SFH 4811
SFH 4813
IR-Lumineszenzdiode (950 nm) im TO-46-Gehäuse
Infrared Emitter (950 nm) in TO-46 Package
Lead (Pb) Free Product - RoHS Compliant
SFH 4811 SFH 4813
2008-01-31 1
Wesentliche Merkmale
• Hergestellt im Schmelzepitaxieverfahren
• Kathode galvanisch mit dem Gehäuseboden
verbunden
• Hohe Zuverlässigkeit
• Gute spektrale Anpassung an
Si-Fotoempfänger
• Hermetisch dichtes Metallgehäuse
Anwendungen
• Lichtschranken für Gleich- und
Wechsellichtbetrieb
• IR-Gerätefernsteuerungen
• Sensorik
• Lichtgitter
Typ
Type
Bestellnummer
Ordering Code
Gehäuse
Package
SFH 4811 Q62702P5300 TO-46-Metallgehäuse, Glaslinse, hermetisch
dicht, Anschlüsse im 2.54-mm-Raster (1/10’’)
TO-46-metal-package, glass lens, hermetically
sealed, solder tabs lead spacing 2.54 mm (1/10’’)
SFH 4813 Q62702P5301
Features
• Fabricated in a liquid phase epitaxy process
• Cathode is electrically connected to the case
• High reliability
• Matches all Si-Photodetectors
• Hermetically sealed package
Applications
• Photointerrupters
• IR remote control
• Sensor technology
• Light curtains
2008-01-31 2
SFH 4811, SFH 4813
Grenzwerte (TC = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range
Top; Tstg – 40 … + 100 °C
Sperrspannung
Reverse voltage
VR5 V
Durchlaßstrom
Forward current
IF300 mA
Stoßstrom, tp = 10 µs, D = 0
Surge current
IFSM 3 A
Verlustleistung
Power dissipation
Ptot 470 mW
Wärmewiderstand
Thermal resistance
RthJA
RthJC
450
160
K/W
K/W
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA, tp = 20 ms
λpeak 950 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 100 mA, tp = 20 ms
∆λ 55 nm
Abstrahlwinkel
Half angle
SFH 4811
SFH 4813
ϕ
ϕ
± 5
± 35
Grad
deg.
Aktive Chipfläche
Active chip area
A0.09 mm2
Abmessungen der aktiven Chipfläche
Dimensions of the active chip area
L × B
L × W
0.3 × 0.3 mm²
SFH 4811, SFH 4813
2008-01-31 3
Abstand Chipoberfläche bis Linsenscheitel
Distance chip front to lens top
SFH 4811
SFH 4813
H
H
4.7
2.6
mm
mm
Schaltzeiten, Ie von 10% auf 90% und von 90% auf
10%, bei IF = 100 mA, RL = 50 Ω
Switching times, Ie from 10% to 90% and from 90%
to 10%, IF = 100 mA, RL = 50 Ω
tr, tf0.5 µs
Kapazität
Capacitance
VR = 0 V, f = 1 MHz
Co25 pF
Durchlaßspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µs
IF = 1.5 A, tp = 100 µs
VF
VF
VF
1.30 (≤ 1.5)
1.90 (≤ 2.5)
2.30 (≤ 3.0)
V
V
V
Sperrstrom
Reverse current
VR = 5 V
IR0.01 (≤ 1) µA
Gesamtstrahlungsfluß
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe8mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 100 mA
Temperature coefficient of Ie or Φe,
IF = 100 mA
TCI– 0.55 %/K
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA
TCV– 1.5 mV/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA
TCλ+ 0.3 nm/K
Kennwerte (TA = 25 °C) (cont’d)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
2008-01-31 4
SFH 4811, SFH 4813
Gruppierung der Strahlstärke Ie in Achsrichtung
gemessen bei einem Raumwinkel Ω = 0.01 sr
Grouping of Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
SFH 4811 SFH 4813
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie min.
Ie typ.
25
40
2.5
4.5
mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 µs
Ie typ.
250
30
mW/sr
SFH 4811, SFH 4813
2008-01-31 5
Relative Spectral Emission
Irel = f (λ)
Forward Current
IF = f (VF)
Single pulse, tp = 20 µs
OHRD1938
λ
rel
Ι
0880 920 960 1000
nm
1060
20
40
60
80
%
100
V
OHR01041
F
F
Ι
1
1
10
0
10
-1
10
10 -2
A
1.5 2 2.5 3 3.5 4 V 4.5
max.
typ.
Radiant Intensity Ie/Ie (100 mA) = f (IF)
Single pulse, tp = 20 µs
Permissible Pulse Handling
Capability IF = f (τ), TC = 25 °C,
RthJC = 160 K/W, duty cycle
D = parameter
Ι
OHR01037
F
-1
10
10
0
1
10
2
10
10
-2 -1
10
0
10 A 10
1
Ι
e
Ι
e
(100 mA)
t
OHR00860
p
-5
10
10 2
Ι
F
10 3
10 4
5
DC
0.2
0.5
0.1
0.005
0.01
0.02
0.05
tp
T
Ι
F
tp
T
D=
5
mA
-4
10 -3
10 -2
10 -1
10 0
10 1
10 2
10s
D=
Max. Permissible Forward Current
IF = f (TA, TC)
T
OHR00486
A
0
F
Ι
0 20 40 60 80 100˚C
50
100
150
200
250
300
mA
350
,
C
T
= 160 K/W
thJC
R
R
thJA
= 450 K/W
2008-01-31 6
SFH 4811, SFH 4813
Radiation Characteristics, SFH 4811 Irel = f (ϕ)
Radiation Characteristics, SFH 4813 Irel = f (ϕ)
OHR01178
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0
100˚
90˚
80˚
70˚
60˚
50˚
0˚10˚20˚30˚40˚
0
0.2
0.4
0.6
0.8
1.0
ϕ
OHR01186
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0
100˚
90˚
80˚
70˚
60˚
50˚
0˚10˚20˚30˚40˚
0
0.2
0.4
0.6
0.8
1.0
ϕ
SFH 4811, SFH 4813
2008-01-31 7
Maßzeichnung
Package Outlines
Maße in mm (inch) / Dimensions in mm (inch).
ø5.6 (0.220)
2.54 (0.100)
spacing
ø4.8 (0.189)
ø4.6 (0.181)
6.2 (0.244)
5.4 (0.213)
5.2 (0.205)
4.9 (0.193)
20 (0.787)
18 (0.709)
GEMY6049
Chip position (1.1 (0.043)) ø5.3 (0.209)
0.9 (0.035)
1.1 (0.043)
1.1 (0.043)
0.9 (0.035)
ø0.43 (0.017)
0.35 (0.014) max.
1
2
SFH 4811
2.54 (0.100)
spacing
3.8 (0.150)
3.5 (0.138)
GEMY6050
0.9 (0.035)
1.1 (0.043
)
1.1 (0.043)
0.9 (0.035)
Chip position (1.1 (0.043))
ø0.43 (0.017)
ø4.8 (0.189)
ø4.6 (0.181)
0.35 (0.014) max.
20 (0.787)
18 (0.709)
ø5.6 (0.220)
ø5.3 (0.209)
1
2
SFH 4813
2008-01-31 8
SFH 4811, SFH 4813
Lötbedingungen
Soldering Conditions
Wellenlöten (TTW) (nach CECC 00802)
TTW Soldering (acc. to CECC 00802)
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
OHLY0598
0
0
50 100 150 200 250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s 2 K/s
ca 200 K/s
CC... 130100
2 K/s Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
