2007/2/20 1
©2007 Kyocera Corporation All rights reserved.
＜Technical Note＞
JAPAN CDMA/US CDMA SAW Duplexer “SD25 Series”
Kyocera introduces CSP (Chip Size Package) type duplexer constructed by
placing a SAW element, minimized with unique simulation technology,
directly on ceramic substrate, and then sealed and coated with resin.
Optimizing the combination of the SAW element and the substrate enables
the duplexer to be as small as 2.5 x 2.0 x 0.8mm (typical value), making it the
smallest duplexer in the industry. The product exhibits excellent resistance
to climate and shocks because of its hermetic sealing with solder along the
peripheral of the element mounted on the substrate.
SAW Duplexer “SD25 Series”
2007/2/20 2
©2007 Kyocera Corporation All rights reserved.
[Structure]
Matching Network
Resin Coating SAW DPX Chip
Ceramics Substrate
(Low Temp.
Co-fired Ceramics)
Hot Terminal
(Pb-free High
Temp. Solder)
Hermetic Seal Ring
(Pb-free High Temp.
Solder)
[Part Number]
SD 25 – 0836 R 8 UU 01
①② ③ ④⑤⑥⑦
①Type of Product (SAW Duplexer)
②Package Size
③Frequency
④Direction of Tx/Rx Port
⑤Terminals
⑥Input/Output Condition
⑦Custom Specification (Standard)
[Features]
1.World Smallest Size*
(2.5 x 2.0 x 0.8 mm typ.)
2.Built-in Matching Circuit
-Simplifies Circuit Design
-Reduces the Number of Components
-Reduces Component Assembly Space
3.High Reliability by Hermetic Sealing
-Excellent Resistance to
Climate and Shocks
4.Low Loss and High Isolation
5.High Productivity
6.Pb Free, RoHS Compliant
*As of Jan., 2007.
2007/2/20 3
©2007 Kyocera Corporation All rights reserved.
[Recommended Land Pattern]
[Test Circuit]
[Dimensions]
0.8 2.5
2.0
(2)
(1)
(3)
(8)
(7)
(6)
(5) (4)
K ***
*
0.4
(2)
(1)
(3)
(8)
8-0.4
7-0.5
0.3
0.9
(7)
(6)
(5)
(4)
Unit：mm
PIN FUNCTION
(1) Rx
(3) Tx
(6) Ant
(2)(4)(5)(7)(8) GND
Unit :mm
:Electrode
0.4
(6)
(7)
(5)
(8)
8-0.4
7-0.5
0.3
0.9
(1)
(2)
(3)
(4)
PIN FUNCTION
(1) Rx
(3) Tx
(6) Ant
(2)(4)(5)(7)(8) GND
[Tape Specifications]
(3)
(6) DUT R
R
ANT Port
Tx Port
(1) Rx Port
R
Condition : R = 50ohm
Ｈ
ＪφＫＡＴ
φＬＧ
Ｒ
ＲＷ
Ｂ
Ｒ
Ｒ
Ｅ
Ｄ
Ｆ
Part ＡＢＤＥＦ
Dimensions 2.4±0.1 2.9±0.1 8.0±0.2 3.5±0.05 1.75±0.1
Part ＧＨ Ｊ
φＫφＬ
Dimensions 4.0±0.1 4.0±0.1 2.0±0.05 1.50±0.1 1.1±0.1
Part ＲＷＴ
Dimensions 0.3 MAX 1.15±0.1 0.25±0.05
Unit：mm
2007/2/20 4
©2007 Kyocera Corporation All rights reserved.
min. max.
Insertion Loss - 2.3 dB
Ripple - 1.0 dB
VSWR(Tx) - 2.0 -
VSWR(Ant) - 2.0 -
779-804MHz 15 - dB
869-894MHz 40 - dB
1570-1580MHz 40 - dB
1648-1698MHz 35 - dB
2400-2480MHz 20 - dB
2472-2547MHz 20 - dB
Insertion Loss - 3.3 dB
Ripple - 1.5 dB
VSWR(Rx) - 2.0 -
VSWR(Ant) - 2.0 -
Attenuation 824-849MHz 55 - dB
824-849MHz 55 - dB
869-894MHz 40 - dB
Ohm
Tx to ANT
869-894MHz
ANT to Rx
Tx to Rx
Unit
Input/Output impedance 50(Unbalance)
Frequency
824-849MHz
Isolation
Specifications
Items
Attenuation
Electrical Characteristics
P/N : SD25-0836R8UU
<US CDMA>
760 960
860
Frequency (MHz)
Attenuation (dB)
0
-100
Tx to Ant Ant to Rx
Isolation
Tx to Rx
06000
Frequency (MHz)
Attenuation (dB)
0
-100
Tx to Ant
Ant to Rx
2007/2/20 5
©2007 Kyocera Corporation All rights reserved.
Electrical Characteristics
P/N : SD25-0827R8UU
<JAPAN CDMA>
min. max.
Insertion Loss - 2.3 dB
Ripple - 1.0 dB
VSWR(Tx) - 2.0 -
VSWR(Ant) - 2.0 -
0-770MHz 30 - dB
843-870MHz 20 - dB
869-875MHz 35 - dB
1574-1577MHz 40 - dB
1648-1660MHz 30 - dB
2110-2130MHz 30 - dB
2472-2490MHz 27 - dB
Insertion Loss - 2.3 dB
Ripple - 1.0 dB
VSWR(Rx) - 2.0 -
VSWR(Ant) - 2.0 -
824-830MHz 45 - dB
898-925MHz 42 - dB
1920-1980MHz 35 - dB
2400-2484MHz 30 - dB
824-830MHz 55 - dB
869-875MHz 44 - dB
Ohm
ANT to Rx
Tx to Rx
Unit
Input/Output impedance 50(Unbalance)
Frequency
824-830MHz
Isolation
Attenuation
869-875MHz
Specifications
Items
Attenuation
Tx to ANT
745 945
845
Frequency (MHz)
Attenuation (dB)
0
-100
Tx to Ant Ant to Rx
Isolation
Tx to Rx
06000
Frequency (MHz)
Attenuation (dB)
0
-100
Tx to Ant
Ant to Rx
