Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
(315) 432-89 09
(800) 544-24 14
+44 2392-232392
Model 0922B75-37AA
Rev. A
Xinger Balun
75Ω to 75Ω Balanced
Description
The 0922B75-37AA is a low cost, low profile sub-miniature unbalanced to
balanced transformer designed for differential inputs and output locations on
wireless chipsets in an eas y to use surface mount package covering dual polariz ed
commercial Satellite bands 950 MHz – 2150 MHz. The 0922B75-37AA is ideal for
high volume manufacturing and is higher performance than traditional wire wound
baluns. The 0922B75-37AA has an unbalanced port impedance of 75Ω and a 75Ω
balanced port impedance*. This transformation enables single ended signals to be
applied to differential ports on modern integrated chipsets. The output ports have
equal amplitude (-3dB) with 180 degree phase differential. The 0922B75-37AA is
available on tape and reel for pick and place high volume manufactur ing.
ELECTRICAL SPECIFICATIONS**
Frequency
Unbalanced
Port
Impedance
Balanced
Port
Impedance*
Return
Loss
Insertion
Loss
MHz Ohms Ohms dB min dB max
950 - 2150 75 75 12 0.8***
Amplitude
Balance
Phase
Balance
Power
Handling
ΘJC
Operating
Temp.
dB Degrees max Watts ºC / Watt ºC
Features:
• 950 – 2150 MHz
• 180° Transformer
• 75 Ohm to 2 x 37.5 Ohm
• Low Insertion Loss
• Multi-band Cellular Apps
• Sat LNB Chipset Compliant
• No DC Decoupling Capacitors
Required
• Input to Output DC Isolation
• Surface Mountable
• RoHS compliant
• Tape & Reel
0 ± 0.7 180 ± 10 4 TBD -55 to +85
**Specification based on performance of unit properly installed on microstrip printed circuit
boards with 75 Ω + 37.5Ω nominal impedance. Spec’s subject to change without notice.
* 37.5Ω reference to ground
*** Insertion Loss stated at room temperature (0.9 dB Max at +85 º C)
Outline Drawing
Mechanical Outline
Dimensions are in Inches [Millimeters]
Side ViewTop View (Near-side) Bottom View (Far-side)
.150±.005
[3.81±0.13]
.150±.005
[3.81±0.13]
456
31
2
6X .030±.004
[0.76±0.10]
Pin
3
6
1
2
4
5
Designation
In
NC / DC
GND
Out 1
GND
Out 2 Tolerances are Non-Cumulative
6X .009±.004
[0.24±0.10]
.125±.004
[3.18±0.10]
4X .020±.004
[0.51±0.10]
.059±.006
[1.51±0.15]
Orientation
Marker Denotes
Pin Location
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model 0922B75-37AA
Rev. A
Typical Broadband Performance: 550 MHz. to 2550 MHz.
Bala nced and UnBalanced Return Loss
-30
-25
-20
-15
-10
-5
0
550 750 950 1150 1350 1550 1750 1950 2150 2350 2550
Frequency [MHz]
Return Loss [dB]
Amplitude Balance
-1
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
1
550 750 950 1150 1350 1550 1750 1950 2150 2350 2550
Freque ncy [M Hz]
Amplitude Balance [dB]
Insertion Loss
-2
-1.8
-1.6
-1.4
-1.2
-1
-0.8
-0.6
-0.4
-0.2
0
550 750 950 1150 1350 1550 1750 1950 2150 2350 2550
Frequency [MHz]
Insertion Loss [dB]
Phase Balance
170
172.5
175
177.5
180
182.5
185
187.5
190
550 750 950 1150 1350 1550 1750 1950 2150 2350 2550
Frequency [MHz]
Phase Balance [Deg]
Pin Configuration:
The internal configuration of the Xinger® balun is diagramed to
the left; the unbalanced port is DC connected to ground and the
two balanced ports are DC connected and floating. For many
chipset applications there is an opportunity to eliminate t wo
decoupling capacitors and/or use a sin gle bias point if
applicable. Differential driv e is popular in integrated circuit since
it aids stability in the presence of bond wire and pin inductance,
provides some degree of imm unity to power supply and ground
noise, and can provide higher output power in the case of some
device limits. The construction of the Xin ger® balu n is bonded
multi-layered stripline made of low loss dielectric material with
plated through vias connecting the internal circuitry to the
external printed circuit board, similar to that of the Xinger®
hybrids and directional co uplers.
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
(315) 432-89 09
(800) 544-24 14
+44 2392-232392
Model 0922B75-37AA
Rev. A
Mounting Configuration:
Packaging and Ordering Information
Parts are available in reel and are packaged per EIA 481-2. Parts are oriented in tape and reel as sh own below. Minimum order
quantities are 4000 per reel. See Mod el Numbers below for further ordering information.
Direction of
Part Feed
(Unloading)
Dimensions are in inches [mm]
Mounting Footprint
Dimensions are in Inches [Millimeters]
75 Ω
Transmission
Line
6X .030
[0.76]
6X .016
[0.41]
.125
[3.17]
4X .020
[0.51]
2X 37.5 Ω
Transmission
Line
No copper
area
Plated thru
holes to
ground
Circuit Pattern
Footprint Pad (s)
Solder Resist
In order for Xinger surface mount components to work
optimally, there must be a 75Ω transmission line to the
balanced port and 37.5Ω transmission lines from the
unbalanced ports. If this condition is not satisfied, amplitude
balance, insertion loss and VSWR may not meet published
specifications.
All of the Xinger components are constructed from ceramic
filled PTFE composites which possess excellent electrical
and mechanical stability having X and Y thermal coefficient
of expansion (CTE) of 17 ppm/oC
An example of the PCB footprint used in the testing of thes e
parts is shown to the left. In specific designs, the
transmission line widths need to be adjusted to the unique
dielectric coefficients and thicknesses as well as varying
pick and place equipme nt tolerances.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model 0922B75-37AA
Rev. A
REEL DIMENSIONS (inches [mm])
ØA
B
ØC 0.472 [12.0]
4.017 [102.03]
13.0 [330.2]
4000
QUANTITY/REEL TABLE 1
ØD
0.512 [13.0]
ØD
B
ØA ØC
