iVPX7225 Series
3U VITA 46 VPX & VITA 65 OpenVPX Processor Board
One of first in a new li ne o f VPX products from Emerson Netw or k Po wer,
the 3U iVPX7225 features the dual- co re 3rd generation Intel® Core™ i7 2.5
GHz processor with integrated graphics and memory controller and the
mobile Intel® QM77 PCH chipset with leading edge I/O functionality. This
high compute den si t y plat form offers both high spee d fab ric connectivity
with PCI Express and Gigabit Ethernet control plane connectivity with data
transfer rates up to 5Gbps. On-board memory includes 8GB DDR3L-1600
memory (designed fo r 16GB), embedded USB flash, and 1MByte non-
volatile Ferroelectric Random Access Memory (F-RAM). Additional
connectivity include s three USB 2.0 ports, two serial ports, three SATA
ports, eight GPIO, DisplayPort, VGA and one XMC site for maximum
flexibility.
The iVPX7225 is a fully rugged SBC for extreme environments with
extended shock, vibration, temperatures and conduction cooling. It is
designed for a range of industrial, communication and military/aerospace
applications.
The iVPX7225 software support includes UEFI compliant BIO S w ith
password protection and a wide range of operating systems including Wind
River VxWork s 6. 9 an d Li nu x 3. x.
3rd generatio n Int e l ® C ore™ i7 2.5 GHz
dual-core integrated processor
8GB ECC-protected DDR3L-1600, soldered
down
Intel® QM77 platform controller
hub (PCH)
1MByte F-RAM
4GB USB NAND Flash
PCI Express Fat Pipe data plane
1000BASE-BX/KX control plane
SATA, USB and serial interfaces
Integrated 2D/3D graphics
with digital and VGA output
One XMC site
Optional rear transition module
Extended temperature -40 °C
to +71 °C and rugged variants
Air and conduction co oled
VITA 48 REDI two-level maintenance
(2LM)
FullyRugged3USBCfor
BlockDiagram
iVPX7225blockDiagram
HardwareSpecifications
PROCESSOR
Dual core 3rd generation Intel® Core™ i7 3555LE,
2.5GHz, 4MB L2 cache, 25W
MEMORY
Dual channel DDR3L with ECC, soldered down
Support for 8GBytes memory (designed to support up to
16GBytes)
USERFLASH/NVRAMMEMORY
4GByte embedded USB flash
1MByte F-RAM (NVRAM)
BOOTFLASHMEMORY
Dual UEFI BIOS in dual 8MB SPI flash devices
Support for crisis recovery
BACKPLANEI/O
Two (2) 1000BASE-BX/KX Ethernet (Ultra Thin Pipe
(control plane)
Two (2) PCIe x4 Gen2 (Fat Pipe data plane)
One port configurable with non-transparent bridging
capability
One (1) DisplayPort
One (1) VGA
Three (3) USB 2.0
Three (3) SATA (2x 6Gbps, 1x 3Gbps)
Two (2) RS-232/RS-422/RS-485
Eight (8) GPIO
XMC X12d I/O (to P2; optional X8d)
SMBus
IPMC I2C
Selective Read-Only Override pins
RTM control signals
FRONTPANEL
Air cooled
XMC front panel I/O
Reset switch
Status LEDs
Conduction cooled
Reset switch
Status LEDs
ETHERNETCONTROLLERS
PCIe x4 to 2X 1000BASE-BX/KX to OpenVPX back-
plane through 82580 Ethernet controller
EXPANSIONI/O
One (1) XMC expansion site with PCIe x8 Gen 2 and 1
x SATA 3Gbps connections.
OpenVPXPROFILES
Payload module profile
MOD3-PAY-2F2U-16.2.3-2/3
MOD3-PAY-1F1F2U-16.2.4-3/4
Payload slot p rofile
SLT3-PAY-2F2U-14.2.3
SLT3-PAY-1F1f2U-14.2.4
OPTIONALTRANSITIONMODULE
Mini DisplayPort, VGA, USB 2.0, Ethernet, Serial, I2C,
GPIO, SATA, SMC I/O, write protect override switches
OTHERFEATURES
Watchdog unit
Trusted Platform Module (TPM)
Intel® vPro™ Technology capable (supports Intel®
TXT, VT, and TPM)
VITA 46.11 system management IPMI V1.5 compliant
Multiple 32-bit timers
Temperature sensors
Status and user LEDs
Reset switch
Locking ejector handle
BIOS
UEFI BIOS
POWERREQUIREMENTS
Maximum for 2.5GHz, 8GByte memory variant
5.0 V 58W (Estimated)
POWERREQUIREMENTS
Intended for use in systems meeting the following regu-
lations:
US: FCC Part 15, Subpart B, Class A (non-
residential)
Canada: ICES-003, Class A (non-residential)
DOCUMENTATION
Installation and User Manual: Front Board and RTM
Hardware Release Notes
Software Release Notes/Guides
Environmental Specifications
Ruggedization Level ENP1 ENP2 ENP3 ENP4
Cooling Method Forced Air Forced Air Conduction Conduction
Operating Temperature 0 °C to +55 °C -40 °C to +71 °C -40 °C to +71 °C -40 °C to +85 °C
Storage Temperature -40 °C to +85 °C -50 °C to +100 °C -50 °C to +100 °C -50 °C to +125 °C
Vibration Sine (10 min/Axis) 2G, 5 to 2000 HZ 10G, 15 to 2000 HZ 10G, 15 to 2000 HZ 10G, 15 to 2000 HZ
Vibration Random (1 Hr/Axis) 0.01g2/Hz, 15 to
2000 Hz
0.04g2/Hz, 15 to
2000 Hz (8GRMS)1
0.1g2/Hz, 15 to
2000 Hz (12GRMS)2
0.1g2/Hz, 15 to
2000 Hz (12GRMS)2
Shock 20g/11ms 30g/11ms 40g/11ms 40g/11ms
Humidity to 95% RH3 to 100% RH3 to 100% RH3 to 100% RH3
Conformal Coating Optional Optional Optional Optional
ENP2 and ENP3 variants available for this product line.
Note 1: Flat 15-1000 Hz, -6db/octave 1000-2000 Hz [MIL-STD 810F Figure 514.5C- 17]
Note 2: +3db/octave 15-300 Hz, Flat .1g2 300-1000 Hz, -6db/octave 1000-2000 Hz [MIL-STD 810F Figure 514.5C-8]
Note 3: Up to 100% RH with optional conformal coating
companies. ©2012 Emerson Electric Co.
OrderingInformation
PartNumber Description
iVPX7225-02250802 3UVPX,Air,Dual-Core2.5GHz3555LE,8GBDDR3L,.8”FP,ENP2
iVPX7225-02250822 3UVPX,Air,QuadDual-Core2.5GHzE3555LE,8GBDDR3L,1”FP,ENP2
iVPX7225-02250813L 3UVPX,Conduction,Dual-Core2.5GHZ3555LE,8GBDDR3L,.85”PITCH,ENP3
IVPX7225-02250813 3UVPX,Conduction,Dual-Core2.5GHZ3555LE,8GBDDR3L,.85"PITCH,ENP3,
NO2LMCOVERS
IVPX7225-RTM 3UVPX,AIR,RTMFORIVPX7225,.8”FACEPLATE
IVPX7225-RTM-1 3UVPX,AIRCOOLED,RTMFORIVPX7225,1”FACEPLATE