SLUS198C – FEBUARY 2000 - REVISED - JUNE 2001
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DIntegrated 0.15-Ω Power MOSFET
D7-V to 15-V Operation
DDigital-Programmable Current Limit from
0 A to 3 A
D100-µA ICC When Disabled
DProgrammable On Time
DProgrammable Start Delay
DFixed 2% Duty Cycle
DThermal Shutdown
DFault-Output Indicator
DMaximum-Output Current Can Be Set to 1 A
Above the Programmed-Fault Level or to a
Full 4 A
DPower SOIC and TSSOP, Low Thermal
Resistance Packaging
description
The UCC3915 programmable hot swap power manager provides complete power-management, hot-swap
capability, and circuit breaker functions. The only external component required to operate the device, other than
power supply bypassing, is the fault-timing capacitor, CT. All control and housekeeping functions are integrated,
and externally programmable. These include the fault current level, maximum output sourcing current,
maximum fa u l t t i m e , and startup delay. In the event of a constant fault, the internal fixed 2% duty cycle ratio limits
average output power.
The internal 4-bit DAC allows programming of the fault-level current from 0 A to 3 A with 0.25-A resolution. The
IMAX control pin sets the maximum-sourcing current to 1 A above the trip level or to a full 4 A of output current
for fast output capacitor charging. (continued)
block diagram
UDG-99174
6 7 8 9
1 A
ABOVE
FAULT
+
–
+
–
OVER CURRENT
COMPARATOR
CURRENT FAULT
LEVEL 0–3 A
10 H = 4 A
MAX
CURRENT
LEVEL
4 A
ON TIME
CONTROL
2% DUTY
CYCLE
0–3 A
0.25
RES
1113 1245
B3 B2 B1 B0
4 BIT DAC
GND HEAT SINK
GND PINS CT
CHARGE
PUMP +
–
+
16
LINEAR CURRENT
AMPLIFIER
2
3
VOUT
REVERSE VOLTAGE
COMPARATOR 30 mV
FAULT
THERMAL
SHUTDOWN
INTERNAL
BIAS +
–1
15
14 VOUT
VIN
CURRENT SENSE
H = OPEN
1.5 V
SHTDWN
IMAX
VOUT
VIN
POWER
FET *
NOTE: Pin numbers refer to DIL-16 and SOIC-16 packages.
Copyright 2000, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SLUS198C – FEBUARY 2000 - REVISED - JUNE 2001
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description (continued)
When the output current is below the fault level, the output MOSFET is switched on with a nominal ON resistance
of 0.15 Ω. When the output current exceeds the fault level, but is less than the maximum-sourcing level, the
output remains switched on, but the fault timer starts, charging CT. Once CT charges to a preset threshold, the
switch is turned off, and remains off for 50 times the programmed fault time. When the output current reaches
the maximum sourcing level, the MOSFET transitions from a switch to a constant current source.
The UCC3915 can be put into sleep mode, drawing only 100 µA of supply current. Other features include an
open-drain fault-output indicator, thermal shutdown, undervoltage lockout, 7-V to 15-V operation, and
low-thermal resistance SOIC and TSSOP power packages.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
VIN 15.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VOUT – VIN .0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FAULT sink current 50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FAULT voltage –0.3 V to 8 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current Self limiting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TTL input voltage –0.3 to VIN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Junction temperature, TJ –55°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (soldering, 10 sec.) 300°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the Interface Products Data Book (TI Literature
Number SLUD002) for thermal limitations and considerations of packages.
package information
DIL-16, SOIC-16
N, DP Package
(TOP VIEW)
TSSOP-24,
PWP Package
(TOP VIEW)
*Pin 5 serves as lowest impedance to the electrical
ground; Pins 4, 12, and 13 serve as heat sink/ground.
These pins should be connected to large etch areas t o
help dissipate heat. For N Package, pins 4, 12, and 13
are N/C.
*Pin 9 serves as lowest impedance to the electrical ground;
other GND pins serve as heat sink/ground. These pins should
be connected to large etch areas to help dissipate heat.
B3
N/C
N/C
GND*
GND*
FAULT
VIN
EGND*
GND*
GND*
VIN
N/C
GND*
SHTDWN
GND*
B2
GND*
GND*
CT
12
11
10
9
8
7
6
5
4
3
2
1
13
14
15
16
17
18
19
20
21
22
23
24
IMAX
VOUT
VOUT
B1 B0
FAULT16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
VOUT
VOUT
GND*
GND*
CT
IMAX
B0
SHTDWN
VIN
VIN
GND*
EGND*
B3
B2
B1
SLUS198C – FEBUARY 2000 - REVISED - JUNE 2001
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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics, these specifications apply for TA = –40°C to 85°C for the UCC2915 and
0°C to 70°C for the UCC3915, VIN = 12 V, IMAX = 0.4 V, SHTDWN = 2.4 V, TA = TJ, (unless otherwise
stated)
supply
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Voltage input range 7.0 15.0 V
Supply current 1.0 2.0 mA
Sleep mode current SHTDWN = 0.2 V, no load 100 150 µA
Output leakage SHTDWN = 0.2 V 20 µA
NOTE 1: All voltages are with respect to GND. Current is positive into and negative out of the specified terminal.
output
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
IOUT = 1 A (10 V to 12 V) 0.15 0.3 V
IOUT = 2 A (10 V to 12 V) 0.3 0.6 V
Voltage drop
IOUT = 3 A (10 V to 12 V) 0.45 0.9 V
Voltage drop IOUT = 1 A, VIN = 7 V and 15 V 0.2 0.4 V
IOUT = 2 A, VIN = 7 V and 15 V 0.4 0.8 V
IOUT = 3 A, VIN = 7 V, 12 V MAX 0.6 1.2 V
Initial startup time See Note 2 100 µs
Short circuit response See Note 2 100 ns
Thermal shutdown See Note 2 165 °C
Thermal hysteresis See Note 2 10 °C
NOTE 1: All voltages are with respect to GND. Current is positive into and negative out of the specified terminal.
NOTE 2: Ensured by design. Not production tested.
DAC
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Code = 0000–0011 (device off)
Code = 0100 0.07 0.25 0.45 A
Code = 0101 0.32 0.50 0.70 A
Code = 0110 0.50 0.75 0.98 A
Code = 0111 0.75 1.00 1.3 A
Trip current Code = 1000 1.0 1.25 1.6 A
Tri
current
Code = 1001 1.25 1.50 1.85 A
Code = 1010 1.5 1.75 2.15 A
Code = 1011 1.70 2.00 2.4 A
Code = 1100 1.90 2.25 2.7 A
Code = 1101 2.1 2.50 2.95 A
NOTE 1: All voltages are with respect to GND. Current is positive into and negative out of the specified terminal.
SLUS198C – FEBUARY 2000 - REVISED - JUNE 2001
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics, these specifications apply for TA = –40°C to 85°C for the UCC2915 and
0°C to 70°C for the UCC3915, VIN = 12 V, IMAX = 0.4 V, SHTDWN = 2.4 V, TA = TJ, (unless otherwise
stated)
DAC (continued)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Trip c rrent
Code = 1110 2.30 2.75 3.25 A
Trip current Code = 1111 2.50 3.0 3.50 A
Max output current over trip
(current source mode) Code = 0100 to 1111, IMAX = 0 V 0.35 1.0 1.65 A
Max output current
(current source mode) Code = 0100 to 1111, IMAX = 2.4 V 3.0 4.0 5.2 A
NOTE 1: All voltages are with respect to GND. Current is positive into and negative out of the specified terminal.
fault timer
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
CT charge current VCT = 1.0 V –83 –62 –47 µA
CT discharge current VCT = 1.0 V 0.8 1.2 1.8 µA
Output duty cycle VOUT = 0 V 1.0% 1.9% 3.3%
CT fault threshold 1.2 1.5 1.7 V
CT reset threshold 0.4 0.5 0.6 V
NOTE 1: All voltages are with respect to GND. Current is positive into and negative out of the specified terminal.
shutdown
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Shutdown threshold 1.1 1.5 1.9 V
Shutdown hysteresis 150 mV
Input current 100 500 nA
NOTE 1: All voltages are with respect to GND. Current is positive into and negative out of the specified terminal.
open drain output (FAULT)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
High level output current FAULT = 5 V 250 µA
Low level output voltage IOUT = 5 mA 0.2 0.8 V
NOTE 1: All voltages are with respect to GND. Current is positive into and negative out of the specified terminal.
TTL input dc characteristics
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
TTL input voltage high 2.0 V
TTL input voltage low 0.8 V
TTL input high current VIH = 2.4 V 3 10 µA
TTL input low current VIL = 0.4 V 1µA
NOTE 1: All voltages are with respect to GND. Current is positive into and negative out of the specified terminal.
SLUS198C – FEBUARY 2000 - REVISED - JUNE 2001
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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
pin descriptions
B0 – B3: These pins provide digital input to the DAC, which sets the fault-current threshold. They can be used
to provide a digital soft-start and adaptive-current limiting.
CT: A capacitor connected to ground sets the maximum-fault time. The maximum-fault time must be more than
the time required to charge the external capacitance in one cycle. The maximum-fault time is defined as
TFAULT = 16.1 × 103 × CT. Once the fault time is reached the output will shutdown for a time given by
TSD = 833 × 103 × CT, this equates to a 1.9% duty cycle.
FAULT: Open-drain output, which pulls low upon any fault or interrupt condition, or thermal shutdown.
IMAX: When this pin is set to a logic low, the maximum-sourcing current will always be 1 A above the
programmed-fault level. When set to a logic high, the maximum-sourcing current will be a constant 4 A for
applications which require fast charging of load capacitance.
SHTDWN: When this pin is brought to a logic low, the IC is put into a sleep mode drawing typically less than
100 µA of ICC.The input threshold is hysteretic, allowing the user to program a startup delay with an external
RC circuit.
VIN: Input voltage to the UCC3915. The recommended voltage range is 7 V to 15 V. Both VIN pins should be
connected together and connected to the power source.
VOUT: Output voltage from the UCC3915. Both VOUT pins should be connected together and connected to
the load. When switched the output voltage will be approximately VIN – (0.15 Ω × IOUT). VOUT must not exceed
VIN by greater than 0.3 V.
APPLICATION INFORMATION
UDG-99175
6 7 8 9
11
10
B0B1B2B3 IMAX
16
3
2
4 12 13 5
14
15
1SHTDWN
VOUT
VIN
FAULT
CT
GND
HEAT SINK
GND PINS
UCC3915
RLCOUT
VOUT
CSD
RSD VIN
CIN D1
CT
S1 S2 S3 S4 S5 DIP
SWITCH
S6
VIN
VIN
R1 LED5 V
Figure 1. Evaluation Circuit
SLUS198C – FEBUARY 2000 - REVISED - JUNE 2001
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
protecting the UCC3915 from voltage transients
The parasitic inductance associated with the power distribution can cause a voltage spike at VIN if the load
current is suddenly interrupted by the UCC3915. It is important to limit the peak of this spike to less than 15 V
to prevent damage to the UCC3915. This voltage spike can be minimized by:
DReducing the power distribution inductance (e.g., twist the positive (+) and negative (–) leads of the power
supply feeding VIN, locate the power supply close to the UCC3915 or use PCB power and ground planes).
DDecoupling VIN with a capacitor, CIN (refer to Figure 1), located close to the VIN pins. This capacitor is
typically 1 µF or less to limit the inrush current.
DClamping the voltage at VIN below 15 V with a Zener diode, D1(refer to Figure 1), located close to the VIN
pins.
Figure 2. Load Current, Timing-Capacitor Voltage, and Output Voltage of the UCC3915
Under Fault Conditions
estimating maximum load capacitance
For hot-swap applications, the rate at which the total output capacitance can be charged depends on the
maximum-output current available and the nature of the load. For a constant-current, current-limited
application, the output will come up if the load asks for less than the maximum available short-circuit current.
To ensure recovery of a duty cycle from a short-circuited load condition, there is a maximum total output
capacitance wh i c h can be charged for a given unit on time (fault time). The design value of on or fault time can
be adjusted by changing the timing capacitor CT.
SLUS198C – FEBUARY 2000 - REVISED - JUNE 2001
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
For worst-case constant-current load of value just less than the trip limit; COUT(max) can be estimated from:
COUT(max) [ǒIMAX *ILOADǓ ǒ16.1 103 CT
VOUT Ǔ
Where VOUT is the output voltage.
For a resistive load of value RL, the value of COUT(max) can be estimated from:
COUT(max) [
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȡ
Ȣ
16.1 103 CT
RL ȏn
ȧ
ȧ
ȧ
ȱ
Ȳ
1
1*
VOUT
IMAX RL
ȧ
ȧ
ȧ
ȳ
ȴ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȣ
Ȥ
Long C T times must consider the maximum temperature. Thermal shutdown protection may be the limiting fault
time.
safety recommendations
Although the UCC3915 is designed to provide system protection for all fault conditions, all integrated circuits
can ultimately fail short. For this reason, if the UCC3915 is intended for use in safety-critical applications where
UL or some other safety rating is required, a redundant safety device such as a fuse should be placed in series
with the device. The UCC3915 will prevent the fuse from blowing for virtually all fault conditions, increasing
system reliability and reducing maintenance cost, in addition to providing the hot-swap benefits of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
UCC2915DP ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2915DPG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC2915DPTR ACTIVE SOIC D 16 TBD Call TI Call TI
UCC2915DPTRG4 ACTIVE SOIC D 16 TBD Call TI Call TI
UCC3915DP ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3915DPG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3915DPTR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3915DPTRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3915N ACTIVE PDIP N 16 TBD Call TI Call TI
UCC3915NG4 ACTIVE PDIP N 16 TBD Call TI Call TI
UCC3915PWP ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3915PWPG4 ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3915PWPTR ACTIVE TSSOP PW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3915PWPTRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 2
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
UCC3915DPTR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
UCC3915PWPTR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UCC3915DPTR SOIC D 16 2500 367.0 367.0 38.0
UCC3915PWPTR TSSOP PW 24 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2012
Pack Materials-Page 2
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