LM4902MM/NOPB - NATIONAL SEMICONDUCTOR

LM4902

LM4902 265mW at 3.3V Supply Audio Power Amplifier with Shutdown Mode

Literature Number: SNAS150C

LM4902 May 9, 2011

265mW at 3.3V Supply Audio Power Amplifier with

Shutdown Mode

General Description

The LM4902 is a bridged audio power amplifier capable of

delivering 265mW of continuous average power into an 8Ω

load with 1% THD+N from a 3.3V power supply.

Boomer® audio power amplifiers were designed specifically

to provide high quality output power from a low supply voltage

while requiring a minimal amount of external components.

Since the LM4902 does not require output coupling capaci-

tors, bootstrap capacitors or snubber networks, it is optimally

suited for low-power portable applications.

The LM4902 features an externally controlled, low power

consumption shutdown mode, and thermal shutdown protec-

tion.

The closed loop response of the unity-gain stable LM4902

can be configured by external gain-setting resistors.

Key Specifications

■ THD+N at 1kHz for 265mW continuous

average output power into 8Ω,

VDD = 3.3V 1.0% (max)

■ THD+N at 1kHz for 675mW continuous

average output power into 8Ω,

VDD = 5V 1.0% (max)

■ Shutdown current 0.1µA (typ)

Features

■MSOP and LLP packaging

■No output coupling capacitors, bootstrap capacitors, or

snubber circuits are necessary

■Thermal shutdown protection circuitry

■Unity-gain stable

■External gain configuration capability

■Latest generation "click and pop" suppression circuitry

Applications

■Cellular phones

■PDA's

■Any portable audio application

Typical Application

20029801

FIGURE 1. Typical Audio Amplifier Application Circuit

Boomer® is a registered trademark of National Semiconductor Corporation.

LM4902 265mW at 3.3V Supply Audio Power Amplifier with Shutdown Mode

Connection Diagrams

MSOP

20029802

Top View

Order Number LM4902MM

See NS Package Number MUA08A

MSOP Marking

20029878

Top View

G - Boomer Family

C3 - LM4902MM

LLP

20029875

Top View

Order Number LM4902LD

See NS Package Number LDA08B

LLP Marking

20029877

Top View

XY - Date Code

TT - Die Traceability

G - Boomer Family

A3 - LM4902LD

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LM4902

Absolute Maximum Ratings (Note 2)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage 6.0V

Storage Temperature −65°C to +150°C

Input Voltage −0.3V to VDD + 0.3V

Power Dissipation (Note 3) Internally limited

ESD Susceptibility (Note 4) 2000V

ESD Susceptibility (Note 5) 200V

Junction Temperature 150°C

Soldering Information

Small Outline Package

Vapor Phase (60 sec.) 215°C

Infrared (15 sec.) 220°C

See AN-450 “Surface Mounting and their Effects on Product

Reliability” for other methods of soldering surface mount

devices.

Thermal Resistance

θJC (MSOP) 56°C/W

θJA (MSOP) 190°C/W

θJA (LLP) 67°C/W

Operating Ratings

Temperature Range

TMIN ≤ TA ≤ TMAX −40°C ≤ TA ≤ +85°C

Supply Voltage 2.0V ≤ VDD ≤ 5.5V

Electrical Characteristics (Note 1, Note 2)

The following specifications apply for VDD = 5V, for all available packages, unless otherwise specified. Limits apply for TA = 25°C.

Symbol Parameter Conditions

LM4902

Units

(Limits)

Typical

(Note 6)

Limit

(Note 7,

Note 9)

IDD Quiescent Power Supply Current VIN = 0V, IO = 0A (Note 8) 4 6.0 mA (max)

ISD Shutdown Current VPIN1 =GND 0.1 5 μA (max)

VOS Output Offset Voltage VIN = 0V 5 50 mV (max)

POOutput Power THD = 1% (max); f = 1kHz; RL = 8Ω; 675 300 mW (min)

THD+N Total Harmonic Distortion+Noise PO = 400 mWrms; AVD = 2; RL = 8Ω;

20Hz ≤ f ≤ 20kHz, BW < 80kHz 0.4 %

PSRR Power Supply Rejection Ratio

VRIPPLE = 200mV sine p-p

f = 217Hz (Note 10) 70

f = 1KHz (Note 10) 67

f = 217Hz (Note 11) 55

f = 1KHz (Note 11) 55

Electrical Characteristics (Note 1, Note 2)

The following specifications apply for VDD = 3.3V, for all available packages, unless otherwise specified.

Limits apply for TA = 25°C.

Symbol Parameter Conditions

LM4902

Units

(Limits)

Typical

(Note 6)

Limit

(Note 7,

Note 9)

IDD Quiescent Power Supply Current VIN = 0V, IO = 0A (Note 8) 3 5 mA (max)

ISD Shutdown Current VPIN1 = GND 0.1 3 μA (max)

VOS Output Offset Voltage VIN = 0V 5 50 mV (max)

POOutput Power THD = 1% (max); f = 1kHz; RL = 8Ω; 265 mW

THD+N Total Harmonic Distortion+Noise PO = 250 mWrms; AVD = 2; RL = 8Ω;

20Hz ≤ f ≤ 20kHz, BW < 80kHz 0.4 %

PSRR Power Supply Rejection Ratio

VRIPPLE = 200mV sine p-p

f = 217Hz (Note 10) 73

f = 1KHz (Note 10) 70

f = 217Hz (Note 11) 60

f = 1KHz (Note 11) 68

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LM4902

Electrical Characteristics (Note 1, Note 2)

The following specifications apply for VDD = 2.6V, for all available packages, unless otherwise specified.

Limits apply for TA = 25°C.

Symbol Parameter Conditions

LM4902

Units

(Limits)

Typical

(Note 6)

Limit

(Note 7,

Note 9)

IDD Quiescent Power Supply Current VIN = 0V, IO = 0A (Note 8) 2.6 4 mA (max)

ISD Shutdown Current VPIN1 = VDD 0.1 2.0 μA (max)

VOS Output Offset Voltage VIN = 0V 5 mV

POOutput Power THD = 1% (max); f = 1kHz; RL = 8Ω 130 mW

THD+N Total Harmonic Distortion+Noise PO = 100 mWrms; AVD = 2; RL = 8Ω;

20Hz ≤ f ≤ 20kHz, BW < 80kHz 0.4 %

PSRR Power Supply Rejection Ratio

VRIPPLE = 200mV sine p-p

f = 217Hz (Note 11) 58

f = 1KHz (Note 11) 63

Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.

Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions

which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters

where no limit is given, however, the typical value is a good indication of device performance.

Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature TA. The maximum

allowable power dissipation is PDMAX = (TJMAX − TA) / θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4902, TJMAX =

150°C. The typical junction-to-ambient thermal resistance, when board mounted, is 190°C/W for package number MUA08A.

Note 4: Human body model, 100pF discharged through a 1.5kΩ resistor.

Note 5: Machine Model, 220pF–240pF discharged through all pins.

Note 6: Typicals are measured at 25°C and represent the parametric norm.

Note 7: Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).

Note 8: The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier.

Note 9: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.

Note 10: Unterminated input.

Note 11: 10Ω terminated input.

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LM4902

External Components Description

(Figure 1)

Components Functional Description

1. RiInverting input resistance which sets the closed-loop gain in conjunction with RF. This resistor also forms a high pass

filter with Ci at fc = 1/(2π RiCI).

2. CiInput coupling capacitor which blocks the DC voltage at the amplifier's input terminals. Also creates a highpass filter

with Ri at fc = 1/(2π RiCi). Refer to the section, Proper Selection of External Components, for an explanation of

how to determine the value of Ci.

3. RFFeedback resistance which sets the closed-loop gain in conjunction with Ri.

4. CSSupply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing section for

information concerning proper placement and selection of the supply bypass capacitor.

5. CBBypass pin capacitor which provides half-supply filtering. Refer to the Proper Selection of External Components

for information concerning proper placement and selection of CB.

Typical Performance

Characteristics

THD+N vs Frequency

20029830

THD+N vs Frequency

20029831

THD+N vs Frequency

20029832

THD+N vs Frequency

20029833

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LM4902

THD+N vs Frequency

20029834

THD+N vs Frequency

20029835

THD+N vs Frequency

20029836

THD+N vs Frequency

20029837

THD+N vs Frequency

20029838

THD+N vs Frequency

20029839

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LM4902

THD+N vs Frequency

20029840

THD+N vs Output Power

20029841

THD+N vs

Output Power

20029842

THD+N vs

Output Power

20029843

THD+N vs

Output Power

20029844

THD+N vs

Output Power

20029845

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LM4902

THD+N vs

Output Power

20029846

THD+N vs

Output Power

20029847

THD+N vs

Output Power

20029848

THD+N vs

Output Power

20029849

THD+N vs

Output Power

20029850

THD+N vs

Output Power

20029851

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LM4902

Output Power vs

Supply Voltage

20029852

Output Power vs

Supply Voltage

20029853

Output Power vs

Supply Voltage

20029854

Output Power vs

Supply Voltage

20029855

Output Power vs

Load Resistance

20029856

Power Dissipation vs

Output Power

20029857

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LM4902

Power Dissipation vs

Output Power

20029858

Power Dissipation vs

Output Power

20029859

Clipping Voltage vs

Supply Voltage

20029860

Noise Floor

20029861

Noise Floor

20029862

Frequency Response vs

Input Capacitor Size

20029871

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LM4902

Power Supply

Rejection Ratio

20029863

Power Supply

Rejection Ratio

20029864

Power Supply

Rejection Ratio

20029865

Power Supply

Rejection Ratio

20029866

Power Supply Rejection Ratio

vs Supply Voltage

20029867

Power Supply Rejection Ratio

vs Supply Voltage

20029868

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LM4902

Power Derating Curve

20029873

Supply Current vs

Supply Voltage

20029870

Open Loop Frequency Response

20029872

LM4902LD Power Derating Curve (Note 12)

20029876

Note 12: This curve shows the LM4902LD's thermal dissipation ability at different ambient temperatures given the exposed-DAP of the part is soldered to a plane

of 1oz. Cu with an area given in the label of each curve.

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LM4902

Application Information

EXPOSED-DAP PACKAGE PCB MOUNTING

CONSIDERATION

The LM4902's exposed-DAP (die-attach paddle) package

(LD) provides a low thermal resistance between the die and

the PCB to which the part is mounted and soldered. This al-

lows rapid heat from the die to the surrounding PCB copper

traces, ground plane, and surrounding air. This allows the

LM4902LD to operate at higher output power levels in higher

ambient temperatures than the MM package. Failing to opti-

mize thermal design may compromise the high power perfor-

mance and activate unwanted, though necessary, thermal

shutdown protection.

The LD package must have its DAP soldered to a copper pad

on the PCB. The DAP's PCB copper pad is connected to a

large plane of continuous unbroken copper. This plane forms

a thermal mass, heat sink, and radiation area. Place the heat

sink area on either outside plane in the case of a two-sided

PCB, or on an inner layer of a board with more than two layers.

Connect the DAP copper pad to the inner layer or backside

copper heat sink area with 2 vias. The via diameter should be

0.012in - 0.013in with a 1.27mm pitch. Ensure efficient ther-

mal conductivity by plating through the vias.

Best thermal performance is achieved with the largest prac-

tical heat sink area. The power derating curve in the Typical

Performance Characteristics shows the maximum power

dissipation versus temperature for several different areas of

heat sink area. Placing the majority of the heat sink area on

another plane is preferred as heat is best dissipated through

the bottom of the chip. Further detailed and specific informa-

tion concerning PCB layout, fabrication, and mounting an LD

(LLP) package is available from National Semiconductor's

Package Engineering Group under application note AN1187.

BRIDGE CONFIGURATION EXPLANATION

As shown in Figure 1, the LM4902 has two operational am-

plifiers internally, allowing for a few different amplifier config-

urations. The first amplifier's gain is externally configurable,

while the second amplifier is internally fixed in a unity-gain,

inverting configuration. The closed-loop gain of the first am-

plifier is set by selecting the ratio of RF to Ri while the second

amplifier's gain is fixed by the two internal 20kΩ resistors.

Figure 1 shows that the output of amplifier one serves as the

input to amplifier two which results in both amplifiers produc-

ing signals identical in magnitude, but out of phase 180°.

Consequently, the differential gain for the IC is

AVD = 2*(RF/Ri)

By driving the load differentially through outputs Vo1 and

Vo2, an amplifier configuration commonly referred to as

“bridged mode” is established. Bridged mode operation is dif-

ferent from the classical single-ended amplifier configuration

where one side of its load is connected to ground.

A bridge amplifier design has a few distinct advantages over

the single-ended configuration, as it provides differential drive

to the load, thus doubling output swing for a specified supply

voltage. Four times the output power is possible as compared

to a single-ended amplifier under the same conditions. This

increase in attainable output power assumes that the ampli-

fier is not current limited or clipped. In order to choose an

amplifier's closed-loop gain without causing excessive clip-

ping, please refer to the Audio Power Amplifier Design

section.

A bridge configuration, such as the one used in LM4902, also

creates a second advantage over single-ended amplifiers.

Since the differential outputs, Vo1 and Vo2, are biased at half-

supply, no net DC voltage exists across the load. This elimi-

nates the need for an output coupling capacitor which is

required in a single supply, single-ended amplifier configura-

tion. If an output coupling capacitor is not used in a single-

ended configuration, the half-supply bias across the load

would result in both increased internal lC power dissipation

as well as permanent loudspeaker damage.

POWER DISSIPATION

Power dissipation is a major concern when designing a suc-

cessful amplifier, whether the amplifier is bridged or single-

ended. Equation 1 states the maximum power dissipation

point for a bridge amplifier operating at a given supply voltage

and driving a specified output load.

PDMAX = (VDD)2/(2π2RL) Single-Ended (1)

However, a direct consequence of the increased power de-

livered to the load by a bridge amplifier is an increase in

internal power dissipation point for a bridge amplifier operat-

ing at the same conditions.

PDMAX = 4(VDD)2/(2π2RL) Bridge Mode (2)

Since the LM4902 has two operational amplifiers in one pack-

age, the maximum internal power dissipation is 4 times that

of a single-ended amplifier. Even with this substantial in-

crease in power dissipation, the LM4902 does not require

heatsinking. From Equation 1, assuming a 5V power supply

and an 8Ω load, the maximum power dissipation point is

625 mW. The maximum power dissipation point obtained

from Equation 2 must not be greater than the power dissipa-

tion that results from Equation 3:

PDMAX = (TJMAX − TA)/θJA (3)

For package MUA08A, θJA = 190°C/W. TJMAX = 150°C for the

LM4902. Depending on the ambient temperature, TA, of the

system surroundings, Equation 3 can be used to find the

maximum internal power dissipation supported by the IC

packaging. If the result of Equation 2 is greater than that of

Equation 3, then either the supply voltage must be decreased,

the load impedance increased, the ambient temperature re-

duced, or the θJA reduced with heatsinking. In many cases

larger traces near the output, VDD, and Gnd pins can be used

to lower the θJA. The larger areas of copper provide a form of

heatsinking allowing a higher power dissipation. For the typ-

ical application of a 5V power supply, with an 8Ω load, the

maximum ambient temperature possible without violating the

maximum junction temperature is approximately 30°C pro-

vided that device operation is around the maximum power

dissipation point. Internal power dissipation is a function of

output power. If typical operation is not around the maximum

power dissipation point, the ambient temperature can be in-

creased. Refer to the Typical Performance Characteris-

tics curves for power dissipation information for lower output

powers.

POWER SUPPLY BYPASSING

As with any power amplifier, proper supply bypassing is crit-

ical for low noise performance and high power supply rejec-

tion. The capacitor location on both the bypass and power

supply pins should be as close to the device as possible. The

effect of a larger half supply bypass capacitor is improved

PSRR due to increased half-supply stability. Typical applica-

tions employ a 5V regulator with 10μF and a 0.1μF bypass

capacitors which aid in supply stability, but do not eliminate

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LM4902

the need for bypassing the supply nodes of the LM4902. The

selection of bypass capacitors, especially CB, is thus depen-

dent upon desired PSRR requirements, click and pop perfor-

mance as explained in the section, Proper Selection of

External Components, system cost, and size constraints.

SHUTDOWN FUNCTION

In order to reduce power consumption while not in use, the

LM4902 contains a shutdown pin to externally turn off the

amplifier's bias circuitry. This shutdown feature turns the am-

plifier off when a logic low is placed on the shutdown pin. The

trigger point between a logic low and logic high level is typi-

cally half supply. It is best to switch between ground and

supply to provide maximum device performance. By switch-

ing the shutdown pin to GND, the LM4902 supply current draw

will be minimized in idle mode. While the device will be dis-

abled with shutdown pin voltages greater than GND, the idle

current may be greater than the typical value of 0.1μA. In ei-

ther case, the shutdown pin should be tied to a definite voltage

to avoid unwanted state changes.

In many applications, a microcontroller or microprocessor

output is used to control the shutdown circuitry which provides

a quick, smooth transition into shutdown. Another solution is

to use a single-pole, single-throw switch in conjunction with

an external pull-up resistor. When the switch is closed, the

shutdown pin is connected to ground and disables the ampli-

fier. If the switch is open, then the external pull-up resistor will

enable the LM4902. This scheme guarantees that the shut-

down pin will not float, thus preventing unwanted state

changes.

PROPER SELECTION OF EXTERNAL COMPONENTS

Proper selection of external components in applications using

integrated power amplifiers is critical to optimize device and

system performance. While the LM4902 is tolerant to a variety

of external component combinations, consideration to com-

ponent values must be used to maximize overall system

quality.

The LM4902 is unity-gain stable, giving a designer maximum

system flexibility. The LM4902 should be used in low gain

configurations to minimize THD+N values, and maximize the

signal to noise ratio. Low gain configurations require large in-

put signals to obtain a given output power. Input signals equal

to or greater than 1 Vrms are available from sources such as

audio codecs. Please refer to the section, Audio Power Am-

plifier Design, for a more complete explanation of proper

gain selection.

Besides gain, one of the major considerations is the closed-

loop bandwidth of the amplifier. To a large extent, the band-

width is dictated by the choice of external components shown

in Figure 1. The input coupling capacitor, Ci, forms a first order

high pass filter which limits low frequency response. This val-

ue should be chosen based on needed frequency response

for a few distinct reasons.

Selection of Input Capacitor Size

Large input capacitors are both expensive and space hungry

for portable designs. Clearly, a certain sized capacitor is

needed to couple in low frequencies without severe attenua-

tion. But in many cases the speakers used in portable sys-

tems, whether internal or external, have little ability to

reproduce signals below 150Hz. In this case using a large

input capacitor may not increase system performance.

In addition to system cost and size, click and pop performance

is effected by the size of the input coupling capacitor, Ci. A

larger input coupling capacitor requires more charge to reach

its quiescent DC voltage (nominally ½ VDD). This charge

comes from the output via the feedback and is apt to create

pops upon device enable. Thus, by minimizing the capacitor

size based on necessary low frequency response, turn-on

pops can be minimized.

Besides minimizing the input capacitor size, careful consid-

eration should be paid to the bypass capacitor value. Bypass

capacitor, CB, is the most critical component to minimize turn-

on pops since it determines how fast the LM4902 turns on.

The slower the LM4902's outputs ramp to their quiescent DC

voltage (nominally ½ VDD), the smaller the turn-on pop.

Choosing CB equal to 1.0 μF along with a small value of Ci (in

the range of 0.1μF to 0.39μF), should produce a clickless and

popless shutdown function. While the device will function

properly, (no oscillations or motorboating), with CB equal to

0.1μF, the device will be much more susceptible to turn-on

clicks and pops. Thus, a value of CB equal to 1.0μF or larger

is recommended in all but the most cost sensitive designs.

AUDIO POWER AMPLIFIER DESIGN

Design a 300 mW/8Ω Audio Amplifier

Given:

Power Output 300mWrms

Load Impedance 8Ω

Input Level 1Vrms

Input Impedance 20kΩ

Bandwidth 100Hz–20 kHz ± 0.25dB

A designer must first determine the minimum supply rail to

obtain the specified output power. By extrapolating from the

Output Power vs Supply Voltage graphs in the Typical Per-

formance Characteristics section, the supply rail can be

easily found. A second way to determine the minimum supply

rail is to calculate the required Vopeak using Equation 4 and

add the dropout voltage. Using this method, the minimum

supply voltage would be (Vopeak + (2*VOD)), where VOD is ex-

trapolated from the Dropout Voltage vs Supply Voltage curve

in the Typical Performance Characteristics section.

(4)

Using the Output Power vs Supply Voltage graph for an 8Ω

load, the minimum supply rail is 3.5V. But since 5V is a stan-

dard supply voltage in most applications, it is chosen for the

supply rail. Extra supply voltage creates headroom that allows

the LM4902 to reproduce peaks in excess of 700 mW without

producing audible distortion. At this time, the designer must

make sure that the power supply choice along with the output

impedance does not violate the conditions explained in the

Power Dissipation section.

Once the power dissipation equations have been addressed,

the required differential gain can be determined from Equa-

tion 5.

(5)

RF/Ri = AVD/2 (6)

From Equation 5, the minimum AVD is 1.55; use AVD = 2.

Since the desired input impedance was 20 kΩ, and with a

AVD of 2, a ratio of 1:1 of RF to Ri results in an allocation of

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LM4902

Ri = RF = 20 kΩ. The final design step is to address the band-

width requirements which must be stated as a pair of −3 dB

frequency points. Five times away from a pole gives

0.17 dB down from passband response which is better than

the required ±0.25 dB specified.

fL = 100Hz/5 = 20Hz

fH = 20kHz × 5 = 100kHz

As stated in the External Components section, Ri in con-

junction with Ci create a highpass filter.

Ci ≥ 1/(2π*20 kΩ*20 Hz) = 0.397μF; use 0.39μF

The high frequency pole is determined by the product of the

desired high frequency pole, fH, and the differential gain,

AVD. With a AVD = 2 and fH = 100kHz, the resulting GBWP =

100kHz which is much smaller than the LM4902 GBWP of

25MHz. This figure displays that if a designer has a need to

design an amplifier with a higher differential gain, the LM4902

can still be used without running into bandwidth problems.

DIFFERENTIAL AMPLIFIER CONFIGURATION FOR LM4902

20029874

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LM4902

Physical Dimensions inches (millimeters) unless otherwise noted

8-Lead (0.118″ Wide) Molded Mini Small Outline Package

Order Number LM4902MM

NS Package Number MUA08A

Order Number LM4902LD

NS Package Number LDA08B

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LM4902

Notes

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LM4902

Notes

LM4902 265mW at 3.3V Supply Audio Power Amplifier with Shutdown Mode

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