FJH1101
© 1999 Fairchild Semiconductor Corporation FJH1101 - Rev. A
General Description:
An Ultra Low Leakage Diode in the DO-35 package.
The forward voltage is typically greater than 0.5 volts
at 1.0 micro-ampere.
This product is light sensitive, any damage to the body
coating will affect the reverse leakage when exposed to
light.
Ultra Low Leakage Diode
Absolute Maximum Ratings* TA = 25OC unless otherwise noted
Sym Parameter Value Units
Tstg Storage Temperature -55 to +200 OC
TJOperating Junction Temperature 175 OC
PDTotal Power Dissipation at TA = 25OC 250 mW
Linear Derating Factor from TA = 25OC 1.67 mW/OC
ROJA Thermal Resistance Junction-to-Ambient 300 OC/W
Wiv Working Inverse Voltage 15 V
IFDC Forward Current (IF) 150 mA
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
Electrical Characteristics TA = 25OC unless otherwise noted
SYM CHARACTERISTICS MIN MAX UNITS TEST CONDITIONS
BVBreakdown Voltage 20 VIR= 5.0 uA
IRReverse Leakage 5.0 pA VR= 5.0 V
15 pA VR= 15 V
VFForward Voltage 1.10 V IF= 50 mA
CTDiode Capacitance 2.0 pF VR= 0 V, f = 1.0 MHz
CATHODE
BAND
0.200 (5.08)
0.120 (3.05)
0.022 (0.558) Diameter
0.018 (0.458) Typ 20 mils
0.090 (2.28) Diameter
0.060 (1.53)
0.500 Minimum
12.70 Typ 1.000 LOGO
FJH
11
01
Typical Forward Voltages
1.0 uA - - - - - - - - - - 530 mV
10 uA - - - - - - - - - - 605 mV
100 uA - - - - - - - - - - 685 mV
1.0 mA- - - - - - - - - - 780 mV
10 mA- - - - - - - - - - 895 mV
50 mA- - - - - - - - - - 995 mV
100 mA- - - - - - - - - - 1.07 V
Information Only Data Sheet
FINAL REVERSE CURRENT & FORWARD VOLTAGE LIMITS MIGHT BE INCREASED SLIGHTLY
DO-35 Tape and Reel Data
September 1999, Rev. A
DO-35 Packaging Information
T50R
TNR
13
10,000
254x79x794
30,000
0.137
2.23
Note/Comments
Packaging Option
Packaging type
Reel Size ( inch diameter)
Qty per Reel/Tube/Bag
Int Box Dimension (mm)
Max qty per Box
Weight per unit (gm)
Weight per Reel/Ammo (kg)
Inside Tape Spacing (mm) 52
T50A
Ammo
-
5,000
406x267x184
50,000
0.137
0.800
52
Bulk
Standard
(no flow code)
Bag
-
500
279x133x108
5,000
0.137
-
-
DO-35 Packaging
Configuration: Figure 1.0
Soabar Label sample
P.O. No.
TYPE IN5225A MARK BLK-BRN
REV A2 PART No.
PKG EC No.
QTY 10,000 M.O. No. OX5046F035
Q.C. DATE D9903
MFD. UNDER US PAT 3.025. 589 & OTHER US PATS & APPLICATI ONS
Kraft Paper Wound
Between Layers
Corrugated Outer Liner
Red/Blue (Cat hode)
White (Anode )
Soabar Label
DO-35 Packaging
Information Table: Figure 2.0
T50R
TNR Options
REEL DIMENSIONS
ITEM DESCRIPTION SYMBOL MINIMUM MAXIMUM
Ree l Di am e ter D1 10. 3 75 10. 62 5
Arb or Hol e Di am et er (S ta nd ard) D2 1. 24 5 1.2 55
Core Diameter D3 3.190 3.310
Flange to Flange Inner Width W1 3.400
Note: All Dimensions are in inches
D1
D3
W1
D2
DO-35 Reel Dimensions:
Figure 3.0
Soabar Label
©2000 Fairchild Semiconductor International
DO-35 Tape and Ammo Data, continued
September 1999, Rev. A
TAPING DIMENSIONS
INCH MM MILS NOTES
A2.520 64.00 2519 Overall width
+0.066/ +1.69/ +66.5/
-0.027 -0.69 -27.0
B2.047±0.027 52 ±0.69 2047±27 Inside Tape Spacing
C0.200 ±0.0157 5.08 ±0.40 200 ±15.7 Component Pitch
D0.047(max) 1.2(max) 47(max) Component Misalignment
E0.022(max) 0.55(max) 22(max) Tape M ismatch
F0.027(max) ±0.69 ±27 Units in l ine w/ one another
G0.126(min) 3.2(min) 126(min) Lead amount between tapes
H0 0 0 Lead amount beyond tapes
L1-L2 ±0.027 ±0.69 ±2 7 Delta between t wo lea ds
254mm x 79mm x 79mm
Intermediate Container (5,000 cap)
T50A Option
DO-35 A mmo Packing
Configuration: Figure 4.0
A
F
CD
L2
L1
E
B
G
H
DO-35 Bulk Packing
Configuration: Figure 6.0
133mm x 95mm
Anti-static bag (500/bag)
Im 102mm x 76mm x 127mm
mediate Box (1,000 cap)
DO-35 Taping
Dimension: Figure 5.0
Soabar Label
(on top of box)
DO-35 (FS PKG Code D2)
DO-35 Package Dimensions
March 2000, Rev. A
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in millimeters
Part Weight per unit (gram): 0.137
©2000 Fairchild Semiconductor International
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN T O IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
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LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF F AIRCHILD SEMICONDUCTOR CORPORA TION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT ST A TUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
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