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SMT Power Inductors
Shielded Drum Core PF0552NL and PF0553NL Series
Part No.
Trise Factor
(KO)
Core Loss Factor
(K1)
PG0085/86 2.3 5.29E-10
PG0087 5.8 15.2E-10
PG0040/41 0.8 2.80E-10
P1174 0.8 6.47E-10
PF0601 4.6 14.0E-10
PF0464 3.6 24.7E-10
PF0465 3.6 33.4E-10
P1166 1.9 29.6E-10
P1167 2.1 42.2E-10
PF0560NL 5.5 136E-10
P1168/69 4.8 184E-10
P1170/71 4.3 201E-10
P1172/73 5.6 411E-10
PF0552NL 8.3 201E-10
PF0553NL 7.1 411E-10
Take note that the component’s temperature rise varies depending on the system condition. It is suggested that the component be tested at the system level, to verify
the temperature rise of the component during system operation.
1. Unless otherwise specified, all testing is made at 100kHz, 0.1VAC.
2. Optional Tape & Reel packaging can be ordered by adding a “T” sux to the part
number (i.e P1166.102NL becomes P1166.102NLT). Pulse complies with industry
standard Tape and Tape & Reel specification EIA481.
3. The “NL” sux indicates an RoHS-compliant part numer. Non-NL suxed parts are
not necessarily RoHS compliant, but are electrically and mechanically equivalent to
NL versions. If a part number does not have the “NL” version, but an RoHS compliant
version is required, please contact Pulse for availability.
4. Temperature of the component (ambient plus temperature rise) must be within
specified operating temperature range.
5. The rated current (Irated) as listed is either the saturation current or the heating
current depending on which value is lower.
6. The saturation current, Isat, is the current at which the component inductance drops
by the indicated percentage (typical) at an ambient temperature of 25C. This current
is determined by placing the component in the specified ambient environment and
applying a short duration pulse current (to eliminate self-heating eects) to the
component.
7. The heating current, Idc, is the DC current required to raise the component tempera-
ture by the indicated delta (approximately). The heating current isdetermined by
mounting the component on a typical PCB and applying current for 30 minutes. The
temperature is measured by placing the thermocouple on top of the unit under test.
8. In high volt*time (Et) or ripple current applications, additional heating in the
component can occur due to core losses in the inductor which may necessitate
derating the current in order to limit the temperature rise of the component. In order
to determine the approximate total loss (or temperature rise) for a given application,
both copper losses and core losses should be taken into account.
Estimated Temperature Rise:
Trise = [Total loss (mW) / K0].833(°C)
Total Loss = Copper loss + Core loss (mW)
Copper loss = IRMS2 x DCR (Typical) (mW)
Irms = [IDC2 + ΔI2 /12]1/2 (A)
Core loss = K1 x f (kHz)1.23 x Bac (Ga)2.38 (mW)
Bac (peak to peak flux density) = K2 x ΔI (Ga)
[= K2/L (µH) x Et (V-µSec) (Ga)]
where f varies between 25kHz and 1MHz, and Bac is less than 2500 Gauss.
K2 is a core size and winding dependent value and is given for each p/n in the
proceeding datasheets. K0 & K1 are platform and material dependant constants and
are given in the table below for each platform.
Notes: