Agilent AMMC-6241
26–43 GHz Low Noise Amplifier
Data Sheet
Description
Agilent’s AMMC-6241 is a high
gain, low-noise amplifier that
operates from 26 GHz to 43
GHz. This LNA provides a
wide-band solution for system
design since it covers several
bands, thus, reduces part
inventory. The device has
input / output match to 50
Ohm, is unconditionally stable
and can be used as either
primary or sub-sequential low
noise gain stage. By
eliminating the complex tuning
and assembly processes
typically required by hybrid
(discrete-FET) amplifiers, the
AMMC-6241 is a cost-effective
alternative in the 26 - 43 GHz
communications receivers. The
backside of the chip is both
RF and DC ground. This helps
Features
Wide frequency range: 26 - 43 GHz
High gain: 20 dB
Low 50
Noise Figure: 2.7 dB
50
Input and Output Match
Flat Gain Response
Single 3V Supply Bias
Applications
Microwave Radio systems
Satellite VSAT, DBS Up/Down
Link
LMDS & Pt-Pt mmW Long Haul
Broadband Wireless Access
(including 802.16 and 802.20
WiMax)
WLL and MMDS loops
Commercial Grade Military
AMMC-6241 Absolute Maximum Ratings[1]
Note: Operation in excess of any one of these conditions may result in permanent damage to this device.
Symbol Parameters/Conditions Units Min. Max.
VdPositive Drain Voltage V 7
VgGate Supply Voltage V NA
IdDrain Current mA 100
Pin CW Input Power dBm 15
Tch Operating Channel Temp. °C +150
Tstg Storage Case Temp. °C -65 +150
Tmax Maximum Assembly Temp (60 sec max) °C +300
Chip Size: 1900 x 800 µm (74.8 x 31.5 mils)
Chip Size Tolerance: ± 10 µm (± 0.4 mils)
Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils)
RF Pad Dimensions: 110 x 90 µm (4.3 x 3.5 mils)
DC Pad Dimensions: 100 x 100 µm (3.9 x 3.9 mils)
simplify the assembly process
and reduces assembly related
performance variations and
costs. It is fabricated in a
PHEMT process to provide
exceptional noise and gain
performance. For improved
reliability and moisture
protection, the die is
passivated at the active areas.
Note: These devices are ESD sensitive. The following precautions are strongly recommended. Ensure that an ESD approved
carrier is used when dice are transported from one destination to another. Personal grounding is to be worn at all times when
handling these devices. For more details, refer to Agilent Application Note A004R: Electrostatic Discharge Damage and Control.
ESD Machine Model (Class A)
ESD Human Body Model (Class 0)
2
AMMC-6241 DC Specifications/Physical Properties [1]
Noise Figure at 32 GHz
AMMC-6241 RF Specifications [3, 4, 5]
TA= 25°C, Vd=3.0 V, Id(Q)=60 mA, Zin=Zo=50
Notes:
3. Small/Large -signal data measured in wafer form TA = 25°C.
4. 100% on-wafer RF test is done at frequency =30, 32, and 38 GHz.
5. Specifications are derived from measurements in a 50 test environment. Aspects of the amplifier performance may be improved over a more
narrow bandwidth by application of additional conjugate, linearity, or low noise (Gopt) matching.
6. As derived from measured s-parameters
Typical distribution of Small Signal Gain, Noise Figure, and Return Loss. Based on 1500 part sampled over several
production lots.
Gain at 38 GHz Noise Figure at 38GHz
Notes:
1. Ambient operational temperature TA=25°C unless otherwise noted.
2. Channel-to-backside Thermal Resistance (qch-b) = 26°C/W at Tchannel (Tc) = 34°C as measured using infrared microscopy. Thermal Resistance at
backside temperature (Tb) = 25°C calculated from measured data.
Symbol Parameters and Test Conditions Units Minimum Typical Maximum Sigma
Gain Small-signal Gain[6] dB 26-35 GHz = 20
35-40 GHz = 18.5
26-37 GHz = 21
37-40 GHz = 19.5
1.0
NF Noise Figure into 50 dB 26-37 GHz = 2.7
37-40 GHz = 3.0
26-37 GHz = 3.0
37-40 GHz = 3.3
0.05
P-1dB Output Power at 1dB Gain
Compression
dBm +10
OIP3 Third Order Intercept Point;
f=100MHz; Pin=-35dBm
dBm +20
RLin Input Return Loss[6] dB -13 -11 0.40
RLout Output Return Loss[6] dB -16 -12 0.50
Isol Reverse Isolation[6] dB -40 0.50
LSL
19 20
USL
2.6 2.7 2.8 2.9
USL
2.8 2.9 3 3.1 3.2 3.3
Symbol Parameters and Test Conditions Units Min. Typ. Max.
IdDrain Supply Current (under any RF power drive and temperature) (Vd=3.0 V) mA 60 80
θch-b Thermal Resistance[2] (Backside temperature, Tb = 25°C) °C/W 25
3
Figure 1. Typical Gain Figure 2. Typical Isolation Figure 3 Typical Input Return Loss
Figure 4. Typical Output Return Loss Figure 5. Typical Noise Figure into a 50
load.
Figure 6. Typical Output P-1dB and 3rd Order
Intercept Point.
Figure 7. Gain Over Temperature Figure 8. Isolation Over Temperature Figure 9. Input Return Loss Over Temperature
AMMC-6241 Typical Performances
(TA = 25°C, Vd1 = Vd2 =3.0 V, Itotal = 60 mA, Zin = Zout = 50
unless otherwise stated)
NOTE: These measurements are in a 50 test environment. Aspects of the amplifier performance may be improved over
a narrower bandwidth by application of additional conjugate, linearity, or low noise (Gopt) matching.
0
5
10
15
20
25
25 29 33 37 41 45
Frequency (GHz)
S21 (dB)
-70
-60
-50
-40
-30
-20
-10
0
25 29 33 37 41 45
Frequency (GHz)
S12 (dB)
-20
-15
-10
-5
0
25 29 33 37 41 45
Frequency (GHz)
S11 (dB)
-25
-20
-15
-10
-5
0
25 29 33 37 41 45
Frequency (GHz)
S22 (dB)
1.0
1.5
2.0
2.5
3.0
3.5
26 28 30 32 34 36 38 40
Frequency (GHz)
NF (dB)
0
5
10
15
20
25
27 31 35 39 43
Frequency (GHz)
OIP3 & OP1dB (dBm)
OIP3
OP-1dB
0
5
10
15
20
25
30
25 29 33 37 41 45
Frequency (GHz)
S21 (dB)
25C
-40C
+85C
-80
-60
-40
-20
0
25 29 33 37 41 45
Frequency (GHz)
S12 (dB)
25C
-40C
+85C
-20
-15
-10
-5
0
25 29 33 37 41 45
Frequency (GHz)
S11 (dB)
25C
-40C
+85C
4
Figure 10. Output Return Loss Over
Temperature
AMMC-6241 Typical Performances
(TA = 25°C, Vd1= Vd2 =3.0 V, Itotal =60 mA, Zin = Zout = 50
unless otherwise stated)
NOTE: These measurements are in a 50 test environment. Aspects of the amplifier performance may be improved over
a narrower bandwidth by application of additional conjugate, linearity, or low noise (Gopt) matching.
Figure 11. Noise Figure Over Temperature Figure 12. Typical Total Idd over Temperature
Figure 13. Gain over Vdd Figure 14. Isolation Over Vdd Figure 15. Input RL Over Vdd
Figure 16. Output RL Over Vdd Figure 17. Output IP3 Over Vdd
-30
-25
-20
-15
-10
-5
0
25 29 33 37 41 45
Frequency (GHz)
S22 (dB)
25C
-40C
+85C
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
26 28 30 32 34 36 38 40
Frequency (GHz)
NF (dB)
+25C
-40C
+85C
56
58
60
62
64
66
3 3.5 4 4.5 5
Vdd (V)
Idd (mA)
-40C
+25C
+85C
0
5
10
15
20
25
25 30 35 40 45
Frequency (GHz)
S21 (dB)
3V
4V
5V
-80
-60
-40
-20
0
25 30 35 40 45
Frequency (GHz)
S12 (dB)
3V
4V
5V
-20
-15
-10
-5
0
25 30 35 40 45
Frequency (GHz)
S11 (dB)
3V
4V
5V
-25
-20
-15
-10
-5
0
25 30 35 40 45
Frequency (GHz)
S22 (dB)
3V
4V
5V
4
9
14
19
24
29
27 31 35 39 43
Frequency (GHz)
OIP3 (dBm)
3V
4V
5V
5
AMMC-6241 Typical Scattering Parameters[1] (Tc=25°C, VD1=VD2= 3 V, Itotal= 60 mA ,Zin = Zout = 50
)
Note: Data obtained from on-wafer measurements
S11 S21 S12 S22
Freq GHz dB Mag Phase dB Mag Phase dB Mag Phase dB Mag Phase
15.0 -1.013 0.890 173.506 -7.637 0.415 -94.306 -59.891 0.001 132.755 -10.443 0.301 129.202
17.0 -1.306 0.860 152.019 5.022 1.783 163.635 -74.194 0.000 57.784 -14.828 0.181 102.094
19.0 -1.528 0.839 127.230 9.344 2.932 75.144 -58.181 0.001 46.460 -20.040 0.100 80.180
22.0 -2.642 0.738 74.942 15.740 6.123 -29.058 -71.353 0.000 -129.404 -27.825 0.041 4.390
24.0 -5.557 0.527 13.805 19.561 9.507 -103.326 -69.197 0.000 139.800 -28.011 0.040 -90.859
25.0 -8.397 0.380 -29.421 20.760 10.915 -143.267 -73.597 0.000 -65.707 -24.449 0.060 -110.024
26.0 -11.117 0.278 -81.009 21.155 11.422 178.829 -69.288 0.000 169.237 -23.448 0.067 -127.918
26.5 -11.627 0.262 -106.817 21.214 11.501 160.796 -58.793 0.001 -110.455 -22.500 0.075 -137.132
27.0 -11.731 0.259 -129.432 21.239 11.533 143.152 -59.928 0.001 -142.525 -22.260 0.077 -143.296
27.5 -11.805 0.257 -149.942 21.203 11.485 126.214 -58.475 0.001 -171.775 -21.694 0.082 -148.929
28.0 -11.787 0.257 -165.515 21.113 11.367 110.350 -58.768 0.001 -162.445 -21.715 0.082 -157.855
28.5 -12.038 0.250 -176.581 21.023 11.250 95.138 -57.465 0.001 158.458 -21.674 0.082 -156.390
29.0 -12.076 0.249 173.456 21.060 11.297 80.037 -57.267 0.001 169.607 -21.093 0.088 -165.820
29.5 -12.070 0.249 165.646 21.058 11.296 65.449 -55.391 0.002 168.814 -21.180 0.087 -168.128
30.0 -12.259 0.244 159.454 21.007 11.229 51.326 -52.903 0.002 134.843 -21.033 0.089 -165.016
30.5 -12.339 0.242 154.710 21.043 11.276 37.629 -55.427 0.002 92.750 -19.948 0.101 -169.860
31.0 -12.699 0.232 150.567 21.040 11.272 23.753 -55.992 0.002 109.517 -19.390 0.107 -174.803
31.5 -12.988 0.224 148.382 21.078 11.322 10.265 -53.178 0.002 109.357 -18.631 0.117 -177.679
32.0 -13.131 0.221 146.592 21.104 11.355 -3.075 -61.593 0.001 76.010 -18.449 0.120 173.486
32.5 -13.159 0.220 145.349 21.192 11.471 -16.397 -56.515 0.001 131.534 -18.461 0.119 168.589
33.0 -13.040 0.223 145.137 21.308 11.625 -30.578 -58.069 0.001 100.560 -17.807 0.129 164.643
33.5 -12.824 0.228 143.097 21.302 11.617 -44.533 -54.981 0.002 85.525 -18.223 0.123 157.797
34.0 -12.498 0.237 140.155 21.296 11.609 -58.173 -56.012 0.002 113.052 -18.033 0.125 155.542
34.5 -12.573 0.235 138.158 21.182 11.458 -72.363 -54.348 0.002 84.952 -17.550 0.133 150.830
35.0 -12.710 0.231 134.590 21.024 11.251 -85.797 -55.336 0.002 50.316 -17.667 0.131 145.841
35.5 -12.792 0.229 131.388 20.813 10.981 -98.385 -57.651 0.001 106.642 -17.466 0.134 143.100
36.0 -13.029 0.223 130.988 20.678 10.811 -111.390 -54.494 0.002 104.628 -17.225 0.138 137.833
36.5 -13.389 0.214 129.322 20.494 10.585 -123.674 -54.425 0.002 83.500 -16.978 0.142 131.310
37.0 -13.752 0.205 130.820 20.310 10.364 -136.026 -52.515 0.002 90.790 -17.004 0.141 127.335
37.5 -13.599 0.209 130.535 20.239 10.279 -147.683 -52.954 0.002 67.823 -16.551 0.149 120.618
38.0 -13.511 0.211 131.737 20.142 10.165 -160.235 -52.864 0.002 57.307 -16.813 0.144 113.724
38.5 -13.392 0.214 130.598 19.955 9.948 -172.253 -53.785 0.002 81.931 -17.019 0.141 107.173
39.0 -13.449 0.213 130.777 19.742 9.708 175.463 -51.373 0.003 54.256 -17.453 0.134 100.864
39.5 -13.713 0.206 130.341 19.463 9.400 164.088 -54.373 0.002 53.324 -17.967 0.126 97.791
40.0 -13.892 0.202 130.693 19.274 9.198 152.397 -56.900 0.001 27.630 -18.409 0.120 94.365
40.5 -13.822 0.204 131.722 19.016 8.929 141.026 -60.282 0.001 22.819 -18.887 0.114 92.964
41.0 -13.857 0.203 133.603 18.830 8.740 129.648 -54.278 0.002 32.324 -19.364 0.108 92.290
41.5 -13.578 0.209 134.336 18.631 8.542 118.871 -51.010 0.003 -8.926 -19.483 0.106 92.508
42.0 -13.775 0.205 136.724 18.429 8.346 107.881 -54.346 0.002 41.468 -19.835 0.102 94.045
42.5 -13.188 0.219 139.343 18.218 8.145 97.768 -52.144 0.002 19.887 -19.299 0.108 94.187
43.0 -13.131 0.221 142.382 18.030 7.970 87.333 -58.236 0.001 -38.809 -19.365 0.108 93.694
44.0 -11.798 0.257 146.033 17.887 7.841 67.235 -59.155 0.001 -43.306 -17.525 0.133 90.759
45.0 -10.167 0.310 147.240 17.877 7.831 45.991 -52.882 0.002 162.395 -17.185 0.138 81.030
46.0 -8.784 0.364 144.663 17.791 7.755 24.481 -52.831 0.002 -14.230 -17.248 0.137 74.975
47.0 -7.425 0.425 139.414 17.680 7.656 2.691 -50.765 0.003 -17.966 -16.593 0.148 69.936
48.0 -6.079 0.497 135.513 17.700 7.673 -19.090 -53.926 0.002 -12.616 -15.788 0.162 60.992
49.0 -4.403 0.602 128.030 17.793 7.756 -43.456 -52.746 0.002 110.943 -15.204 0.174 57.597
50.0 -2.878 0.718 120.056 17.615 7.599 -66.790 -49.370 0.003 18.237 -14.953 0.179 47.450
6
AMMC-6241 Typical Scattering Parameters[1] (Tc=25°C, VD1=VD2= 5 V, Itotal= 65 mA, Zin = Zout = 50
)
Note: Data obtained from on-wafer measurements
S11 S21 S12 S22
Freq GHz dB Mag Phase dB Mag Phase dB Mag Phase dB Mag Phase
15.0 -0.954 0.896 175.370 -8.236 0.387 -97.484 -58.789 0.001 74.582 -9.268 0.344 119.399
17.0 -1.228 0.868 153.538 4.910 1.760 149.468 -58.503 0.001 111.433 -12.649 0.233 86.348
19.0 -1.693 0.823 127.796 9.038 2.831 54.112 -64.600 0.001 82.329 -15.405 0.170 56.944
22.0 -4.463 0.598 72.488 14.671 5.415 -60.910 -64.010 0.001 104.610 -17.425 0.135 4.474
24.0 -10.804 0.288 7.846 17.336 7.359 -139.132 -64.039 0.001 -127.800 -17.988 0.126 -25.688
25.0 -15.616 0.166 -49.454 17.926 7.876 -177.892 -63.440 0.001 -139.623 -18.079 0.125 -40.543
26.0 -15.749 0.163 -118.695 18.185 8.114 145.637 -66.326 0.000 135.455 -18.089 0.125 -51.511
26.5 -14.388 0.191 -142.095 18.195 8.123 127.785 -60.997 0.001 147.814 -18.056 0.125 -56.680
27.0 -13.469 0.212 -157.405 18.134 8.067 111.019 -63.857 0.001 107.728 -17.926 0.127 -61.943
27.5 -12.672 0.232 -168.987 18.081 8.018 94.474 -62.998 0.001 160.703 -18.032 0.125 -67.733
28.0 -12.138 0.247 -179.012 18.015 7.957 78.323 -58.768 0.001 154.081 -18.015 0.126 -70.838
28.5 -11.933 0.253 175.281 17.898 7.850 63.047 -60.915 0.001 142.052 -17.578 0.132 -75.742
29.0 -11.570 0.264 168.288 17.844 7.802 47.754 -63.581 0.001 137.503 -17.990 0.126 -81.550
29.5 -11.350 0.271 163.120 17.735 7.704 32.835 -62.100 0.001 146.597 -18.079 0.125 -83.191
30.0 -11.555 0.264 160.007 17.591 7.578 18.567 -60.126 0.001 95.390 -17.595 0.132 -87.204
30.5 -11.254 0.274 157.772 17.515 7.512 4.174 -60.519 0.001 109.746 -17.674 0.131 -91.933
31.0 -11.283 0.273 155.500 17.405 7.417 -9.721 -56.518 0.001 129.344 -17.733 0.130 -94.827
31.5 -11.322 0.272 152.983 17.327 7.351 -23.446 -56.438 0.002 93.162 -17.607 0.132 -97.411
32.0 -11.104 0.278 151.391 17.244 7.281 -37.449 -60.113 0.001 102.403 -17.794 0.129 -99.657
32.5 -10.807 0.288 149.758 17.048 7.118 -51.248 -62.866 0.001 109.088 -17.546 0.133 -101.921
33.0 -10.496 0.299 147.850 16.850 6.959 -64.998 -60.915 0.001 105.331 -17.643 0.131 -104.875
33.5 -10.547 0.297 145.153 16.638 6.790 -78.200 -64.266 0.001 126.300 -17.286 0.137 -105.042
34.0 -10.404 0.302 143.126 16.371 6.585 -91.518 -55.886 0.002 113.278 -16.680 0.147 -110.187
34.5 -10.415 0.301 140.889 16.064 6.356 -103.678 -58.954 0.001 93.294 -16.775 0.145 -113.869
35.0 -10.362 0.303 138.559 15.807 6.171 -115.864 -56.036 0.002 103.385 -16.586 0.148 -114.914
35.5 -10.429 0.301 136.295 15.574 6.008 -127.653 -59.955 0.001 155.593 -16.405 0.151 -117.350
36.0 -10.496 0.299 134.946 15.279 5.807 -138.958 -54.224 0.002 99.686 -16.368 0.152 -119.576
36.5 -10.552 0.297 133.658 15.017 5.635 -150.079 -65.294 0.001 97.414 -16.046 0.158 -122.641
37.0 -10.420 0.301 132.618 14.810 5.502 -161.113 -57.283 0.001 119.408 -15.743 0.163 -125.742
37.5 -10.278 0.306 132.713 14.595 5.367 -171.710 -54.466 0.002 88.985 -15.643 0.165 -129.586
38.0 -10.279 0.306 130.938 14.400 5.248 177.346 -55.347 0.002 118.334 -15.366 0.170 -131.580
38.5 -10.249 0.307 128.628 14.210 5.134 167.047 -53.201 0.002 103.431 -15.139 0.175 -134.722
39.0 -10.210 0.309 128.373 14.060 5.047 156.768 -54.049 0.002 75.833 -14.871 0.180 -136.323
39.5 -10.178 0.310 126.565 13.885 4.946 147.006 -52.533 0.002 92.297 -14.738 0.183 -139.034
40.0 -10.306 0.305 125.591 13.784 4.889 137.311 -54.574 0.002 69.756 -14.487 0.189 -141.707
40.5 -10.258 0.307 125.375 13.652 4.815 127.521 -58.441 0.001 108.679 -14.153 0.196 -145.685
41.0 -10.127 0.312 124.344 13.606 4.790 117.909 -57.963 0.001 67.753 -13.736 0.206 -149.614
41.5 -10.264 0.307 124.574 13.621 4.798 107.923 -63.136 0.001 22.773 -13.394 0.214 -152.750
42.0 -10.032 0.315 123.150 13.524 4.745 98.584 -57.167 0.001 59.413 -13.059 0.222 -157.118
42.5 -10.283 0.306 124.307 13.509 4.736 89.573 -54.474 0.002 112.809 -12.764 0.230 -161.086
43.0 -10.126 0.312 121.899 13.579 4.775 80.311 -60.628 0.001 127.139 -12.652 0.233 -164.450
44.0 -10.167 0.310 124.109 13.792 4.893 61.548 -51.744 0.003 153.671 -12.185 0.246 -174.591
45.0 -9.783 0.324 125.766 14.185 5.120 42.684 -46.879 0.005 122.651 -11.784 0.258 177.006
46.0 -9.264 0.344 127.464 14.828 5.513 23.764 -49.932 0.003 96.883 -11.499 0.266 170.747
47.0 -8.307 0.384 129.119 15.605 6.029 3.192 -46.375 0.005 107.536 -10.948 0.284 163.908
48.0 -7.300 0.432 129.338 16.576 6.742 -18.746 -47.935 0.004 100.387 -10.276 0.306 155.748
49.0 -5.323 0.542 131.169 17.761 7.727 -44.350 -44.298 0.006 78.726 -9.333 0.341 147.162
50.0 -2.732 0.730 130.750 18.988 8.900 -72.015 -41.210 0.009 80.639 -8.077 0.395 136.626
7
Biasing and Operation
The AMMC-6241 is normally
biased with a positive supply
connected to both VD1 and VD2
bond pads through the 100pF
bypass capacitor as shown in
Figure 21. The recommended
supply voltage is 3 V. It is
important to place the bypass
capacitor as close to the die as
possible. No negative gate bias
voltage is needed for the
AMMC-6241. Input and
output matching are achieved
on-die, therefore no other
external component is required
besides one 100pF bypass
capacitor for the main supply.
The input and output are DC-
blocked with internal coupling
capacitors.
No ground wires are needed
because all ground connections
are made with plated through-
holes to the backside of the
device.
Refer the Absolute Maximum
Ratings table for allowed DC
and thermal conditions.
Assembly Techniques
The backside of the MMIC
chip is RF ground. For
microstrip applications the
chip should be attached
directly to the ground plane
(e.g. circuit carrier or
heatsink) using electrically
conductive epoxy [1]
For best performance, the
topside of the MMIC should be
brought up to the same height
as the circuit surrounding it.
This can be accomplished by
mounting a gold plate metal
shim (same length and width
as the MMIC) under the chip
which is of correct thickness
to make the chip and adjacent
circuit the same height. The
amount of epoxy used for the
chip and/or shim attachment
should be just enough to
provide a thin fillet around the
bottom perimeter of the chip
or shim. The ground plan
should be free of any residue
that may jeopardize electrical
or mechanical attachment.
The location of the RF bond
pads is shown in Figure 12.
Note that all the RF input and
output ports are in a Ground-
Signal-Ground configuration.
RF connections should be kept
as short as reasonable to
minimize performance
degradation due to undesirable
series inductance. A single
bond wire is normally
sufficient for signal
connections, however double
bonding with 0.7 mil gold wire
or use of gold mesh [2] is
recommended for best
performance, especially near
the high end of the frequency
band.
Thermosonic wedge bonding is
preferred method for wire
attachment to the bond pads.
Gold mesh can be attached
using a 2 mil round tracking
tool and a tool force of
approximately 22 grams and a
ultrasonic power of roughly 55
dB for a duration of 76 +/- 8
mS. The guided wedge at an
untrasonic power level of 64
dB can be used for 0.7 mil
wire. The recommended wire
bond stage temperature is 150
+/- 2C.
Caution should be taken to not
exceed the Absolute Maximum
Notes:
[1] Ablebond 84-1 LM1 silver epoxy is
recommended.
[2] Buckbee-Mears Corporation, St. Paul, MN,
800-262-3824
Figure 18. AMMC-6241 Simplified Schematic
www.agilent.com/
semiconductors
For product information and a complete list
of distributors, please go to our web site.
Data subject to change.
Copyright © 2004-2005 Agilent Technologies, Inc.
Obsoletes 5989-3235EN
September 19, 2005
5989-3943EN
Figure 19. AMMC-6241 Bonding pad locations
Figure 20. AMMC-6241 Assembly diagram
00 1900
800 790 1110 1445
705
350 350
181090
RFin RFout
VD1 VD2
RF INPUT RF OUTPUT
VD1 VD2
Gold Plated Shim
(
O
p
tional
)
100 pF Capacitor
To VDD DC supply
AMMC-6240
Ordering Information:
AMMC-6241-W10 = 10 devices per tray
AMMC-6241-W50 = 50 devices per tray