MIXERS - DOUBLE-BALANCED - CHIP
4
4 - 54
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC553
GaAs MMIC FUNDAMENTAL
MIXER, 7 - 14 GHz
v02.1007
General Description
Features
Functional Diagram
High LO/RF Isolation: 48 dB
Passive Double Balanced Topology
Low Conversion Loss: 7 dB
Wide IF Bandwidth: DC - 5 GHz
Robust 1,000V ESD, Class 1C
Small Size: 0.83 x 1.12 x 0.1 mm
Typical Applications
The HMC553 is ideal for:
• Microwave Radio
• Military & Space
• Communications, Radar & EW
The HMC553 is a passive double balanced mixer
that can be used as an upconverter or downconverter
between 7 and 14 GHz. The miniature monolithic
mixer is fabricated in a GaAs MESFET process, and
requires no external components or matching circu-
itry. The HMC553 operates with LO drive levels as
low as +9 dBm and provides excellent LO to RF and
LO to IF isolation due to optimized balun structures.
Measurements were made with the chip mounted
into in a 50 ohm test  xture and includes the para-
sitic effects of wire bond assembly. Connections were
made with a 1 mil wire bond with minimal length (<12
mil).
Electrical Speci cations, TA = +25° C, IF= 100 MHz, LO= +13 dBm*
Parameter Min. Typ. Max. Min. Typ. Max. Units
Frequency Range, RF & LO 7 - 11 11 - 14 GHz
Frequency Range, IF DC - 5 DC - 5 GHz
Conversion Loss 7 9.5 8 10 dB
Noise Figure (SSB) 7 9.5 8 10 dB
LO to RF Isolation 40 48 35 45 dB
LO to IF Isolation 28 33 30 35 dB
RF to IF Isolation 15 22 25 28 dB
IP3 (Input) 18 22 dBm
IP2 (Input) 48 48 dBm
1 dB Gain Compression (Input) 10 11.5 dBm
*Unless otherwise noted, all measurements performed as downconverter, IF= 100 MHz.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
MIXERS - DOUBLE-BALANCED - CHIP
4
4 - 55
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Conversion Gain vs.
Temperature @ LO = +13 dBm
Conversion Gain vs. LO Drive
Isolation @ LO = +13 dBm
IF Bandwidth @ LO = +13 dBm
Return Loss @ LO = +13 dBm
Upconverter Performance
Conversion Gain vs. LO Drive
-20
-15
-10
-5
0
6 7 8 9 10 11 12 13 14 15
+25C
+85C
-55C
CONVERSION GAIN (dB)
FREQUENCY (GHz)
-25
-20
-15
-10
-5
0
6 7 8 9 10 11 12 13 14 15
RF
LO
RETURN LOSS (dB)
FREQUENCY (GHz)
-20
-15
-10
-5
0
6 7 8 9 10 11 12 13 14 15
+9 dBm
+11 dBm
+13 dBm
+15 dBm
CONVERSION GAIN (dB)
FREQUENCY (GHz)
-20
-15
-10
-5
0
0123456
IF Return Loss
Conversion Gain
RESPONSE (dB)
FREQUENCY (GHz)
-20
-15
-10
-5
0
6 7 8 9 10 11 12 13 14 15
+9 dBm
+11 dBm
+13 dBm
+15 dBm
CONVERSION GAIN (dB)
FREQUENCY (GHz)
-60
-50
-40
-30
-20
-10
0
6 7 8 9 10 11 12 13 14 15
RF/IF
LO/RF
LO/IF
ISOLATION (dB)
FREQUENCY (GHz)
HMC553
v02.1007 GaAs MMIC FUNDAMENTAL
MIXER, 7 - 14 GHz
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
MIXERS - DOUBLE-BALANCED - CHIP
4
4 - 56
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Input IP2 vs.
Temperature @ LO = +13 dBm *
Input IP3 vs. LO Drive *
Input IP3 vs.
Temperature @ LO = +13 dBm *
Input IP2 vs. LO Drive *
* Two-tone input power = -5 dBm each tone, 1 MHz spacing.
Input P1dB vs.
Temperature @ LO = +13 dBm
5
10
15
20
25
30
7 8 9 1011121314
+9 dBm
+11 dBm
+13 dBm
+15 dBm
IP3 (dBm)
FREQUENCY (GHz)
20
30
40
50
60
7 8 9 1011121314
+25C
+85C
-40C
IP2 (dBm)
FREQUENCY (GHz)
20
30
40
50
60
7 8 9 1011121314
+9 dBm
+11 dBm
+13 dBm
+15 dBm
IP2 (dBm)
FREQUENCY (GHz)
5
10
15
20
25
30
7 8 9 1011121314
+25C
+85C
-40C
IP3 (dBm)
FREQUENCY (GHz)
MxN Spurious Outputs
nLO
mRF01234
0xx7503858
1220415365
2 100 72 62 73 102
3103100967190
4 x x 10 5 101 10 4 111
RF = 10.1 GHz @ -10 dBm
LO = 10 GHz @ +13 dBm
All values in dBc below the IF output power level.
6
8
10
12
14
7 8 9 1011121314
+25C
+85C
-40C
P1dB (dBm)
FREQUENCY (GHz)
HMC553
v02.1007 GaAs MMIC FUNDAMENTAL
MIXER, 7 - 14 GHz
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
MIXERS - DOUBLE-BALANCED - CHIP
4
4 - 57
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Outline Drawing
Absolute Maximum Ratings
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS .004”.
3. TYPICAL BOND PAD IS .004” SQUARE.
4. BOND PAD SPACING CENTER TO CENTER IS .006”.
5. BACKSIDE METALLIZATION: GOLD.
6. BOND PAD METALLIZATION: GOLD.
7. BACKSIDE METAL IS GROUND.
8. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
9. THIS DIE IS DESIGNED FOR PICK-UP WITH VACUUM (EDGE)
COLLET TOOLS. TO PRECLUDE THE RISK OF PERMANENT
DAMAGE, NO CONTACT TO THE DIE SURFACE IS ALLOWED
WITHIN THIS RECTANGULAR AREA.
Die Packaging Information [1]
Standard Alternate
WP-7 (Waffle Pack) [2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RF / IF Input +25 dBm
LO Drive +25 dBm
Channel Temperature 150 °C
Continuous Pdiss (T = 85 °C)
(derate 4.09 mW/°C above 85 °C) 266 mW
Thermal Resistance
(channel to die bottom) 244 °C/W
Storage Temperature -65 to +150 °C
Operating Temperature -55 to +85 °C
ESD Sensitivity (HBM) Class 1C
HMC553
v02.1007 GaAs MMIC FUNDAMENTAL
MIXER, 7 - 14 GHz
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
MIXERS - DOUBLE-BALANCED - CHIP
4
4 - 58
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Pad Number Function Description Interface Schematic
1LO This pad is DC coupled
and matched to 50 Ohms..
2RF This pad is DC coupled
and matched to 50 Ohms..
3IF
This pad is DC coupled. For applications not requiring oper-
ation to DC, this port should be DC blocked externally using
a series capacitor whose value has been chosen to pass the
necessary IF frequency range. For operation to DC, this pin
must not source or sink more than 2 mA of current or part
non-function and possible part failure will result.
GND The backside of the die
must be connected to RF ground.
Pad Descriptions
Assembly Drawing
HMC553
v02.1007 GaAs MMIC FUNDAMENTAL
MIXER, 7 - 14 GHz
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
MIXERS - DOUBLE-BALANCED - CHIP
4
4 - 59
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin  lm
substrates are recommended for bringing RF to and from the chip (Figure 1). If
0.254mm (10 mil) thick alumina thin  lm substrates must be used, the die should
be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface
of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick
die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then
attached to the ground plane (Figure 2).
Microstrip substrates should be brought as close to the die as possible in order to
minimize ribbon bond length. Typical die-to-substrate spacing is 0.076mm (3 mils).
Gold ribbon of 0.075 mm (3 mil) width and minimal length <0.31 mm (<12 mils) is
recommended to minimize inductance on RF, LO & IF ports.
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective
containers, and then sealed in an ESD protective bag for shipment. Once the
sealed ESD protective bag has been opened, all die should be stored in a dry
nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean
the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied.
Use shielded signal and bias cables to minimize inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with
a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and
should not be touched with vacuum collet, tweezers, or  ngers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting
surface should be clean and  at.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature
of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip
to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for
attachment.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy  llet is observed around the
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage
temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use
the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on
the package or substrate. All bonds should be as short as possible <0.31 mm (12 mils).
0.102mm (0.004”) Thick GaAs MMIC
3 mil Ribbon Bond
RF Ground Plane
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 1.
0.102mm (0.004”) Thick GaAs MMIC
3 mil Ribbon Bond
RF Ground Plane
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 2.
0.150mm (0.005”) Thick
Moly Tab
HMC553
v02.1007 GaAs MMIC FUNDAMENTAL
MIXER, 7 - 14 GHz
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D