Silicon PIN Chips PIN Diode Chips Rev. V23 Features Anode Switch & Attenuator Die Extensive Selection of I-Region Lengths Hermetic Glass Passivated Cermachip Oxide Passivated Planar Chips Voltage Ratings to 3000 V Fast Switching Speed Low Loss High Isolation RoHS* Compliant Description MACOM offers a comprehensive line of low capacitance, planar and mesa, silicon PIN diode chips which use ceramic glass and silicon nitride passivation technology. The silicon PIN chip series of devices cover a broad spectrum of performance requirements for control circuit applications. They are available in several choices of I-region lengths and have been optimally designed to minimize parametric trade offs when considering low capacitance, low series resistance, and high breakdown voltages. Their small size and low parasitics, make them an ideal choice for broadband, high frequency, micro-strip hybrid assemblies. The attenuator line of PIN diode chips are a planar or mesa construction and because of their thicker I-regions and predictable RS vs. I characteristics, they are well suited for low distortion attenuator and switch circuits. Incorporated in the chip's construction is MACOM's, time proven, hard glass, Cermachip process. The hard glass passivation completely encapsulates the entire PIN junction area resulting in a hermetically sealed chip which has been qualified in many military applications. These Cermachip diodes are available in a wide range of voltages, up to 3,000 volts, which are capable of controlling kilowatts of RF power. Many of MACOM 's silicon PIN diode chips are also available in several different package styles. Please refer to the "Packaged PIN Diode Datasheet" for case style availability and electrical specifications located on the MACOM website. Also for high voltage, high power devices refer to MA4PK2000. 1 Full Area Cathode Absolute Maximum Ratings1 TA = +25C (Unless otherwise specified) Parameter Absolute Maximum Forward Current (IF) Per P/N Rs vs. I Graph Reverse Voltage (VR) Per Specification Table Power Dissipation (W) 175C - TambientC Theta Operating Temperature -55C to +175C Storage Temperature -55C to +200C Junction Temperature +175C Mounting Temperature +320C for 10 seconds 1. Exceeding these limits may cause permanent damage to the chip. * Restrictions on Hazardous Substances, European Union Directive 2011/65/EU. MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0008899 Silicon PIN Chips PIN Diode Chips Rev. V23 Electrical Specifications: TA = +25C Low Capacitance PIN Maximum Characteristics Part Number Reverse Voltage2 VR <10 A Nominal Characteristics Capacitance Series Res. 1 MHz 500 MHz CJ @ -10 V RS @ 10 mA Carrier Lifetime3 TL Reverse Recovery Time4 TRR I Region Length Theta VDC pF s s m C/W MA4P161-134 100 0.10 1.50 150 15 13 65 MA4P203-134 100 0.15 1.50 150 25 13 75 MA4P7493-134 150 0.05 1.80 80 8 19 60 MADP-000165-01340W 200 0.06 2.50 200 20 19 30 MADP-000135-01340W 200 0.15 1.20 440 44 19 30 Attenuator PIN Maximum Characteristics Part Number Reverse Voltage2 VR <10 A Nominal Characteristics Capacitance Series Res. Carrier Series Res. Series Res. I Region 1 MHz 100 MHz Lifetime3 100 MHz 100 MHz Theta Length CJ @ -100 V RS @ 10 mA TL RS @ 10 A RS @ 1 mA VDC pF s mils C/W MA47416-132 200 0.15 6 2 2000 30 4 30 MA47418-134 200 0.15 3 1 500 15 2 25 2. Reverse Voltage (VR) is sourced and the resultant reverse leakage current (I R) is measured to be <10 A. 3. Nominal carrier life time (TL ) specified at IF = +10 mA , IREV = - 6 mA. 4. Nominal reverse recovery time specified at IF = +20 mA , IREV = - 200 mA. 2 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0008899 Silicon PIN Chips PIN Diode Chips Rev. V23 Electrical Specifications: TA = +25C (cont.) Cermachip PIN Maximum Characteristics Part Number MA4P303-134 Nominal Characteristics Reverse Voltage5 VR <10 A Capacitance 1 MHz CJ @ -100 V Series Res. 100 MHz RS @ 100 mA Carrier Lifetime6 I Region Length Theta VDC pF s m C/W 0.3 20 30 0.6 30 20 200 0.15 @ 10 V 1.5 @ 10 mA 8 8 MA4P404-132 250 0.20 @ 50 V 0.70 @ 50 mA MA4P504-132 500 0.20 0.60 1 50 20 MA4P505-131 500 0.35 0.45 2 50 14 MA4P506-131 500 0.70 0.30 3 50 11 MADP-000488-13740W 900 0.19 @ 50 V 1.6 @ 50 mA 4 140 45 MA4P604-131 1000 0.30 1.00 3 90 10 MA4P606-131 1000 0.60 0.70 4 90 8 MA4P607-212 1000 1.30 0.40 12 127 4 MA4PK3000-12527 3000 2.90 0.25 @ 500 mA9 60 350 1.5 5. Reverse Voltage (VR) is sourced and the resultant reverse leakage current (I R) is measured to be <10 A. 6. Nominal carrier life time (TL ) specified at IF = +10 mA , IREV = - 6 mA. 7. Upon completion of circuit installation, the chip must be covered with a dielectric conformal coating such as SYLGARD 539 (R) to prevent voltage arcing. 8. Test Frequency = 500 MHz 9. Test Frequency = 4 MHz 3 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0008899 Silicon PIN Chips PIN Diode Chips Rev. V23 Chip Dimensions Anode Low Capacitance PIN Chip Part Number MA4P161-134 Nominal Characteristics (mils.) Anode Diameter Chip Size Chip Thickness 0.5 0.5 0.5 3.5 13 x 13 6.0 MA4P203-134 3.1 13 x 13 6.0 MA4P7493-134 3.8 13 x 13 6.5 MADP-000165-01340W 1.8 13 x 13 10.0 MADP-000135-01340W 3.1 13 x 13 10.0 Attenuator PIN Chip Part Number MA47416-132 MA47418-134 Nominal Characteristics (mils.) Anode Diameter Chip Size Chip Thickness 0.5 2.0 1.0 10 7.5x7.5 19 x 19 7.0 7.5 13 x 13 7.0 10. Anode top contact is square. Cermachip PIN Chip Part Number MA4P303-134 4 Nominal Characteristics (mils.) Anode Diameter Chip Size Chip Thickness 0.5 2.0 1.0 3.0 13 x 13 10.0 MA4P404-132 6.8 20 x 20 10.0 MA4P504-132 6.8 20 x 20 10.0 MA4P505-131 13.0 27 x 27 11.0 MA4P506-131 15.8 27 x 27 12.0 MADP-000488-13740W 12.2 23 x 23 13.5 MA4P604-131 17.0 27 x 27 13.5 MA4P606-131 21.0 32 x 32 14.0 MA4P607-212 37.0 62 x 62 18.5 MA4PK3000-1252 85.0 172 x 172 28.0 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0008899 Silicon PIN Chips PIN Diode Chips Rev. V23 Typical Series Resistance vs. Forward Current Performance MA4P504, MA4P505, MA4P506 MA4P203, MA4P303, MA4P404 1000 100 Series Resistance () Series Resistance () 1000 MA4P203 MA4P303 MA4P404 10 1 0.1 0 0.1 1 10 100 100 10 1 0.1 1000 MA4P504 MA4P505 MA4P506 0 0.1 Forward Current (mA) MA4P604, MA4P606, MA4P607 100 1000 10000 1000 100 Series Resistance () Series Resistance () 10 MA47416, MA47418 1000 MA4P604 MA4P606 MA4P607 10 1 0.1 1 Forward Current (mA) 0 0.1 1 10 Forward Current (mA) 100 1000 MA47416 MA47418 100 10 1 0.1 0 0.1 1 10 100 1000 Forward Current (mA) 5 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0008899 Silicon PIN Chips PIN Diode Chips Rev. V23 MA4PK3000 (3kV) Chip Forward Current vs. DC Forward Voltage @ 100 MHz Reverse Bias Conductance vs. Frequency 1000 Reverse Bias Conductance (s) Forward Current (mA) 10000 1000 100 10 1 0.3 0.5 0.7 0.9 1.1 1.3 0V 1V 10 V 20 V 100 V 100 10 1 1 10 100 Frequency (MHz) Forward Voltage (V) Series Resistance vs. Forward Current @ 100 MHz Series Resistance () 10 1 0.1 0 10 100 1000 Forward Current (mA) 6 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0008899 Silicon PIN Chips PIN Diode Chips Rev. V23 Die Handling and Bonding Information Handling: All semiconductor chips should be handled with care to avoid damage or contamination from perspiration, salts, and skin oils. The use of plastic tipped tweezers or vacuum pickup is strongly recommended for the handling and placing of individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. Die Attach Surface: Die can be mounted with an 80Au/Sn20, eutectic solder preform, RoHS compliant solders or electrically conductive silver epoxy. The metal RF and DC ground plane mounting surface must be free of contamination and should have a surface flatness of < 0.002". Eutectic Die Attachment Using Hot Gas Die Bonder: A work surface temperature of 255oC is recommended. When hot forming gas (95%N/5%H) is applied, the work area temperature should be approximately 290oC. The chip should not be exposed to temperatures greater than 320oC for more than 10 seconds. Eutectic Die Attachment Using Reflow Oven: For recommended reflow profile refer to Application Note 538 "Surface Mounting Instructions". Electrically Conductive Epoxy Die Attachment: A controlled amount of electrically conductive, silver epoxy, approximately 1 - 2 mils in thickness, should be used to minimize ohmic and thermal resistance. A thin epoxy fillet should be visible around the perimeter of the chip after placement to ensure full area coverage. Cure conductive epoxy per manufacturer's schedule. Typically 150C for 1 hour. Wire and Ribbon Bonding: The die anode bond pads have a Ti-Pt-Au metallization scheme, with a final gold thickness of 1.0 micron. Thermo-compression or thermo-sonic wedge bonding of either gold wire or ribbon is recommended. A bonder heat stage temperature setting of 200oC, tool tip temperature of 150C and a force of 18 to 50 grams is suggested. Ultrasonic energy may also be used but should be adjusted to the minimum amplitude required to achieve an acceptable bond. Excessive energy may cause the anode metallization to separate from the chip. Automatic ball or wedge bonding may also be used. For more detailed handling and assembly instructions, see Application Note M541, "Bonding and Handling Procedures for Chip Diode Devices". 7 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0008899 Silicon PIN Chips PIN Diode Chips Rev. V23 MACOM Technology Solutions Inc. All rights reserved. Information in this document is provided in connection with MACOM Technology Solutions Inc ("MACOM") products. These materials are provided by MACOM as a service to its customers and may be used for informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM assumes no responsibility for errors or omissions in these materials. MACOM may make changes to specifications and product descriptions at any time, without notice. MACOM makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS, WHICH MAY RESULT FROM THE USE OF THESE MATERIALS. MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM customers using or selling MACOM products for use in such applications do so at their own risk and agree to fully indemnify MACOM for any damages resulting from such improper use or sale. 8 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0008899