ICX279AL Diagonal 4.5mm (Type 1/4) CCD Image Sensor for CCIR B/W Video Cameras Description The ICX279AL is an interline CCD solid-state image sensor suitable for CCIR B/W video cameras with a diagonal 4.5mm (Type 1/4) system. Compared with the current product ICX209AL, basic characteristics such as sensitivity, smear and dynamic range are improved drastically from visible light region to near infrared light region through the adoption of EXview HAD CCDTM technology. This chip features a field period readout system and an electronic shutter with variable charge-storage time. The package is a 10mm-square 14-pin DIP (Plastic). Features * Sensitivity in near infrared light region (+5dB compared with the ICX209AL, = 945nm) * High sensitivity (+6dB compared with the ICX209AL, no IR cut filter) * Low smear (-20dB compared with the ICX209AL) * High D range (+2dB compared with the ICX209AL) * Horizontal register: 3.3 to 5V drive * Reset gate: 3.3 to 5V drive * No voltage adjustment (Reset gate and substrate bias are not adjusted.) * High resolution and low smear * Excellent antiblooming characteristics * Continuous variable-speed shutter * Recommended range of exit pupil distance: -20 to -100mm 14 pin DIP (Plastic) Pin 1 2 V 12 3 Pin 8 H 40 Optical black position (Top View) Device Structure * Interline CCD image sensor * Image size: Diagonal 4.5mm (Type 1/4) * Number of effective pixels: 752 (H) x 582 (V) approx. 440K pixels * Total number of pixels: 795 (H) x 596 (V) approx. 470K pixels * Chip size: 4.43mm (H) x 3.69mm (V) * Unit cell size: 4.85m (H) x 4.65m (V) * Optical black: Horizontal (H) direction : Front 3 pixels, rear 40 pixels Vertical (V) direction : Front 12 pixels, rear 2 pixels * Number of dummy bits: Horizontal 22 Vertical 1 (even fields only) * Substrate material: Silicon TM EXview HAD CCD is a trademark of Sony Corporation. EXview HAD CCD is a CCD that drastically improves light efficiency by including near infrared light region as a basic structure of HAD (Hole-Accumulation-Diode) sensor. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E00Z52A3Z ICX279AL USE RESTRICTION NOTICE (December 1, 2003 ver.) This USE RESTRICTION NOTICE ("Notice") is for customers who are considering or currently using the CCD products ("Products") set forth in this specifications book. Sony Corporation ("Sony") may, at any time, modify this Notice which will be available to you in the latest specifications book for the Products. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has its own use restriction notice on the Products, such a use restriction notice will additionally apply between you and the subsidiary or distributor. You should consult a sales representative of the subsidiary or distributor of Sony on such a use restriction notice when you consider using the Products. Use Restrictions * The Products are intended for incorporation into such general electronic equipment as office products, communication products, measurement products, and home electronics products in accordance with the terms and conditions set forth in this specifications book and otherwise notified by Sony from time to time. * You should not use the Products for critical applications which may pose a life- or injury- threatening risk or are highly likely to cause significant property damage in the event of failure of the Products. You should consult your Sony sales representative beforehand when you consider using the Products for such critical applications. In addition, you should not use the Products in weapon or military equipment. * Sony disclaims and does not assume any liability and damages arising out of misuse, improper use, modification, use of the Products for the above-mentioned critical applications, weapon and military equipment, or any deviation from the requirements set forth in this specifications book. Design for Safety * Sony is making continuous efforts to further improve the quality and reliability of the Products; however, failure of a certain percentage of the Products is inevitable. Therefore, you should take sufficient care to ensure the safe design of your products such as component redundancy, anti-conflagration features, and features to prevent mis-operation in order to avoid accidents resulting in injury or death, fire or other social damage as a result of such failure. Export Control * If the Products are controlled items under the export control laws or regulations of various countries, approval may be required for the export of the Products under the said laws or regulations. You should be responsible for compliance with the said laws or regulations. No License Implied * The technical information shown in this specifications book is for your reference purposes only. The availability of this specifications book shall not be construed as giving any indication that Sony and its licensors will license any intellectual property rights in such information by any implication or otherwise. Sony will not assume responsibility for any problems in connection with your use of such information or for any infringement of third-party rights due to the same. It is therefore your sole legal and financial responsibility to resolve any such problems and infringement. Governing Law * This Notice shall be governed by and construed in accordance with the laws of Japan, without reference to principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relating to this Notice shall be submitted to the exclusive jurisdiction of the Tokyo District Court in Japan as the court of first instance. Other Applicable Terms and Conditions * The terms and conditions in the Sony additional specifications, which will be made available to you when you order the Products, shall also be applicable to your use of the Products as well as to this specifications book. You should review those terms and conditions when you consider purchasing and/or using the Products. -2- ICX279AL GND NC V1 V2 V3 V4 7 6 5 4 3 2 1 Vertical Register VOUT Block Diagram and Pin Configuration (Top View) Note) Horizontal Register 9 10 11 12 13 14 SUB VL RG H1 H2 VDD 8 GND Note) : Photo sensor Pin Description Pin No. Symbol Description Pin No. Symbol Description 1 V4 Vertical register transfer clock 8 VDD Supply voltage 2 V3 Vertical register transfer clock 9 GND GND 3 V2 Vertical register transfer clock 10 SUB Substrate clock 4 V1 Vertical register transfer clock 11 VL Protective transistor bias 5 NC 12 RG Reset gate clock 6 GND GND 13 H1 Horizontal register transfer clock 7 VOUT Signal output 14 H2 Horizontal register transfer clock Absolute Maximum Ratings Item Against SUB Ratings Unit VDD, VOUT, RG - SUB -40 to +8 V V1, V3 - SUB -50 to +15 V V2, V4, VL - SUB -50 to +0.3 V H1, H2, GND - SUB -40 to +0.3 V -0.3 to +18 V V1, V2, V3, V4 - GND -10 to +18 V H1, H2 - GND -10 to +6 V V1, V3 - VL -0.3 to +28 V V2, V4, H1, H2, GND - VL -0.3 to +15 V to +15 V VDD, VOUT, RG - GND Against GND Against VL Voltage difference between vertical clock input pins Between input clock pins H1 - H2 H1, H2 - V4 Storage temperature Operating temperature 1 +24V (Max.) when clock width < 10s, clock duty factor < 0.1%. -3- -5 to +5 V -13 to +13 V -30 to +80 C -10 to +60 C Remarks 1 ICX279AL Bias Conditions Symbol Min. Typ. Max. Unit Supply voltage VDD 14.55 15.45 V Protective transistor bias VL 15.0 1 Substrate clock SUB 2 Reset gate clock RG 2 Item Remarks 1 VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL power supply for the V driver should be used. 2 Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within the CCD. DC Characteristics Symbol Item Supply current Min. IDD Typ. Max. Unit 4 6 mA Remarks Clock Voltage Conditions Item Readout clock voltage Vertical transfer clock voltage Horizontal transfer clock voltage Min. Typ. Max. Unit Waveform diagram VVT 14.55 15.0 15.45 V 1 VVH1, VVH2 -0.05 0 0.05 V 2 VVH3, VVH4 -0.2 0 0.05 V 2 VVL1, VVL2, VVL3, VVL4 -8.0 -7.0 -6.5 V 2 VVL = (VVL3 + VVL4)/2 VV 6.3 7.0 8.05 V 2 VV = VVHn - VVLn (n = 1 to 4) Symbol VVH = (VVH1 + VVH2)/2 VVH3 - VVH -0.25 0.1 V 2 VVH4 - VVH -0.25 0.1 V 2 VVHH 0.3 V 2 High-level coupling VVHL 0.3 V 2 High-level coupling VVLH 0.3 V 2 Low-level coupling VVLL 0.3 V 2 Low-level coupling VH 3.0 3.3 5.25 V 3 VHL -0.05 0 0.05 V 3 3.0 3.3 5.5 V 4 Input through 0.1F capacitance VRGLH - VRGLL 0.4 V 4 Low-level coupling VRGL - VRGLm 0.5 V 4 Low-level coupling 23.5 V 5 VRG Reset gate clock voltage Remarks Substrate clock voltage VSUB 21.0 22.0 -4- ICX279AL Clock Equivalent Circuit Constant Symbol Item Min. Typ. Max. Unit Remarks CV1, CV3 1200 pF CV2, CV4 680 pF CV12, CV34 220 pF CV23, CV41 150 pF CV13 82 pF CV24 75 pF Capacitance between horizontal transfer clock and GND CH1, CH2 22 pF Capacitance between horizontal transfer clocks CHH 36 pF Capacitance between reset gate clock and GND CRG 5 pF Capacitance between vertical transfer clock and GND Capacitance between vertical transfer clocks Capacitance between substrate clock and GND CSUB 180 pF Vertical transfer clock series resistor R1 , R 2 , R 3 , R 4 82 Vertical transfer clock ground resistor RGND 15 Horizontal transfer clock series resistor RH 12 Reset gate clock series resistor RRG 51 V2 V1 CV12 R1 R2 RH RH H1 CV1 H2 CHH CV2 CV41 CV23 CH1 CH2 CV13 CV24 CV4 R4 RGND CV3 R3 CV34 V4 V3 Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit RRG RG CRG Reset gate clock equivalent circuit -5- ICX279AL Drive Clock Waveform Conditions (1) Readout clock waveform 100% 90% M VVT M 2 10% 0% tr twh 0V tf (2) Vertical transfer clock waveform V1 V3 VVH1 VVHH VVH VVHH VVHL VVHL VVHL VVL1 VVHH VVHH VVH3 VVH VVHL VVL3 VVLH VVLH VVLL VVLL VVL VVL V2 V4 VVHH VVHH VVH VVH VVHH VVHH VVHL VVHL VVH2 VVHL VVH4 VVLH VVL2VVLH VVLL VVLL VVL4 VVL VVH = (VVH1 + VVH2)/2 VVL = (VVL3 + VVL4)/2 VV = VVHn - VVLn (n = 1 to 4) VVHL -6- VVL ICX279AL (3) Horizontal transfer clock waveform tr twh tf 90% VH twl 10% VHL (4) Reset gate clock waveform tr twh tf VRGH twl VRG Point A RG waveform VRGLH VRGL VRGLL VRGLm H1 waveform VH/2 [V] VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL. VRGL = (VRGLH + VRGLL)/2 Assuming VRGH is the minimum value during the interval twh, then: VRG = VRGH - VRGL Negative overshoot level during the falling edge of RG is VRGLm. (5) Substrate clock waveform 100% 90% M VSUB 10% VSUB 0% (A bias generated within the CCD) tr twh -7- M 2 tf ICX279AL Clock Switching Characteristics twh Symbol twl tr tf Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. 2.3 2.5 Readout clock VT Vertical transfer clock V1, V2, V3, V4 Horizontal transfer clock Item H1 26 28.5 26 28.5 6.5 9.5 6.5 9.5 H2 26 28.5 26 28.5 6.5 9.5 6.5 9.5 During H1 parallel-serial H2 conversion 5.38 0.01 0.01 5.38 0.01 0.01 51 3 3 During imaging 0.5 RG 11 Substrate clock SUB 1.5 1.8 13 s 0.5 Remarks During readout 250 ns 1 15 Reset gate clock Unit 0.5 ns 2 s ns 0.5 s When draining charge 1 When vertical transfer clock driver CXD1267AN is used. 2 When VH = 3.0V. tf tr - 2ns, and the cross-point voltage (VCR) for the H1 rising side of the H1 and H2 waveforms must be at least VH/2 [V]. Item Symbol Horizontal transfer clock H1, H2 two Min. Typ. 22 26 Max. Unit Remarks ns 3 3 The overlap period for twh and twl of horizontal transfer clocks H1 and H2 is two. -8- ICX279AL Image Sensor Characteristics Item (Ta = 25C) Symbol Min. Typ. Sensitivity 1 S1 640 Sensitivity 2 S2 2200 Saturation signal Vsat 900 Smear Sm Video signal shading SH Dark signal Max. Unit Measurement method 800 mV 1 3200 mV 2 mV 3 -100 dB 4 20 % 5 Zone 0 and I 25 % 5 Zone 0 to II' Vdt 2 mV 6 Ta = 60C Dark signal shading Vdt 1 mV 7 Ta = 60C Flicker F 2 % 8 Lag Lag 0.5 % 9 -108 Zone Definition of Video Signal Shading 752 (H) 12 12 8 H 8 V 10 H 8 Zone 0, I 582 (V) 6 Zone II, II' V 10 lgnored region Effective pixel region -9- Remarks Ta = 60C ICX279AL Image Sensor Characteristics Measurement Method Measurement conditions 1) In the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions. 2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black (OB) level is used as the reference for the signal output, and the value measured at point [ A] in the drive circuit example is used. Definition of standard imaging conditions 1) Standard imaging condition I: Use a pattern box (luminance: 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F8. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) Standard imaging condition II: Indicate the state which removes an IR cut filter of standard imaging condition I. 3) Standard imaging condition III: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 4) Standard imaging condition IV: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens (exit pupil distance -33mm) with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. Sensitivity 1 Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/250s, measure the signal output (Vs1) at the center of the screen and substitute the value into the following formula. S1 = VS1 x 250 50 [mV] 2. Sensitivity 2 Set to standard imaging condition II. After selecting the electronic shutter mode with a shutter speed of 1/1000s, measure the signal output (Vs2) at the center of the screen and substitute the value into the following formula. S2 = VS2 x 1000 [mV] 50 3. Saturation signal Set to standard imaging condition III. After adjusting the luminous intensity to 10 times the intensity with the average value of the signal output, 200mV, measure the minimum value of the signal output. - 10 - ICX279AL 4. Smear Set to standard imaging condition III. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity to 500 times the intensity with average value of the signal output, 200mV. When the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value YSm [mV] of the signal output and substitute the value into the following formula. Sm = 20 x log 1 1 VSm x x 500 10 200 [dB] (1/10V method conversion value) 5. Video signal shading Set to standard imaging condition IV. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the signal output is 200mV. Then measure the maximum (Vmax [mV]) and minimum (Vmin [mV]) values of the signal output and substitute the values into the following formula. SH = (Vmax - Vmin)/200 x 100 [%] 6. Dark signal Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 7. Dark signal shading After measuring 6, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark signal output and substitute the values into the following formula. Vdt = Vdmax - Vdmin [mV] 8. Flicker Set to standard imaging condition III. Adjust the luminous intensity so that the average value of the signal output is 200mV, and then measure the difference in the signal level between fields (Vf [mV]). Then substitute the value into the following formula. F = (Vf/200) x 100 [%] 9. Lag Adjust the signal output value generated by strobe light to 200mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula. Lag = (Vlag/200) x 100 [%] FLD V1 Light Strobe light timing Signal output 200mV Output - 11 - Vlag (lag) Drive Circuit 15V 1 20 2 19 3 18 XSUB 4 17 XV2 5 100k 1/35V 0.1 -7.0V 16 CXD1267AN XV1 6 XSG1 7 14 XV3 8 13 XSG2 9 12 XV4 10 11 3.3/16V 15 22/16V - 12 - 4 5 6 7 NC GND VOUT V3 3 V1 2 V2 1 V4 22/20V GND VDD VL 8 RG 9 H1 14 13 12 11 10 H2 SUB ICX279 (BOTTOM VIEW) 100 2SK523 [A] CCD OUT 3.9k H2 2200p H1 1M 0.01 3.3/20V 0.1 RG ICX279AL ICX279AL Spectral Sensitivity Characteristics (excludes both lens characteristics and light source characteristics) 1.0 0.9 0.8 Relative Response 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 500 600 700 800 900 1000 Wave Length [nm] Sensor Readout Clock Timing Chart V1 2.6 V2 Odd Field V3 V4 33.6 1.5 2.6 2.6 2.6 0.2 V1 V2 Even Field V3 V4 Unit: s - 13 - Drive Timing Chart (Vertical Sync) FLD VD BLK 340 335 330 325 320 315 310 25 20 15 10 625 1 2 3 4 5 - 14 - 620 HD V1 V2 V3 V4 CCD OUT 581 582 2 4 6 1 3 5 2 4 6 1 3 5 582 581 1 3 5 2 4 6 1 3 5 2 4 6 ICX279AL Drive Timing Chart (Horizontal Sync) HD BLK H1 20 10 20 22 1 2 3 1 2 3 10 1 2 3 5 40 30 20 10 750 752 1 3 5 745 H2 - 15 - RG V1 V2 V3 V4 SUB ICX279AL ICX279AL Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W soldering iron with a ground wire and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. 3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. 4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.) Cover glass 50N 50N 1.2Nm Plastic package Compressive strength - 16 - Torsional strength ICX279AL b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution. d) The notch of the package is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch of the package. e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) Others a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD characteristics. d) This CCD image sensor has sensitivity in the near infrared area. Its focus may not match in the same condition under visible light/near infrared light because of aberration. Incident light component of long wavelength which transmits the silicon substrate may have bad influence upon image. e) This package has 2 kinds of internal structure. However, their package outline, optical size, and strength are the same. Structure A Structure B Package Chip Metal plate (lead frame) Cross section of lead frame The cross section of lead frame can be seen on the side of the package for structure A. - 17 - Package Outline Unit: mm 14 pin DIP (400mil) 0 to 9 A 5.0 2.5 10.16 8.9 10.0 0.1 1.7 8.9 10.0 0.1 7 7 - 18 - 7.0 1.0 B' 2.5 2.6 ~ 1 0.25 1 3.35 0.15 7.0 2.5 V C H 0.5 ~ 1.0 D 5.0 ~ B 14 8 8 1.7 14 1. "A" is the center of the effective image area. 2. The two points "B" of the package are the horizontal reference. The point "B'" of the package is the vertical reference. 3. The bottom "C" of the package, and the top of the cover glass "D" are the height reference. 4. The center of the effective image area relative to "B" and "B'" is (H, V) = (5.0, 5.0) 0.15mm. 0.3 0.46 1.27 0.3 M PACKAGE STRUCTURE 1.27 3.5 0.3 5. The rotation angle of the effective image area relative to H and V is 1. 6. The height from the bottom "C" to the effective image area is 1.41 0.10mm. The height from the top of the cover glass "D" to the effective image area is 1.94 0.15mm. 7. The tilt of the effective image area relative to the bottom "C" is less than 25m. The tilt of the effective image area relative to the top "D" of the cover glass is less than 25m. 8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5. Plastic LEAD TREATMENT GOLD PLATING LEAD MATERIAL 42 ALLOY PACKAGE MASS 0.60g DRAWING NUMBER AS-D3-02(E) 9. The notch of the package is used only for directional index, that must not be used for reference of fixing. 10. Cover glass defect Edge part Length : no matter, Width : less than 0.5mm, Depth : less than the thickness of the glass. Corner part Length : less than 1.5mm, Depth : less than the thickness of the glass. ICX279AL Sony Corporation PACKAGE MATERIAL