RF & Protection Devices
Data Sheet
Revision 2.1, 2009-12-09
BGS12AL7-6
SPDT RF Switch
Edition 2009-12-09
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
BGS12AL7-6
SPDT RF Switch
Data Sheet 3 Revision 2.1, 2009-12-09
Trademarks of Infineon Technologies AG
A-GOLD™, BlueMoon™, COMNEON™, CONVERGATE™, COSIC™, C166™, CROSSAVE™, CanPAK™,
CIPOS™, CoolMOS™, CoolSET™, CONVERPATH™, CORECONTROL™, DAVE™, DUALFALC™, DUSLIC™,
EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, E-GOLD™, EiceDRIVER™,
EUPEC™, ELIC™, EPIC™, FALC™, FCOS™, FLEXISLIC™, GEMINAX™, GOLDMOS™, HITFET™,
HybridPACK™, INCA™, ISAC™, ISOFACE™, IsoPACK™, IWORX™, M-GOLD™, MIPAQ™, ModSTACK™,
MUSLIC™, my-d™, NovalithIC™, OCTALFALC™, OCTAT™, OmniTune™, OmniVia™, OptiMOS™,
OPTIVERSE™, ORIGA™, PROFET™, PRO-SIL™, PrimePACK™, QUADFALC™, RASIC™, ReverSave™,
SatRIC™, SCEPTRE™, SCOUT™, S-GOLD™, SensoNor™, SEROCCO™, SICOFI™, SIEGET™,
SINDRION™, SLIC™, SMARTi™, SmartLEWIS™, SMINT™, SOCRATES™, TEMPFET™, thinQ!™,
TrueNTRY™, TriCore™, TRENCHSTOP™, VINAX™, VINETIC™, VIONTIC™, WildPass™, X-GOLD™, XMM™,
X-PMU™, XPOSYS™, XWAY™.
Other Trademarks
AMBA™, ARM™, MULTI-ICE™, PRIMECELL™, REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is
licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum.
COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of
Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium.
HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of
Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION.
MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of
Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc.,
USA. muRata™ of MURATA MANUFACTURING CO. OmniVision™ of OmniVision Technologies, Inc.
Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of
Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™
of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™
of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™,
PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™,
WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.
Last Trademarks Update 2009-10-19
BGS12AL7-6 SPDT RF Switch
Revision History: 2009-12-09, Revision 2.1
Previous Revision: 2009-11-24, V2.0
Page Subjects (major changes since last revision)
11 max. Values for Insertion Loss @ TA = -30 °C...+85 °C
BGS12AL7-6
SPDT RF Switch
Table of Contents
Data Sheet 4 Revision 2.1, 2009-12-09
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5 Measurement Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table of Contents
BGS12AL7-6
SPDT RF Switch
List of Figures
Data Sheet 5 Revision 2.1, 2009-12-09
Figure 1 Functional Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 2 Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 3 Measurement Results (@ T = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 4 Application Board: No External Components Necessary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 5 Deembedding Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 6 Package TSLP7-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 7 Marking Info . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8 Board pad (SMD) & Apertures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 9 Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
List of Figures
BGS12AL7-6
SPDT RF Switch
List of Tables
Data Sheet 6 Revision 2.1, 2009-12-09
Table 1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 2 Operation Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 4 Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 5 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
List of Tables
123
654
7
Product Name Package Chip Marking
BGS12AL7-6 TSLP7-6 M4781 12
SPDT RF Switch
BGS12AL7-6
Data Sheet 7 Revision 2.1, 2009-12-09
1 Features
Main features:
• Low insertion loss
• High port-to-port-isolation
• Low harmonic generation
• On-chip control logic, only one control line required
• High ESD robustness
• No external components required
• General purpose switch for applications up to 3 GHz
• Small leadless package TSLP-7-6
• Lead and halogen free package (RoHS and WEEE compliant)
Description
The BGS12AL7-6 General Purpose RF MOS switch is designed to cover a broad range of applications from
30 MHz to 3 GHz. The symmetric design of its single pole double throw configuration, as shown in Figure 1 offers
high design flexibility. This single supply chip integrates on-chip CMOS logic driven by a simple, single-pin CMOS
or TTL compatible control input signal. The 0.1 dB compression point exceeds the switch’s maximum input power
level of 21 dBm, resulting in linear performance at all signal levels. The RF switch has a very low insertion loss of
0.4 dB in the 1 GHz and 0.5 dB in the 2 GHz range.
Unlike GaAs technology, external DC blocking capacitors at the RF ports are only required if DC voltage is applied
externally.
BGS12AL7-6
SPDT RF Switch
Features
Data Sheet 8 Revision 2.1, 2009-12-09
The BGS12AL7-6 RF switch is manufactured in Infineon’s patented MOS technology, offering the performance of
GaAs with the economy and integration of conventional CMOS including the inherent higher ESD robustness.
Figure 1 Functional Diagram
BGS12AL7-6_Functional_Diagramm.vsd
GND
RF1
Vdd Ctrl
Decoder
+ESD
RF2
RFin
GND
RF1
Vdd Ctrl
Decoder
+ESD
RF2
RFin
BGS12AL7-6
SPDT RF Switch
Maximum Ratings
Data Sheet 9 Revision 2.1, 2009-12-09
2 Maximum Ratings
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the integrated circuit.
Table 1 Maximum Ratings
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Storage temperature range Tstg -65 – 150 °C –
DC Voltage at all pins to GND VDC ––5V–
RF power max. at all RF ports PIN ––24dBm–
ESD Capability
Human Body Model IEC61340-3-1 VESD – – 1000 V –
Machine Model IEC61340-3-2 – – 100
Charge Device Model JEDEC JESD22-C101D – – 1500 –
Table 2 Operation Ranges
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Ambient temperature TA-30 – 85 °C –
RF Frequency f0.03 – 3 GHz –
Control voltage low VCtrL -0.3 – 0.3 V –
Control voltage high VCtrlH 1.4 – Vdd V –
Supply voltage1)
1) Supply voltage must be connected before Control Voltage
Vdd 2.4 – 3.6 V –
Current consumption Vdd Pin (over
temperature)
IVdd 80 – 350 μA–
Current Consumption Vctrl Pin ICtrl ––30μA–
Power Range Pin –––dBm–
(VSWR ∞: 1) ––15 –
(VSWR 3: 1) – – 18 –
(VSWR 1: 1) – – 21 –
BGS12AL7-6
SPDT RF Switch
Pin Description
Data Sheet 10 Revision 2.1, 2009-12-09
3 Pin Description
Figure 2 Pin Configuration (top view)
Table 3 Pin Description
Pin No. Name Pin
Type
Buffer
Type
Function
1RF2 I/O RF Port 2 Out
2GNDGND Ground
3RF1 I/O RF Port 1 Out
4Vdd PWR Supply Voltage
5RFINI/O RF Port In
6CTRLI Control Pin
7 NC NC It is recommended to connect Pin 7 to Ground
Table 4 Truth Table
Ctrl 1 RF 1 RF 2
01 0
10 1
TSLP7-6.vsd
Ctrl
RF2
Vdd
RF1
RFin
GND
23
456
7
Gnd
1
BGS12AL7-6
SPDT RF Switch
Electrical Specifications
Data Sheet 11 Revision 2.1, 2009-12-09
4 Electrical Specifications
Test Conditions:
• Termination port impedance: Z0 = 50 Ω
• Temperature range: TA = -30 °C...+85 °C
• Supply Voltage: Vdd = 2.8 V
•Pin = 15 dBm
• Across operating range of control voltages: VCtrH = 1.4...2.8 V
Table 5 Electrical Characteristics
Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
Insertion Loss IL –0.3
1)
1) Not measured in production, verified by design
0.51) dB f=0.1GHz, TA = 25 °C
–0.350.6dB
f=1GHz, TA = 25 °C
–0.50.7dB
f=2GHz, TA = 25 °C
––0.6
1) dB f=0.1GHz
––0.7
1) dB f=1GHz
––0.8
1) dB f=2GHz
Return Loss RL –30
1) –dBf=0.1GHz
15 20 – dB f=1GHz
12 15 – dB f=2GHz
Isolation RFin - RF1 ISORFin-RF1 –50
1) –dBf=0.1GHz
20 32 – dB f=1GHz
15 25 – dB f=2GHz
Isolation RFin - RF2 ISORFin-RF2 –50
1) –dBf=0.1GHz
20 32 – dB f=1GHz
15 25 – dB f=2GHz
Isolation RF1 - RF2 ISORF1-RF2 –50
1) –dBf=0.1GHz
24 32 – dB f=1GHz
15 25 – dB f=2GHz
Isolation RF ports - Vdd, Vctrl ISORF-DC 25 301) –dBf=1GHz
15 201) –dBf=2GHz
Harmonic Generation up to 12.75 GHz PHarm –-75
1) -50 dBm f=1GHz
–-80
1) -50 dBm f=2GHz
On Switching Time (10-90%) RF ton –3
1) 5μsf=1GHz
Off Switching Time (10-90%) RF toff –0.5
1) 5μsf=1GHz
Current Consumption at Vdd Pin Idd –140–μA–
Input 0.1 dB compression P0.1dB 211) ––dBmf=1GHz
BGS12AL7-6
SPDT RF Switch
Measurement Results
Data Sheet 12 Revision 2.1, 2009-12-09
5 Measurement Results
Figure 3 Measurement Results (@ T = 25°C)
BGS12AL7-6_measurement_ results_V3.vsd
0.5 1.0 1.5 2.0 2.5 3.0 3.50.0 4.0
-1.8
-1.6
-1.4
-1.2
-1.0
-0.8
-0.6
-0.4
-0.2
-2.0
0.0
freq, GHz
Insertion Loss (dB)
Insertion Loss RFin to RF1 / RFin to RF2
0.51.01.52.02.53.03.50.0 4.0
-45
-40
-35
-30
-25
-20
-15
-10
-5
-50
0
freq, GHz
R
e
t
urn
L
oss
(dB)
Return Loss RFin Port
0.5 1.0 1.5 2.0 2.5 3.0 3.50.0 4.0
-45
-40
-35
-30
-25
-20
-15
-10
-5
-50
0
freq, GHz
R
eturn
L
oss
(dB)
R
e
t
urn
L
oss
RF1
P
or
t
/
RF2
P
or
t
0.51.01.52.02.53.03.50.0 4.0
-45
-40
-35
-30
-25
-20
-15
-10
-5
-50
0
freq, GHz
Isolation (dB)
Isolation RFin to RF2 / RFin to RF1
0.5 1.0 1.5 2.0 2.5 3.0 3.50.0 4.0
-45
-40
-35
-30
-25
-20
-15
-10
-5
-50
0
freq, GHz
Isolation (dB)
Isolation RF1 to RF2 / RF2 to RF1
RF1 mode
RF2 mode RF1 mode
RF2 mode
RF1 mode
RF2 mode
RF1 mode
RF2 mode
RF1 mode
RF2 mode
10 12 14 16 18 20 22 24 26 28830
10
15
20
25
5
30
Pin ( dBm)
Pout (dBm)
Pin versus Pout (0.1dB Compression Point)
RF1/RF2 mode
no compression
observed up to 24dBm
BGS12AL7-6
SPDT RF Switch
Measurement Results
Data Sheet 13 Revision 2.1, 2009-12-09
Application Board
Figure 4 Application Board: No External Components Necessary
Figure 5 Deembedding Board
BGS 12AL7-6_application_board.vsd
BGS 12AL7-6_application_deembedding _board.vsd
BGS12AL7-6
SPDT RF Switch
Package Outlines
Data Sheet 14 Revision 2.1, 2009-12-09
6 Package Outlines
Figure 6 Package TSLP7-6
Figure 7 Marking Info
Figure 8 Board pad (SMD) & Apertures
Package TSLP7-6_V3.vsd
Marking TSLP7-6_V3.vsd
BGS12AL7-6 _board_pad_and_apertures _V2.vsd
