UNISONIC TECHNOLOGIES CO., LTD
ULN2003 LINEAR INTEGRATED CIRCUIT
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Copyright © 2013 Unisonic Technologies Co., Ltd QW-R113-001.M
7CH DARLINGTON SINK
DRIVER
DESCRIPTION
The UTC ULN2003 are high-voltage, high-current
darlington drivers comprised of seven NPN Darlington pairs.
All units feature integral clamp diodes for switching
inductive loads.
Applications include relay, hammer, lamp and display
(LED) drivers.
FEATURES
*Output Current (Single Output): 500mA (MAX.)
*High Sustaining Voltage Output: 50V (MIN.)
*Output Clamp Diodes
*Inputs Compatible With Various Types Of Logic
ORDERING INFORMATION
Ordering Number Package Packing
Lead Free Halogen Free
ULN2003L-D16-T ULN2003G-D16-T DIP-16 Tube
ULN2003L-S16-R ULN2003G-S16-R SOP-16 Tape Reel
ULN2003L-S16-T ULN2003G-S16-T SOP-16 Tube
ULN2003L-P16-R ULN2003G-P16-R TSSOP-16 Tape Reel
ULN2003L-P16-T ULN2003G-P16-T TSSOP-16 Tube
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PIN CONNECTION
BLOCK DIAGRAM
Note: The input and output parasitic diodes cannot be used as clamp diodes.
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ABSOLUTE MAXIMUM RATINGS (TA=25°C)
PARAMETER SYMBOL RATING UNIT
Output Sustaining Voltage VOUT -0.5~50 V
Input Voltage VIN -0.5~30 V
Clamp Diode Reverse Voltage VR 50 V
Output Current IOUT 500 mA / ch
Clamp Diode Forward Current IF 500 mA
Power Dissipation
DIP-16
PD
1.47 W
SOP-16 1.25 (Note2) W
TSSOP-16 0.62 W
Junction Temperature TJ +125 °C
Operating Temperature TOPR -40~+85 °C
Storage Temperature TSTG -55~+150 °C
Note: 1. Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
2. On PCB (Test Board: JEDEC 2s2p)
RECOMMENDED OPERATING CONDITIONS (TA=-40~+85°C)
CHARACTERISTIC SYMBOL TEST CONDITIONS MIN TYP MAX UNIT
Output Sustaining Voltage VOUT 0 50 V
Output Current
DIP-16
IOUT
TPW = 25ms
7 Circuits
TA = 85°C
TJ = 120°C
Duty = 10% 0 350
mA/ch
Duty = 50% 0 100
SOP-16 Duty = 10% 0 300
Duty = 50% 0 90
TSSOP-16 Duty = 10% 0 150
Duty = 50% 0 30
Input Voltage VIN 0 24 V
Input Voltage (Output On) VIN
(
ON
)
I
OUT = 400mA 2.8 24 V
Input Voltage (Output Off) VIN
(
OFF
)
0 0.7 V
Clamp Diode Reverse Voltage VR 50 V
Clamp Diode Forward Current IF 350 mA
Power Dissipation
DIP-16
PD
TA = 85°C 0.76
W
SOP-16 TA = 85°C (Note) 0.65
TSSOP-16 TA = 85°C 0.32
Note: On PCB (Test Board: JEDEC 2s2p)
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ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)
CHARACTERISTIC SYMBOL TEST CIRCUIT TEST CONDITIONS MIN TYP MAX UNIT
Output Leakage Current ILEAK 1
VCE = 50 V, TA = 25°C 50 μA
VCE = 50 V, TA = 85°C 100
Collector-Emitter Saturation
Voltage VCEO(SAT) 2
IOUT = 350 mA, IIN = 500 μA 1.3 1.6
V
IOUT = 200 mA, IIN = 350 μA 1.1 1.3
IOUT = 100 mA, IIN = 250 μA 0.9 1.1
DC Current Transfer Ratio hFE 2 VCE = 2 V, IOUT = 350 mA 1000
Input Current (Output On) IIN
(
ON
)
3 VIN = 2.4 V, IOUT = 350 mA 0.4 0.7 mA
Input Current (Output Off) IIN
(
OFF
)
4 IOUT = 500 µA, TA = 85°C 50 65 μA
Input Voltage (Output On) VIN(ON) 5 VCE = 2 V IOUT = 350 mA 2.6 V
IOUT = 200 mA 2.0
Clamp Diode Reverse Current IR 6
VR = 50 V, TA = 25°C 50 μA
VR = 50 V, TA = 85°C 100
Clamp Diode Forward Voltage VF 7 IF = 350 mA 2.0 V
Input Capacitance CIN 15 pF
Turn-On Delay tON 8
VOUT = 50 V, RL = 125 Ω
CL = 15 pF 0.1
μs
Turn-Off Delay tOFF 8
VOUT = 50 V, RL = 125 Ω
CL = 15 pF 0.2
ULN2003 LINEAR INTEGRATED CIRCUIT
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TEST CIRCUIT
Components in the test circuits are used only to obtain and confirm the device characteristics. These components
and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
OPEN
VIN
OPEN
ILEAK
VCE
OPEN
OPEN
IR
VR
VIN(ON)
OPEN
IOUT
VCE
OPEN
IOUT
IIN(OFF)
OPEN
IOUT
VCE,VCEO(SAT)
IIN
hFE=
OPEN
IIN(ON)
OPEN
VIN
1. ILEAK 2. VCEO(SAT),hFE
3. IIN(ON) 4. IIN(OFF)
5. VIN(ON)
6.
IR
IOUT
IIN
VIN
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TEST CIRCUIT(Cont.)
OPEN
OPEN
VFIF
7. VF
Note 1: Pulse width 50µs ,duty cycle 10%
Output impedance 50Ωt
R5ns, t
F10ns
Note 2: See below
Note 3: CL includes probe and jig capacitance
TYPE NUMBER
ULN2003
R1
0
VIH
3V
INPUT CONDITION
8. tON, tOFF
PULSE
GENERATOR Note 2
INPUT OPEN VOUT
RL
CL=15pF
(Note 3)(Note 1)
OUTPUT
INPUT
OUTPUT
50
TON TOFF
90
50
10
90
50
10
tRtF
50µs
VIH
0
VOL
VO
H
50
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APPLICATION NOTES
This UTC ULN2003 has no protection functions for over-current and over-voltage. If the applied situation includes
over-current or over-voltage, this IC may be destroyed. We should take care of the systems design with this IC. The
OUTPUT, COMMON and GND lines should be designed carefully，because the IC may be destroyed due to
short-circuit between outputs, air contamination fault, or fault by improper grounding.
The UTC ULN2003 is a darlington driver array. When it is applied with a general logic circuit such as TTL or
CMOS, resistors should be connected in series to every input to achieve a stable input current.
When the load is connected between the output and the power supply, the COMMON pin should be shorted to the
power supply to protect the IC from extra swing voltage.
NOTICE ON PRODUCT USE
(1) The absolute maximum ratings should be not exceeded, even for a moment, otherwise the device may be
breakdown, damaged or deteriorated, and even injury by explosion or combustion.
(2) The power supply fuse should be used to prevent a continuous large current from the over current situation
and IC failure. The improper wiring layout and an abnormal pulse noise from the wiring or load both can cause a
large continuous current and even the breakdown, and finally can lead smoke or ignition. So we should design
carefully considering fuse capacity, fusing time and insertion circuit location, the effects of a large current can be
improved.
(3) When the inductive load is applied such as motor coil, it can cause the device malfunction or breakdown due to
the current resulting from the inrush current at power ON or the negative current resulting from the back
electromotive force at power OFF, so a protection circuit should be designed. When using build-in protection
functions IC, a stable power supply is required, otherwise the protection function may not operate and cause IC
breakdown. IC breakdown may result injury, smoke or ignition.
(4) The devices should not be mounted in the wrong orientation or incorrectly, and the positive and negative
terminals of power supplies should also are connected properly, otherwise the current or power consumption may
exceed the absolute maximum rating, also it may cause the device breakdown, damage or deterioration, and may
result injury by explosion or combustion. In addition, any device should not be used when it is applied the current
with mounted in the wrong orientation or incorrectly even just one time.
(5) The careful selection of external components is also important, such as inputs and negative feedback
capacitors, load components (such as speakers), power amp and regulator. If a large leakage current flow the input
or negative feedback capacitors, the IC output DC voltage will be increased. If this output voltage is connected to a
speaker with low input withstand voltage, the smoke or ignition can be caused for over-current or IC failure, even the
smoke or ignition from the IC itself. In addition, please also pay attention to the Bridge Tied Load (BTL) connection
type IC that inputs output DC voltage to a speaker directly.
POINTS TO REMEMBER ON PRODUCT USE
(1) Heat Dissipation Design
An inadequate IC heat dissipation design can reduce the IC life, deterioration of IC characteristics, even IC
breakdown. When the IC is applied with a large current flow such as power amp, regulator and so on, the careful
heat dissipation design should be implemented, not to exceed the maximum ratings of junction temperature (Tj).
Meanwhile, also please pay attention to the effect of IC heat dissipation on peripheral components.
(2) Back-EMF
Being the effect of back-EMF, a current can flow back to the motor’s power supply when a motor rotates in the
reverse direction, stops or slows down suddenly. If the power supply has a low current sink capability, the device’s
motor power supply and output pins might be influenced for excessing the absolute maximum ratings. In the system
design, we should take the effect of back-EMF into consideration to avoid the accident.
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TYPICAL CHARACTERISTICS
Output Current, I
OUT
(mA)
Output Current, I
OUT
(mA)
Output Current, IOUT (mA)
Output Current, IOUT (mA)
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TYPICAL CHARACTERISTICS(Cont.)
Input Current, I
IN
(mA)
Input Current, I
IN
(mA)
Output Current, IOUT (mA)
Output Current, I
OUT
(mA)
Clamp Diode Forward Current, I
F
(mA)
DC Current Transfer Ratio, hFE
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TYPICAL CHARACTERISTICS(Cont.)
PD (W)
Power Dissipation, PD
(W)
UTC assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.