2057592-2 - Tyco Electronics

Application Specification

114--13263

LOC B

1of 12

E2009 Tyco Electronics Corporation, Harrisburg, PA

All International Rights Reserved

TE logo and Tyco Electronics are trademarks.

*Trademark. Other products, logos, and company names used are the property of their respective owners.

TOOLING ASSISTANCE CENTER 1--800--722--1111

PRODUCT INFORMATION 1--800--522--6752

This controlled document is subject to change.

For latest revision and Regional Customer Service,

visit our website at www.tycoelectronics.com

CFP Receptacle Connector 30 DEC 09 Rev B

All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless

otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2_. Figures and

illustrations are for identification only and are not drawn to scale.

1. INTRODUCTION

This specification covers the requirements for application of CFP Receptacle Connectors. The CFP connector

assembly is a 74--position, 0.8 mm pitch, right--angle surface mount connector. A connector cover assembly,

that also provides a positive stop for the CFP transceiver and EMI isolation for the connector assembly,

protects this assembly. Threaded holes in the connector cover assembly hold the installed CFP transceiver in

place once installed. CFP guide rails roughly align the transceiver with the connector as it is inserted. The CFP

external bracket and backer plates roughly align the CFP transceiver to the guide rails as it is inserted through

the bezel or front panel, and block EMI emissions from escaping the cabinet when the CFP port is in use.

When corresponding with Tyco Electronics Personnel, use the terminology provided in this specification to

facilitate your inquiries for information. Basic terms and features of this product are provided in Figure 1.

Figure 1 (cont’d)

CFP Receptacle Components

Connector Slot

CFP Connector Assembly

CFP Connector Cover Assembly

Guide Pins

Contacts

Belly--to--Belly

Clearance

Hole (2) Plc

Front EMI Gasket

Transfer Attach Hole (2) Plc

Guide Pin

(2) Plc

Transceiver Slot

Bottom

EMI

Gasket

Host PC Board

Attach Hole (2) Plc

CFP Guide Rails

Outside Clearance

Slots (2) Plc Guide Pins

Host PC Board

Attach Holes

Heat Sink

Attachment

Holes

Transceiver

Slot

Belly--to--Belly

Clearance

Holes

Insert

Attachment

Slot (2) Plc

Standoff

(2) Plc

Arm (2) Plc

NOTE

CFP Receptacle Connector 114- 13263

Rev B2 of 12 Tyco Electronics Corporation

(

end

)

Guide Rail Arm

Slot (2) Plc

Spring Clip

(2) plc

Host PC Board

Clearance Slot

External Bracket

Slot (2) Plc

2--56 UNC Holes

(4) Plc

CFP Backer Plate

cke

Cowling Keying Feature

(2) Plc

Arm (2) Plc

EMI Gasket

Transceiver Slot

Clearance Holes

(4) Plc

CFP Guide Rain

Insert (Optional)

Clearance Hole

Guide Rail

Attachment

Tab

CFP Alignment Aid

Connector Cover Tab

Aid Body

Handle

Alignment Rials

(2) Plc

2. REFERENCE MATERIAL

2.1. Revision Summary

SUpdated document to corporate requirements

SAdded new information to Figure 8 and Paragraph 3.17.

2.2. Customer Assistance

Reference Product Base Part Number 2057630 and Product Code L622 are representative of the CFP

Receptacle Connector. Use of these numbers will identify the product line and expedite your inquiries through a

service network established to help you obtain product and tooling information. Such information can be

obtained through a local Tyco Electronics Representative or, after purchase, by calling Product Information at

the number at the bottom of this page.

2.3. Drawings

Customer Drawings for product part numbers are available from the service network. If there is a conflict

between the information contained in the Customer Drawings and this specification or with any other technical

documentation supplied by Tyco Electronics, the information contained in the customer drawings takes priority.

2.4. Specifications

Design Objective 108--2399 provides expected product performance and test information. EIA (Electronic

Industries Alliance)--364--52 provides solderability requirements and evaluation methods, and Workmanship

Specification 101--21 provides solder fillet requirements for the connector.

2.5. Instructional Material

Instruction sheets (408--Series) provide assembly instructions. Documents available which pertain to this

product are:

Document Number Document Title

408--9816 Handling Reeled Products

408--10302 CFP Receptacle Connector

CFP Receptacle Connector 114- 13263

Rev B 3 of 12Tyco Electronics Corporation

2.6. Manuals

Manual 402--40 can be used as a guide to soldering. This manual provides information on various flux types

and characteristics with the commercial designation and flux removal procedures. A checklist is included in the

manual as a guide for information on soldering problems.

3. REQUIREMENTS

3.1. Safety

Do not stack product component containers so high that the containers buckle or deform.

3.2. Storage

A. Ultraviolet Light

Prolonged exposure to ultraviolet light may deteriorate the chemical composition used in the connector

material.

B. Shelf Life

The products should be used on a first in, first out basis to avoid storage contamination that could

adversely affect performance.

C. Chemical Exposure

Do not store CFP components near any chemical listed below as they may cause stress corrosion

cracking in the contacts or compliant pins.

Alkalies Ammonia Citrates Phosphates Citrates Sulfur Compounds

Amines Carbonates Nitrites Sulfur Nitrites Tartrates

3.3. Limitations

The connectors are designed to operate in a temperature range of --55to 105C[--67to 221F].

3.4. Material

The connector cover, guide rail, backer plate, and external bracket are made of zinc alloy plated with nickel

over copper. EMI gaskets are made of conductive elastomer. The connector housing is made of polyester LCP,

UL 94--V--0. The contacts are made of copper alloy plated with gold.

3.5. Host PC Board

A. Material and Thickness

The host pc board material shall be glass epoxy (FR--4 or G--10). The pc board thickness shall be a

minimum of 2.4 mm for mounting CFP receptacles to one side of the pc board, and 3 mm minimum for

mounting CFP receptacles on both sides of the pc board.

Contact PRODUCT INFORMATION at the number listed at the bottom of page 1 for suitability of other pc board

materials.

B. Tolerance

Maximum allowable bow of the pc board shall be 0.08 mm over the length of the cage assembly. The

coplanarity of the pc board circuit pads must be 0.03 mm.

C. Circuit Pads

The circuit pads must be solderable in accordance with EIA--364--52.

D. Layout

All holes and circuit pads must be precisely located on the pc board to ensure proper placement and

optimum performance of the connector and cage assembly. Recommended circuit pad pattern, keep out

zones, dimensions, and tolerances for a single CFP receptacle are provided in Customer Drawings.

Contact the Product Information number at the bottom of page 1 for specific drawings.

NOTE

CFP Receptacle Connector 114- 13263

Rev B4 of 12 Tyco Electronics Corporation

3.6. Solder Paste Characteristics

SAlloy type for tin--lead solder shall be 63 Sn/37 Pb, 60 Sn/40 Pb, or 62 Sn/36 Pb/2 Ag

SAlloy type for lead--free solder shall be compatible with pure tin or gold; for example,

SAC305 (96.5 Sn/3 Ag/0.5 Cu) or SAC405 (95.5 Sn/4 Ag/0.5 Cu)

SFlux incorporated in the paste shall be rosin, mildly active (RMA) type

SPaste will be at least 80% solids by volume

SMesh designation --200 to +325 (74 to 44 square micron openings, respectively)

SMinimum viscosity of screen print shall be 5x10% cp (centipoise)

SMinimum viscosity of stencil print shall be 7.5x10% cp (centipoise)

3.7. Solder Volume

Minimum solder volume (V) (before curing) for each circuit pad is calculated by multiplying the pad length (L)

by the pad width (W) by the stencil thickness (T): 1.4 mm (L) x 0.35 mm (W) x 0.15 mm (T) = 0.074 mm3(V).

Solder volume for each connector must be 0.074 mm3per contact solder tine.

Solder volume may vary depending on solder paste composition.

3.8. Solder Paste Thickness

Solder paste thickness for the connector contact solder tines must be at least 0.15 mm.

3.9. Stencil

The stencil aperture is determined by the circuit pad size and stencil thickness. It may be any shape as long as

it prevents solder bridging from one pad to another. Generally, a thinner stencil will need a larger aperture to

maintain the given volume of solder paste. The stencil should be 0.15 mm thick.

3.10. Solder Mask

When soldering, a solder mask is recommended between all circuit pads to minimize solder bridging between

pads. The mask must not exceed the height of the pad. If a trace is run between adjacent pads on the pc

board, a solder mask must be applied over the trace to prevent bridging and wicking of solder away from the

connector contact solder tines. The mask most suitable is Liquid Photo Imageable.

All traces must be covered by solder mask in the solder deposit area. Exposed traces could cause bridging and create

a short, or wick solder away from the solder tines, producing a weak solder joint.

3.11. Connector Assembly Placement

Connectors should be handled only by the housing to avoid deformation, contamination, or damage to the contact

solder tines.

The connector must be soldered to the host pc board before seating the connector cover assembly. The soldering

process will cause damage to the connector cover assembly.

A. Registration

The connector contact solder tines must be aligned with matching circuit pads and alignment posts aligned

with matching holes before placing the connector on the host pc board.

B. Position

Optimally, the contact solder tines should be centered on the host pc board circuit pads. However, a slight

misalignment is permissible as shown in Figure 2.

NOTE

CAUTION

CFP Receptacle Connector 114- 13263

Rev B 5 of 12Tyco Electronics Corporation

Figure 2

Host PC Board Contact Solder Tine

Overhang Up to 50%

is Permissible

Contact Solder Tine Centered on

PC Board Circuit Pad Preferred

C. Seating

Because the connector alignment posts are for clearance and fit only, the force required to seat the

connector is minimal. Apply only that force necessary to seat the contact solder tines into the top surface

of the solder paste. The alignment posts must be inserted into the host pc board holes. See Figure 3.

Figure 3

Connector

Host PC Board

Connector Housing Does

Not Contact PC Board

Contact Solder Tails

Rest on Contact Pads

Guide Pins Inserted

In Guide Pin Holes

D. Placement by Vacuum Pickup

In order to facilitate use of a vacuum pick and place tool, tape has been placed over the centroid of the

connector. The location of the centroid of the connector based on number of contacts is shown in Figure 4.

4.4

3.12. Soldering

A. Process

The connector must be soldered using non--focused infrared (IR) reflow or equivalent soldering technique.

When mounting to both sides of the host pc board, the surface tension of the solder when it is in the

liquidus state will hold the connector on the pc board. Reflow temperature and time may vary depending

on the size of the host pc board and placement of other components. The reflow temperature and

approximate time to which the connector can be subjected is specified in Figure 5.

CFP Receptacle Connector 114- 13263

Rev B6 of 12 Tyco Electronics Corporation

Figure 5

Reflow Zone

Time Above 217C

(90 Seconds Max)

40--70 Seconds Typ

Peak Temperature

235--255C

Soaking Zone

(2.0 Minutes Max)

60--90 Seconds Typ

Pre--Heating Zone

(2.0 --4.0 Minutes Max)

<2.5 C/Second

30 60 90 120 150 180 210 240 270 3000

Time (Seconds)

300C

250C

200C

150C

100C

50C

0C

ter Le

ree Re

Alloys: Sn96.5/Ag3.0/Cu0.5 and Sn96.5/Ag3.5

More Than 3 Minutes

3_C [37.4_F]

Per Second

100 Seconds

0.5_C[33_F]

Per Second

Equalization

20_C[68_F]

110_C [230_F]

160_C [320_F]

230_C [446_F]

Ramp--Up Reflow Cool--Down

Reflow Soldering Process Cycle

Pre--Heat Soldering Solidification

30 Seconds

3_C [37.4_F]

Per Second

Peak Dwell

20 Seconds

45 Seconds

3_C [37.4_F]

Per Second

Ambient Rate

Tin--Lead Solder

(Maximum 230_C [446_F] for 20 Seconds)

Solder Will Begin to Reflow at

183_C [361_F]

CFP Receptacle Connector 114- 13263

Rev B 7 of 12Tyco Electronics Corporation

Excessive temperature may cause connector housing degradation or plating deterioration. It is recommended that

component temperatures not exceed 230C [446F] when using tin--lead solder and 260C [500F] when using

lead--free solder.

B. Cleaning

After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the

solder and flux for recommended cleaning solvents. Cleaners must be free of dissolved flux and other

contaminants. It is recommended cleaning the host pc board on its edge. If using aqueous cleaner,

standard equipment such as a soak--tank or an automatic in--line machine should be used. Common

cleaning solvents that will not affect the connector for the time and temperature specified are listed in

Figure 6.

Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.

Refer to the manufacture’s Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners.

Trichloroethylene and Methylene Chloride is not recommended because of harmful occupational and environmental

effects. Both are carcinogenic (cancer--causing).

If you have a particular solvent that is not listed, contact Product Information at the number on the bottom of page 1 for

recommendations.

C. Drying

When drying cleaned assemblies and host pc boards, make certain that temperatures do not exceed

85C [185F]. Excessive temperatures may cause connector housing degradation.

CLEANER TIME TEMPERATURE

NAME TYPE

(Minutes)

(Maximum)

ALPHA 2110 Aqueous 1132_C [270_F]

BIOACT EC--7 Solvent 5100_C [212_F]

Butyl CARBITOL Solvent 1Ambient Room

Isopropyl Alcohol Solvent 5100_C [212_F]

KESTER 5778 Aqueous 5100_C [212_F]

KESTER 5779 Aqueous 5100_C [212_F]

LONCOTERGE 520 Aqueous 5100_C [212_F]

LONCOTERGE 530 Aqueous 5100_C [212_F]

Terpene Solvent Solvent 5100_C [212_F]

Figure 6

3.13. Checking Installed Connector

All solder joints must conform to those specified in Workmanship Specification 101--21 and all other

requirements specified in this document. The installed connector must have solder fillets evenly formed around

each contact solder tine. Solder must have 95% minimum coverage over the circuit pad. See Figure 7.

CAUTION

DANGER

NOTE

CFP Receptacle Connector 114- 13263

Rev B8 of 12 Tyco Electronics Corporation

Figure 7

Connector

Contact Solder

Tine

Host PC Board

95% Minimum

Solder Coverage

Over Circuit Pad

3.14. Connector Cover Assembly

The Connector Cover Assembly, displayed in Figure 1, must be positioned so the guide pins are aligned with

the guide pin holes on the host pc board. Care must be taken to avoid damage to the contacts and connector

assembly. The connector cover assembly must be fastened to the host pc board tightly enough to ensure full

compression of the bottom EMI gasket, using two M3 x 0.5 mm screws. The bottom of the metal frame of the

assembly must rest flush against the plated surface on the pc board. See Section 6, VISUAL AID.

3.15. Bezel

A. Thickness

The bezel thickness range shall be 1 mm through 3 mm.

B. Cutout

The bezel must provide a cutout that allows proper mounting of the external bracket assembly. Care must

be used to avoid interference between adjacent receptacles and other components. The minimum

allowable distance between components must be considered to ensure proper assembly. Dimensions for

bezel cutout and minimum allowable distance between cutouts are shown in Figure 8.

C. Position

The bezel and host pc board must be positioned in relation to each other to avoid interference with the

insertion and extraction of the transceiver. This relationship must conform to the dimensions given in

Figure 8.

CFP Receptacle Connector 114- 13263

Rev B 9 of 12Tyco Electronics Corporation

Figure 8

82.8 +0.1 Typ

See Detail J

0.1 +0.1 Detail J

116.25 Max

113.25 Min

1 Min

103.5 +0.05

Section X--X

Thickness of

PC Board

(C--0.2) +0.1

2X14.8+0.1 Typ

C of Host Connector

Locating Pin

2.05 Ref

Minimum Spacing

Between Ports 86.0

Center--to--Center

3.16. Guide Rail Placement

The connector must be soldered to the pc board BEFORE seating the guide rails.

The guide pins and threaded attachment holes of the guide rails, shown in Figure 1, must be aligned with

matching holes in the pc board, shown in Figure 2, then inserted into the pc board. The guide rail must be

firmly attached to the host pc board with the bottom surface of the guide rail seated on the plated surface of the

pc board, using two M3 x 0.5 mm screws. See Section 6, VISUAL AID.

3.17. External Bracket Assembly and Backer Plate Assembly

The two assemblies, shown in Figure 1, should be assembled around the opening in the bezel, shown in

Figure 8. The external bracket shall be secured by four 2--56 UNC hex socket head cap screws and should fit

securely on the bezel with the EMI gasket fully compressed and the metal frame in contact with the bezel

surface. The arms of the external bracket should be inserted in the external bracket slot of the backer plate.

The rail arms should be inserted through the guide rail arm slot and the slot in the arm of the external bracket.

The board clearance slot on the backer plate must be facing the host pc board. See Section 6, VISUAL AID.

3.18. Guide Rail Insert

The Guide Rail Insert, shown in Figure 1, is optional. Two inserts may be installed on each guide rail, resting

on the top of the rail with the tab of the insert placed into the slots on the top of the guide rail. The clearance

hole in the insert will be aligned to the outside clearance slots on the rails allowing a fastener to be fed through

the insert, clearance slot, and optional hole on the host pc board. The insert provides additional surface area

for the head of a fastener, wherever it is not provided by a combination of two rails seated back--to--back to

each other. See Section 6, VISUAL AID.

3.19. Removal and Repair

The optional rail inserts can be removed by unscrewing them and lifting them straight off the guide rails.

The guide rails must be detached from the slots of the rear of the backer plate and external bracket assemblies

prior to removing the backer plate and external bracket assemblies. Unscrew the assemblies from each other,

while supporting both assemblies to prevent them from falling. Then pull the assemblies apart.

NOTE

CFP Receptacle Connector 114- 13263

Rev B10 of 12 Tyco Electronics Corporation

The guide rails must be detached from the slots of the rear of the backer plate and external bracket assemblies

prior to removal. To remove the guide rails, unscrew the rails from the host board or any other structures as

they are attached to and lift them from the host pc board. If guide rails are mounted on both sides of the host

pc board, both sets of rails must be unscrewed from the board to remove either set.

The guide rails on the same side of the host pc board must both be removed before removing the connector

cover assembly. To remove the connector cover assembly, unscrew the assembly and lift the assembly from

the pc board. If an assembly is mounted on both sides on the host pc board, both assemblies must be

unscrewed from the pc board to remove either assembly.

The connector cover assembly must be removed from the host pc board before removing the connector.

Standard de--soldering methods must be used to remove the connector from the host pc board. The connector

must NOT be re--used after removal. The connector is not repairable. Any defective or damaged product must

NOT be used.

3.20. Reel Dimensions

Reed dimensions are provided in Figure 9.

Figure 9

R0.75 MIN

0.10 MAX

0.2%%P0.05

SKEW OF SPROCKET HOLES

(84.4)

1.75%%P0.1

84.4 0.1

88.0 0.3

42.2 0.3

20.0 0.1

4.0 0.1

2.0 0.2 \U+22051.5

+0.1

-- 0 . 0

65.72

C--C

A--A

65.9 0.1

4X1.7 0.1

10.10 0.1

12.5

32.8632.86

60.52

20.0

2X2.0 0.1

9.70 0.1

4.0

5.0

2.7

USER DIRECTION

OF UNREELING

02 03

04 05

B--B

5%%D 5%%D

CFP Receptacle Connector 114- 13263

Rev B11 of 12Tyco Electronics Corporation

4. QUALIFICATIONS

CFP Connectors have not yet been sent for agency evaluation.

5. TOOLING

The connector assembly can be installed without special tooling. However, for automatic machine placement,

the robotic equipment must have a true position accuracy tolerance sufficient to properly locate the connector

and bottom cage. This includes gripper and fixture tolerances as well as equipment repeatability.

CFP Receptacle Connector 114- 13263

Rev B12 of 12 Tyco Electronics Corporation

6. VISUAL AID

Figure 10 shows a typical application of a CFP Receptacle Connector. This illustration should be used by

production personnel to ensure a correctly applied product. Applications which DO NOT appear correct should

be inspected using the information in the preceding pages of this specification and in the instructional material

shipped with the product or tooling.

FIGURE 10. VISUAL AID

EXTERNAL BRACKET

ARMS FIT INSIDE

EXTERNAL BRACKET

GUIDE RAIL ARM FITS INSIDE

GUIDE RAIL ARM SLOT IN

BACKER PLATE AND THE

SLOT IN EXTERNAL BRACKET

OPTIONAL RAIL

INSERTS AND

SCREWS

(4) PLC

M3 SCREWS INSERTED

FROM BOTTOM SIDE

OF HOST PC BOARD

(4) PLC

COVER ASSEMBLY

RESTS ON PLATED

AREA OF PC BOARD

GUIDE RAIL RESTS ON

PLATED AREAS OF PC

BOARD

PC BOARD CLEARANCE

SLOT ON BACKER PLATE

FACING HOST PC BOARD

M3 SCREWS PASS THROUGH

CLEARANCE HOLE IN ONE

COMPONENT TO THREADED

HOLE IN OPPOSING COMPONENT

CONNECTOR COVER

TRANSPARENT FOR

CLARITY

HOST PC BOARD

TRANSPARENT

FOR CLARITY