RI-R6C-001A-03 - Texas Instruments

RADIO FREQUENCY IDENTIFICATION SYSTEMS

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SCBS856

HF Reader System Series 6000

S6700 Multi-Protocol Transceiver IC

The S6700 Multi Protocol T ransceiver IC enables a bro ad range of 13.56MHz

RFID interrogator designs for po rtable and stationar y readers. This low power

consumption device supports multiple RF communication protocols, minim izes

onboard power requirements and reduces parts count in a final reader product.

Part number RI-R6C-001A

Operating Frequency 13.56MHz

Supported RF Communication Protocols - Tag-it HF

- ISO 15693-2 (e.g. Tag-it HF-I)

- ISO 14443-2 (Type A)

- Transparent (directly switched according to input pin)

Operating Voltage 3.3V - 5V DC ± 10%

Current Consumption Transmit: < 200 mA

Stand-by: - Oscillator on < 15 mA

- Oscillator off < 50 µA

Transmitter power 200mW at 5V DC operating voltage

Transmitter modulation ASK, 10% to 100% selectable through external components

Antenna Impedance 50 Ohm at 13.56MHz

Receive channels ASK 423.75kHz, ASK 847kHz, FSK 423.75kHz/484.29kHz selectable

Communication Interface Serial interface, CMOS compatible

Operating Temperature -40°C to +85°C

Storage Temperature -55°C to +125°C

Package / Pincount SSOP 20

Packing / Delivery Tape-on-Reel, 2000 units per reel

Recommended application schematic

Pin description

µC

ANTENNA

C6C5

10 11

VDD_TX

TX_OUT

R_MOD

VSS_TX

XTAL1

XTAL2

VSS_DIG

XTAL_CLK

DOUT

VDD_DIG

DIN

M_ERR

SCLOCK

VDD_RX

VSS_RX

RX_IN

VCC

XTAL 13.56 MHz

VCC

C10

COAX

C 7

C1 47pF

C2 10pF

C3 10nF

C4 47pF

C5 10µF Tantalum

C6 100nF

C7 22pF

C8 100nF

C9 22pF

C10 100nF

L1 2.7µH (Q-60)

L2 2.7µH (Q-60)

L3 5.6µH (Q-60)

L4 3.3µH (Q-60)

R1 2.2kΩ

R2 18Ω

Pin Symbol Description

1 VDD_TX Transmitter power supply

2 TX_OUT Output transistor drain connection

3 R_MOD External resistor to set 10% modulation depth mode

4 VSS_TC Transmitter section ground

5 XTAL1 Pin 1 of Xtal resonator

6 XTAL2 Pin 2 of Xtal resonator, external clock input

7 VSS_DIG Digital section ground

8 XTAL_CLK Buffered output of Xtal oscillator

9 Not used Grounded for normal operation

10 Not used Grounded for normal operation

11 DOUT Data output for serial link

12 VDD_DIG Digital section power supply

13 DIN Data input for serial link

14 M_ERR Manchester Protocol error flag

15 SCLOCK Serial link clock

16 Not used Leave open for normal operation

17 VDD_RX Receiver section power supply

18 Not used Leave open for normal operation

19 VSS_RX Receiver section ground

20 RX_IN Receiver input

For more information, contact the sales office or distributor nearest you. This contact information can be found

on our web site at: http://www.ti-rfid.com

PACKAGE OPTION ADDENDUM

www.ti.com 13-Nov-2010

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

RI-R6C-001A-03 ACTIVE SSOP DB 20 2000 TBD Call TI Call TI Call Local Sales Office

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

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provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

4040065 /E 12/01

28 PINS SHOWN

Gage Plane

8,20

7,40

0,55

0,95

0,25

12,90

12,30

10,50

8,50

Seating Plane

9,907,90

10,50

9,90

0,38

5,60

5,00

0,22

2016

6,50

0,05 MIN

5,905,90

DIM

A MAX

A MIN

PINS **

2,00 MAX

6,90

7,50

0,65 M

0,15

0°–ā8°

0,10

0,09

0,25

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

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