General Specifications.
Unless stated all values are typical.
Contact
Resistance: < 4mOhms Current Rating: 3.0 amps
Capacitance: 0.35pF max Material: Brass outer, beryllium copper inner.
*Plating: Outer; W30500SFTRC Nickel 2.5Um/Pure Tin 6.0Um
W30500SFT 60/40 tin/lead 2-3Um.
W30500SFG Nickel 2.5Um/Gold 0.1Um
W30500SFTTRC Nickel 2.5Um/Pure Tin 6.0Um
*Plating: Inner; W30500SFTRC Nickel 2.5Um/Gold 0.1Um
W30500SFT Nickel 2.5Um/Gold 0.1Um
W30500SFG Nickel 2.5Um/Gold 0.1Um
W30500SFTTRC Nickel 2.5Um/ Pure Tin 0.1Um
* Note: Other plating specs available. Please contact sales@winslowadaptics.com with your require-
ments.
Insertion Force: 30 grams per pin 0.018” diameter
Withdrawal Force: 20 grams per pin 0.018” diameter.
Force to remove from moulding: 12lb minimum
WINSLOW ADAPTICs
Data Sheet – Screw Machined I.C. Sockets
W30500SFTRC - W30500SFT - W30500SFG
W30500SFTTRC
Test Conditions Result
Vibration 10 to 2,000Hz at 20g’s No mechanical damage to assembly or loss
of continuity
Shock 150g’s No mechanical damage to assembly or loss
of continuity
Thermal Shock -65 to +150 degrees
Centigrade
No change in insulation resistance, loss of
continuity or mechanical damage to assem-
bly.
Life vs Contact
Resistance
1,000 cycles insertion/
withdrawal of IC lead device.
Average: Before test; 5.8mOhms
After test; 6.9mOhms
Fungus Resistance
of Moulding
Non-Nutrient
Salt Spray Contact resistance remained 14mOhm. No
galvanic corrosion visible at 50X
Endurance & Exposure
to Ammonium Sulphide
Exposure after 10 insertions of
DIP IC.
New tin-plated contact resistance 11mOhms
Atmosphere (contact) Exposure after 10 insertions of
DIP IC
New gold-plated contact resistance 5mOhms
max.
Continuity of Soldered
Connectors
Resistance change was less than 10%
Test Data and Results (Sockets Tested—W30524T)