DS18010 Rev. E-2 1 of 3 MMSZ5221B - MMSZ5259B
MMSZ5221B - MMSZ5259B
500mW SURFACE MOUNT ZENER DIODE
·Planar Die Construction
·500mW Power Dissipation
·General Purpose, Medium Current
·Ideally Suited for Automated Assembly
Processes
Mechanical Data
Features
A B
C
DE
G
H
J
SOD-123
Dim Min Max
A3.55 3.85
B2.55 2.85
C1.40 1.70
D¾1.35
E0.55 Typical
G0.25 ¾
H0.15 Typical
J¾0.10
All Dimensions in mm
·Case: SOD-123, Plastic
·Terminals: Solderable per MIL-STD-202,
Method 208
·Polarity: Cathode Band
·Marking: Date Code and Type Code
Type Code: See Table on Page 2
·Weight: 0.01grams (approx.)
Maximum Ratings @ TA= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Forward Voltage @ IF= 10mA VF0.9 V
Power Dissipation (Note 1) Pd500 mW
Thermal Resistance, Junction to Ambient Air (Note 1) RqJA 350 K/W
Operating and Storage Temperature Range Tj, TSTG -65 to +150 °C
Notes: 1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm2.
2. Tested with pulses, Tp£1.0ms.
DS18010 Rev. E-2 2 of 3 MMSZ5221B - MMSZ5259B
Type
Number
Type
Code
Zener Voltage Range (Note 2) Test
Current
Maximum Zener
Impedance
Maximum Reverse
Leakage Current
VZ@I
ZT IZT ZZT @ IZT ZZK @I
ZK
= 0.25mA IR@V
R
Nom (V) Min (V) Max (V) mA WmAV
MMSZ5221B C1 2.4 2.28 2.52 20 30 1200 100 1.0
MMSZ5223B C3 2.7 2.57 2.84 20 30 1300 75 1.0
MMSZ5225B C5 3.0 2.85 3.15 20 30 1600 50 1.0
MMSZ5226B G1 3.3 3.14 3.47 20 28 1600 25 1.0
MMSZ5227B G2 3.6 3.42 3.78 20 24 1700 15 1.0
MMSZ5228B G3 3.9 3.71 4.10 20 23 1900 10 1.0
MMSZ5229B G4 4.3 4.09 4.52 20 22 2000 5.0 1.0
MMSZ5230B G5 4.7 4.4 7 4.94 20 19 1900 5.0 2.0
MMSZ5231B E1 5.1 4.85 5.36 20 17 1600 5.0 2.0
MMSZ5232B E2 5.6 5.32 5.88 20 11 1600 5.0 3.0
MMSZ5233B E3 6.0 5.70 6.30 20 7 1600 5.0 3.5
MMSZ5234B E4 6.2 5.89 6.51 20 7 1000 5.0 4.0
MMSZ5235B E5 6.8 6.46 7.14 20 5 750 3.0 5.0
MMSZ5236B F1 7.5 7.13 7.88 20 6 500 3.0 6.0
MMSZ5237B F2 8.2 7.79 8.61 20 8 500 3.0 6.5
MMSZ5238B F3 8.7 8.27 9.14 20 8 600 3.0 6.5
MMSZ5239B F4 9.1 8.65 9.56 20 10 600 3.0 7.0
MMSZ5240B F5 10 9.50 10.50 20 17 600 3.0 8.0
MMSZ5241B H1 11 10.45 11.55 20 22 600 2.0 8.4
MMSZ5242B H2 12 11.40 12.60 20 30 600 1.0 9.1
MMSZ5243B H3 13 12.35 13.65 9.5 13 600 0.5 9.9
MMSZ5245B H5 15 14.25 15.75 8.5 16 600 0.1 11
MMSZ5246B J1 16 15.20 16.80 7.8 17 600 0.1 12
MMSZ5248B J3 18 17.10 18.90 7.0 21 600 0.1 14
MMSZ5250B J5 20 19.00 21.00 6.2 25 600 0.1 15
MMSZ5251B K1 22 20.90 23.10 5.6 29 600 0.1 17
MMSZ5252B K2 24 22.80 25.20 5.2 33 600 0.1 18
MMSZ5254B K4 27 25.65 28.35 5.0 41 600 0.1 21
MMSZ5255B K5 28 26.60 29.40 4.5 44 600 0.1 21
MMSZ5256B M1 30 28.50 31.50 4.2 49 600 0.1 23
MMSZ5257B M2 33 31.35 34.65 3.8 58 700 0.1 25
MMSZ5258B M3 36 34.20 37.80 3.4 70 700 0.1 27
MMSZ5259B M4 39 37.05 40.95 3.2 80 800 0.1 30
Electrical Characteristics @ TA= 25°C unless otherwise specified
Notes: 1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm2.
2. Tested with pulses, Tp£1.0ms.
DS18010 Rev. E-2 3 of 3 MMSZ5221B - MMSZ5259B
0
0.1
0.2
0.3
0.4
0.5
25050
75 100 125 150
P,P
O
WER DISSIPATI
O
N(W)
D
T , AMBIENT TEMPERATURE ( C)
Fig. 1 Power Dissipation vs Ambient Temperature
A°
0.6
