours.

Recommended baking condition: 60±5°C for 20 hours.

Device Color (X1)

W Cool White

Flux Bin Select (X2X3)

Individual reel will contain parts from one bin only

X2Min Flux Bin

X3Max Flux Bin

Flux Bin Limits

Bin ID Min. (lm) Max. (lm)

A 4.30 5.50

B 5.50 7.00

C 7.00 9.00

D 9.00 11.50

E 11.50 15.00

F 15.00 19.50

G 19.50 25.50

H 25.50 33.00

J 33.00 43.00

K 43.00 56.00

L 56.00 73.00

Tolerance of each bin limit = ± 12%

Color Bin Select (X4)

Individual reel will contain parts from one full bin only.

0 Full Distribution

A 1 and 2 only

B 2 and 3 only

C 3 and 4 only

D 4 and 5 only

E 5 and 6 only

G 1, 2 and 3 only

H 2, 3 and 4 only

J 3, 4 and 5 only

K 4, 5 and 6 only

M 1, 2, 3 and 4 only

N 2, 3, 4 and 5 only

P 3, 4, 5 and 6 only

R 1, 2, 3, 4 and 5 only

S 2, 3, 4, 5 and 6 only

Z Special Color Bin

Color Bin Limits

Bin ID Limits (Chromaticity Coordinates)

1 x 0.296 0.291 0.310 0.313

y 0.259 0.268 0.297 0.284

2 x 0.291 0.285 0.307 0.310

y 0.268 0.279 0.312 0.297

3 x 0.313 0.310 0.330 0.330

y 0.284 0.297 0.330 0.310

4 x 0.310 0.307 0.330 0.330

y 0.297 0.312 0.347 0.330

5 x 0.330 0.330 0.338 0.352

y 0.310 0.330 0.342 0.344

6 x 0.330 0.330 0.347 0.345

y 0.330 0.347 0.371 0.352

7 x 0.352 0.338 0.364 0.360

y 0.344 0.342 0.380 0.357

8 x 0.345 0.347 0.367 0.364

y 0.352 0.371 0.401 0.380

Tolerance of each bin limit = ±0.02

VF Bin Limits

Bin ID Min. Max.

S5 3.20 3.50

S6 3.50 3.80

S7 3.80 4.10

Tolerance of each bin limit = ±0.1V

Packaging Option (X5)

Option Test Current Package Type Reel Size

E 150mA Top Mount 7 Inch

X - COORDINATE

Y - COORDINATE

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AV02-0209EN - September 29, 2009