5 $5 Preferred Device (& ( + (*+'& ) These Silicon Epitaxial Planar Diodes are designed for use in ultra high speed switching applications. These devices are housed in the SC-59 package which is designed for low power surface mount applications. * Fast trr, < 3.0 ns * Low CD, < 2.0 pF * Available in 8 mm Tape and Reel Use M1MA151/2KT1 to order the 7 inch/3000 unit reel. Use M1MA151/2KT3 to order the 13 inch/10,000 unit reel. http://onsemi.com SC-59 PACKAGE SINGLE SILICON SWITCHING DIODES 40/80 V-100 mA SURFACE MOUNT 0 MAXIMUM RATINGS (TA = 25C) Rating Reverse Voltage M1MA151KT1 Symbol Value Unit VR 40 Vdc M1MA152KT1 Peak Reverse Voltage M1MA151KT1 80 VRM M1MA152KT1 Forward Current Peak Forward Current Peak Forward Surge Current Vdc 40 80 IF 100 mAdc IFM 225 mAdc IFSM (Note 1) 500 mAdc 3 2 THERMAL CHARACTERISTICS Rating 1 Symbol Max Unit Power Dissipation PD 200 mW Junction Temperature TJ 150 C Storage Temperature Tstg -55 to + 150 C SC-59 SUFFIX CASE 318D 1. t = 1 SEC MARKING DIAGRAM Mx M x = A for 151 B for 152 M = Date Code Preferred devices are recommended choices for future use and best overall value. Preferred devices are ON Semiconductor recommended choices for future use and best overall value. Semiconductor Components Industries, LLC, 2002 May, 2002 - Rev. 6 686 Publication Order Number: M1MA151KT1/D M1MA151KT1, M1MA152KT1 ELECTRICAL CHARACTERISTICS (TA = 25C) Characteristic Reverse Voltage Leakage Current Symbol Condition Min Max Unit IR VR = 35 V -- 0.1 mAdc VR = 75 V -- 0.1 VF IF = 100 mA -- 1.2 Vdc VR IR = 100 mA 40 -- Vdc 80 -- M1MA151KT1 M1MA152KT1 Forward Voltage Reverse Breakdown Voltage M1MA151KT1 M1MA152KT1 Diode Capacitance Reverse Recovery Time (Figure 1) CD VR = 0, f = 1.0 MHz -- 2.0 pF trr (Note 2) IF = 10 mA, VR = 6.0 V, RL = 100 W, Irr = 0.1 IR -- 3.0 ns 2. trr Test Circuit RECOVERY TIME EQUIVALENT TEST CIRCUIT INPUT PULSE ;< OUTPUT PULSE ;( ; ) ;<< ; = << = tp = 2 ms tr = 0.35 ns Figure 1. Reverse Recovery Time Equivalent Test Circuit http://onsemi.com 687 IF = 10 mA VR = 6 V RL = 100 W M1MA151KT1, M1MA152KT1 INFORMATION FOR USING THE SC-59 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection $ $ # %+,-./ SC-59 POWER DISSIPATION The power dissipation of the SC-59 is a function of the pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RqJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows. PD = the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 338 milliwatts. PD = 150C - 25C 370C/W = 338 milliwatts The 370C/W assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 338 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad. Using a board material such as Thermal Clad, the power dissipation can be doubled using the same footprint. TJ(max) - TA RqJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into SOLDERING PRECAUTIONS * The soldering temperature and time should not exceed The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * * * 260C for more than 10 seconds. When shifting from preheating to soldering, the maximum temperature gradient should be 5C or less. After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. http://onsemi.com 688 M1MA151KT1, M1MA152KT1 SOLDER STENCIL GUIDELINES The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration. Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. TYPICAL SOLDER HEATING PROFILE The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177-189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 7 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. ' ' 0 1 2 "'3 ' ' 0 2 43 1 5 2 "'3 ) 0 0 " " ' ' $ 0 0 1 5 1 $ 5 2'43 2 43 ' 4 9 $ ' ' 7 ) $ # ' " ) "8 ) : " " " " " 6 Figure 2. Typical Solder Heating Profile http://onsemi.com 689