bq294602, bq294604 www.ti.com SLUSAS0B - DECEMBER 2011 - REVISED MARCH 2012 Single-Cell Protector for Li-Ion Batteries Check for Samples: bq294602, bq294604 FEATURES * * * * * * 1 * Single-Cell Monitor for Secondary Protection Fixed Programmable Delay Timer Fixed OVP Threshold - bq294602 = 4.35 V with 4-s Delay Timer - bq294604 = 4.35 V with 6.5-s Delay Timer - bq294622 = 4.45 V with 4-s Delay Timer - bq294624 = 4.45 V with 6.5-s Delay Timer - bq294682 = 4.225 V with 4-s Delay Timer - bq294684 = 4.225 V with 6.5-s Delay Timer High-Accuracy Overvoltage Protection: 10 mV Low Power Consumption ICC 1 A (VCELL(ALL) < VPROTECT) Low leakage current per cell input < 100 nA Small package footprint - 6-pin SON APPLICATIONS * 2nd-Level Protection in Li-Ion Battery Packs in: - Tablets - Slates - Portable Equipment and Instrumentation DESCRIPTION The bq2946xy family of products is a secondary level voltage monitor and protector for Li-Ion battery pack systems. The cell is monitored for over voltage condition and triggers an internal counter once the OVP threshold is exceeded and after a fixed set delay the out is transitioned to a high level. The output is reset (goes low) if the cell voltage drops below the set threshold minus the hysteresis. DRV Package (Top View) NC 1 V1 2 VSS 3 6 OUT 5 VDD 4 VSS PWR PAD 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2011-2012, Texas Instruments Incorporated bq294602, bq294604 SLUSAS0B - DECEMBER 2011 - REVISED MARCH 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION (1) TA OVP (V) DELAY TIME (S) TAPE AND REEL (LARGE) TAPE AND REEL (SMALL) bq294602 4.35 4.0 bq294602DRVR bq294602DRVT bq294604 4.35 6.5 bq294604DRVR bq294604DRVT 4.45 4.0 bq294622DRVR bq294622DRVT 4.45 6.5 bq294624DRVR bq294624DRVT bq294682 (2) 4.225 4.0 bq294682DRVR bq294682DRVT (2) 4.225 6.5 bq294684DRVR bq294684DRVT PART NUMBER -40C to 110C bq294622 (1) (2) PACKAGE DESIGNATOR (2) bq294624 (2) bq294684 PACKAGE SON-6 DRV For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder on ti.com (www.ti.com). Product Preview only THERMAL INFORMATION bq2946xy THERMAL METRIC (1) SON UNITS 6 PINS JA Junction-to-ambient thermal resistance JC(top) Junction-to-case(top) thermal resistance 90.4 JB Junction-to-board thermal resistance 110.7 JT Junction-to-top characterization parameter 96.7 JB Junction-to-board characterization parameter 90 JC(bottom) Junction-to-case(bottom) thermal resistance n/a (1) 2 186.4 C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright (c) 2011-2012, Texas Instruments Incorporated Product Folder Link(s): bq294602 bq294604 bq294602, bq294604 www.ti.com SLUSAS0B - DECEMBER 2011 - REVISED MARCH 2012 PIN FUNCTIONS bq2946xy Pin Name Type I/O 1 NC -- No Connection Description 2 V1 IA Sense input for positive voltage of the cell 3 VSS P Electrically connected to IC ground and negative terminal of the cell 4 VSS P Electrically connected to IC ground and negative terminal of the cell 5 VDD P Power supply 6 OUT OA Output drive for external N-Channel FET Thermal Pad PWRPAD -- VSS pin to be connected to the PWRPAD on the printed circuit board for proper operation PIN DETAILS Description The method of overvoltage detection is comparing the cell voltage to an overvoltage protection threshold voltage VOV. Once the cell voltage exceeds the programmed fixed value VOV, the delay timer circuit is activated. This delay (tDELAY) is fixed for 4 s for the bq294602 device. When these conditions are satisfied, the OUT terminal is transitioned to a high level. This output (OUT) is released to a low condition if the cell input (V1) is below the OVP threshold minus the VHYS. Cell Voltage (V) V1-VSS) VOV VOV - VHYS t DELAY OUT (V) Figure 1. Timing for Overvoltage Sensing Sense Positive Input for V1 This is an input to sense single battery cell voltage. A series resistor and a capacitor across the cell is required for noise filtering and stable voltage monitoring. Output Drive, OUT The gate of an external N-Channel MOSFET is connected to this terminal. This output transitions to a high level when an overvoltage condition is detected and after the programmed delay timer. The out will reset to a low level if the cell voltage falls below the VOV threshold before the fixed delay timer expires. Supply Input, VDD This terminal is the unregulated input power source for the IC. A series resistor is connected to limit the current, and a capacitor is connected to ground for noise filtering. Thermal Pad, PWRPAD For correct operation, the power pad (PWRPAD) is connected to the VSS terminal on the printed circuit board. Copyright (c) 2011-2012, Texas Instruments Incorporated Product Folder Link(s): bq294602 bq294604 Submit Documentation Feedback 3 bq294602, bq294604 SLUSAS0B - DECEMBER 2011 - REVISED MARCH 2012 www.ti.com FUNCTIONAL BLOCK DIAGRAM PACK + R VD CVD VDD CIN VSS Enable Monitoring REG V1 RIN INT_EN VOV Delay Timer OSC OUT PWRPAD PACK - ABSOLUTE MAXIMUM RATINGS Over operating free-air temperature range (unless otherwise noted) (1) PARAMETER CONDITION VALUE/UNIT VDD-VSS -0.3 to 30 V V1-VSS -0.3 to 8 V Supply voltage range Input voltage range Output voltage range OUT-VSS -0.3 to 30 V Continuous total power dissipation, PTOT See package dissipation rating. Functional temperature -65 to 110C Storage temperature range, TSTG -65 to 150C Lead temperature (soldering, 10 s), TSOLDER (1) 300C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Over operating free-air temperature range (unless otherwise noted) PARAMETER Supply voltage, VDD (1) Input voltage range V1-VSS Operating ambient temperature range, TA (1) 4 MIN NOM 3 MAX UNIT 8 V 0 5 V -40 110 C See APPLICATION SCHEMATIC. Submit Documentation Feedback Copyright (c) 2011-2012, Texas Instruments Incorporated Product Folder Link(s): bq294602 bq294604 bq294602, bq294604 www.ti.com SLUSAS0B - DECEMBER 2011 - REVISED MARCH 2012 DC CHARACTERISTICS Typical values stated where TA = 25C and VDD = 4 V, MIN/MAX values stated where TA = -40C to 110C and VDD = 4 V (unless otherwise noted). Test # Symbol Parameter Condition Min Typ Max Unit Voltage Protection Threshold VCx 1.0 bq294602, fixed delay 4 s, V1 > VOV 4.35 V 1.1 bq294604, fixed delay 6.5 s, V1 > VOV 4.35 V bq294622, fixed delay 4 s, V1 > VOV (1) 4.45 V 1.2 VOV 1.3 V(PROTECT) - Overvoltage Detection bq294624, fixed delay 6.5 s, V1 > VOV (1) 1.4 bq294682, fixed delay 4 s, V1 > VOV 1.5 bq294684, fixed delay 6.5 s, V1 > VOV 1.6 VHYS Overvoltage Detection Hysteresis 1.7 VOA OV Detection Accuracy TA = 25C 1.8 VOA -DRIFT OV Detection Accuracy due to Temperature TA = -40C TA = 0C TA = 60C TA = 110C (1) (1) 250 4.45 V 4.225 V 4.225 V 300 400 V -10 10 mV -40 -20 -24 -54 44 20 24 54 mV mV mV mV Supp ly and Leakage Current 1.9 ICC Supply Current 1.10 IIN Input Current at V1 Pins (V1-VSS) = 4.0 V (See Figure 9 for reference) 1 (V1-VSS) = 2.8 V with TA = -40C to 60C 2 1.25 Measured at V1 = 4.0 V (V1-VSS) = 4.0 V TA = 0C to 60C (See Figure 9 for reference.) -0.1 (V1-VSS) > VOV VDD = V1, IOH = 100 A, TA = -40C to 110C 3.0 0.1 A A Output Drive OUT 1.11 1.12 VOUT Output Drive Voltage VDD - 0.3 V (V1-VSS) < VOV, IOL = 100 A, TA = 25C TA = -40C to 110C 250 400 mV OUT Short Circuit Current OUT = 0 V, (V1-VSS) > VOV 1.5 3.0 mA CL = 1 nF, VOH(OUT) = 0 V to 5 V (2) 1.13 1.14 IOUT(Short) 1.15 tR Output Rise Time 1.16 ZO Output Impedance 5 s 2 5 k Fixed Delay Timer 1.17 tDELAY Fault Detection Delay Time 1.18 tDELAY_CTM Fault Detection Delay Time in Test Mode (1) (2) Fixed Delay, bq2946x2 3.2 4 4.8 Fixed Delay, bq2946x4 5.2 6.5 7.8 Fixed delay (Internal settings) 15 s ms Product Preview only Specified by design. Not 100% tested in production. Copyright (c) 2011-2012, Texas Instruments Incorporated Product Folder Link(s): bq294602 bq294604 Submit Documentation Feedback 5 bq294602, bq294604 SLUSAS0B - DECEMBER 2011 - REVISED MARCH 2012 www.ti.com TYPICAL CHARACTERISTICS 1.3 ICC Current (A) 1.2 1.1 1 0.9 0.8 0.7 -40 0 25 Temperature Deg C 60 110 Figure 2. ICC Current Consumption Versus Temperature Overoltage Threshold (V) 4.370 4.360 4.350 Min 4.340 Max Mean 4.330 4.320 4.310 -40 0 25 60 110 Temperature Deg C Figure 3. bq294602 Overvoltage Threshold (OVT) vs. Temp 325 324 323 Vhys (mV) 322 321 320 319 318 317 316 315 -40 0 25 60 110 Temperature Deg C Figure 4. Hysteresis VHYS Versus Temperature 6 Submit Documentation Feedback Copyright (c) 2011-2012, Texas Instruments Incorporated Product Folder Link(s): bq294602 bq294604 bq294602, bq294604 www.ti.com SLUSAS0B - DECEMBER 2011 - REVISED MARCH 2012 -3.85 -3.9 I OUT (mA) -3.95 -4 -4.05 -4.1 -40 0 25 60 110 Temperature Deg C Figure 5. Output Current IOUT Versus Temperature Copyright (c) 2011-2012, Texas Instruments Incorporated Product Folder Link(s): bq294602 bq294604 Submit Documentation Feedback 7 bq294602, bq294604 SLUSAS0B - DECEMBER 2011 - REVISED MARCH 2012 www.ti.com APPLICATION INFORMATION Pack + RVD bq2946xy NC OUT V1 VDD VSS VSS RIN VCELL CVD CIN Pack - Figure 6. Application Configuration NOTE Connect VSS (Pins 3 and 4) externally to the CELL- terminal. Changes to the ranges stated in Table 1 will impact the accuracy of the cell measurements. Figure 6 shows each external component. Table 1. Parameters PARAMETER External Component MIN NOM MAX UNIT Voltage monitor filter resistance RIN 900 1000 1100 Voltage monitor filter capacitance CIN 0.01 0.1 Supply voltage filter resistance RVD 100 Supply voltage filter capacitance CVD F 1K 0.1 F APPLICATION SCHEMATIC Pack + 100 bq2946xy NC OUT V1 VDD VSS VSS 1K VCELL 0.1 F 0.1 F Pack - Figure 7. 1-Cell Configuration with Fixed Delay NOTE Connect VSS (Pins 3 and 4) externally to the CELL- terminal. 8 Submit Documentation Feedback Copyright (c) 2011-2012, Texas Instruments Incorporated Product Folder Link(s): bq294602 bq294604 bq294602, bq294604 www.ti.com SLUSAS0B - DECEMBER 2011 - REVISED MARCH 2012 CUSTOMER TEST MODE Customer Test Mode (CTM) helps to reduce test time for checking the overvoltage delay timer parameter once the circuit is implemented in the battery pack. To enter CTM, VDD should be set to at least 10 V higher than V1 (see Figure 8). The delay timer is greater than 10 ms, but considerably shorter than the timer delay in normal operation. To exit Customer Test Mode, remove the VDD to V1 voltage differential of 10 V so that the decrease in this value automatically causes an exit. CAUTION Avoid exceeding any Absolute Maximum Voltages on any pins when placing the part into Customer Test Mode. Also avoid exceeding Absolute Maximum Voltage for the cell voltage (V1-VSS). Stressing the pins beyond the rated limits may cause permanent damage to the device. Figure 8 shows the timing for the Customer Test Mode. VDD - Test Pin (V1) = 10 V VDD Test Pin (V1) t DELAY > 10 ms OUT (V) Figure 8. Timing for Customer Test Mode Figure 9 shows the measurement for current consumption for the product for both VDD and Vx. bq2946xy IIN 1 NC OUT 6 2 V1 VDD 5 3 VSS ICC VSS 4 PWRPAD 3.6 V Figure 9. Configuration for IC Current Consumption Test Copyright (c) 2011-2012, Texas Instruments Incorporated Product Folder Link(s): bq294602 bq294604 Submit Documentation Feedback 9 bq294602, bq294604 SLUSAS0B - DECEMBER 2011 - REVISED MARCH 2012 www.ti.com REVISION HISTORY Changes from Original (December 2011) to Revision A * Page Added the bq294604 device into production. ....................................................................................................................... 2 Changes from Original (February 2012) to Revision B * 10 Page Added a second ICC Test Condition ...................................................................................................................................... 5 Submit Documentation Feedback Copyright (c) 2011-2012, Texas Instruments Incorporated Product Folder Link(s): bq294602 bq294604 PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Top-Side Markings (3) (4) BQ294604DRVR ACTIVE SON DRV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 4604 BQ294604DRVT ACTIVE SON DRV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 4604 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. 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Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 25-Feb-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant BQ294604DRVR SON DRV 6 3000 330.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2 BQ294604DRVT SON DRV 6 250 180.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 25-Feb-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ294604DRVR SON DRV 6 3000 367.0 367.0 35.0 BQ294604DRVT SON DRV 6 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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