C39
SD Memory Card Connectors
DM1 Series
Features
1. Withstands higher force of card insertion
Metal cover extends over the back of the connector
allowing it to withstand force of up to 400 N (static load)
when dropped or accidentally hit.
2. No damage to the card when accidentally
pulled-out
The connectors will release the card when a moderate
pull-out force of about 4 N is applied. There will be no
damage to the lock components and all connector
functions will not be affected.
3. Accidental card fall-out prevention
Built-in lock feature holds the card securely in place.
4. Reliable Card Insertion and Withdrawal
Built-in Push-in / Push-out ejection mechanism assures
simple and reliable card insertion and withdrawal.
5. Designed to accept Secure Digital I/O card
(Built-in Ground Contact)
The connector allows use of various expansion modules,
including the Bluetooth communication modules.
Applications
Notebook PC's, digital cameras, PDA's, audio/video
equipment and other devices utilizing SD I/O cards.
Card
Standard type
Withstands higher force of card insertion.
Metal cover extends over the back of the connector.
Card
Reverse type
Metal cover extends over the back of the connector.
No damage to the card when
accidentally pulled-out.
Accidental card
fall-out prevention
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
C40
DM1AA - SF - PEJ
500 V DC
1000 Mømin. (Initial value)
1.
Insulation resistance
Rating Current rating 0.5A DC
Voltage rating 125 V AC
Operating temperature range:-25çto +85ç(Note 1)
Storage temperature range:-40çto +85ç(Note 2) Operating humidity range : Relative humidity 95%
max. (No condensation)
Product Specifications
Item Specification Conditions
500 V AC / one minuteNo flashover or insulation breakdown 2.
Withstanding voltage
100mA DC
100 mømax. (Initial value)
3. Contact resistance
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis
No electrical discontinuity of 100 ns or more4. Vibration 96 hours at temperature of 40
ç
±2
ç
and
humidity of 90% to 95%
Contact resistance: 40 mømax. from initial value
Insulation resistance: 100 Mømin.
5. Humidity
Temperature: -55ç/+5çto +35ç/+85ç/+5çto +35ç
Duration: 30 /5 /30 /5 (Minutes) 5 cycles
Contact resistance: 40 mømax. from initial value
Insulation resistance: 100 Mømin.
6. Temperature cycle
10000 cycles at 400 to 600 cycles per hour
Contact resistance: 40mømax. from initial value
7. Durability (mating/un-mating)
Reflow: At the recommended temperature profile
Manual soldering: 300ç for 3 seconds
No deformation of components affecting performance.
8. Resistance to soldering heat
Note1: Includes temperature rise caused by current flow.
Note2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature
Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during
transportation.
Materials
Ordering information
1 2 3 4
Component Material Finish Remarks
Insulator
Heat resistant thermoplastic compound
Color: Black UL94V-0
Contacts Phosphor bronze Contact area: Gold plating
Termination area: Tinned copper plating --------------------
Cover Stainless steel Termination area: Tinned copper plating --------------------
Others Stainless steel
Piano wire --------------------
Nickel plating --------------------
Series name :DM1
Connector type :AA : Standard receptacle
:B : Reverse receptacle
Terminal type SF :
Right angle surface mount
DSF :
Reverse right angle surface mount
Eject mechanism codes
PEJ :
Card Push insert/Push withdraw
1
23
4
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
C41
2
2
1.6±0.05
1.2±0.05
25.4±0.05
15±0.054.125±0.05
P=2.5±0.05
9-1.1±0.05
1.35±0.05
1.7±0.05
22.4±0.05
2±0.05
1.2±0.05
23.2±0.05
4.55±0.05
2+0.1
0
4-2 +0.1
0
2-Ø1.3
+0.1
0
2+0.1
0
2+0.1
0
3-1 +0.1
0
20.75±0.05
18.15±0.05
9.2±0.05
Card detection switch
Write protection switch
9.2
18.15
3-0.5
20.75
No.8
No.7
No.6
No.5
No.4
No.3
No.2
No.1
No.9
1C
L
128
13.2
9.75
8.05
t=0.2,W=0.6 15
5.625 P2.5
1
2.9
22.4
2-Ø1.2
0.55
30.5
2.523.2
4.55
4-1.5
1C
L
1
1C
L
1C
L
24.15 (Card slot dimension)
Weight:2.2g
When card
is ejected
When card
is ejected
When card
is inserted
When card is inserted
WRITE PROTECT WRITE ENABLE
Card detection switch Write protection switch
OPEN CLOSE OPEN OPEN CLOSE
1C
Lindicates the center line of card slot.
5
1
SD Card
Card pushed-in for insertion Card fully inserted Card ejected
(Card ejected dimension)
SD Card SD Card
5
6
11
Standard type
Part number
DM1AA-SF-PEJ(21) 609-0004-8-21
HRS No.
BPCB mounting pattern
BCard insertion/withdrawal dimensions
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
C42
A(5:1) B(5:1) C(5:1)
(R0.6)
(R0.4)
(R0.6)
(R0.4)
(R0.6)
(R0.4)
1.7 +0.1
0(Land)
1.2 +0.1
0(Land)
1.3 +0.1
0(Through hole)
0.8 +0.1
0(Through hole)
1.9 +0.1
-0.1 (Land)
1.2 +0.1
0(Land)
1.5 +0.1
0(Through hole)
0.8 +0.1
0(Through hole)
2.4 +0.1
-0.1 (Land)
1.2 +0.1
0(Land)
2+0.1
0(Through hole)
0.8 +0.1
0(Through hole)
CARD DETECT
COMMON FOR CD & WP
WP
A
A
C
B
5.62
9.47±0.05 12.8±0.05
11.2±0.05
9.75±0.05
0.8±0.05
1.4±0.05
8.05±0.05
12.5±0.05
5.625±0.05
P=2.5±0.05
1.25±0.05
8-1.1±0.05
12.57±0.05 11.23±0.05
14.13±0.05
11.93±0.05
2.03±0.05
1.4±0.05
23.48±0.05
26.98±0.05
28.5±0.05
14.25±0.05
0.8±0.05
11-2.5±0.051.05±0.05
28.25±0.05
3
3
Center of Card dimension
Reverse type BPCB mounting pattern
2
(0.25)
(1.77)
No.8
No.7 No.6 No.5 No.4 No.3
No.2
No.1
No.9
28
(14.35)
18.68
216.85
6-0.65
1.5
1.85
1.050.35
2
2
2
2
2
27.2
2
27.45
29
2
8.63
1C
L
1C
L
2
6.95
2
7.65
5.62
2.9
1C
L
1C
L
29.9
SD Card
(5):Card pushed for insertion
(6):Card fully inserted
10:
Card ejected(Card ejected dimension)
Weight:2.1g
1
2
When card is ejected
OPEN OPEN CLOSE
WRITE PROTECT WRITE ENABLE
Card detection switch
When card
is ejected
When card
is ejected
When card
is ejected
Write protection switch
OPEN CLOSE
indicates the dimension of DIP terminals.
C
Lindicates the center line of the card slot.
Part number
DM1B-DSF-PEJ 609-0003-5
HRS No.
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
C43
2±0.15
4±0.1
1.75±0.1
Ø1.5
+0.1
0
36±0.1 3.4±0.3
4.35±0.3
44±0.3
40.4±0.1
20.2±0.1
Unreeling direction
BPackaging specifications
Embossed Carrier Tape Dimensions (Standard type) 450 pieces per reel
2±0.15
4±0.1 36±0.1 4.6±0.3
3.4±0.3
1.75±0.1
44±0.3
40.4±0.1
20.2±0.1
Ø1.5
+0.1
0
Unreeling direction
Embossed Carrier Tape Dimensions(Reverse type) 450 pieces per reel
End section
Blank section(160mm min.)
Mounting section(450) Lead section (400mm min.)
Blank section (100mm min.)
Embossed carrier tape
Top cover tape
(Ø380)
(Ø150)
D
Unreeling direction
44.4 +2
0
Reel dimensions
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
C44
100ç
150ç
200ç
300ç
50S0S 100S 150S 200S
MAX240ç
220ç
Preheating
Soldering
Preheating: 150ç30 to 90 sec.
IR Reflow Conditions
Soldering : 235±5ç 10 sec. Max.
Soldering : 220ç10 to 20 sec.
Recommended Temperature Profile
Recommended Conditions
Reflow system : IR reflow
Solder : Paste type 63 Sn/37 Pb(Flux content 9 wt%)
Test board : Glass epoxy 60mm x 100mm x 1.6 mm thick
Metal mask thickness: 0.15 mm
Recommended temperature profile.
The temperature may be slightly changed according to the solder paste type and thickness.
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.