Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
To all our customers
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but th ere is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regar ding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation
or an authorized Renesas Technology Corporation product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
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rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various
means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
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or system that is used under circumstances in which human life is potentially at stake. Please contact
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contained therein.
HD74HC75
Quad. Bistable Latches
ADE-205-422 (Z)
1st. Edition
Sep. 2000
Description
This latch is ideally suited for use as temporary storage for binary information processing, input/output, and
indicator units. Information present at the data (D) input is transferred to the Q output when the latch
enable (LE) is high. The Q output will follow the data input as long as the enable remains high. when the
enable goes low, the information that was present at the data input at the time the transition occurred is
retained at thte Q output unit the enable is permitted to go high again.
Features
• High Speed Operation: tpd (D to Q) = 12.5 ns typ (CL = 50 pF)
• High Output Current: Fanout of 10 LSTTL Loads
• Wide Operating Voltage: VCC = 2 to 6 V
• Low Input Current: 1 µA max
• Low Quiescent Supply Current: ICC (static) = 2 µA max (Ta = 25°C)
Function Table
Inputs Outputs
D Latch Enable Q Q
LH L H
HH H L
XL Q
0Q0
HD74HC75
2
Pin Arrangement
1
2
3
4
5
6
7
8
Q0a
D0a
D1a
LEb
VCC
D0b
D1b
Q1b
Q0a
Q1a
Q1a
LEa
GND
Q0b
Q0b
Q1b
16
15
14
13
12
11
10
9
(Top view)
Block Diagram
Data Q
Q
Latch
Enable
HD74HC75
3
DC Characteristics
Ta = 25°CTa = –40 to
+85°C
Item Symbol VCC (V) Min Typ Max Min Max Unit Test Conditions
Input voltage VIH 2.0 1.5 — — 1.5 — V
4.5 3.15 — — 3.15 —
6.0 4.2 — — 4.2 —
VIL 2.0 — — 0.5 — 0.5 V
4.5 — — 1.35 — 1.35
6.0 — — 1.8 — 1.8
Output voltage VOH 2.0 1.9 2.0 — 1.9 — V Vin = VIH or VIL IOH = –20 µA
4.5 4.4 4.5 — 4.4 —
6.0 5.9 6.0 — 5.9 —
4.5 4.18 — — 4.13 — IOH = –4 mA
6.0 5.68 — — 5.63 — IOH = –5.2 mA
VOL 2.0 — 0.0 0.1 — 0.1 V Vin = VIH or VIL IOL = 20 µA
4.5 — 0.0 0.1 — 0.1
6.0 — 0.0 0.1 — 0.1
4.5 — — 0.26 — 0.33 IOL = 4 mA
6.0 — — 0.26 — 0.33 IOL = 5.2 mA
Input current Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND
Quiescent supply
current ICC 6.0 — — 2.0 — 20 µA Vin = VCC or GND, Iout = 0 µA
HD74HC75
4
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = 25°CTa = –40 to
+85°C
Item Symbol VCC (V) Min Typ Max Min Max Unit Test Conditions
Propagation delay tPLH 2.0 — — 125 — 155 ns D to Q
time tPHL 4.5 — 12 25 — 31
6.0 — — 21 — 26
2.0 — — 110 — 140 D to Q
4.5 — 13 22 — 28
6.0 — — 19 — 24
2.0 — — 145 — 180 Latch Enable to Q
4.5 — 12 29 — 36
6.0 — — 25 — 31
2.0 — — 125 — 155 Latch Enable to Q
4.5 — 13 25 — 31
6.0 — — 21 — 26
Output rise/fall tTLH 2.0 — — 75 — 95 ns
time tTHL 4.5 — 5 15 — 19
6.0 — — 13 — 16
Setup time tsu 2.0 100 — — 125 — ns Data to Latch Enable
4.5 20 4 — 25 —
6.0 17 — — 21 —
Hold time th2.0 5 — — 5 — ns Latch Enable to Data
4.5 5 0 — 5 —
6.0 5 — — 5 —
Pulse width tw2.0 80 — — 100 — ns Latch Enable
4.5 16 5 — 20 —
6.0 14 — — 17 —
Input capacitance Cin — — 5 10 — 10 pF
HD74HC75
5
Package Dimensions
Hitachi Code
JEDEC
EIAJ
Mass
(reference value)
DP-16
Conforms
Conforms
1.07 g
Unit: mm
6.30
19.20
16 9
81 1.3
20.00 Max
7.40 Max
7.62
0.25
+ 0.13
– 0.05
2.54 ± 0.25 0.48 ± 0.10
0.51 Min
2.54 Min 5.06 Max
0° – 15°
1.11 Max
Hitachi Code
JEDEC
EIAJ
Mass
(reference value)
FP-16DA
—
Conforms
0.24 g
Unit: mm
*Dimension including the plating thickness
Base material dimension
*0.22 ± 0.05
*0.42 ± 0.08
0.12
0.15
M
2.20 Max 5.5
10.06
0.80 Max
16 9
18
10.5 Max
+ 0.20
– 0.30
7.80
0.70 ± 0.20
0° – 8°
0.10 ± 0.10
1.15
1.27
0.40 ± 0.06
0.20 ± 0.04
HD74HC75
6
Hitachi Code
JEDEC
EIAJ
Mass
(reference value)
FP-16DN
Conforms
Conforms
0.15 g
Unit: mm
*Dimension including the plating thickness
Base material dimension
1.27
16 9
18
0.15
0.25
M
1.75 Max 3.95
*0.22 ± 0.03
9.9
0° – 8°
10.3 Max
+ 0.10
– 0.30
6.10
+ 0.67
– 0.20
0.60
+ 0.11
– 0.04
0.14
*0.42 ± 0.08
0.635 Max
0.40 ± 0.06
0.20 ± 0.03
1.08
HD74HC75
7
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
Copyright Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
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Telex : 23222 HAS-TP
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Germany
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Fax: <49> (89) 9 29 30 00
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Tel: <1> (408) 433-1990
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For further information write to:
Colophon 2.0
