BGS12AL7-6 SPDT RF Switch Data Sheet Revision 2.1, 2009-12-09 RF & Protection Devices Edition 2009-12-09 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGS12AL7-6 SPDT RF Switch BGS12AL7-6 SPDT RF Switch Revision History: 2009-12-09, Revision 2.1 Previous Revision: 2009-11-24, V2.0 Page Subjects (major changes since last revision) 11 max. Values for Insertion Loss @ TA = -30 C...+85 C Trademarks of Infineon Technologies AG A-GOLDTM, BlueMoonTM, COMNEONTM, CONVERGATETM, COSICTM, C166TM, CROSSAVETM, CanPAKTM, CIPOSTM, CoolMOSTM, CoolSETTM, CONVERPATHTM, CORECONTROLTM, DAVETM, DUALFALCTM, DUSLICTM, EasyPIMTM, EconoBRIDGETM, EconoDUALTM, EconoPACKTM, EconoPIMTM, E-GOLDTM, EiceDRIVERTM, EUPECTM, ELICTM, EPICTM, FALCTM, FCOSTM, FLEXISLICTM, GEMINAXTM, GOLDMOSTM, HITFETTM, HybridPACKTM, INCATM, ISACTM, ISOFACETM, IsoPACKTM, IWORXTM, M-GOLDTM, MIPAQTM, ModSTACKTM, MUSLICTM, my-dTM, NovalithICTM, OCTALFALCTM, OCTATTM, OmniTuneTM, OmniViaTM, OptiMOSTM, OPTIVERSETM, ORIGATM, PROFETTM, PRO-SILTM, PrimePACKTM, QUADFALCTM, RASICTM, ReverSaveTM, SatRICTM, SCEPTRETM, SCOUTTM, S-GOLDTM, SensoNorTM, SEROCCOTM, SICOFITM, SIEGETTM, SINDRIONTM, SLICTM, SMARTiTM, SmartLEWISTM, SMINTTM, SOCRATESTM, TEMPFETTM, thinQ!TM, TrueNTRYTM, TriCoreTM, TRENCHSTOPTM, VINAXTM, VINETICTM, VIONTICTM, WildPassTM, X-GOLDTM, XMMTM, X-PMUTM, XPOSYSTM, XWAYTM. Other Trademarks AMBATM, ARMTM, MULTI-ICETM, PRIMECELLTM, REALVIEWTM, THUMBTM of ARM Limited, UK. AUTOSARTM is licensed by AUTOSAR development partnership. BluetoothTM of Bluetooth SIG Inc. CAT-iqTM of DECT Forum. COLOSSUSTM, FirstGPSTM of Trimble Navigation Ltd. EMVTM of EMVCo, LLC (Visa Holdings Inc.). EPCOSTM of Epcos AG. FLEXGOTM of Microsoft Corporation. FlexRayTM is licensed by FlexRay Consortium. HYPERTERMINALTM of Hilgraeve Incorporated. IECTM of Commission Electrotechnique Internationale. IrDATM of Infrared Data Association Corporation. ISOTM of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLABTM of MathWorks, Inc. MAXIMTM of Maxim Integrated Products, Inc. MICROTECTM, NUCLEUSTM of Mentor Graphics Corporation. MifareTM of NXP. MIPITM of MIPI Alliance, Inc. MIPSTM of MIPS Technologies, Inc., USA. muRataTM of MURATA MANUFACTURING CO. OmniVisionTM of OmniVision Technologies, Inc. OpenwaveTM Openwave Systems Inc. RED HATTM Red Hat, Inc. RFMDTM RF Micro Devices, Inc. SIRIUSTM of Sirius Sattelite Radio Inc. SOLARISTM of Sun Microsystems, Inc. SPANSIONTM of Spansion LLC Ltd. SymbianTM of Symbian Software Limited. TAIYO YUDENTM of Taiyo Yuden Co. TEAKLITETM of CEVA, Inc. TEKTRONIXTM of Tektronix Inc. TOKOTM of TOKO KABUSHIKI KAISHA TA. UNIXTM of X/Open Company Limited. VERILOGTM, PALLADIUMTM of Cadence Design Systems, Inc. VLYNQTM of Texas Instruments Incorporated. VXWORKSTM, WIND RIVERTM of WIND RIVER SYSTEMS, INC. ZETEXTM of Diodes Zetex Limited. Last Trademarks Update 2009-10-19 Data Sheet 3 Revision 2.1, 2009-12-09 BGS12AL7-6 SPDT RF Switch Table of Contents Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 Measurement Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Data Sheet 4 Revision 2.1, 2009-12-09 BGS12AL7-6 SPDT RF Switch List of Figures List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Data Sheet Functional Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Measurement Results (@ T = 25C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Application Board: No External Components Necessary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Deembedding Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package TSLP7-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Marking Info . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Board pad (SMD) & Apertures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5 Revision 2.1, 2009-12-09 BGS12AL7-6 SPDT RF Switch List of Tables List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Data Sheet Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Operation Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6 Revision 2.1, 2009-12-09 SPDT RF Switch 1 BGS12AL7-6 Features Main features: * * * * * * * * * 6 Low insertion loss High port-to-port-isolation Low harmonic generation On-chip control logic, only one control line required High ESD robustness No external components required General purpose switch for applications up to 3 GHz Small leadless package TSLP-7-6 Lead and halogen free package (RoHS and WEEE compliant) 5 4 7 1 2 3 Description The BGS12AL7-6 General Purpose RF MOS switch is designed to cover a broad range of applications from 30 MHz to 3 GHz. The symmetric design of its single pole double throw configuration, as shown in Figure 1 offers high design flexibility. This single supply chip integrates on-chip CMOS logic driven by a simple, single-pin CMOS or TTL compatible control input signal. The 0.1 dB compression point exceeds the switch's maximum input power level of 21 dBm, resulting in linear performance at all signal levels. The RF switch has a very low insertion loss of 0.4 dB in the 1 GHz and 0.5 dB in the 2 GHz range. Unlike GaAs technology, external DC blocking capacitors at the RF ports are only required if DC voltage is applied externally. Product Name Package Chip Marking BGS12AL7-6 TSLP7-6 M4781 12 Data Sheet 7 Revision 2.1, 2009-12-09 BGS12AL7-6 SPDT RF Switch Features The BGS12AL7-6 RF switch is manufactured in Infineon's patented MOS technology, offering the performance of GaAs with the economy and integration of conventional CMOS including the inherent higher ESD robustness. RFin RF1 RF2 GND Decoder +ESD Vdd Ctrl BGS 12AL 7-6_Functional_ Diagramm.vsd Figure 1 Data Sheet Functional Diagram 8 Revision 2.1, 2009-12-09 BGS12AL7-6 SPDT RF Switch Maximum Ratings 2 Maximum Ratings Table 1 Maximum Ratings Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Storage temperature range Tstg -65 - 150 C - DC Voltage at all pins to GND VDC - - 5 V - RF power max. at all RF ports PIN - - 24 dBm - VESD - - 1000 V - Machine Model IEC61340-3-2 - - 100 Charge Device Model JEDEC JESD22-C101D - - 1500 ESD Capability Human Body Model IEC61340-3-1 Table 2 - Operation Ranges Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Ambient temperature TA -30 - 85 C - RF Frequency f 0.03 - 3 GHz - Control voltage low VCtrL -0.3 - 0.3 V - Control voltage high VCtrlH 1.4 - Vdd V - Supply voltage Vdd 2.4 - 3.6 V - Current consumption Vdd Pin (over temperature) IVdd 80 - 350 A - Current Consumption Vctrl Pin ICtrl - - 30 A - Power Range Pin - - - dBm - (VSWR : 1) - - 15 - (VSWR 3: 1) - - 18 - (VSWR 1: 1) - - 21 - 1) 1) Supply voltage must be connected before Control Voltage Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Data Sheet 9 Revision 2.1, 2009-12-09 BGS12AL7-6 SPDT RF Switch Pin Description 3 Pin Description Table 3 Pin Description Pin No. Name Pin Type Buffer Type 1 RF2 I/O RF Port 2 Out 2 GND GND Ground 3 RF1 I/O RF Port 1 Out 4 Vdd PWR Supply Voltage 5 RFIN I/O RF Port In 6 CTRL I Control Pin 7 NC NC It is recommended to connect Pin 7 to Ground Ctrl RFin Vdd 6 5 4 Function 7 Gnd 1 2 3 RF2 GND RF1 Figure 2 Pin Configuration (top view) Table 4 Truth Table T SLP7- 6.vsd Ctrl 1 RF 1 RF 2 0 1 0 1 0 1 Data Sheet 10 Revision 2.1, 2009-12-09 BGS12AL7-6 SPDT RF Switch Electrical Specifications 4 Electrical Specifications Test Conditions: * * * * * Termination port impedance: Z0 = 50 Temperature range: TA = -30 C...+85 C Supply Voltage: Vdd = 2.8 V Pin = 15 dBm Across operating range of control voltages: VCtrH = 1.4...2.8 V Table 5 Electrical Characteristics Parameter Symbol Values Min. Insertion Loss IL Isolation RFin - RF1 Isolation RFin - RF2 Isolation RF1 - RF2 Isolation RF ports - Vdd, Vctrl ISORFin-RF1 ISORFin-RF2 ISORF1-RF2 ISORF-DC Harmonic Generation up to 12.75 GHz PHarm On Switching Time (10-90%) RF ton f = 0.1 GHz, TA = 25 C 0.35 0.6 dB f = 1 GHz, TA = 25 C - 0.5 0.7 dB f = 2 GHz, TA = 25 C - - 0.61) dB f = 0.1 GHz - 1) dB f = 1 GHz 1) 0.8 dB f = 2 GHz - dB f = 0.1 GHz - dB f = 1 GHz - dB f = 2 GHz - dB f = 0.1 GHz - dB f = 1 GHz - dB f = 2 GHz - dB f = 0.1 GHz - dB f = 1 GHz - dB f = 2 GHz - dB f = 0.1 GHz - dB f = 1 GHz 0.7 - - 30 15 20 12 15 - 50 20 32 15 25 - 50 20 32 15 25 - 50 24 32 15 25 1) 1) 1) 1) - dB f = 2 GHz 25 30 1) - dB f = 1 GHz 15 201) - dB f = 2 GHz -75 1) -50 dBm f = 1 GHz - -80 1) -50 dBm f = 2 GHz - 1) 5 s f = 1 GHz 5 s f = 1 GHz 140 - A - - - dBm f = 1 GHz - toff - Current Consumption at Vdd Pin Idd - P0.1dB dB - Off Switching Time (10-90%) RF Input 0.1 dB compression 0.51) Max. 0.3 - RL 1) Note / Test Condition - - Return Loss Typ. Unit 21 3 0.5 1) 1) 1) Not measured in production, verified by design Data Sheet 11 Revision 2.1, 2009-12-09 BGS12AL7-6 SPDT RF Switch Measurement Results 5 Measurement Results Insertion Loss RFin to RF1 / RFin to RF2 Return Loss RFin Port 0 -0.2 -5 -0.4 -10 -0.6 -15 Return Loss (dB) Insertion Loss (dB) 0.0 -0.8 -1.0 -1.2 -1.4 RF1 mode RF2 mode -1.6 -1.8 0.5 1.0 1.5 2.0 2.5 -25 -30 -35 RF1 mode RF2 mode -40 -45 -2.0 0.0 -20 3.0 3.5 -50 4.0 0.0 0.5 1.0 1.5 freq, GHz Return Loss RF1 Port / RF2 Port 2.5 3.0 3.5 4.0 3.5 4.0 Isolation RFin to RF2 / RFin to RF1 0 0 -5 -5 -10 -10 -15 -15 Isolation (dB) Return Loss (dB) 2.0 freq, GHz -20 -25 -30 -35 RF1 mode RF2 mode -40 -45 -20 -25 -30 -35 RF1 mode RF2 mode -40 -45 -50 -50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.0 0.5 1.0 1.5 freq, GHz 2.0 2.5 3.0 freq, GHz Isolation RF1 to RF2 / RF2 to RF1 Pin versus Pout (0.1dB Compression Point) 0 30 no compression observed up to 24dBm -5 -10 25 -20 Pout (dBm) Isolation (dB) -15 -25 -30 -35 RF1 mode RF2 mode -40 -45 -50 0.0 Data Sheet 15 RF1/RF2 mode 10 5 0.5 1.0 1.5 2.0 freq, GHz Figure 3 20 2.5 3.0 3.5 4.0 8 10 12 14 BGS 12AL 7-6_measurement_ results_V 3.vsd 16 18 20 22 24 26 28 30 Pin (dBm) Measurement Results (@ T = 25C) 12 Revision 2.1, 2009-12-09 BGS12AL7-6 SPDT RF Switch Measurement Results Application Board BGS 12AL 7-6_applic ation _board .vsd Figure 4 Application Board: No External Components Necessary BGS 12AL 7-6_application _deem bedding _board .vsd Figure 5 Data Sheet Deembedding Board 13 Revision 2.1, 2009-12-09 BGS12AL7-6 SPDT RF Switch Package Outlines 6 Package Outlines Package TSLP7-6 _V3.vsd Figure 6 Package TSLP7-6 Marking TSLP7-6_V 3.vsd Figure 7 Marking Info BGS12 AL7-6 _board _pad_ and_apertures _V2.vsd Figure 8 Data Sheet Board pad (SMD) & Apertures 14 Revision 2.1, 2009-12-09 BGS12AL7-6 SPDT RF Switch Package Outlines 0.5 BGS 12AL7 -6_Tape_ and_Reel_ V1.vsd Figure 9 Tape and Reel Dimensions in mm You can find all of our packages, sorts of packing and others in our Infineon Internet Page "Products": http://www.infineon.com/products. Data Sheet 15 Revision 2.1, 2009-12-09 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG