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DS-XBA170-R03 1
XBA170
Dual Single-Pole, Normally Open
OptoMOS® Relay
RoHS
2002/95/EC e3
Pb
Part # Description
XBA170 8-Pin DIP (50/Tube)
XBA170P 8-Pin Flatpack (50/Tube)
XBA170PTR 8-Pin Flatpack (1000/Reel)
XBA170S 8-Pin Surface Mount (50/Tube)
XBA170STR 8-Pin Surface Mount (1000/Reel)
Parameter Rating Units
Load Voltage 350 V
Load Current 100 mA
Max On-Resistance 50 Ω
Input Control Current 5 mA
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
XBA170 comprises two independent 350V, 100mA,
50Ω solid state relays: one single-pole, normally
open (1-Form-A) relay and one single-pole, normally
closed (1-Form-B) relay.
Featuring low on-resistance combined with enhanced
peak load current handling capabilities, XBA170
is designed to provide an ideal solution where a
complementary Form-A/Form-B relay pair is required.
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Utility Meters (gas, oil, electric and water)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Compliant
• 3750Vrms Input/Output Isolation
• Small 8-Pin Package
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• VDE Compatible
• FCC Compatible
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
• Surface Mount & Tape & Reel Version Available
Switching Characteristics
of Normally Closed Devices
Form-B
I
F
10%
90%
I
LOAD
t
on
t
off
Switching Characteristics
of Normally Open Devices
Form-A
I
F
I
LOAD
10%
90%
t
on
t
off
1
2
3
4
8
7
6
5
+ Control - Normally Closed
– Control - Normally Closed
+ Control - Normally Open
– Control - Normally Open
Normally Closed Pole
Normally Open Pole
AC/DC Configuration
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2R03
XBA170
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
AC/DC Configuration, Continuous - IL- - 100 mA
Peak t=10ms ILPK - - 350
On-Resistance, AC/DC Configuration IL=100mA RON -3350
Ω
Off-State Leakage Current VL=350VPILEAK --1μA
Switching Speeds
Turn-On IF=5mA, VL=10V ton --5
ms
Turn-Off toff --5
Output Capacitance VL=50V, f=1MHz COUT -25-pF
Input Characteristics
Input Control Current IL=100mA IF--2mA
Input Dropout Current - IF0.4 0.7 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10μA
Common Characteristics
Capacitance, Input to Output - CI/O -3-pF
*NOTE: If both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value.
Parameter Ratings Units
Blocking Voltage 350 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
XBA170
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R03
FORM-A / FORM-B COMMON PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (ºC)
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
Typical Leakage vs. Temperature
Measured across Pins 5&6 or 7&8
Temperature (ºC)
Leakage (μA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Energy Rating Curve
Time
Load Current (A)
10μs
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100μs 100ms 1s
10ms 10s 100s
FORM-A RELAY PERFORMANCE DATA*
FormA
Typical Turn-On Time
(N=50, IF=5mA, IL=100mADC, TA=25ºC)
0.67 0.83 1.06 1.140.75 0.990.91
Turn-On (ms)
Device Count (N)
25
20
15
10
5
0
FormA
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mADC, TA=25ºC)
0.11 0.17 0.22 0.280.250.190.14
Turn-Off (ms)
Device Count (N)
25
20
15
10
5
0
FormA
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=100mADC, TA=25ºC)
25
20
15
10
5
0
29.09 30.63 32.9329.86 32.1631.40 33.70
On-Resistance (Ω)
Device Count (N)
FormA
Typical IF for Switch Operation
(N=50, IL=100mADC, TA=25ºC)
0.44 0.56 0.690.50 0.62 0.75 0.81
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
FormA
Typical IF for Switch Dropout
(N=50, IL=100mADC, TA=25ºC)
25
20
15
10
5
0
0.50 0.62 0.750.44 0.56 0.69 0.81
LED Current (mA)
Device Count (N)
FormA
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
25
20
15
10
5
0
424.0 434.5 444.9 455.4429.3 439.7 450.1
Blocking Voltage (VP)
Device Count (N)
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XBA170
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
FORM-A RELAY PERFORMANCE DATA (CONT.)*
FormA
Typical Turn-On
vs. LED Forward Current
(IL=100mADC)
LED Forward Current (mA)
Turn-On (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
FormA
Typical Turn-Off
vs. LED Forward Current
(IL=100mADC)
LED Forward Current (mA)
Turn-Off (ms)
05 101520253035404550
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
Form A
Typical Load Current
vs. Temperature
Temperature (ºC)
Load Current (mA)
160
140
120
100
80
60
40
20
0
-40 -20 0 20 40 60 80 120100
IF=20mA
IF=10mA
IF=5mA
FormA
Typical Turn-On vs. Temperature
(IL=100mADC)
Temperature (ºC)
I
F
=5mA
Turn-On (ms)
-40
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-20 0 20 40 60 80 100 120
IF=10mA
IF=20mA
FormA
Typical Turn-Off vs. Temperature
(IF=5mA, IL=100mADC)
Temperature (ºC)
Turn-Off (ms)
-40
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-20 0 20 40 60 80 100 120
FormA
Typical On-Resistance
vs. Temperature
(IF=5mA, IL=100mADC)
Temperature (ºC)
On-Resistance (Ω)
-40
70
60
50
40
30
20
10
0
-20 0 20 40 60 80 100 120
FormA
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
Temperature (ºC)
LED Current (mA)
-40
6
5
4
3
2
1
0
-20 0 20 40 60 80 100 120
FormA
Typical IF for Switch Dropout
vs. Temperature
(IL=100mADC)
Temperature (ºC)
LED Current (mA)
-40
6
5
4
3
2
1
0
-20 0 20 40 60 80 100 120
FormA
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (VP)
-40
455
450
445
440
435
430
425
420 -20 0 20 40 60 80 100
FormA
Typical Load Current
vs. Load Voltage
(IF=5mA, TA=25ºC)
Load Voltage (V)
Load Current (mA)
120
100
80
60
40
20
0
-20
-40
-60
-80
-100
-120 -3-4 -2 -1 0 1 2 3 4
XBA170
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R03
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
FORM-B RELAY PERFORMANCE DATA*
FormB
Typical Turn-On Time
(N=50, IF=5mA, IL=100mADC, TA=25ºC)
0.11 0.17 0.220.14 0.19 0.25 0.28
Turn-On (ms)
Device Count (N)
25
20
15
10
5
0
FormB
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mADC, TA=25ºC)
0.75 0.91 1.06 1.140.990.830.67
Turn-Off (ms)
Device Count (N)
25
20
15
10
5
0
FormB
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=100mADC, TA=25ºC)
25
20
15
10
5
0
30.59 32.13 33.66 35.2031.36 32.90 34.43
On-Resistance (Ω)
Device Count (N)
FormB
Typical IF for Switch Operation
(N=50, IL=100mADC, TA=25ºC)
25
20
15
10
5
0
0.44 0.56 0.69 0.810.50 0.62 0.75
LED Current (mA)
Device Count (N)
FormB
Typical IF for Switch Dropout
(N=50, IL=100mADC, TA=25ºC)
25
20
15
10
5
0
0.50 0.62 0.750.44 0.56 0.69 0.81
LED Current (mA)
Device Count (N)
FormB
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
25
20
15
10
5
0
424.0 434.5 444.9 455.4429.3 439.7 450.1
Blocking Voltage (VP)
Device Count (N)
FormB
Typical Turn-On
vs. LED Forward Current
(IL=100mADC)
LED Forward Current (mA)
Turn-On (ms)
05 1015202530354045
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
FormB
Typical Turn-Off
vs. LED Forward Current
(IL=100mADC)
LED Forward Current (mA)
Turn-Off (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
Form B
Typical Load Current vs. Temperature
(IF=5mA)
Temperature (ºC)
Load Current (mA)
160
140
120
100
80
60
40
20
0
-40 -20 0 20 40 60 80 120100
FormB
Typical Turn-On vs. Temperature
(IF=5mA, IL=100mADC)
Temperature (ºC)
Turn-On (ms)
-40
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-20 0 20 40 60 80 100 120
FormB
Typical Turn-Off vs. Temperature
(IL=100mADC)
Temperature (ºC)
I
F
=5mA
IF=10mA
IF=20mA
Turn-Off (ms)
-40
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-20 0 20 40 60 80 100 120
FormB
Typical On-Resistance
vs. Temperature
(IF=5mA, IL=100mADC)
Temperature (ºC)
On-Resistance (Ω)
-40
70
60
50
40
30
20
10
0
-20 0 20 40 60 80 100 120
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6R03
XBA170
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
FORM-B RELAY PERFORMANCE DATA (CONT.)*
FormB
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
Temperature (ºC)
LED Current (mA)
-40
6
5
4
3
2
1
0
-20 0 20 40 60 80 100 120
FormB
Typical IF for Switch Dropout
vs. Temperature
(IL=100mADC)
Temperature (ºC)
LED Current (mA)
-40
6
5
4
3
2
1
0
-20 0 20 40 60 80 100 120
FormB
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (VP)
-40
455
450
450
440
435
430
425
420 -20 0 20 40 60 80 100
FormB
Typical Load Current
vs. Load Voltage
(IF=5mA, TA=25ºC)
Load Voltage (V)
Load Current (mA)
120
100
80
60
40
20
0
-20
-40
-60
-80
-100
-120 -3-4 -2 -1 0 1 2 3 4
XBA170
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R03
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all
of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry
standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to
the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled
according to the limitations and information in that standard as well as to any limitations set forth in the information or
standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
XBA170 / XBA170S / XBA170P MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
XBA170 / XBA170S 250ºC for 30 seconds
XBA170P 260ºC for 30 seconds
Board Wash
Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is
acceptable. Since Clare employs the use of silicone coating as an optical waveguide in many of its optically isolated
products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes.
Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic
energy should not be used.
RoHS
2002/95/EC e3
Pb
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8R03
XBA170
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.889 ± 0.102
(0.035 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
0.254 TYP
(0.01)
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.120
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Dimensions
mm
(inches)
PCB Land Pattern
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.286 MAX.
(0.090 MAX.)
0.203 ± 0.013
(0.008 ± 0.0005)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 ± 0.025
(0.085 ± 0.001)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
0.864 ± 0.120
(0.034 ± 0.004)
XBA170
XBA170S
XBA170P
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications
intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare,
Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-XBA170-R03
©Copyright 2010, Clare, Inc.
OptoMOS® is a registered trademark of Clare, Inc.
All rights reserved. Printed in USA.
8/20/2010
For additional information please visit our website at: www.clare.com
9
XBA170
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1=4.20
(0.165)
0
K =4.90
(0.193)
P=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
User Direction of Feed
P = 12.00
(0.472)
W = 16.00
(0.63)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
K1= 2.00
(0.079)
K0= 2.70
(0.106)
XBA170S Tape & Reel
XBA170P Tape & Reel
