LM1877 www.ti.com SNAS550B - FEBRUARY 1995 - REVISED APRIL 2013 LM1877 Dual Audio Power Amplifier Check for Samples: LM1877 FEATURES DESCRIPTION * * * * * * * * The LM1877 is a monolithic dual power amplifier designed to deliver 2W/channel continuous into 8 loads. The LM1877 is designed to operate with a low number of external components, and still provide flexibility for use in stereo phonographs, tape recorders and AM-FM stereo receivers. Each power amplifier is biased from a common internal regulator to provide high power supply rejection, and output Q point centering. The LM1877 is internally compensated for all gains greater than 10. 1 2 2W/Channel -65 dB Ripple Rejection, Output Referred -65 dB Channel Separation, Output Referred Wide Supply Range, 6V-24V Very Low Cross-Over Distortion Low Audio Band Noise AC Short Circuit Protected Internal Thermal Shutdown APPLICATIONS * * * * * * * Multi-Channel Audio Systems Stereo Phonographs Tape Recorders and Players AM-FM Radio Receivers Servo Amplifiers Intercom Systems Automotive Products Connection Diagram Figure 1. 14-Pin SOIC or PDIP (Top View) See NPA0014B or NFF0014A Package 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1995-2013, Texas Instruments Incorporated LM1877 SNAS550B - FEBRUARY 1995 - REVISED APRIL 2013 www.ti.com Equivalent Schematic Diagram These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage 26V Input Voltage 0.7V Operating Temperature 0C to +70C -65C to +150C Storage Temperature Junction Temperature Lead Temperature 150C PDIP Package Soldering (10 sec.) 260C SOIC Package Infrared (15 sec.) 220C SOIC Package Vapor Phase (60 sec.) Thermal Resistance (1) (2) 2 215C JC (PDIP Package) 30C/W JA (PDIP Package) 79C/W JC (SOIC Package) 27C/W JA (SOIC Package) 114C/W Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM1877 LM1877 www.ti.com SNAS550B - FEBRUARY 1995 - REVISED APRIL 2013 Electrical Characteristics VS = 20V, TA = 25C (1) RL = 8, AV = 50 (34 dB) unless otherwise specified Parameter Conditions Total Supply Current PO = 0W Output Power THD = 10% LM1877 VS = 20V, RL = 8 Min LM1877 Max Units 25 50 mA 2.0 VS = 12V, RL = 8 Total Harmonic Distortion Typ W/Ch 1.3 W/Ch PO = 50 mW/Channel 0.075 % PO = 500 mW/Channel 0.045 % f = 1 kHz, VS = 14V PO = 1 W/Channel 0.055 % Output Swing RL = 8 VS -6 Vp-p Channel Separation CF = 50 F, CIN = 0.1 F, -70 dB -60 dB -65 dB -40 dB 2.5 V RS = 0, CN = 0.1 F, AV 200 0.80 mV RS = 0, f = 100 kHz, RL = 8 70 dB Input Offset Voltage 15 mV Input Bias Current 50 nA f = 1 kHz, Output Referred VS = 20V, VO = 4 Vrms -50 VS = 7V, VO = 0.5 Vrms PSRR Power Supply CF = 50 F, CIN = 0.1 F, Rejection Ratio f = 120 Hz, Output Referred VS = 20V, VRIPPLE = 1 Vrms -50 VS = 7V, VRIPPLE = 0.5 Vrms Noise Equivalent Input Noise RS = 0, CIN = 0.1 F, BW = 20 Hz-20 kHz, Output Noise Wideband Open Loop Gain Input Impedance Open Loop DC Output Level VS = 20V 4 9 Slew Rate 10 M 11 V 2.0 V/s Power Bandwidth 65 kHz Current Limit 1.0 A (1) For operation at ambient temperature greater than 25C, the LM1877 must be derated based on a maximum 150C junction temperature. Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM1877 3 LM1877 SNAS550B - FEBRUARY 1995 - REVISED APRIL 2013 www.ti.com Typical Performance Characteristics 4 Device Dissipation vs Ambient Temperature Power Supply Rejection Ratio (Referred to the Output) vs Frequency Figure 2. Figure 3. Power Supply Rejection Ratio (Referred to the Output) vs Frequency Power Supply Rejection Ratio (Referred to the Output) vs Supply Voltage Figure 4. Figure 5. Channel Separation (Referred to the Output) vs Frequency Channel Separation (Referred to the Output) vs Frequency Figure 6. Figure 7. Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM1877 LM1877 www.ti.com SNAS550B - FEBRUARY 1995 - REVISED APRIL 2013 Typical Performance Characteristics (continued) Average Supply Current vs POUT Total Harmonic Distortion vs Frequency Figure 8. Figure 9. Total Harmonic Distortion vs Frequency Power Dissipation (W) Both Channels Operating Figure 10. Figure 11. Open Loop Gain vs Frequency Output Swing vs Supply Voltage Figure 12. Figure 13. Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM1877 5 LM1877 SNAS550B - FEBRUARY 1995 - REVISED APRIL 2013 www.ti.com Typical Applications Figure 14. Stereo Phonograph Amplifier with Bass Tone Control 6 Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM1877 LM1877 www.ti.com SNAS550B - FEBRUARY 1995 - REVISED APRIL 2013 Figure 15. Frequency Response of Bass Tone Control Figure 16. Inverting Unity Gain Amplifier Figure 17. Stereo Amplifier with AV = 200 Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM1877 7 LM1877 SNAS550B - FEBRUARY 1995 - REVISED APRIL 2013 www.ti.com Figure 18. Non-Inverting Amplifier Using Split Supply 8 Figure 19. Typical Split Supply Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM1877 LM1877 www.ti.com SNAS550B - FEBRUARY 1995 - REVISED APRIL 2013 REVISION HISTORY Changes from Revision A (April 2013) to Revision B * Page Changed layout of National Data Sheet to TI format ............................................................................................................ 7 Submit Documentation Feedback Copyright (c) 1995-2013, Texas Instruments Incorporated Product Folder Links: LM1877 9 PACKAGE OPTION ADDENDUM www.ti.com 27-Oct-2016 PACKAGING INFORMATION Orderable Device Status (1) LM1877MX-9/NOPB ACTIVE Package Type Package Pins Package Drawing Qty SOIC NPA 14 1000 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR Op Temp (C) Device Marking (4/5) 0 to 70 LM1877M -9 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 27-Oct-2016 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device LM1877MX-9/NOPB Package Package Pins Type Drawing SOIC NPA 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1000 330.0 16.4 Pack Materials-Page 1 10.9 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 9.5 3.2 12.0 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM1877MX-9/NOPB SOIC NPA 14 1000 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA NPA0014B www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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