LNK562DN-TL - Powerint - Product.Network

Rated Output Power = VR • IR

PI-3924-011706

Figure 1. Typical Application – not a Simpliﬁ ed Circuit (a) and

Output Characteristic Envelope (b).

Product Highlights

Lowest System Cost and Advanced Safety Features

• Lowest component count switcher

• Very tight parameter tolerances using proprietary IC

trimming technology and transformer construction

techniques enable Clampless™designs – decreases

component count/system cost and increases efﬁ ciency

• Meets industry standard requirements for thermal overload

protection – eliminates the thermal fuse used with linear

transformers or additional components in RCC designs

• Frequency jittering greatly reduces EMI – enables low cost

input ﬁ lter conﬁ guration

• Meets HV creepage requirements between DRAIN and all

other pins, both on the PCB and at the package

• Proprietary E-Shield™ transformer eliminates Y-capacitor

Superior Performance over Linear and RCC

• Hysteretic thermal shutdown protection – automatic

recovery improves ﬁ eld reliability

• Universal input range allows worldwide operation

• Auto-restart reduces delivered power by >85% during

short circuit and open loop fault conditions

• Simple ON/OFF control, no loop compensation needed

• High bandwidth provides fast turn on with no overshoot

and excellent transient load response

EcoSmart®– Energy Efﬁ ciency Technology

• Easily meets all global energy efﬁ ciency regulations with

no added components

• No-load consumption <150 mW at 265 VAC input

• ON/OFF control provides constant efﬁ ciency to very

light loads – ideal for mandatory CEC regulations

Applications

• Chargers for cell/cordless phones, PDAs, power tools,

MP3/portable audio devices, shavers etc.

• Standby and auxiliary supplies

Description

LinkSwitch-LP switcher ICs cost effectively replace all

unregulated isolated linear transformer based (50/60 Hz) power

supplies up to 3 W output power. For worldwide operation, a

single universal input design replaces multiple linear transformer

based designs. The self-biased circuit achieves an extremely low

no-load consumption of under 150 mW. The internal oscillator

frequency is jittered to signiﬁ cantly reduce both quasi-peak and

average EMI, minimizing ﬁ lter cost.

Table 1. Output Power Table.

Notes:

1. Output power may be limited by speciﬁ c application parameters

including core size and Clampless operation (see Key Application

Considerations).

2. Minimum continuous power in a typical non-ventilated enclosed

adapter measured at 50 °C ambient.

3. Minimum practical continuous power in an open frame design with

adequate heat sinking, measured at 50 °C ambient.

4. Packages: P: DIP-8B, G: SMD-8B, D: SO-8C. For lead-free

package options, see Part Ordering Information.

OUTPUT POWER TABLE1

PRODUCT4

230 VAC ±15% 85-265 VAC

Adapter2Open

Frame3Adapter2Open

Frame3

LNK562P/G/D 1.9 W 1.9 W 1.9 W 1.9 W

LNK563P/G/D 2.5 W 2.5 W 2.5 W 2.5 W

LNK564P/G/D 3 W 3 W 3 W 3 W

(a)

(b)

Output

LinkSwitch-LP

PI-3923-092705

LNK562-564

LinkSwitch-LP

Energy Efﬁ cient Off-Line Switcher IC for

Linear Transformer Replacement

November 2008

Rev. H 11/08

LNK562-564

PI-4547-011107

FB D

P Package (DIP-8B)

G Package (SMD-8B)

FB S

D Package (SO-8C)

Figure 2. Functional Block Diagram.

Pin Functional Description

DRAIN (D) Pin:

The power MOSFET drain connection provides internal

operating current for both startup and steady-state operation.

BYPASS (BP) Pin:

A 0.1 μF external bypass capacitor for the internally generated

5.8 V supply is connected to this pin.

FEEDBACK (FB) Pin:

During normal operation, switching of the power MOSFET is

controlled by this pin. MOSFET switching is disabled when a

current greater than 70 μA ﬂ ows into this pin.

SOURCE (S) Pin:

This pin is the power MOSFET source connection. It is also the

ground reference for the BYPASS and FEEDBACK pins.

LinkSwitch-LP Functional

Description

LinkSwitch-LP comprises a 700 V power MOSFET switch with

a power supply controller on the same die. Unlike conventional

PWM (pulse width modulation) controllers, it uses a simple

ON/OFF control to regulate the output voltage. The controller

consists of an oscillator, feedback (sense and logic) circuit, 5.8

V regulator, BYPASS pin undervoltage circuit, over-temperature

Figure 3. Pin Conﬁ guration.

protection, frequency jittering, current limit circuit, and leading

edge blanking.

Oscillator

The typical oscillator frequency is internally set to an average

of 66/83/100 kHz for the LNK562, 563 & 564 respectively.

Two signals are generated from the oscillator: the maximum

duty cycle signal (DCMAX) and the clock signal that indicates

the beginning of each switching cycle.

PI-3958-092905

CLOCK

JITTER

AUTO-RESTART

COUNTER FAULT

PRESENT

OSCILLATOR

5.8 V

4.85 V

SOURC

(S)

DCMAX

ADJ

BYPASS

(BP)

VILIMIT

LEADING

EDGE

BLANKING

THERMAL

SHUTDOWN

DRAIN

(D)

BYPASS PIN

UNDER-VOLTAGE

CURRENT LIMIT

COMPARATOR

FEEDBACK

(FB)

OPEN LOOP

PULLDOWN Q

6.3 V

1.69 V -VTH

0.8 V

REGULATOR

5.8 V

RESET

LNK562-564

Rev. H 11/08

The oscillator incorporates circuitry that introduces a small

amount of frequency jitter, typically 5% of the switching

frequency, to minimize EMI. The modulation rate of the

frequency jitter is set to 1 kHz to optimize EMI reduction

for both average and quasi-peak emissions. The frequency

jitter, which is proportional to the oscillator frequency, should

be measured with the oscilloscope triggered at the falling

edge of the DRAIN voltage waveform. The waveform in

Figure 4 illustrates the frequency jitter. The oscillator frequency

is reduced when the FB pin voltage is less than 1.69 V as

described below.

Feedback Input Circuit

The feedback input circuit at the FB pin consists of a low

impedance source follower output set at 1.69 V. When the current

delivered into this pin exceeds 70 μA, a low logic level (disable)

is generated at the output of the feedback circuit. This output

is sampled at the beginning of each cycle on the rising edge of

the clock signal. If high, the power MOSFET is turned on for

that cycle (enabled), otherwise the power MOSFET remains

off (disabled). Since the sampling is done only at the beginning

of each cycle, subsequent changes in the FB pin voltage or

current during the remainder of the cycle are ignored. When

the FB pin voltage falls below 1.69 V, the oscillator frequency

linearly reduces to typically 48% at the auto-restart threshold

voltage of 0.8 V. This function limits the power supply output

current at output voltages below the rated voltage regulation

threshold VR (see Figure 1).

5.8 V Regulator and 6.3 V Shunt Voltage Clamp

The 5.8 V regulator charges the bypass capacitor connected to

the BYPASS pin to 5.8 V by drawing a current from the voltage

on the DRAIN, whenever the MOSFET is off. The BYPASS

pin is the internal supply voltage node. When the MOSFET

is on, the device runs off of the energy stored in the bypass

capacitor. Extremely low power consumption of the internal

circuitry allows LinkSwitch-LP to operate continuously from the

current drawn from the DRAIN pin. A bypass capacitor value of

0.1 μF is sufﬁ cient for both high frequency decoupling and

energy storage.

In addition, there is a 6.3 V shunt regulator clamping the

BYPASS pin at 6.3 V when current is provided to the BYPASS

pin externally. This facilitates powering the device externally

through a resistor from the bias winding to decrease the no-

load consumption.

BYPASS Pin Undervoltage

The BYPASS pin undervoltage circuitry disables the power

MOSFET when the BYPASS pin voltage drops below 4.85 V.

Once the BYPASS pin voltage drops below 4.85 V, it must rise

back to 5.8 V to enable (turn on) the power MOSFET.

Over-Temperature Protection

The thermal shutdown circuitry senses the die temperature.

The threshold is set at 142 °C typical with a 75 °C hysteresis.

When the die temperature rises above this threshold (142 °C)

the power MOSFET is disabled and remains disabled until the

die temperature falls by 75 °C, at which point the MOSFET

is re-enabled.

Current Limit

The current limit circuit senses the current in the power MOSFET.

When this current exceeds the internal threshold (ILIMIT), the

power MOSFET is turned off for the remainder of that cycle. The

leading edge blanking circuit inhibits the current limit comparator

for a short time (tLEB) after the power MOSFET is turned on. This

leading edge blanking time has been set so that current spikes

caused by capacitance and rectiﬁ er reverse recovery time will

not cause premature termination of the MOSFET conduction.

Auto Restart

In the event of a fault condition such as output short circuit or

an open loop condition, LinkSwitch-LP enters into auto-restart

operation. An internal counter clocked by the oscillator gets reset

every time the FB pin voltage exceeds the FEEDBACK Pin

Auto-Restart Threshold Voltage (VFB(AR)). If the FB pin voltage

drops below VFB(AR) for more than 100 ms, the power MOSFET

switching is disabled. The auto-restart alternately enables and

disables the switching of the power MOSFET at a duty cycle

of typically 12% until the fault condition is removed.

Figure 4. Frequency Jitter at fOSC.

600

020

68 kHz

64 kHz

VDRAIN

Time (μs)

PI-3660-081303

500

400

300

200

100

Rev. H 11/08

LNK562-564

Applications Example

The circuit shown in Figure 5 is a typical implementation of

a 6 V, 330 mA, constant voltage, constant current (CV/CC)

output power supply.

AC input differential ﬁ ltering is accomplished with the very

low cost input ﬁ lter stage formed by C1 and L1. The proprietary

frequency jitter feature of the LNK564 eliminates the need for

an input pi ﬁ lter, so only a single bulk capacitor is required.

Adding a sleeve may allow the input inductor L1 to be used as a

fuse as well as a ﬁ lter component. This very simple Filterfuse™

input stage further reduces system cost. Alternatively, a fusible

resistor RF1 may be used to provide the fusing function.

Input diode D2 may be removed from the neutral phase in

applications where decreased EMI margins and/or decreased

input surge withstand is allowed. In such applications, D1 will

need to be an 800 V diode.

The power supply utilizes simpliﬁ ed bias winding voltage

feedback, enabled by LNK564 ON/OFF control. The resistor

divider formed by R1 and R2 determine the output voltage across

the transformer bias winding during the switch OFF time. In the

V/I constant voltage region, the LNK564 device enables/disables

switching cycles to maintain 1.69 V on the FB pin. Diode D3 and

low cost ceramic capacitor C3 provide rectiﬁ cation and ﬁ ltering

of the primary feedback winding waveform. At increased loads,

beyond the constant power threshold, the FB pin voltage begins

to reduce as the power supply output voltage falls. The internal

oscillator frequency is linearly reduced in this region until it

reaches typically 50% of the starting frequency. When the FB

pin voltage drops below the auto-restart threshold (typically

0.8 V on the FB pin, which is equivalent to 1 V to 1.5 V at the

output of the power supply), the power supply will turn OFF

for 800 ms and then turn back on for 100 ms. It will continue

in this mode until the auto-restart threshold is exceeded. This

function reduces the average output current during an output

short circuit condition.

No-load consumption can be further reduced by increasing C3

to 0.47 μF or higher.

A Clampless primary circuit is achieved due to the very

tight tolerance current limit trimming techniques used in

manufacturing the LNK564, plus the transformer construction

techniques used. Peak drain voltage is therefore limited to

typically less than 550 V at 265 VAC, providing signiﬁ cant

margin to the 700 V minimum drain voltage speciﬁ cation

(BVDSS).

Output rectiﬁ cation and ﬁ ltering is achieved with output rectiﬁ er

D4 and ﬁ lter capacitor C5. Due to the auto-restart feature, the

average short circuit output current is signiﬁ cantly less than

1 A, allowing low cost rectiﬁ er D4 to be used. Output circuitry is

designed to handle a continuous short circuit on the power supply

output. Diode D4 is an ultra-fast type, selected for optimum

V/I output characteristics. Optional resistor R3 provides a

preload, limiting the output voltage level under no-load output

conditions. Despite this preload, no-load consumption is within

targets at approximately 140 mW at 265 VAC. The additional

margin of no-load consumption requirement can be achieved

by increasing the value of R4 to 2.2 kΩ or higher while still

maintaining output voltage well below the 9 V maximum

speciﬁ cation. Placement is left on the board for an optional

Zener clamp (VR1) to limit maximum output voltage under

open loop conditions, if required.

Figure 5. 6 V, 330 mA CV/CC Linear Replacement Power Supply.

J3-1

RTN

6 V,

0.33 A

J3-2

J-1

J-2

1N4937 RF1*

8.2 Ω

2.5 W C1

10 μF

400 V

0.1 μF

50 V

3300 μH

UF4002

1N4005

220 μF

25 V

330 nF

50 V

C4*

100 pF

250 VAC

*Optional components

2 kΩ

VR1*

1N5240B

10 V

3 kΩ

37.4 kΩ

EE16

1N4005

90-265

VAC

LinkSwitch-LP

PI-4106-010208

LNK564PN

LNK562-564

Rev. H 11/08

Key Application Considerations

Output Power Table

The data sheet maximum output power table (Table 1) represents

the maximum practical continuous output power level that can

be obtained under the following assumed conditions:

1. The minimum DC input voltage is 90 V or higher for 85 VAC

input, or 240 V or higher for 230 VAC input or 115 VAC with

a voltage doubler. The value of the input capacitance should

be large enough to meet these criteria for AC input designs.

2. Secondary output of 6 V with a Schottky rectiﬁ er diode.

3. Assumed efﬁ ciency of 70%.

4. Voltage only output (no secondary-side constant current

circuit).

5. Discontinuous mode operation (KP > 1).

6. A suitably sized core to allow a practical transformer design

(see Table 2).

7. The part is board mounted with SOURCE pins soldered

to a sufﬁ cient area of copper to keep the SOURCE pin

temperature at or below 100 °C.

8. Ambient temperature of 50 °C for open frame designs and an

internal enclosure temperature of 60 °C for adapter designs.

Below a value of 1, KP is the ratio of ripple to peak primary

current. Above a value of 1, KP is the ratio of primary MOSFET

OFF time to the secondary diode conduction time. Due to

the ﬂ ux density requirements described below, typically a

LinkSwitch-LP design will be discontinuous, which also has

the beneﬁ t of allowing lower-cost fast (vs. ultra-fast) output

diodes and reducing EMI.

Clampless Designs

Clampless designs rely solely on the drain node capacitance

to limit the leakage inductance induced peak drain-to-source

voltage. Therefore the maximum AC input line voltage, the

value of VOR, the leakage inductance energy, (a function of

leakage inductance and peak primary current), and the primary

winding capacitance determine the peak drain voltage. With no

signiﬁ cant dissipative element present, as is the case with an

external clamp, the longer duration of the leakage inductance

ringing can increase EMI.

The following requirements are recommended for a universal

input or 230 VAC only Clampless design:

1. Clampless designs should only be used for PO ≤ 2.5 W using

a VOR of ≤ 90 V

2. For designs with PO ≤ 2 W, a two-layer primary must be

used to ensure adequate primary intra-winding capacitance

in the range of 25 pF to 50 pF.

3. For designs with 2 < P O ≤ 2.5 W, a bias winding must be added

to the transformer using a standard recovery rectiﬁ er diode

(1N4003– 1N4007) to act as a clamp. This bias winding may

also be used to externally power the device by connecting

a resistor from the bias winding capacitor to the BYPASS

pin. This inhibits the internal high-voltage current source,

reducing device dissipation and no-load consumption.

4. For designs with PO >2.5 W, Clampless designs are not practical

and an external RCD or Zener clamp should be used.

5. Ensure that worst-case, high line, peak drain voltage is below

the BVDSS speciﬁ cation of the internal MOSFET and ideally

≤ 650 V to allow margin for design variation.

VOR (Reﬂ ected Output Voltage), is the secondary output plus

output diode forward voltage drop that is reﬂ ected to the

primary via the turns ratio of the transformer during the diode

conduction time. The VOR adds to the DC bus voltage and the

leakage spike to determine the peak drain voltage.

Audible Noise

The cycle skipping mode of operation used in LinkSwitch-LP

can generate audio frequency components in the transformer.

To limit this audible noise generation, the transformer should

be designed such that the peak core ﬂ ux density is below

1500 Gauss (150 mT). Following this guideline and using the

standard transformer production technique of dip varnishing,

practically eliminates audible noise. Vacuum impregnation

of the transformer is not recommended, as it does not provide

any better reduction of audible noise than dip varnishing. And

although vacuum impregnation has the beneﬁ t of increased

transformer capacitance (which helps in Clampless designs),

it can also upset the mechanical design of the transformer,

especially if shield windings are used. Higher ﬂ ux densities are

possible, increasing the power capability of the transformers

above what is shown in Table 2. However careful evaluation of

the audible noise performance should be made using production

transformer samples before approving the design.

Ceramic capacitors that use dielectrics such as Z5U, when used

in clamp circuits, may also generate audio noise. If this is the

case, try replacing them with a capacitor having a different

dielectric or construction, for example a ﬁ lm type.

Bias Winding Feedback

To give the best output regulation in bias winding designs, a

slow diode such as the 1N400x series should be used as the

rectiﬁ er. This effectively ﬁ lters the leakage inductance spike

and reduces the error that this would give when using fast

recovery time diodes. The use of a slow diode is a requirement

in Clampless designs.

LinkSwitch-LP Device

Core Size LNK562 LNK563 LNK564

EE13 1.1 W 1.4 W 1.7 W

EE16 1.3 W 1.7 W 2 W

EE19 1.9 W 2.5 W 3 W

Table 2. Estimate of Transformer Power Capability vs.

LinkSwitch-LP Device and Core Size at a Flux Density of

1500 Gauss (150 mT).

Rev. H 11/08

LNK562-564

LinkSwitch-LP Layout Considerations

Layout

See Figure 6 for a recommended circuit board layout for

LinkSwitch-LP (P & G package).

Single Point Grounding

Use a single point ground connection from the input ﬁ lter

capacitor to the area of copper connected to the SOURCE pins.

Bypass Capacitor (CBP)

The BYPASS pin capacitor should be located as near as possible

to the BYPASS and SOURCE pins.

Primary Loop Area

The area of the primary loop that connects the input ﬁ lter

capacitor, transformer primary and LinkSwitch-LP together

should be kept as small as possible.

Primary Clamp Circuit

An external clamp may be used to limit peak voltage on the

DRAIN pin at turn off. This can be achieved by using an RCD

clamp or a Zener (~200 V) and diode clamp across the primary

winding. In all cases, to minimize EMI, care should be taken

to minimize the circuit path from the clamp components to the

transformer and LinkSwitch-LP.

Thermal Considerations

The copper area underneath the LinkSwitch-LP acts not only as

a single point ground, but also as a heatsink. As it is connected

to the quiet source node, this area should be maximized for

good heat sinking of LinkSwitch-LP. The same applies to the

cathode of the output diode.

Y-Capacitor

The placement of the Y-type cap should be directly from the

primary input ﬁ lter capacitor positive terminal to the common/

return terminal of the transformer secondary. Such a placement

will route high magnitude common-mode surge currents away

from the LinkSwitch-LP device. Note: If an input pi (C, L, C)

EMI ﬁ lter is used, then the inductor in the ﬁ lter should be placed

between the negative terminals on the input ﬁ lter capacitors.

Figure 6. Recommended Circuit Board Layout for LinkSwitch-LP using P Package (Assumes a HVDC Input Stage).

HV DC

INPUT

Input Filter

Capacitor

CBP

OUT

Output Filter

Capacitor

PI-4157-101305

Maximize hatched copper

areas ( ) for optimum

heatsinking

TOP VIEW

Transformer

LinkSwitch-LP

Y1-

Capacitor

LNK562-564

Rev. H 11/08

Output Diode

For best performance, the area of the loop connecting the

secondary winding, the output diode and the output ﬁ lter

capacitor should be minimized. In addition, sufﬁ cient copper

area should be provided at the anode and cathode terminals

of the diode for heat sinking. A larger area is preferred at the

quiet cathode terminal. A large anode area can increase high-

frequency radiated EMI.

Quick Design Checklist

As with any power supply design, all LinkSwitch-LP designs

should be veriﬁ ed on the bench to make sure that component

speciﬁ cations are not exceeded under worst-case conditions. The

following minimum set of tests is strongly recommended:

1. Maximum drain voltage – Verify that VDS does not exceed

650 V at the highest input voltage and peak (overload) output

power. A 50 V margin to the 700 V BVDSS speciﬁ cation gives

margin for design variation, especially in Clampless designs.

2. Maximum drain current – At maximum ambient

temperature, maximum input voltage and peak output

(overload) power, verify drain current waveforms for any

signs of transformer saturation and excessive leading-edge

current spikes at startup. Repeat under steady state conditions

and verify that the leading-edge current spike event is below

ILIMIT(MIN) at the end of the tLEB(MIN). Under all conditions, the

maximum DRAIN current should be below the speciﬁ ed

absolute maximum ratings.

3. Thermal Check – At specified maximum output

power, minimum input voltage and maximum ambient

temperature, verify that the temperature speciﬁ cations

are not exceeded for LinkSwitch-LP, transformer, output

diode and output capacitors. Enough thermal margin

should be allowed for part-to-part variation of the RDS(ON) of

LinkSwitch-LP as speciﬁ ed in the data sheet. Under low line

and maximum power, a maximum LinkSwitch-LP SOURCE pin

temperature of 100 °C is recommended to allow for

these variations.

Design Tools

Up-to-date information on design tools can be found at the

Power Integrations web site: www.powerint.com.

HV DC

INPUT

Input Filter

Capacitor

OUT

PI-4582-021407

Maximize hatched copper

areas ( ) for optimum

heatsinking

TOP VIEW

Transformer

LinkSwitch-LP

CBP

Y1-

Capacitor

Output Filter

Capacitor

Figure 7. Recommended Circuit Board Layout for LinkSwitch-LP using D Package (Assumes a HVDC Input Stage).

Rev. H 11/08

LNK562-564

ABSOLUTE MAXIMUM RATINGS(1,6)

DRAIN Voltage ..................................................700 V

Peak DRAIN Current...................................200 mA (375 mA)(2)

Peak Negative Pulsed Drain Current (see Fig. 11) ...100 mA(3)

FEEDBACK Voltage .........................................-0.3 V to 9 V

FEEDBACK Current.............................................100 mA

BYPASS Voltage ..........................................-0.3 V to 9 V

Storage Temperature .......................................... -65 °C to 150 °C

Operating Junction Temperature(4) ..................... -40 °C to 150 °C

Lead Temperature(5) ........................................................260 °C

Notes:

1. All voltages referenced to SOURCE, TA = 25 °C.

2. The higher peak DRAIN current is allowed while the

DRAIN voltage is simultaneously less than 400 V.

3. Duration not to exceed 2 μs.

4. Normally limited by internal circuitry.

5. 1/16 in. from case for 5 seconds.

6. Maximum ratings speciﬁ ed may be applied, one at a time,

without causing permanent damage to the product.

Exposure to Absolute Maximum Rating conditions for

extended periods of time may affect product reliability.

Parameter Symbol

Conditions

SOURCE = 0 V; TJ = -40 to 125 °C

See Figure 8

(Unless Otherwise Speciﬁ ed)

Min Typ Max Units

CONTROL FUNCTIONS

Output

Frequency fOSC

TJ = 25 °C

VFB =1.69 V Average

LNK562 61 66 71

kHzLNK563 77 83 89

LNK564 93 100 107

Ratio of Output

Frequency At Auto-

Restart to fOSC

fOSC(AR) TJ = 25 °C, VFB = VFB(AR) 48 %

Frequency Jitter Peak-Peak Jitter, TJ = 25 °C 5 %

Maximum Duty

Cycle DCMAX S2 Open 66 70 %

FEEDBACK Pin

Turnoff Threshold

Current

IFB

TJ = 25 °C

See Note A 56 70 84 μA

FEEDBACK Pin

Voltage at Turnoff

Threshold

VFB

TJ = 0 to 125 °C

See Note A 1.60 1.69 1.78 V

DRAIN Supply

Current

IS1

VFB ≥ 2 V

(MOSFET Not Switching)

See Note B

160 220 μA

IS2

FEEDBACK Open

(MOSFET Switching)

See Notes B, C

220 260 μA

THERMAL IMPEDANCE

Thermal Impedance: P or G Package:

(θJA) ........................... 70 °C/W(3); 60 °C/W(4)

(θJC)(1) ............................................... 11 °C/W

D Package:

(θJA) ..................... .... 100 °C/W(3); 80 °C/W(4)

(θJC)(2) ............................................... 30 °C/W

Notes:

1. Measured on pin 2 (SOURCE) close to plastic interface.

2. Measured on pin 8 (SOURCE) close to plastic interface.

3. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad.

4. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.

LNK562-564

Rev. H 11/08

Parameter Symbol

Conditions

SOURCE = 0 V; TJ = -40 to 125 °C

See Figure 8

(Unless Otherwise Speciﬁ ed)

Min Typ Max Units

CONTROL FUNCTIONS (cont.)

BYPASS Pin

Charge Current

ICH1 VBP = 0 V, TJ = 25 °C, See Note D -5.5 -3.3 -1.8

ICH2 VBP = 4 V, TJ = 25 °C, See Note D -3.8 -2.3 -1.0

BYPASS Pin

Voltage VBP 5.55 5.8 6.10 V

BYPASS Pin

Voltage Hysteresis VBPH 0.8 0.95 1.2 V

BYPASS Pin

Supply Current IBPSC See Note E 84 μA

CIRCUIT PROTECTION

Current Limit ILIMIT

di/dt = 40 mA/μs

TJ = 25 °C124 136 148 mA

Power Coefﬁ cient I2fdi/dt = 40 mA/μs

TJ = 25 °C

LNK562 1099 1221 1380

A2HzLNK563 1381 1535 1735

LNK564 1665 1850 2091

Leading Edge

Blanking Time tLEB

TJ = 25 °C

See Note F 220 265 ns

Thermal Shutdown

Temperature TSD 135 142 150 °C

Thermal Shutdown

Hysteresis TSHD See Note G 75 °C

OUTPUT

ON-State

Resistance RDS(ON) ID = 13 mA TJ = 25 °C48 55 Ω

TJ = 100 °C76 88

OFF-State Drain

Leakage Current IDSS

VBP = 6.2 V, VFB ≥2 V, VDS = 560 V,

TJ = 25 °C50 μA

Breakdown Voltage BVDSS

VBP = 6.2 V, VFB ≥2 V,

See Note H, TJ = 25 °C700 V

DRAIN Supply

Voltage 50 V

Output Enable

Delay tEN See Figure 10 17 μs

Output Disable

Setup Time tDST 0.5 μs

Rev. H 11/08

LNK562-564

Parameter Symbol

Conditions

SOURCE = 0 V; TJ = -40 to 125 °C

See Figure 8

(Unless Otherwise Speciﬁ ed)

Min Typ Max Units

OUTPUT (cont.)

FEEDBACK Pin

Auto-Restart

Threshold Voltage

VFB(AR) TJ = 25 °C0.8 V

Auto-Restart

ON-Time

VFB = VFB(AR)

TJ = 25 °C100 ms

Auto-Restart

Duty Cycle DCAR 12 %

NOTES:

A. In a scheme using a resistor divider network at the FB pin, where RU is the resistor from the FB pin to the rectiﬁ ed

bias voltage and RL is the resistor from the FB pin to the SOURCE pin, the output voltage variation is inﬂ uenced

by VFB and IFB variations. To determine the contribution from the VFB variation in percent, the following equation

can be used:

To determine the contribution from IFB variation in percent, the following equation can be used:

Since IFB and VFB are independent parameters, the composite variation in percent would be .

B. Total current consumption is the sum of IS1 and IDSS when FEEDBACK pin voltage is ≥2 V (MOSFET not

switching) and the sum of IS2 and IDSS when FEEDBACK pin is shorted to SOURCE (MOSFET switching).

C Since the output MOSFET is switching, it is difﬁ cult to isolate the switching current from the supply current at the

DRAIN. An alternative is to measure the BYPASS pin current at 6 V.

D. See Typical Performance Characteristics section Figure 16 for BYPASS pin startup charging waveform.

E. This current is only intended to supply an optional optocoupler connected between the BYPASS and FEEDBACK

pins and not any other external circuitry.

F. This parameter is guaranteed by design.

G. This parameter is derived from characterization.

H. Breakdown voltage may be checked against minimum BVDSS by ramping the DRAIN pin voltage up to but not

exceeding minimum BVDSS.

y=100 #

VFB(TYP)RL

RU+RL

+IFB(TYP)RU

VFB(TYP)RL

RU+RL

+IFB(MAX)RU

-1

x= 100 #

VFB(TYP)RL

RU+RL

+IFB(TYP)RU

VFB(MAX)RL

RU+RL

+IFB(TYP)RU

-1

!x2+y2

LNK562-564

Rev. H 11/08

Figure 8. General Test Circuit.

PI-3490-060204

50 V50 V

DFB

470 kΩ

0.1 μF

470 Ω

5 W

PI-3707-112503

tEN

MAX

tP = 1

fOSC

DRAIN

(internal signal)

Figure 9. Duty Cycle Measurement. Figure 10. Output Enable Timing.

100

Time (μs)

DRAIN Current (mA)

PI-4021-101305

-100

2 μs

Figure 11. Peak Negative Pulsed DRAIN Current

Waveform.

Rev. H 11/08

LNK562-564

1.4

1.0

1.2

0.8

0.6

0.4

0.2

-50 0 50 100 150

Temperature (°C)

PI-4164-100505

Current Limit

(Normalized to 25 °C)

100

150

175

200

125

0 4286 101214161820

DRAIN Voltage (V)

DRAIN Current (mA)

PI-3927-083104

25 °C

100 °C

Typical Performance Characteristics

Figure 16. BYPASS Pin Startup Waveform.

1.1

1.0

0.9

-50 -25 0 25 50 75 100 125 150

Junction Temperature (°C)

Breakdown Voltage

(Normalized to 25 °C)

PI-2213-012301

00.2 0.4 0.6 0.8 1.0

Time (ms)

PI-2240-012301

BYPASS Pin Voltage (V)

Figure 12. Breakdown vs. Temperature.

Figure 14. Current Limit vs. Temperature.

Figure 17. Output Characteristics.

1.2

1.0

0.8

0.6

0.4

0.2

-50 -25 0 25 50 75 100 125

Junction Temperature (°C)

PI-2680-012301

Output Frequency

(Normalized to 25 °C)

Figure 13. Frequency vs. Temperature.

1.1

1.0

0.9

-50 -25 0 25 50 75 100 125 150

Temperature (°C)

FEEDBACK Pin Voltage

(Normalized to 25 °C)

PI-4057-071905

Figure 15. FEEDBACK Pin Voltage vs. Temperature.

LNK562-564

Rev. H 11/08

Figure 18. COSS vs. Drain Voltage.

Drain Voltage (V)

Drain Capacitance (pF)

PI-3928-083104

0 100 200 300 400 500 600

100

1000

Typical Performance Characteristics (cont.)

PART ORDERING INFORMATION

LinkSwitch Product Family

LP Series Number

Package Identiﬁ er

G Plastic Surface Mount DIP

P Plastic DIP

D Plastic SO-8

Lead Finish

N Pure Matte Tin (RoHS Compliant)

GRoHS Compliant and Halogen Free (P and D Package

only)

Tape & Reel and Other Options

Blank Standard Conﬁ gurations

TL Tape & Reel, 1 k pcs minimum for G Package. 2.5 k pcs

for D Package. Not available for P Package.

LNK 562 D N - TL

Rev. H 11/08

LNK562-564

Notes:

1. Package dimensions conform to JEDEC specification

MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)

package with .300 inch row spacing.

2. Controlling dimensions are inches. Millimeter sizes are

shown in parentheses.

3. Dimensions shown do not include mold flash or other

protrusions. Mold flash or protrusions shall not exceed

.006 (.15) on any side.

4. Pin locations start with Pin 1, and continue counter-clock-

wise to Pin 8 when viewed from the top. The notch and/or

dimple are aids in locating Pin 1. Pin 6 is omitted.

5. Minimum metal to metal spacing at the package body for

the omitted lead location is .137 inch (3.48 mm).

6. Lead width measured at package body.

7. Lead spacing measured with the leads constrained to be

perpendicular to plane T.

.008 (.20)

.015 (.38)

.300 (7.62) BSC

(NOTE 7)

.300 (7.62)

.390 (9.91)

.367 (9.32)

.387 (9.83)

.240 (6.10)

.260 (6.60)

.125 (3.18)

.145 (3.68)

.057 (1.45)

.068 (1.73)

.120 (3.05)

.140 (3.56)

.015 (.38)

MINIMUM

.048 (1.22)

.053 (1.35)

.100 (2.54) BSC

.014 (.36)

.022 (.56)

-E-

Pin 1

SEATING

PLANE

-D-

-T-

P08B

DIP-8B

PI-2551-121504

D S .004 (.10)

⊕

T E D S .010 (.25) M

⊕

(NOTE 6)

.137 (3.48)

MINIMUM

SMD-8B

PI-2546-121504

.004 (.10)

.012 (.30)

.036 (0.91)

.044 (1.12)

.004 (.10)

0 -

° 8°

.367 (9.32)

.387 (9.83)

.048 (1.22) .009 (.23)

.053 (1.35)

.032 (.81)

.037 (.94)

.125 (3.18)

.145 (3.68)

-D-

Notes:

1. Controlling dimensions are

inches. Millimeter sizes are

shown in parentheses.

2. Dimensions shown do not

include mold flash or other

protrusions. Mold flash or

protrusions shall not exceed

.006 (.15) on any side.

3. Pin locations start with Pin 1,

and continue counter-clock-

wise to Pin 8 when viewed

from the top. Pin 6 is omitted.

4. Minimum metal to metal

spacing at the package body

for the omitted lead location

is .137 inch (3.48 mm).

5. Lead width measured at

package body.

6. D and E are referenced

datums on the package

body.

.057 (1.45)

.068 (1.73)

(NOTE 5)

E S

.100 (2.54) (BSC)

.372 (9.45)

.240 (6.10) .388 (9.86)

.137 (3.48)

MINIMUM

.260 (6.60) .010 (.25)

-E-

Pin 1

D S .004 (.10)

⊕

G08B

.420

.046 .060 .060 .046

.080

Pin 1

.086

.186

.286

Solder Pad Dimensions

LNK562-564

Rev. H 11/08

PI-4526-040207

D07C

SO-8C

3.90 (0.154) BSC

Notes:

1. JEDEC reference: MS-012.

2. Package outline exclusive of mold flash and metal burr.

3. Package outline inclusive of plating thickness.

4. Datums A and B to be determined at datum plane H.

5. Controlling dimensions are in millimeters. Inch dimensions

are shown in parenthesis. Angles in degrees.

0.20 (0.008) C

1 4

26.00 (0.236) BSC

4.90 (0.193) BSC

0.10 (0.004) C

0.10 (0.004) C 2X

A-B

1.27 (0.050) BSC

7X 0.31 - 0.51 (0.012 - 0.020)

0.25 (0.010) M C A-B D

0.25 (0.010)

0.10 (0.004)

(0.049 - 0.065)

1.25 - 1.65

1.75 (0.069)

1.35 (0.053)

0.10 (0.004) C

1.27 (0.050)

0.40 (0.016)

GAUGE

PLANE

0 - 8

1.04 (0.041) REF 0.25 (0.010)

BSC

SEATING

PLANE

0.25 (0.010)

0.17 (0.007)

DETAIL A

SEATING PLANE

Pin 1 ID

+ +

4.90 (0.193)

1.27 (0.050) 0.60 (0.024)

2.00 (0.079)

Reference

Solder Pad

Dimensions

Revision Notes Date

E 1) Final Release Data Sheet 10/05

F 1) Revision of PI-3924 10/05

G 1) Added SO-8C Package 2/07

H 1) Updated Part Ordering Information section with Halogen Free 11/08

Rev. H 11/08

LNK562-564

For the latest updates, visit our website: www.powerint.com

Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power

Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES

NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED

WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS.

Patent Information

The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered

by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A

complete list of Power Integrations patents may be found at www.powerint.com. Power Integrations grants its customers a license under

certain patent rights as set forth at http://www.powerint.com/ip.htm.

Life Support Policy

POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR

SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein:

A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii)

whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in signiﬁ cant

injury or death to the user.

A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause

the failure of the life support device or system, or to affect its safety or effectiveness.

The PI logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, PeakSwitch, EcoSmart, Clampless, E-Shield, Filterfuse, StakFET, PI Expert

and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies.

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