SE95D,112 - NXP - Product.Network

1. General description

The SE95 is a temperature-to-digital converter using an on-chip band gap temperature

sensor and Sigma Delta analog-to-digital conversion technique. The device is also a

thermal detector providing an overtemperature detection output.

The SE95 contains a number of data registers accessed by a controller via the 2-wire

serial I2C-bus interface:

•Conﬁguration register (Conf) to store the device settings such as sampling rate,

device operation mode, OS operation mode, OS polarity, and OS fault queue

•Temperature register (Temp) to store the digital Temp reading

•Set-point registers (Tos and Thyst) to store programmable overtemperature shutdown

and hysteresis limits

•Identiﬁcation register (ID) to store manufacturer numbers

The device includes an open-drain output (pin OS) which becomes active when the

temperature exceeds the programmed limits. There are three selectable logic address

pins (pins A2 to A0) so that eight devices can be connected on the same bus without

address conﬂict.

The SE95 can be conﬁgured for different operation conditions. It can be set in normal

mode to periodically monitor the ambient temperature, or in shutdown mode to minimize

power consumption. The OS output operates in either of two selectable modes: OS

comparator mode and OS interrupt mode. Its active state can be selected as either HIGH

or LOW. The fault queue that deﬁnes the number of consecutive faults in order to activate

the OS output is programmable as well as the set-point limits.

The temperature register always stores a 13-bit two’s complement data giving a

temperature resolution of 0.03125 °C. This high temperature resolution is particularly

useful in applications of measuring precisely the thermal drift or runaway. For normal

operation and compatibility with the LM75A, only the 11 MSBs are read, with a resolution

of 0.125 °C to provide the accuracies speciﬁed. To be compatible with the LM75, read only

the 9 MSBs.

The device is powered-up in normal operation mode with the OS in comparator mode,

temperature threshold of 80 °C and hysteresis of 75 °C, so that it can be used as a

stand-alone thermostat with those pre-deﬁned temperature set points. The conversion

rate is programmable, with a default of 10 conversions/s.

SE95

Ultra high accuracy digital temperature sensor and thermal

watchdog

Rev. 07 — 2 September 2009 Product data sheet

Product data sheet Rev. 07 — 2 September 2009 2 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

2. Features

nPin-for-pin replacement for industry standard LM75/LM75A

nSpeciﬁcation of a single part over supply voltage from 2.8 V to 5.5 V

nSmall 8-pin package types: SO8 and TSSOP8 (MSOP8)

nI2C-bus interface to 400 kHz with up to 8 devices on the same bus

nSupply voltage from 2.8 V to 5.5 V

nTemperature range from −55 °C to +125 °C

n13-bit ADC that offers a temperature resolution of 0.03125 °C

nTemperature accuracy of ± 1 °C from −25 °C to +100 °C

nProgrammable temperature threshold and hysteresis set points

nSupply current of 7.0 µA in shutdown mode for power conservation

nStand-alone operation as thermostat at power-up

nESD protection exceeds 1000 V for Human Body Model (HBM) per JESD22-A114 and

150 V for Machine Model (MM) per JESD22-A115

nLatch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA

3. Applications

nSystem thermal management

nPersonal computers

nElectronics equipment

nIndustrial controllers

4. Ordering information

Table 1. Ordering information

Type

number Package

Temperature range Name Description Version

SE95D −55 °C to +125 °C SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

SE95DP −55 °C to +125 °C TSSOP8 plastic thin shrink small outline package; 8 leads;

body width 3 mm SOT505-1

SE95U −55 °C to +125 °C- wafer -

Product data sheet Rev. 07 — 2 September 2009 3 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

5. Block diagram

6. Pinning information

6.1 Pinning

6.2 Pin description

Fig 1. Block diagram of SE95

002aae892

A2 A1 A0 SCL SDA GND

56721 4

8VCC

SE95 ADC CONTROL AND OTP CONTROL

I2C-BUS INTERFACE LOGIC

OTP

BIAS

SIGMA DELTA

MODULATOR INTERRUPTION

LOGIC

DECIMATION

FILTER

BAND GAP

OSCILLATOR

POR

bit

stream

BANK

Conf

Temp

Tos

Thyst

Fig 2. Pin conﬁguration for SO8 Fig 3. Pin conﬁguration for TSSOP8

SE95D

SDA VCC

SCL A0

OS A1

GND A2

002aac537

7SE95DP

002aac536

SDA VCC

SCL A0

OS A1

GND A2

Table 2. Pin description

Symbol Pin Description

SDA 1 I2C-bus serial bidirectional data line digital I/O; open-drain

SCL 2 I2C-bus serial clock digital input

OS 3 overtemperature shutdown output; open-drain

GND 4 ground; to be connected to the system ground

A2 5 user-deﬁned address bit 2 digital input

Product data sheet Rev. 07 — 2 September 2009 4 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

7. Functional description

7.1 General operation

The SE95 uses the on-chip band gap sensor to measure the device temperature with a

resolution of 0.03125 °C and stores the 13-bit two’s complement digital data, resulting

from 13-bit analog to digital conversion, into register Temp. Register Temp can be read at

any time by a controller on the I2C-bus. Reading temperature data does not affect the

conversion in progress during the read operation.

The device can be set to operate in either mode: normal or shutdown mode. In normal

operation mode, by default, the temperature-to-digital conversion is executed every

100 ms and register Temp is updated at the end of each conversion. In shutdown mode,

the device becomes idle, data conversion is disabled and register Temp holds the latest

result; however, the device I2C-bus interface is still active and register write/read operation

can be performed. The device operation mode is controlled by programming bit

SHUTDOWN of register Conf. The temperature conversion is initiated when the device is

powered up or returned to normal mode from shutdown mode.

In addition, at the end of each conversion in normal mode, the temperature data (or Temp)

in register Temp is automatically compared with the overtemperature shutdown threshold

data (or Tos) stored in register Tos, and the hysteresis data (or Thyst) stored in register

Thyst, in order to set the state of the device OS output accordingly. The registers Tos and

Thyst are write/read capable, and both operate with 9-bit two’s complement digital data.

To match with this 9-bit operation, register Temp uses only the 9 MSB bits of its 13-bit data

for the comparison.

The device temperature conversion rate is programmable and can be chosen to be one of

the four values: 0.125, 1.0, 10, and 30 conversions/s. The default conversion rate is

10 conversions/s. Furthermore, the conversion rate is selected by programming bits

RATEVAL[1:0] of register Conf as shown in Table 6. Note that the average supply current

as well as the device power consumption increase with the conversion rate.

The way that the OS output responds to the comparison operation depends upon the OS

operation mode selected by conﬁguration bit OS_COMP_INT, and the user-deﬁned fault

queue deﬁned by conﬁguration bits OS_F_QUE[1:0].

In OS comparator mode, the OS output behaves like a thermostat. It becomes active

when the temperature exceeds Tos, and is reset when the temperature drops below Thyst.

Reading the device registers or putting the device into shutdown mode does not change

the state of the OS output. The OS output in this case can be used to control cooling fans

or thermal switches.

A1 6 user-deﬁned address bit 1 digital input

A0 7 user-deﬁned address bit 0 digital input

VCC 8 supply voltage

Table 2. Pin description

…continued

Symbol Pin Description

Product data sheet Rev. 07 — 2 September 2009 5 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

In OS interrupt mode, the OS output is used for thermal interruption. When the device is

powered-up, the OS output is ﬁrst activated only when Temp exceeds Tos; then it remains

active indeﬁnitely until being reset by a read of any register. Once the OS output has been

activated by crossing Tos and then reset, it can be activated again only when Temp drops

below Thyst; then again, it remains active indeﬁnitely until being reset by a read of any

Thyst trip, reset, Tos trip, reset, Thyst trip, reset, and etc. Putting the device into shutdown

mode also resets the OS output.

In both cases, comparator mode and interrupt mode, the OS output is activated only if a

number of consecutive faults, deﬁned by the device fault queue, has been met. The fault

queue is programmable and stored in bits OS_F_QUE[1:0], of register Conf. Also, the OS

output active state is selectable as HIGH or LOW by setting accordingly the bit OS_POL

of register Conf.

At power-up, the device is put into normal operation mode, register Tos is set to 80 °C,

to 1. The data reading of register Temp is not available until the ﬁrst conversion is

completed in about 33 ms.

The OS response to the temperature is illustrated in Figure 4.

(1) OS is reset by either reading register or putting the device in shutdown mode. Assumed that the

fault queue is met at each Tos and Thyst crossing point.

Fig 4. OS response to temperature

001aad623

(1) (1) (1)

Tos

Thyst

OS RESET

OS ACTIVE

OS RESET

OS ACTIVE

OS output in comparator mode

OS output in interrupt mode

reading temperature limits

Product data sheet Rev. 07 — 2 September 2009 6 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

7.2 OS output and polarity

The OS output is an open-drain output and its state represents results of the device

watchdog operation as described in Section 7.1. In order to observe this output state, an

external pull-up resistor is needed. The resistor should be as large as possible, up to

200 kΩ, to minimize the Temp reading error due to internal heating by the high OS sinking

current.

The OS output active state can be selected as HIGH or LOW by programming bit

OS_POL of register Conf: setting bit OS_POL to logic 1 selects OS active HIGH and

setting to logic 0 sets OS active LOW. At power-up, bit OS_POL is equal to logic 0 and the

OS active state is LOW.

7.3 OS comparator and interrupt modes

As described in Section 7.1, the OS output responds to the result of the comparison

between register Temp data and the programmed limits, in registers Tos and Thyst, in

different ways depending on the selected OS mode: OS comparator or OS interrupt. The

OS mode is selected by programming bit OS_COMP_INT of register Conf: setting bit

OS_COMP_INT to logic 1 selects the OS interrupt mode, and setting to logic 0 selects the

OS comparator mode. At power-up, bit OS_COMP_INT is equal to logic 0 and the OS

comparator is selected.

The main difference between the two modes is that in OS comparator mode, the OS

output becomes active when Temp has exceeded Tos and reset when Temp has dropped

below Thyst, reading a register or putting the device into shutdown mode does not change

the state of the OS output; while in OS interrupt mode, once it has been activated either

by exceeding Tos or dropping below Thyst, the OS output will remain active indeﬁnitely until

reading a register or putting the device into shutdown mode occurs, then the OS output is

reset.

Temperature limits Tos and Thyst must be selected so that Tos > Thyst. Otherwise, the OS

output state will be undeﬁned.

7.4 OS fault queue

Fault queue is deﬁned as the number of faults that must occur consecutively to activate

the OS output. It is provided to avoid false tripping due to noise. Because faults are

determined at the end of data conversions, fault queue is also deﬁned as the number of

consecutive conversions returning a temperature trip. The value of fault queue is

selectable by programming the two bits OS_F_QUE[1:0] in register Conf. Notice that the

programmed data and the fault queue value are not the same. Table 3 shows the

one-to-one relationship between them. At power-up, fault queue data = 00 and fault queue

value = 1.

Table 3. Fault queue table

Fault queue data Fault queue value

OS_F_QUE[1] OS_F_QUE[0] Decimal

001

012

104

116

Product data sheet Rev. 07 — 2 September 2009 7 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

7.5 Shutdown mode

The device operation mode is selected by programming bit SHUTDOWN of register Conf.

Setting bit SHUTDOWN to logic 1 will put the device into shutdown mode. Resetting bit

SHUTDOWN to logic 0 will return the device to normal mode.

In shutdown mode, the device draws a small current of approximately 7.5 µA and the

power dissipation is minimized; the temperature conversion stops, but the I2C-bus

interface remains active and register write/read operation can be performed. If the OS

output is in comparator mode, then it remains unchanged. In interrupt mode, the OS

output is reset.

7.6 Power-up default and power-on reset

The SE95 always powers-up in its default state with:

•Normal operation mode

•OS comparator mode

•Tos = 80 °C

•Thyst = 75 °C

•OS output active state is LOW

•Pointer value is logic 0

When the power supply voltage is dropped below the device power-on reset level of

approximately 1.9 V (POR) and then rises up again, the device will be reset to its default

condition as listed above.

8. I2C-bus serial interface

The SE95 can be connected to a compatible 2-wire serial interface I2C-bus as a slave

device under the control of a controller or master device, using two device terminals, SCL

and SDA. The controller must provide the SCL clock signal and write/read data to and

from the device through the SDA terminal. Note that if the I2C-bus common pull-up

resistors have not been installed as required for I2C-bus, then an external pull-up resistor,

approximately 10 kΩ, is needed for each of these two terminals. The bus communication

protocols are described in Section 8.7 “Protocols for writing and reading the registers”.

8.1 Slave address

The SE95 slave address on the I2C-bus is partially deﬁned by the logic applied to the

device address pins A2, A1 and A0. Each pin is typically connected either to GND for

logic 0, or to VCC for logic 1. These pins represent the three LSB bits of the device 7-bit

address. The other four MSB bits of the address data are preset to 1001 by hard wiring

inside the SE95. Table 4 shows the device's complete address and indicates that up to

8 devices can be connected to the same bus without address conﬂict. Because the input

pins SCL, SDA and A2 to A0, are not internally biased, it is important that they should not

be left ﬂoating in any application.

0Ch is a reserved address for SMBus Alert Response Address (ARA). This is an optional

command from the SMBus speciﬁcation to allow SMBus devices to respond to an SMBus

master with their slave device if they are generating an interrupt. The SE95 will send a

Product data sheet Rev. 07 — 2 September 2009 8 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

false alert if the address 0Ch is sent and cannot be active on the I2C-bus if this address is

used. Consider using the SE98 since it supports SMBus ARA as well as time-out features

and provides ±1°C accuracy.

8.2 Register list

The SE95 contains 7 data registers. The registers can be 1 byte or 2 bytes wide, and are

deﬁned in Table 5. The registers are accessed by the value in the content of the pointer

and reserved for manufacturer use. Note that when reading a two-byte register, the host

must provide enough clock pulses as required by the I2C-bus protocol (see Section 8.7)

for the device to completely return both data bytes. Otherwise the device may hold the

SDA line in LOW state, resulting in a bus hang condition.

8.3 Register pointer

The register pointer or pointer byte is an 8-bit data byte that is equivalent to the register

command in the I2C-bus deﬁnitions and is used to identify the device register to be

accessed for a write or read operation. Its values are listed as pointer values in Table 5.

For the device register I2C-bus communication, the pointer byte may or may not need to

be included within the command as illustrated in the I2C-bus protocol ﬁgures in

Section 8.7.

The command statements for writing data to a register must always include the pointer

byte; while the command statements for reading data from a register may or may not

include it. To read a register that is different from the one that has been recently read, the

pointer byte must be included. However, to re-read a register that has been recently read,

the pointer byte may not have to be included in the reading.

Table 4. Address table

MSB LSB

1001A2A1A0

Table 5. Register table

name Pointer

value R/W POR

state Description

Conf 01h R/W 00h conﬁguration register: contains a single 8-bit data byte;

to set an operating condition

Temp 00h read

only N/A temperature register: contains two 8-bit data bytes; to

store the measured Temp

Tos 03h R/W 5000h overtemperature shutdown threshold register: contains

two 8-bit data bytes; to store the overtemperature

shutdown limit; default Tos =80°C

Thyst 02h R/W 4B00h hysteresis register: contains two 8-bit data bytes; to

store the hysteresis limit; bit 7 to bit 0 are also used in

OTP (One Time Programmable) test mode to supply

OTP write data; default Thyst =75°C

ID 05h read

only A1h identiﬁcation register: contains a single 8-bit data byte

for the manufacturer ID code

Reserved 04h N/A N/A reserved

Reserved 06h N/A N/A reserved

Product data sheet Rev. 07 — 2 September 2009 9 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

At power-up, the pointer value is preset to logic 0 for register Temp; users can then read

the temperature without specifying the pointer byte.

8.4 Conﬁguration register

The Conﬁguration (Conf) register is a read/write register and contains an 8-bit

non-complement data byte that is used to conﬁgure the device for different operating

conditions. Table 6 shows the bit assignments of this register.

8.5 Temperature register

The Temperature (Temp) register holds the digital result of temperature measurement or

monitor at the end of each analog to digital conversion. This register is read only and

contains two 8-bit data bytes consisting of one Most Signiﬁcant Byte (MSByte) and one

Least Signiﬁcant Byte (LSByte). However, only 13 bits of those two bytes are used to store

the Temp data in two’s complement format with the resolution of 0.03125 °C. Table 7

shows the bit arrangement of the Temp data in the data bytes.

Table 6. Conf register

Legend: * = default value.

Bit Symbol Access Value Description

7 reserved R/W 0* reserved for manufacturer’s use

6 and 5 RATEVAL[1:0] R/W sets the conversion rate

00* 10 conversion/s

01 0.125 conversion/s

10 1 conversion/s

11 30 conversion/s

4 and 3 OS_F_QUE[1:0] R/W OS fault queue programming

00* queue value = 1

01 queue value = 2

10 queue value = 4

11 queue value = 6

2 OS_POL R/W OS polarity selection

0* OS active LOW

1 OS active HIGH

1 OS_COMP_INT R/W OS operation mode selection

0* OS comparator

1 OS interrupt

0 SHUTDOWN R/W 0 operation mode

0* normal

1 shutdown

Table 7. Temp register

MSByte LSByte

7654321076543210

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

Product data sheet Rev. 07 — 2 September 2009 10 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

When reading register Temp, all 16 bits of the two data bytes (MSByte and LSByte) must

be collected and then the two’s complement data value according to the desired resolution

must be selected for the temperature calculation. Table 8 shows the example for 11-bit

two’s complement data value, Table 9 shows the example for 13-bit two’s complement

data value.

When converting into the temperature the proper resolution must be used as listed in

Table 10 using either one of these two formulae:

1. If the Temp data MSB = 0, then: Temp (°C) = +(Temp data) ×value resolution

2. If the Temp data MSB = 1, then: Temp (°C)=−(two’s complement Temp data) ×value

resolution

Table 11 shows some examples of the results for the 11-bit calculations.

Table 8. Example 11-bit two’s complement Temp register

MSByte LSByte

7654321076543210

D10D9D8D7D6D5D4D3D2D1D0XXXXX

Table 9. Example 13-bit two’s complement register

MSByte LSByte

7654321076543210

D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X X X

Table 10. Temp data and Temp value resolution

Data resolution Value resolution

8 bit 1.0 °C

9 bit 0.5 °C

10 bit 0.25 °C

11 bit 0.125 °C

12 bit 0.0625 °C

13 bit 0.03125 °C

Table 11. Temp register value

11-bit binary

(two’s complement) Hexadecimal value Decimal value Value

011 1111 1000 3F8 1016 +127.000 °C

011 1111 0111 3F7 1015 +126.875 °C

011 1111 0001 3F1 1009 +126.125 °C

011 1110 1000 3E8 1000 +125.000 °C

000 1100 1000 0C8 200 +25.000 °C

000 0000 0001 001 1 +0.125 °C

000 0000 0000 000 0 0.000 °C

111 1111 1111 7FF −1−0.125 °C

111 0011 1000 738 −200 −25.000 °C

110 0100 1001 649 −439 −54.875 °C

110 0100 1000 648 −440 −55.000 °C

Product data sheet Rev. 07 — 2 September 2009 11 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

Obviously, for 9-bit Temp data application in replacing the industry standard LM75, just

use only 9 MSB bits of the two bytes and disregard 7 LSB of the LSByte. The 9-bit Temp

data with 0.5 °C resolution of the SE95 is deﬁned exactly in the same way as for the

standard LM75 and it is here similar to the Tos and Thyst registers.

8.6 Overtemperature shutdown threshold and hysteresis registers

These two registers, are write/read registers, and also called set-point registers. They are

used to store the user-deﬁned temperature limits, called overtemperature shutdown

threshold (Tos) and hysteresis temperature (Thyst), for the device watchdog operation. At

the end of each conversion the Temp data will be compared with the data stored in these

two registers in order to set the state of the device OS output; see Section 7.1.

Each of the set-point registers contains two 8-bit data bytes consisting of one MSByte and

one LSByte the same as register Temp. However, only 9 bits of the two bytes are used to

store the set-point data in two’s complement format with the resolution of 0.5 °C. Table 12

and Table 13 show the bit arrangement of the Tos data and Thyst data in the data bytes.

Notice that because only 9-bit data are used in the set-point registers, the device uses

only the 9 MSB of the Temp data for data comparison.

When a set-point register is read, all 16 bits are provided to the bus and must be collected

by the controller to complete the bus operation. However, only the 9 most signiﬁcant bits

should be used and the 7 LSB of the LSByte are equal to zero and should be ignored.

Table 14 shows examples of the limit data and value.

Table 12. Tos register

MSByte LSByte

7654321076543210

D8D7D6D5D4D3D2D1D0XXXXXXX

Table 13. Thyst register

MSByte LSByte

7654321076543210

D8D7D6D5D4D3D2D1D0XXXXXXX

Table 14. Tos and Thyst register

11-bit binary

(two’s complement) Hexadecimal value Decimal value Value

0 1111 1010 0FA 250 125.0 °C

0 0011 0010 032 50 25.0 °C

0 0000 0001 001 1 0.5 °C

0 0000 0000 000 0 0.0 °C

1 1111 1111 1FF −1−0.5 °C

1 1100 1110 1CE −50 −25.0 °C

1 1001 0010 192 −110 −55.0 °C

Product data sheet Rev. 07 — 2 September 2009 12 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

8.7 Protocols for writing and reading the registers

The communication between the host and the SE95 must follow the rules strictly as

deﬁned by the I2C-bus management. The protocols for SE95 register read/write

operations are illustrated in Figure 5 to Figure 10 together with the following deﬁnitions:

1. Before a communication, the I2C-bus must be free or not busy. It means that the SCL

and SDA lines must both be released by all devices on the bus, and they become

HIGH by the bus pull-up resistors.

2. The host must provide SCL clock pulses necessary for the communication. Data is

transferred in a sequence of 9 SCL clock pulses for every 8-bit data byte followed by

1-bit status of the acknowledgement.

3. During data transfer, except the START and STOP signals, the SDA signal must be

stable while the SCL signal is HIGH. It means that the SDA signal can be changed

only during the LOW duration of the SCL line.

4. S: START signal, initiated by the host to start a communication, the SDA goes from

HIGH-to-LOW while the SCL is HIGH.

5. RS: RE-START signal, same as the START signal, to start a read command that

follows a write command.

6. P: STOP signal, generated by the host to stop a communication, the SDA goes from

LOW-to-HIGH while the SCL is HIGH. The bus becomes free thereafter.

7. W: write bit, when the write/read bit is in a write command.

8. R: read bit, when the write/read bit is logic 1 in a read command.

9. A: device acknowledge bit, returned by the SE95. It is logic 0 if the device works

properly and logic 1 if not. The host must release the SDA line during this period in

order to give the device the control on the SDA line.

10. A’: master acknowledge bit, not returned by the device, but set by the master or host

in reading 2-byte data. During this clock period, the host must set the SDA line to

LOW in order to notify the device that the ﬁrst byte has been read for the device to

provide the second byte onto the bus.

11. NA: not-acknowledge bit. During this clock period, both the device and host release

the SDA line at the end of a data transfer, the host is then enabled to generate the

stop signal.

12. In a write protocol, data is sent from the host to the device and the host controls the

SDA line, except during the clock period when the device sends the device

acknowledgement signal to the bus.

13. In a read protocol, data is sent to the bus by the device and the host must release the

SDA line during the time that the device is providing data onto the bus and controlling

the SDA line, except during the clock period when the master sends the master

acknowledgement signal to the bus.

Product data sheet Rev. 07 — 2 September 2009 13 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

Fig 5. Write conﬁguration register (1-byte data)

001aad624

1SSDA

SCL

001A2A1A0WA 00000001A000D4D3D2D1D0A P

23456789123456789123456789

START STOP

write device

acknowledge device

acknowledge

device

acknowledge

device address pointer byte configuration data byte

Fig 6. Read conﬁguration register including pointer byte (1-byte data)

001aad625

SCL

SDA

(next)

123456789123456789

device address pointer byte

START RE-START

write device

acknowledge

device

acknowledge

00000001A

1S 0 0 1 A2 A1 A0 W A

SCL (cont.)

SDA (cont.)

123456789123456789

device address data byte from device

STOP

read master not

acknowledged

device

acknowledge

D7 D6 D5 D4 D3 D2 D1 D0 P1001A2A1A0RA NA

Fig 7. Read conﬁguration register with preset pointer (1-byte data)

001aad626

START

SCL

SDA

123456789123456789

device address data byte from device

STOP

read master not

acknowledged

device

acknowledge

D7 D6 D5 D4 D3 D2 D1 D0 P1001A2A1A0RA NA

Product data sheet Rev. 07 — 2 September 2009 14 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

Fig 8. Write Tos or Thyst register (2-byte data)

001aad627

123456789123456789

D7SDA (cont.)

SCL (cont.)

D6 D5 D4 D3 D2 D1 D0 A D7 D6 D5 D4 D3 D2 D1 D0 A P

1SSDA

SCL

001A2A1A0WA000000P1P0A(next)

(next)

123456789123456789

device address pointer byte

ms byte data ls byte data

START write device

acknowledge

device

acknowledge

STOP

device

acknowledge

device

acknowledge

Fig 9. Read Temp, Tos or Thyst register including pointer byte (2-byte data)

123456789

123456789123456789123456789

1001A2A1A0RAD7D6D5D4D3D2D1D0A4D7D6D5D4D3D2D1D0NA P

1234567890

1S 001A2A1A0WA 000000P1P0A (next)

(next)

SDA

SCL

SDA (cont)

SCL (cont)

001aad628

device address pointer byte

device address ms byte from device ls byte from device

START RE-START

write device

acknowledge

device

acknowledge

read master

acknowledge master not

acknowledged

device

acknowledge

STOP

Fig 10. Read Temp, Tos or Thyst register with preset pointer (2-byte data)

123456789123456789123456789

1S 0 0 1 A2 A1 A0 R A D7 D6 D5 D4 D3 D2 D1 D0 A4 D7 D6 D5 D4 D3 D2 D1 D0 NA P

SDA

SCL

001aad629

device address ms byte from device ls byte from device

START read master

acknowledge master not

acknowledged

device

acknowledge

STOP

Product data sheet Rev. 07 — 2 September 2009 15 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

9. Limiting values

10. Recommended operating conditions

Table 15. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VCC supply voltage −0.3 +6.0 V

VI(SCL) input voltage on pin SCL −0.3 +6.0 V

VI(SDA) input voltage on pin SDA −0.3 +6.0 V

VI(A0) input voltage on pin A0 −3.0 VCC + 0.3 V

VI(A1) input voltage on pin A1 −3.0 VCC + 0.3 V

VI(A2) input voltage on pin A2 −3.0 VCC + 0.3 V

II(PIN) input current on input pins −5.0 +5.0 mA

IO(OS) output current on pin OS - 10.0 mA

VO(OS) output voltage on pin OS −0.3 +6.0 V

VESD electrostatic discharge

voltage human body model - 1000 V

machine model - 150 V

Tstg storage temperature −65 +150 °C

Tjjunction temperature - 150 °C

Table 16. Recommended operating characteristics

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage 2.8 - 5.5 V

Tamb ambient temperature −55 - +125 °C

Product data sheet Rev. 07 — 2 September 2009 16 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

11. Static characteristics

[1] Typical values are at VCC = 3.3 V and Tamb =25°C.

[2] Assumes a minimum 11-bit temperature reading.

[3] The digital pins are pin SCL, SDA and A2 to A0.

[4] Device analog-to-digital conversion.

Table 17. Static characteristics

= 2.8 V to 5.5 V, T

amb

−

C to +125

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ[1] Max Unit

Tacc temperature accuracy VCC = 2.8 V to 3.6 V [2]

Tamb =−25 °C to +100 °C−1.0 - +1.0 °C

Tamb =−55 °C to +125 °C−2.0 - +2.0 °C

VCC = 3.6 V to 5.5 V [2]

Tamb =−25 °C to +100 °C−2- +2 °C

Tamb =−55 °C to +125 °C−3- +3 °C

Tres temperature resolution 11-bit digital temperature data - 0.125 - °C

tconv(T) temperature conversion time normal mode - 33 - ms

ICC supply current normal mode: I2C-bus inactive - 150 - µA

normal mode: I2C-bus active - - 1.0 mA

shutdown mode - 7.5 - µA

VIH HIGH-level input voltage digital pins [3] 0.7VCC -V

CC + 0.3 V

VIL LOW-level input voltage digital pins [3] −0.3 - +0.3VCC V

VI(hys) hysteresis of input voltage pins SCL and SDA - 300 - mV

pins A2 to A0 - 300 - mV

IIH HIGH-level input current digital pins; VIN =V

CC [3] −1.0 - +1.0 µA

IIL LOW-level input current digital pins; VIN =0V [3] −1.0 - +1.0 µA

VOL LOW-level output voltage pins SDA and OS; IOL = 3 mA - - 0.4 V

IOL = 4 mA - - 0.8 V

ILO output leakage current pins SDA and OS; VOH =V

CC --10 µA

VPOR power-on reset voltage VCC supply below which the

logic is reset 1.0 - 2.5 V

OSQ OS fault queue programmable [4] 1-6

Tos overtemperature shutdown

threshold default value - 80 - °C

fsam sampling rate programmable 0.125 10 30 sample/s

Thyst hysteresis temperature default value - 75 - °C

Ciinput capacitance digital pins - 20 - pF

Product data sheet Rev. 07 — 2 September 2009 17 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

12. Dynamic characteristics

[1] These speciﬁcations are guaranteed by design and not tested in production.

Table 18. Dynamic characteristics[1]

= 2.8 V to 5.5 V, T

amb

−

C to +125

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

TCLK SCL clock period see Figure 11 2.5 - - µs

t(SCL)H HIGH period of the SCL clock 0.6 - - µs

t(SCL)L LOW period of the SCL clock 1.3 - - µs

tHD;STA hold time (repeated) START condition 100 - - ns

tSU;DAT data set-up time 100 - - ns

tHD;DAT data hold time 0 - - ns

tSU;STO set-up time for STOP condition 100 - - ns

tffall time pins SDA and OS;

CL= 400 pF; IOL =3mA - 250 - ns

Fig 11. Timing diagram

001aad616

SDA

SCL

tHIGH

tLOW

ssrps

tftHD;STA

tHD;DAT

tftSU;DAT

tSU;STO

tHD;STA

Product data sheet Rev. 07 — 2 September 2009 18 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

13. Performance curves

Fig 12. Shutdown supply current as a function of

temperature Fig 13. Typical normal I2C-bus inactive supply current

as a function of temperature

Fig 14. Typical normal I2C-bus inactive supply current

as a function of temperature Fig 15. Typical SDA VOL as a function of temperature

Fig 16. Typical conversion time as a function of

temperature Fig 17. Typical OS VOL as a function of temperature

001aad617

ICC(SD)

(µA)

T (°C)

−50 1251000−25 25 7550

VCC = 5.5 V

3.3 V

3.9 V

2.8 V

001aad618

100

200

300

ICC

(µA)

T (°C)

−50 1251000−25 25 7550

VCC = 5.5 V

3.3 V

3.9 V

2.8 V

001aad619

100

200

300

ICC

(µA)

T (°C)

−50 1251000−25 25 7550

30 conversions/s

10 conversions/s

1 conversions/s

0.125 conversions/s

001aad620

0.05

0.15

0.25

0.20

0.10

VOL(SDA)

(V)

T (°C)

−50 1251000−25 25 7550

VCC = 2.8 V

3.3 V

3.9 V

5.5 V

001aad621

tconv(T)

(ms)

T (°C)

−50 1251000−25 25 7550

001aad622

VOL(OS)

(V)

T (°C)

−50 1251000−25 25 7550

VCC = 2.8 V

3.3 V

3.9 V

5.5 V

Product data sheet Rev. 07 — 2 September 2009 19 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

14. Application information

The SE95 is sensitive to power supplies with ramp-up time ≤2 ms and could NACK or

hang the I2C-bus. In most applications the SE95 will function properly since power

supplies have a >2 ms ramp-up time. If the power supply ramp-up time is ≤2 ms, use an

RC network with R = 300 Ω and C = 10 µF, as shown in Figure 18, to add about 3 ms to

the ramp-up time. The 10 µF capacitor is the same as the bypass capacitor that is

typically used to prevent ﬂuctuations on the power supply. The 300 Ω resistor will reduce

the supply voltage by about 45 mV since the SE95 supply current is about 150 µA. Ensure

the SE95 is the only device connected to the end of 300 Ω resistor since additional

devices would draw more current and cause a larger voltage drop across the resistor.

Fig 18. Typical application circuit

002aae891

10 kΩ

SE95 detector or

interrupt line

SCL

SDA

VCC

power supply

GND

digital logic

or tie to

VCC or GND

I2C-bus

10 µF

300 Ω

power supply

Product data sheet Rev. 07 — 2 September 2009 20 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

15. Package outline

Fig 19. Package outline SOT96-1 (SO8)

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.05 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

99-12-27

03-02-18

Product data sheet Rev. 07 — 2 September 2009 21 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

Fig 20. Package outline SOT505-1 (TSSOP8)

UNIT A1

max. A2A3bpLHELpwyv

ceD(1) E(2) Z(1) θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.15

0.05 0.95

0.80 0.45

0.25 0.28

0.15 3.1

2.9 3.1

2.9 0.65 5.1

4.7 0.70

0.35 6°

0°

0.1 0.10.10.94

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.7

0.4

SOT505-1 99-04-09

03-02-18

0.25

A2A1

(A3)

detail X

vMA

2.5 5 mm0

scale

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1

1.1

pin 1 index

Product data sheet Rev. 07 — 2 September 2009 22 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

16. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note

AN10365 “Surface mount reﬂow

soldering description”

16.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for ﬁne pitch SMDs. Reﬂow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

16.2 Wave and reﬂow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reﬂow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature proﬁle. Leaded packages,

packages with solder balls, and leadless packages are all reﬂow solderable.

Key characteristics in both wave and reﬂow soldering are:

•Board speciﬁcations, including the board ﬁnish, solder masks and vias

•Package footprints, including solder thieves and orientation

•The moisture sensitivity level of the packages

•Package placement

•Inspection and repair

•Lead-free soldering versus SnPb soldering

16.3 Wave soldering

Key characteristics in wave soldering are:

•Process issues, such as application of adhesive and ﬂux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

•Solder bath speciﬁcations, including temperature and impurities

Product data sheet Rev. 07 — 2 September 2009 23 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

16.4 Reﬂow soldering

Key characteristics in reﬂow soldering are:

•Lead-free versus SnPb soldering; note that a lead-free reﬂow process usually leads to

higher minimum peak temperatures (see Figure 21) than a SnPb process, thus

reducing the process window

•Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

•Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classiﬁed in accordance with

Table 19 and 20

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reﬂow

soldering, see Figure 21.

Table 19. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm3)

< 350 ≥ 350

< 2.5 235 220

≥ 2.5 220 220

Table 20. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm3)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product data sheet Rev. 07 — 2 September 2009 24 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

For further information on temperature proﬁles, refer to Application Note

AN10365

“Surface mount reﬂow soldering description”

17. Abbreviations

MSL: Moisture Sensitivity Level

Fig 21. Temperature proﬁles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 21. Abbreviations

Acronym Description

ADC Analog-to-Digital Converter

ESD ElectroStatic Discharge

HBM Human Body Model

I2C-bus Inter-Integrated Circuit bus

I/O Input/Output

LSB Least Signiﬁcant Bit

LSByte Least Signiﬁcant Byte

MM Machine Model

MSB Most Signiﬁcant Bit

MSByte Most Signiﬁcant Byte

OTP One-Time Programmable

POR Power-On Reset

SMBus System Management Bus

Product data sheet Rev. 07 — 2 September 2009 25 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

18. Revision history

Table 22. Revision history

Document ID Release date Data sheet status Change notice Supersedes

SE95_7 20090902 Product data sheet - SE95_6

Modiﬁcations: •Figure 1 “Block diagram of SE95”: changed from “AVD CONTOL” to “ADC CONTROL”

•Section 14 “Application information”:

–Added ﬁrst paragraph

–Figure 18 “Typical application circuit” modiﬁed

•Added soldering information

•Added Section 17 “Abbreviations”

SE95_6 20090604 Product data sheet - SE95_5

SE95_5 20071213 Product data sheet - SE95_4

SE95_4 20070212 Product data sheet - SE95_3

SE95_3

(9397 750 14388) 20051212 Product data sheet - SE95_2

SE95_2

(9397 750 14163) 20041005 Objective speciﬁcation - SE95_1

SE95_1

(9397 750 10265) 20031003 Objective speciﬁcation - -

Product data sheet Rev. 07 — 2 September 2009 26 of 27

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

19. Legal information

19.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Deﬁnitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

19.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

19.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

19.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

I2C-bus — logo is a trademark of NXP B.V.

20. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Deﬁnition

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development.

Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation.

Product [short] data sheet Production This document contains the product speciﬁcation.

NXP Semiconductors SE95

Ultra high accuracy digital temperature sensor and thermal watchdog

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 2 September 2009

Document identifier: SE95_7

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

21. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Functional description . . . . . . . . . . . . . . . . . . . 4

7.1 General operation. . . . . . . . . . . . . . . . . . . . . . . 4

7.2 OS output and polarity . . . . . . . . . . . . . . . . . . . 6

7.3 OS comparator and interrupt modes . . . . . . . . 6

7.4 OS fault queue . . . . . . . . . . . . . . . . . . . . . . . . . 6

7.5 Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . . 7

7.6 Power-up default and power-on reset. . . . . . . . 7

2C-bus serial interface . . . . . . . . . . . . . . . . . . . 7

8.1 Slave address. . . . . . . . . . . . . . . . . . . . . . . . . . 7

8.2 Register list. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

8.3 Register pointer . . . . . . . . . . . . . . . . . . . . . . . . 8

8.4 Conﬁguration register . . . . . . . . . . . . . . . . . . . . 9

8.5 Temperature register. . . . . . . . . . . . . . . . . . . . . 9

8.6 Overtemperature shutdown threshold

and hysteresis registers . . . . . . . . . . . . . . . . . 11

8.7 Protocols for writing and reading

the registers . . . . . . . . . . . . . . . . . . . . . . . . . . 12

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15

10 Recommended operating conditions. . . . . . . 15

11 Static characteristics. . . . . . . . . . . . . . . . . . . . 16

12 Dynamic characteristics . . . . . . . . . . . . . . . . . 17

13 Performance curves . . . . . . . . . . . . . . . . . . . . 18

14 Application information. . . . . . . . . . . . . . . . . . 19

15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20

16 Soldering of SMD packages . . . . . . . . . . . . . . 22

16.1 Introduction to soldering . . . . . . . . . . . . . . . . . 22

16.2 Wave and reﬂow soldering . . . . . . . . . . . . . . . 22

16.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 22

16.4 Reﬂow soldering. . . . . . . . . . . . . . . . . . . . . . . 23

17 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 24

18 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 25

19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 26

19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26

19.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

19.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 26

19.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26

20 Contact information . . . . . . . . . . . . . . . . . . . . 26

21 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27