TDA8793HL - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Preliminary speciﬁcation

Supersedes data of 1998 May 14

File under Integrated Circuits, IC02

1999 Oct 06

INTEGRATED CIRCUITS

TDA8793

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC)

1999 Oct 06 2

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

FEATURES

•8-bit low-power ADC (170 mW typical)

•2.7 to 3.6 V operation

•Sampling rate up to 100 Msps

•Track-and-hold circuit

•CMOS/TTL compatible digital inputs and outputs

•Internal references

•Adjustable full scale range possibility with external

reference

•Power-down mode; 5 mW.

APPLICATIONS

•Radio communications

•Digital data storage read channels

•Medical imaging

•Digital instrumentation.

GENERAL DESCRIPTION

The TDA8793 is an 8-bit low-power Analog-to-Digital

Converter (ADC) which includes a track-and-hold circuit

and internal references. The device converts an analog

input signal, up to 100 MHz, into 8-bit binary codes at a

maximum sample rate of 100 Msps. All digital inputs and

outputareTTL/CMOScompatible.Asinewaveclockinput

signal can also by used.

The Power-down mode enables the device power

consumption to be reduced to 5 mW.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VCCA analog supply voltage 2.7 3.0 3.6 V

VCCD digital supply voltage 2.7 3.0 3.6 V

VCCO output stages supply voltage 2.7 3.0 3.6 V

ICCA analog supply current operating 32 40 48 mA

standby 0 5 100 µA

ICCD digital supply current operating 13 16 22 mA

standby 0 0.65 1.1 mA

ICCO output stages supply current −0.1 −mA

INL integral non-linearity ramp input; fCLK = 2 MHz;

VCCA =V

CCD =3V −±0.8 tbf LSB

DNL differential non-linearity ramp input; fCLK = 2 MHz;

VCCA =V

CCD =3V −±0.25 tbf LSB

fCLK(max) maximum clock input frequency 100 −−MHz

Ptot total power dissipation VCC =3V −170 −mW

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA8793HL LQFP32 plastic low proﬁle quad ﬂat package; 32 leads; body 5 ×5×1.4 mm SOT401-1

1999 Oct 06 3

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

BLOCK DIAGRAM

handbook, full pagewidth

MGR016

TRACK-AND-

HOLD ADC LATCHES CMOS

OUTPUTS

VREFOUT = 1.85 V

VSDN = 1.25 V

REFERENCE

INN

REFOUT 2

REFIN

SDN

STDBY

INP

CLK

TEN

DEC

AGND

VCCA

VCCD

VCCO2

VCCO1

CLOCK DRIVER

DGND

OGND1

ODGND2

TDA8793

Fig.1 Block diagram.

1999 Oct 06 4

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 not connected

REFIN 2 reference input for ADC

INN 3 negative input

INP 4 positive input

REFOUT 5 reference for AC coupling

AGND 6 analog ground

VCCA 7 analog supply voltage

STDBY 8 standby mode input

DGND 9 digital ground

VCCD 10 digital supply voltage

CLK 11 clock input

TEN 12 track enable input (active LOW)

n.c. 13 not connected

n.c. 14 not connected

D0 15 data output bit 0 (LSB)

D1 16 data output bit 1

D2 17 data output bit 2

D3 18 data output bit 3

OGND1 19 output ground 1

VCCO1 20 output supply voltage 1

OGND2 21 output ground 2

VCCO2 22 output supply voltage 2

D4 23 data output bit 4

D5 24 data output bit 5

D6 25 data output bit 6

D7 26 data output bit 7 (MSB)

n.c 27 not connected

n.c 28 not connected

n.c 29 not connected

n.c 30 not connected

DEC 31 decoupling

SDN 32 stabilized decoupling node

SYMBOL PIN DESCRIPTION

handbook, full pagewidth

TDA8793

MGR017

n.c.

REFOUT

STDBY

VCCA

INN

AGND

DGND

CLK

n.c.

VCCD

D0 D7

n.c.

SDN

n.c.

VCCO2

VCCO1

n.c.

OGND2

DEC

n.c.

D1 D6

OGND1

n.c.

TEN

INP

REFIN

Fig.2 Pin configuration.

1999 Oct 06 5

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is

desirable to take normal precautions appropriate to handling integrated circuits.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCCA analog supply voltage −0.3 +7.0 V

VCCD digital supply voltage −0.3 +7.0 V

VCCO output stages supply voltage −0.3 +7.0 V

∆VCC supply voltage differences between

VCCA and VCCD −1.0 +1.0 V

VCCO and VCCD −1.0 +1.0 V

VCCA and VCCO −1.0 +1.0 V

VINP, INN input voltage range referenced to AGND −0.3 +7.0 V

IOoutput current −10 mA

Tstg storage temperature −55 +150 °C

Tamb ambient temperature 0 70 °C

Tjjunction temperature −−°C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth(j-a) thermal resistance from junction to ambient in free air 94 K/W

1999 Oct 06 6

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

CHARACTERISTICS

VCCA =V

7to V6= 2.7 to 3.6 V; VCCD =V

10 to V9= 2.7 to 3.6 V; VCCO =V

20 (or V22) to V19 (or V21) = 2.7 to 3.6 V;

AGND to DGND and OGND shorted together; VCCA to VCCD =−0.15 to +0.15 V; VCCD to VCCO =−0.15 to +0.15 V;

VCCA to VCCO =−0.15 to +0.15 V; Tamb = 0 to 70 °C; typical values measured at VCCA =V

CCD =V

CCO = 3.0 V and

Tamb =25°C; single-ended input; unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

VCCA analog supply voltage 2.7 3.0 3.6 V

VCCD digital supply voltage 2.7 3.0 3.6 V

VCCO output stages supply voltage 2.7 3.0 3.6 V

ICCA analog supply current 32 40 48 mA

ICCD digital supply current 13 16 22 mA

ICCO output stages supply current fi= ramp input −0.1 tbf mA

fi= 20 MHz −4 tbf mA

Internal reference (pin SDN); note 1

Vref reference voltage 1.21 1.25 1.29 V

Vreg line regulation voltage 2.7 < VCCA < 3.6 V −0.4 3 mV

TC temperature coefﬁcient −18 −ppm/K

ILload current −1−−mA

Internal reference (pin REFOUT)

Vo(ref) reference voltage 1.76 1.82 1.88 V

Vo(reg) line regulation voltage 2.7 < VCCA < 3.6 V −1.5 4 mV

TC temperature coefﬁcient −18 −ppm/K

ILload current −1−−mA

Adjustable full scale input (pin REFIN); see Figs 3, 4,and 7

Iref input current VREFIN = 1.25 V −−0.87 −mA

Clock input (pin CLK); note 2

VIL LOW-level input voltage 0 −0.8 V

VIH HIGH-level input voltage 2 −VCCD V

IIL LOW-level input current VCLK =0 −2−+2 µA

IIH HIGH-level input current VCLK =V

CCD −−5µA

rclock rise time 0.75 −tbf ns

tfclock fall time 0.75 −tbf ns

Ziinput impedance fCLK = 100 MHz −32 −kΩ

Ciinput capacitance fCLK = 100 MHz −2−pF

Standby input (pin STDBY); see Table 1

VIL LOW-level input voltage 0 −0.8 V

VIH HIGH-level input voltage 2 −VCCD V

IIL LOW-level input current VSTDBY =0 −5−−µA

IH HIGH-level input current VSTDBY =V

CCD −−5µA

1999 Oct 06 7

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

Track enable input (pin TEN); see Table 2

VIL LOW-level input voltage 0 −0.8 V

VIH HIGH-level input voltage 2 −VCCD V

IIL LOW-level input current VTEN =0 −5−−µA

IH HIGH-level input current VTEN =V

CCD −−5µA

Inputs (pins INP and INN); analog input voltage referenced to AGND; VREFIN = 1.27 V; see Table 3

Vi(p-p) input voltage range

(peak-to-peak value) Vi=V

INP −VINN;

Tamb =25°C0.90 0.97 1.040 V

∆TCI input voltage range drift −0.5 −mV/K

Vi(os) input offset voltage output code = 127 −25 −+25 mV

Ziinput impedance fINP = 50 MHz −90 −kΩ

Ciinput capacitance fINP = 50 MHz −2−pF

IIL LOW-level input current VINP =V

REFOUT + 0.5 −1−−µA

INP =V

REFOUT −0.5 −1−−µA

IH HIGH-level input current VINP =V

REFOUT + 0.5 −−40 µA

VINP =V

REFOUT −0.5 −−40 µA

Adjustable full scale range; VREFIN = 1.2 to 1.35 V; see Fig.3

VI(p-p) input voltage range

(peak-to-peak value) Vi=V

INP −VINN;

Tamb =25°C−1−V

Voltage controlled regulator input pin VREFIN (referenced to AGND); note 3

Vi(ref) reference voltage tbf 1.25 tbf V

Ii(ref) input current on pin VREFIN −tbf 1.1 mA

Outputs; ADC data outputs

VOL LOW-level output voltage IO=1mA −−0.5 V

VOH HIGH-level output voltage IO=−0.4 mA VCCO −0.5 −VCCO V

CLoutput load capacitance −−10 pF

δv/δt slew rate 10% to 90%; CL=10pF −1.2 −V/ns

Switching characteristics; note 2; see Table 1

fCLK(min) minimum clock frequency track = LOW −−6 MHz

fCLK(max) maximum clock frequency 100 −−MHz

tW(CLKH) clock pulse width HIGH 4 −−ns

tW(CLKL) clock pulse width LOW 4 −−ns

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Oct 06 8

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

Analog signal processing; note 3; see Figs 4, 5, 6 and 7

INL integral non-linearity ramp input; fCLK = 2 MHz;

VCCA =V

CCD =3V −±0.8 tbf LSB

DNL differential non-linearity ramp input; fCLK = 2 MHz;

VCCA =V

CCD =3V −±0.25 tbf LSB

S/N signal-to-noise ratio (full scale) without harmonics;

fCLK = 100 MHz

fi= 20 MHz 42 45 −dB

fi= 50 MHz −45 −dB

BW(−3dB) −3 dB analog bandwidth −350 −MHz

THD total harmonics distortion fi= 20 MHz −−56 −dB

fi= 50 MHz −−52 −dB

Hfund(FS) full scale fundamental harmonics fCLK = 100 MHz

fi= 20 MHz −−0dB

= 50 MHz −−0dB

D2(FS) second harmonic distortion (full

scale) all components included differential inputs;

fCLK = 100 MHz

fi= 20 MHz −66 −dB

fi= 50 MHz −57 −dB

single-ended input;

fCLK = 100 MHz

fi= 20 MHz −66 −dB

fi= 50 MHz −55 −dB

HD3(FS) third harmonic distortion (full scale)

all components included differential inputs;

fCLK = 100 MHz

fi= 20 MHz −64 −dB

fi= 50 MHz −61 −dB

single-ended input;

fCLK = 100 MHz

fi= 20 MHz −64 −dB

fi= 50 MHz −59 −dB

SFDR spurious free dynamic range fCLK = 100 MHz dB

fi= 20 MHz −57 −dB

fi= 50 MHz −54 −dB

EB effective bits fCLK = 100 MHz; note 4 bits

fi= 20 MHz 7.0 7.4 −bits

fi= 50 MHz −7.2 −bits

Data timing; fCLK = 100 MHz; CL=10pF;see Fig.8

tds sampling delay −−1.5 ns

thoutput hold time 3 −−ns

tdoutput delay time −58ns

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 Oct 06 9

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

Notes

1. It is possible to use the reference output voltage (pin SDN) to drive other analog circuits under the limits indicated.

2. In addition to a good layout of the digital and analog grounds, it is recommended that the rise and fall times of the

clock must be not less than 0.75 ns.

3. It is possible with an external reference voltage connected to REFIN pin to adjust the ADC input range. The input

range variation will be fixed.

4. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8 k acquisition points per equivalent

fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency

(nyquist frequency). Conversion to signal-to-noise ratio: SINAD = 6.02 ×EB + 1.76 dB.

Table 1 Standby selection

Table 2 Track-and-hold selection

Table 3 Output coding and input voltage (typical values; referenced to AGND); VREFIN = 1.27 V

PIN STDBY D0 TO D7 ICCA +I

CCD

LOW inactive 56 mA

HIGH active; output logic state LOW 0.7 mA

PIN TEN TRACK-AND-HOLD

LOW active

HIGH inactive; tracking mode

STEP VINP (V) VINN (V) BINARY OUTPUT BITS

D7 D6 D5 D4 D3 D2 D1 D0

Underﬂow <1.6 >2.1 0 0000000

0 1.6 2.1 00000000

1 ... ... 00000001

... ... ... ... ... ... ... ... ... ... ...

127 1.85 1.85 ... ... ... ... ... ... ... ...

... ... ... ... ... ... ... ... ... ... ...

254 ... ... 11111110

255 2.1 1.6 11111111

Overﬂow >2.1 <1.6 1 1111111

1999 Oct 06 10

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

handbook, halfpage

1.15 1.25 VREFIN (V)

Vi(p-p)

(V)

1.35 1.45

1.4

1.2

0.8

0.6

FCE421

Fig.3 ADC input voltage as a function of VREFIN

reference input voltage.

Typical values measured at VCCA =V

CCD =V

CCO = 3.0 V,

fCLK = 100 MHz, Tamb =25°C and single-ended input.

handbook, halfpage

1.15 1.25

(1)

(2)

VREFIN (V)

SFDR

S/N

(dB)

1.35 1.45

FCE423

Fig.4 Noise and spurious free dynamic range as

a function of VREFIN reference input voltage.

(1) SFDR

(2) S/N

Typical values measured at VCCA =V

CCD =V

CCO = 3.0 V,

fCLK = 100 MHz, Tamb =25°C and single-ended input.

handbook, halfpage

FCE419

(3)

10 fi (MHz)

THD

S/N

(dB)

(1)

(2)

Fig.5 Noise and distortion as a function of input

frequency.

(1) THD for differential inputs

(2) THD for single-ended input

(3) S/N

Typical values measured at VCCA =V

CCD =V

CCO = 3.0 V,

fCLK = 100 MHz and Tamb =25°C.

handbook, halfpage

5.5

6.5

7.5

FCE420

110

(bits)

(1)

(2)

fi (MHz)

Fig.6 Effective bits as a function of input frequency.

(1) Differential inputs

(2) Single-ended input

Typical values measured at VCCA =V

CCD =V

CCO = 3.0 V,

fCLK = 100 MHz and Tamb =25°C.

Fig.6 Effective bits as a function of input frequency.

1999 Oct 06 11

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

handbook, halfpage

1.15

51.25 1.35 VREFIN (V)

(bits)

1.45

FCE422

Fig.7 Effective bits as a function of VREFIN

reference input voltage.

Typical values measured at VCCA =V

CCD =V

CCO = 3.0 V,

fCLK = 100 MHz, Tamb =25°C and single-ended input.

handbook, full pagewidth

tds

CLK

MGR018

50 %

HIGH

LOW

50 %

HIGH

LOW

sample N sample N + 1 sample N + 2

DATA

D0 to D7

tCPH

tCPL

DATA

N − 1

DATA

N − 2 DATA

N + 1

DATA

Fig.8 Timing diagram.

1999 Oct 06 12

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

APPLICATION INFORMATION

handbook, full pagewidth

MGR019

50 Ω50 Ω

231

100 nF

10 nF

220 nF

100 nF

input

REFIN

DEC

32SND

INN

INP

REFOUT

100 nF

TDA8793

Fig.9 Application diagram for single-ended input mode with internal reference.

handbook, full pagewidth

MGR020

50 Ω50 Ω

231

100 nF

10 nF

220 nF

100 nF

input

REFIN

DEC

INN

INP

REFOUT

100 nF

EXTERNAL

REFERENCE

1.25 V

TDA8793

Fig.10 Application diagram for single-ended input mode with external reference.

1999 Oct 06 13

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

handbook, full pagewidth

MGR021

50 Ω

231

100 nF

220 nF

100 nF

input 1

input 2

REFIN

DEC

32SND

INN

INP

REFOUT

100 nF

TDA8793

Fig.11 Application diagram for differential input mode with internal reference.

handbook, full pagewidth

MGR022

100 Ω100 Ω

231

100 nF

input

REFIN

DEC

1 : 1

SND

INN

INP

REFOUT

100 nF

220 nF

TDA8793

Fig.12 Application diagram for differential input mode using a transformer.

1999 Oct 06 14

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

PACKAGE OUTLINE

0.2

UNIT A

max. A1A2A3bpcE

(1) eH

pZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 1.60 0.15

0.05 1.5

1.3 0.25 0.27

0.17 0.18

0.12 5.1

4.9 0.5 7.15

6.85 1.0 0.95

0.55 7

0.12 0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.75

0.45

SOT401-1 95-12-19

97-08-04

D(1) (1)(1)

5.1

4.9

7.15

6.85

0.95

0.55

vMB

vMA

24 17

detail X

(A )

0 2.5 5 mm

scale

LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm SOT401-1

pin 1 index

1999 Oct 06 15

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

SOLDERING

Introduction to soldering surface mount packages

Thistextgivesaverybrief insighttoacomplex technology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable

for surface mount ICs, or for printed-circuit boards with

high population densities. In these situations reflow

soldering is often used.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

totheprinted-circuitboardbyscreenprinting,stencillingor

pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary

between 100 and 200 seconds depending on heating

method.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended

forsurface mountdevices(SMDs) orprinted-circuitboards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•Forpackages withleadson foursides,the footprintmust

be placed at a 45°angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

1999 Oct 06 16

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

Suitability of surface mount IC packages for wave and reﬂow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

PACKAGE SOLDERING METHOD

WAVE REFLOW(1)

BGA, SQFP not suitable suitable

HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(2) suitable

PLCC(3), SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended(3)(4) suitable

SSOP, TSSOP, VSO not recommended(5) suitable

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

1999 Oct 06 17

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

NOTES

1999 Oct 06 18

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

NOTES

1999 Oct 06 19

Philips Semiconductors Preliminary speciﬁcation

8-bit, low-power, 3 V, 100 Msps

Analog-to-Digital Converter (ADC) TDA8793

NOTES

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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999 68

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For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,

5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

Argentina: see South America

Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. +61 2 9704 8141, Fax. +61 2 9704 8139

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,

Tel. +359 2 68 9211, Fax. +359 2 68 9102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,

Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. +45 33 29 3333, Fax. +45 33 29 3905

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615 800, Fax. +358 9 6158 0920

France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. +33 1 4099 6161, Fax. +33 1 4099 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,

Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: PTPhilipsDevelopmentCorporation, SemiconductorsDivision,

Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,

Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),

Tel. +39 039 203 6838, Fax +39 039 203 6800

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,

TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,

Tel. +47 22 74 8000, Fax. +47 22 74 8341

Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,

Tel. +48 22 5710 000, Fax. +48 22 5710 001

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,

Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Al. Vicente Pinzon, 173, 6th floor,

04547-130 SÃO PAULO, SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,

ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 62 5344, Fax.+381 11 63 5777

Printed in The Netherlands 545004/02/pp20 Date of release: 1999 Oct 06 Document order number: 9397 750 06028