DRV Package
(Top View)
1
2
34
5
6OUT
VDD
NC
V1
VSS
PWR PAD
VSS
bq294602, bq294604
www.ti.com
SLUSAS0B –DECEMBER 2011–REVISED MARCH 2012
Single-Cell Protector for Li-Ion Batteries
Check for Samples: bq294602,bq294604
1FEATURES • Low Power Consumption ICC ≈1 µA
(VCELL(ALL) < VPROTECT)
• Single-Cell Monitor for Secondary Protection • Low leakage current per cell input < 100 nA
• Fixed Programmable Delay Timer • Small package footprint
• Fixed OVP Threshold – 6-pin SON
– bq294602 = 4.35 V with 4-s Delay Timer
– bq294604 = 4.35 V with 6.5-s Delay Timer APPLICATIONS
– bq294622 = 4.45 V with 4-s Delay Timer • 2nd-Level Protection in Li-Ion Battery Packs in:
– bq294624 = 4.45 V with 6.5-s Delay Timer – Tablets
– bq294682 = 4.225 V with 4-s Delay Timer – Slates
– bq294684 = 4.225 V with 6.5-s Delay Timer – Portable Equipment and Instrumentation
• High-Accuracy Overvoltage Protection:
± 10 mV
DESCRIPTION
The bq2946xy family of products is a secondary level voltage monitor and protector for Li-Ion battery pack
systems. The cell is monitored for over voltage condition and triggers an internal counter once the OVP threshold
is exceeded and after a fixed set delay the out is transitioned to a high level. The output is reset (goes low) if the
cell voltage drops below the set threshold minus the hysteresis.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains Copyright © 2011–2012, Texas Instruments Incorporated
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
bq294602, bq294604
SLUSAS0B –DECEMBER 2011–REVISED MARCH 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
PACKAGE TAPE AND REEL TAPE AND REEL
TAPART NUMBER PACKAGE OVP (V) DELAY TIME (S)
DESIGNATOR (LARGE) (SMALL)
bq294602 4.35 4.0 bq294602DRVR bq294602DRVT
bq294604 4.35 6.5 bq294604DRVR bq294604DRVT
bq294622(2) 4.45 4.0 bq294622DRVR bq294622DRVT
–40°C to SON-6 DRV
110°C bq294624(2) 4.45 6.5 bq294624DRVR bq294624DRVT
bq294682(2) 4.225 4.0 bq294682DRVR bq294682DRVT
bq294684(2) 4.225 6.5 bq294684DRVR bq294684DRVT
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder on ti.com (www.ti.com).
(2) Product Preview only
THERMAL INFORMATION bq2946xy
THERMAL METRIC(1) SON UNITS
6 PINS
θJA Junction-to-ambient thermal resistance 186.4
θJC(top) Junction-to-case(top) thermal resistance 90.4
θJB Junction-to-board thermal resistance 110.7 °C/W
ψJT Junction-to-top characterization parameter 96.7
ψJB Junction-to-board characterization parameter 90
θJC(bottom) Junction-to-case(bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): bq294602 bq294604
VOV
V
OV VHYS
Cell Voltage (V)
V1–VSS)
OUT (V) tDELAY
–
bq294602, bq294604
www.ti.com
SLUSAS0B –DECEMBER 2011–REVISED MARCH 2012
PIN FUNCTIONS
bq2946xy Pin Name Type I/O Description
1 NC — No Connection
2 V1 IA Sense input for positive voltage of the cell
Electrically connected to IC ground and negative terminal of the
3 VSS P cell
Electrically connected to IC ground and negative terminal of the
4 VSS P cell
5 VDD P Power supply
6 OUT OA Output drive for external N-Channel FET
VSS pin to be connected to the PWRPAD on the printed circuit
Thermal Pad PWRPAD — board for proper operation
PIN DETAILS
Description
The method of overvoltage detection is comparing the cell voltage to an overvoltage protection threshold voltage
VOV. Once the cell voltage exceeds the programmed fixed value VOV, the delay timer circuit is activated. This
delay (tDELAY) is fixed for 4 s for the bq294602 device. When these conditions are satisfied, the OUT terminal is
transitioned to a high level. This output (OUT) is released to a low condition if the cell input (V1) is below the
OVP threshold minus the VHYS.
Figure 1. Timing for Overvoltage Sensing
Sense Positive Input for V1
This is an input to sense single battery cell voltage. A series resistor and a capacitor across the cell is required
for noise filtering and stable voltage monitoring.
Output Drive, OUT
The gate of an external N-Channel MOSFET is connected to this terminal. This output transitions to a high level
when an overvoltage condition is detected and after the programmed delay timer. The out will reset to a low level
if the cell voltage falls below the VOV threshold before the fixed delay timer expires.
Supply Input, VDD
This terminal is the unregulated input power source for the IC. A series resistor is connected to limit the current,
and a capacitor is connected to ground for noise filtering.
Thermal Pad, PWRPAD
For correct operation, the power pad (PWRPAD) is connected to the VSS terminal on the printed circuit board.
Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): bq294602 bq294604
OUT
V1
VSS
VDD
RVD
CVD
RIN
C
IN V
OV
OSC
Delay
Timer
PACK +
PACK –
INT_EN
REG
PWRPAD
Enable Monitoring
bq294602, bq294604
SLUSAS0B –DECEMBER 2011–REVISED MARCH 2012
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER CONDITION VALUE/UNIT
Supply voltage range VDD–VSS –0.3 to 30 V
Input voltage range V1–VSS –0.3 to 8 V
Output voltage range OUT–VSS –0.3 to 30 V
Continuous total power dissipation, PTOT See package dissipation rating.
Functional temperature –65 to 110°C
Storage temperature range, TSTG –65 to 150°C
Lead temperature (soldering, 10 s), TSOLDER 300°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum–rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN NOM MAX UNIT
Supply voltage, VDD(1) 3 8 V
Input voltage range V1–VSS 0 5 V
Operating ambient temperature range, TA –40 110 °C
(1) See APPLICATION SCHEMATIC.
4Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): bq294602 bq294604
bq294602, bq294604
www.ti.com
SLUSAS0B –DECEMBER 2011–REVISED MARCH 2012
DC CHARACTERISTICS
Typical values stated where TA= 25°C and VDD = 4 V, MIN/MAX values stated where TA= –40°C to 110°C and VDD = 4 V
(unless otherwise noted).
Test Symbol Parameter Condition Min Typ Max Unit
#
Voltage Protection Threshold VCx
1.0 bq294602, fixed delay 4 s, V1 > VOV 4.35 V
1.1 bq294604, fixed delay 6.5 s, V1 > VOV 4.35 V
V(PROTECT) –
1.2 VOV Overvoltage bq294622, fixed delay 4 s, V1 > VOV(1) 4.45 V
Detection
1.3 bq294624, fixed delay 6.5 s, V1 > VOV (1) 4.45 V
1.4 bq294682, fixed delay 4 s, V1 > VOV (1) 4.225 V
1.5 bq294684, fixed delay 6.5 s, V1 > VOV (1) 4.225 V
Overvoltage
1.6 VHYS Detection 250 300 400 V
Hysteresis
OV Detection
1.7 VOA TA= 25°C –10 10 mV
Accuracy TA= –40°C –40 44 mV
OV Detection TA= 0°C –20 20 mV
1.8 VOA –DRIFT Accuracy due to TA= 60°C –24 24 mV
Temperature TA= 110°C –54 54 mV
Supp ly and Leakage Current
(V1–VSS) = 4.0 V (See Figure 9 for reference) 1 2
1.9 ICC Supply Current µA
(V1–VSS) = 2.8 V with TA= –40°C to 60°C 1.25
Measured at V1 = 4.0 V
Input Current at
1.10 IIN (V1–VSS) = 4.0 V –0.1 0.1 µA
V1 Pins TA= 0°C to 60°C (See Figure 9 for reference.)
Output Drive OUT
1.11 (V1–VSS) > VOV 3.0 VDD - 0.3 V
VDD = V1, IOH = 100 µA, TA= –40°C to 110°C
1.12 Output Drive
VOUT Voltage (V1–VSS) < VOV, IOL = 100 µA, TA= 25°C
1.13 250 400 mV
TA= –40°C to 110°C
OUT Short
1.14 IOUT(Short) OUT = 0 V, (V1–VSS) > VOV 1.5 3.0 mA
Circuit Current
Output Rise
1.15 tRCL = 1 nF, VOH(OUT) = 0 V to 5 V(2) 5 µs
Time
Output
1.16 ZO2 5 kΩ
Impedance
Fixed Delay Timer
Fixed Delay, bq2946x2 3.2 4 4.8
Fault Detection
1.17 tDELAY s
Delay Time Fixed Delay, bq2946x4 5.2 6.5 7.8
Fault Detection
1.18 tDELAY_CTM Delay Time in Fixed delay (Internal settings) 15 ms
Test Mode
(1) Product Preview only
(2) Specified by design. Not 100% tested in production.
Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): bq294602 bq294604
0.7
0.8
0.9
1
1.1
1.2
1.3
-40 0 25 60 110
Temperature Deg C
Current (µA)
CC
I
4.310
4.320
4.330
4.340
4.350
4.360
4.370
–40 0 25 60 110
Overoltage Threshold (V)
Temperature Deg C
Min
Max
Mean
315
316
317
318
319
320
321
322
323
324
325
-40 0 25 60 110
Vhys (mV)
Temperature Deg C
bq294602, bq294604
SLUSAS0B –DECEMBER 2011–REVISED MARCH 2012
www.ti.com
TYPICAL CHARACTERISTICS
Figure 2. ICC Current Consumption Versus Temperature
Figure 3. bq294602 Overvoltage Threshold (OVT) vs. Temp
Figure 4. Hysteresis VHYS Versus Temperature
6Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): bq294602 bq294604
–4.1
–4.05
–4
–3.95
–3.9
–3.85
–40 0 25 60 110
I(mA)
Temperature Deg C
OUT
bq294602, bq294604
www.ti.com
SLUSAS0B –DECEMBER 2011–REVISED MARCH 2012
Figure 5. Output Current IOUT Versus Temperature
Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): bq294602 bq294604
VCELL
OUT
VDD
VSS
bq2946xy
Pack +
Pack –
NC
V1
VSS
RVD
CVD
RIN
CIN
VCELL
OUT
VDD
VSS
bq2946xy
Pack +
Pack –
NC
V1
VSS
100
0.1 µF
1K
0.1 µF
bq294602, bq294604
SLUSAS0B –DECEMBER 2011–REVISED MARCH 2012
www.ti.com
APPLICATION INFORMATION
Figure 6. Application Configuration
NOTE
Connect VSS (Pins 3 and 4) externally to the CELL– terminal.
Changes to the ranges stated in Table 1 will impact the accuracy of the cell measurements. Figure 6 shows each
external component.
Table 1. Parameters
PARAMETER External MIN NOM MAX UNIT
Component
Voltage monitor filter RIN 900 1000 1100 Ω
resistance
Voltage monitor filter CIN 0.01 0.1 µF
capacitance
Supply voltage filter RVD 100 1K Ω
resistance
Supply voltage filter CVD 0.1 µF
capacitance
APPLICATION SCHEMATIC
Figure 7. 1-Cell Configuration with Fixed Delay
NOTE
Connect VSS (Pins 3 and 4) externally to the CELL– terminal.
8Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): bq294602 bq294604
OUT
VDD
VSS
1
3
2
6
4
5
3.6 V
IIN ICC
bq2946xy
NC
VSS
V1
PWRPAD
bq294602, bq294604
www.ti.com
SLUSAS0B –DECEMBER 2011–REVISED MARCH 2012
CUSTOMER TEST MODE
Customer Test Mode (CTM) helps to reduce test time for checking the overvoltage delay timer parameter once
the circuit is implemented in the battery pack. To enter CTM, VDD should be set to at least 10 V higher than V1
(see Figure 8). The delay timer is greater than 10 ms, but considerably shorter than the timer delay in normal
operation. To exit Customer Test Mode, remove the VDD to V1 voltage differential of 10 V so that the decrease
in this value automatically causes an exit.
CAUTION
Avoid exceeding any Absolute Maximum Voltages on any pins when placing the part
into Customer Test Mode. Also avoid exceeding Absolute Maximum Voltage for the
cell voltage (V1–VSS). Stressing the pins beyond the rated limits may cause
permanent damage to the device.
Figure 8 shows the timing for the Customer Test Mode.
Figure 8. Timing for Customer Test Mode
Figure 9 shows the measurement for current consumption for the product for both VDD and Vx.
Figure 9. Configuration for IC Current Consumption Test
Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): bq294602 bq294604
bq294602, bq294604
SLUSAS0B –DECEMBER 2011–REVISED MARCH 2012
www.ti.com
REVISION HISTORY
Changes from Original (December 2011) to Revision A Page
• Added the bq294604 device into production. ....................................................................................................................... 2
Changes from Original (February 2012) to Revision B Page
• Added a second ICC Test Condition ...................................................................................................................................... 5
10 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): bq294602 bq294604
PACKAGE OPTION ADDENDUM
www.ti.com 24-Jan-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
BQ294604DRVR ACTIVE SON DRV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 4604
BQ294604DRVT ACTIVE SON DRV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 4604
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
BQ294604DRVR SON DRV 6 3000 330.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2
BQ294604DRVT SON DRV 6 250 180.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Feb-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
BQ294604DRVR SON DRV 6 3000 367.0 367.0 35.0
BQ294604DRVT SON DRV 6 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Feb-2013
Pack Materials-Page 2
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