PPR975-250-3-1000J - API TECHNOLOGIES CORP

Surface Mount Solutions

Surface Mount

Solutions

Attenuators

Resistors

Terminations

GENERAL INFORMATION

These high power devices are designed to dissipate power in RF

circuits when mounted to an appropriate heat sink. The termina-

tions provide a low VSWR under maximum power conditions. The

resistor configurations are typically used in “Wilkinson” type power

divider networks, or to terminate 3 dB stripline or microstrip hybrids.

Aluminum nitride is used for those applications where the use and

disposal of beryllium oxide is a concern.

SERIES ANT, ANR

RESISTORS & TERMINATIONS

High Power, Aluminum Nitride, Thin Film, Drop-in – 10-600 Watts, DC-4 GHz

NOTES

1. Input power ratings are based on flange

temperature of 100° C maximum.

2. 50 and 100 Ohms standard. Other values

from 10-500 Ohms available on special order.

Contact factory for details. Standard tolerance ±5%.

Specify resistance value when ordering.

3. VSWR applies to termination style only.

GENERAL SPECIFICATIONS

Resistive Element Thin Film

Substrate Aluminum Nitride

Cover Alumina Ceramic

Mounting Flange Copper, Nickel Plated per QQ-N-290

Tab Beryllium Copper, Gold Plated per MIL-G-4520 4

AVERAGE POWER DERATING CURVE

FLANGE TEMPERATURE — °C

POWER DERATING

% OF RATED POWER

100

100 125 150

Frequency Input Power VSWR (Typical) Capacitance Figure

Model Range (Watts Avg.) (Note 3) (pF) (Typ.) No.

ANT & ANR 300-10 DC-4.0 GHz 10 1.25:1 1.0 1

ANT & ANR 515-40 DC-2.5 GHz 40 1.15:1 1.0 2

ANT & ANR 515-80 DC-1.0 GHz 80 1.25:1 1.6 2

ANT & ANR 800-100 DC-2.0 GHz 100 1.25:1 1.4 3

ANT & ANR 870-150 DC-2.0 GHz 150 1.25:1 4.5 4

ANT & ANR 975-200 DC-1.0 GHz 200 1.25:1 4.5 5

ANT & ANR 1250-400 DC-500 MHz 400 1.50:1 7.0 6

ANT & ANR 1900-600 DC-500 MHz 600 1.50:1 15.0 7

PERFORMANCE SPECIFICATIONS

.003 .001±

[0.08 0.03]±

.130 [3.3]

.062 [1.57]

.160

MAX

.250 [6.35]

.125 [3.18]

.060 [1.52] TYP

.095 [2.41]

.250 [6.35]

MIN

.515

(13.08)

.250 [6.35]

MIN

.116 [2.95]

PHYSICAL DIMENSIONS

ANT 300-10 — 10 WATTS

Flange Mounted

ANR 300-10 — 10 WATTS

Flange Mounted

ANT 515-40 — 40 WATTS

ANT 515-80 — 80 WATTS

Flange Mounted

ANR 515-40 — 40 WATTS

ANR 515-80 — 80 WATTS

Flange Mounted

FIG. 2

.062 [1.57]

.100 [2.54]

.200 [5.08]

.300 [7.62]

.200 [5.08]

.005 .001 [0.13 0.03]±±

.110 [2.79]

.030 [0.76]

.040 [1.02]

.125 [3.17] MIN

.160 [4.06]

MAX

.116 [ 2.95]

FIG. 1

.005 .001 [0.13 0.03]±±

TAB THICKNESS

.040 [1.02]

.560 [14.22]

.800 [20.32]

.108 [2.74]

.060 [1.52]

.150 [3.81] MAX

.150 [3.81] MIN

.400 [10.16]

.120 [3.05]

.115 [2.92]

.230 [5.84]

.130 [3.30]

THRU 2 PLS

ANT 800-100 — 100 WATTS

Flange Mounted

ANR 800-100 — 100 WATTS

Flange Mounted

FIG. 3

REV 04/11

KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]

TERMINATIONS (ANT) SERIES RESISTORS (ANR) SERIES FIGURES

ANT 870-150 — 150 WATTS

Flange Mounted

ANR 870-150 — 150 WATTS

Flange Mounted

ANT 975-200 — 200 WATTS

Flange Mounted

ANR 975-200 — 200 WATTS

Flange Mounted

ANT 1900-600 — 600 WATTS

Flange Mounted

FIG. 4

FIG. 5

FIG. 7ANR 1900-600 — 600 WATTS

Flange Mounted

.125 [3.18] MIN

.250 [6.35]

1.550 [39.37]

1.000 [25.40]

1.900 [48.26]

1.040

[26.42]

.175 [4.45]

.500 [12.70]

.270 [6.86]

.195 [4.95]

.125 [3.18]

.166 [4.22]

THRU 4 PLS

.005 .001 [0.13 0.03]±±

.250 [6.35]

MAX

ANT 1250-400 — 400 WATTS

Flange Mounted

ANR 1250-400 — 400 WATTS

Flange Mounted

FIG. 6

.200 [5.08] MAX

.375 [9.53]

.110 [2.79]

.300 [7.62]

.125 [3.18] MIN

.975 [24.77]

.375 [9.52]

.725 [18.41]

.120 [3.05]

.125 [3.17]

.171 [4.34]

.125 [3.17]

THRU 2 PLS

.188 [4.76]

.003 .001 [0.08 0.03]±±

.062 [1.57]

.155 [3.94]

.160 [4.06] MAX

.187 [4.76]

.375 [9.52]

.120 [3.05]

.250 [6.35]

.560 [14.22]

.870 [22.10]

.125 [3.18] MIN

.108 [2.74]

.161 [4.09]

THRU 2 PLS

.500

[12.7]

1.250[31.8]

.125

[3.18]

MIN.

500[12.7]

.250[6.4]

.875

[22.23]

.120[3.05]

TYP. .160[4.06]

DIA TYP.

.125[3.18]

.210[5.33]

MAX.

.171[4.34]

.003 .001±

[0.08 0.03]±

PHYSICAL DIMENSIONS

TERMINATIONS (ANT) SERIES RESISTORS (ANR) SERIES FIGURES

SERIES ANT, ANR

RESISTORS & TERMINATIONS

KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]

300 Dino Drive, Ann Arbor, MI 48103

Tel: 888-244-6638 or 734-426-5553 •Fax: 734-426-5557

www.aeroflex.com/inmet •inmetsales@aeroflex.com

When properly mounted on an appropriate heat sink, this chip

device provides high power dissipation capabilities. Ideal

for ferrite isolator applications, the improved thin film design

technology and laser trimming provide proven RF power

capabilities to meet the demands of today's CDMA and

WCDMA system requirements. Aluminum Nitride is featured

for those applications where the use and disposal of Beryllium

oxide is a concern.

•Environmentally friendly AlN substrate

•High performance, thin film element

•Power 100 Watts

•New adhesion process results in improved

terminal strength

•On-chip matching network improves frequency

performance over the DC-3 GHz frequency range

SPECIFICATIONS

Parameters Specifications

Frequency Range DC to 3 GHz

Power 100 Watts*

VSWR 1.10:1 max

Resistance 50 Ohms +/- 5%

Operating Temperature -55 C to 150 C°°

Substrate Aluminum Nitride

* Refer to average power derating curve chart.

.225 REF

[5,72] REF

.350REF

[8,89]REF

.040 REF

[1,02]

WRAP AROUND

.045

[1,14]

.050

[1,27]

PHYSICAL DIMENSIONS

CHIP BASE TEMP ºC

% OF RATED POWER

75 100

100

125 150

AVERAGE POWER DERATING CURVE

TYPICAL PERFORMANCE

A3RS91.1

High Power Chip Termination

100 Watts

A3RS91.1

300 Dino Drive, Ann Arbor, MI 48103

Tel: 888-244-6638 or 734-426-5553 •Fax: 734-426-5557

www.aeroflex.com/inmet •inmetsales@aeroflex.com

KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]

REV 04/11

GENERAL INFORMATION

When mounted on an appropriate heat sink, these chip devices

provide high power dissipation in terminations and as balancing

resistors in Wilkinson power divider networks. Laser trimming

provides maximum RF power capability. Aluminum nitride

is used for those applications where the use and disposal of

beryllium oxide is a concern.

ORDERING INFORMATION

SERIES ANC

RESISTORS, TERMINATIONS

High Power Chip, Aluminum Nitride – 50 & 100 Ohms

KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]

NOTES

1. Resistance value is expressed using military 4-digit call-out.

50R0 = 50 Ohms

1000 = 100 Ohms

Other values from 10–500 Ohms may be available as special order.

Contact factory for availability.

2. Tinning with Sn96 “Lead Free” high temperature solder will maintain RoHS

compliance.

GENERAL SPECIFICATIONS

Solderable Terminals Electroplated Silver over Nickel

Substrate Aluminum Nitride

Resistive Element Thin Film

PHYSICAL DIMENSIONS

TOP

VIEW W

TYPE X

(RESISTOR)

TYPE G

(TERMINATION)

50 Ohms

100 Ohms

50 Ohms

ONLY

0.005

[0.13]

MAX

(FULL FILM) (NARROW FILM)

EXAMPLE: Typical Model No.

NPC T 250-250 XJ

Prefix

Tinning (See Note 2)

Size

Terminal type (X or G)

Ohmic Value (Note 1)

50R0

1000

ANC X

Tolerance Key

F= 1%

G = 2%

J = 5% (Standard)

(See Note 1 Below)

H = Sn96

T = Sn63

Capacitance Termination

W L T A B (pF) VSWR Power FREQ.

Model Prefix in [mm] in [mm] in [mm] in [mm] in [mm] Typical Typical CW GHz

ANC 50-50 0.050 [1,27] 0.050 [1,27] 0.010 [0,25] N/A 0.010 [0,25] 0.5 1.25 5 DC-4.0

ANC 50-100 0.050 [1,27] 0.100 [2,5] 0.010 [0,25] N/A 0.020 [0,51] 1.0 1.25 10 DC-2.0

ANC 100-200 0.100 [2,5] 0.200 [5,1] 0.040 [1,02] N/A 0.030 [0,76] 1.0 1.25 10 DC-4.0

ANC 200-200 0.200 [5,1] 0.200 [5,1] 0.040 [1,02] 0.085 [2,2] 0.040 [1,02] 1.2 1.25 30 DC-4.0

ANC 250-250-40 0.250 [6,4] 0.250 [6,4] 0.040 [1,02] 0.085 [2,2] 0.050 [1,27] 1.0 1.15 40 DC-2.5

ANC 250-250-80 0.250 [6,4] 0.250 [6,4] 0.040 [1,02] N/A 0.050 [1,27] 1.6 1.25 80 DC-1.0

ANC 250-375 0.250 [6,4] 0.375 [9,5] 0.040 [1,02] N/A 0.050 [1,27] 4.5 1.25 125 DC-1.0

ANC 350-225 0.350 [8,9] 0.225 [5,7] 0.040 [1,02] 0.045 [1,14] 0.050 [1,27] 1.4 1.25 100 DC-2.0

ANC 375-375 0.375 [9,5] 0.375 [9,5] 0.040 [1,02] 0.250 [6,4] 0.050 [1,27] 4.5 1.25 200 DC-1.0

PERFORMANCE SPECIFICATIONS

REV 04/11

300 Dino Drive, Ann Arbor, MI 48103

Tel: 888-244-6638 or 734-426-5553 •Fax: 734-426-5557

www.aeroflex.com/inmet •inmetsales@aeroflex.com

GENERAL INFORMATION

Aeroflex / Inmet’s series of High PowerSurface MountTerminations

are ideal for high frequency applications where small size and

low costs are an important design criteria. The ability of these

chips to be directly mounted to the PC Board eliminates the need

for expensive mounting flanges and input tabs. Large solderable

surface areas on the bottom of the chips allows for higher power

dissipation in smaller sizes. All KAC series chips are manufac-

tured using environmentally friendly Aluminum Nitride ceramic

and are classified as RoHS compliant.

ORDERING INFORMATION

SERIES KAC

Surface Mount Terminations (SMT)

High Power, Aluminum Nitride (AlN), 10 - 150 Watts

NOTE

Tinning with Sn96 “Lead Free” high temperature solder will maintain RoHS

compliance.

GENERAL SPECIFICATIONS

Substrate Aluminum Nitride

Solderable Terminals Electroplated Silver over Nickel

Resistive Element Proprietary Thick Film

Operating Temperature -55 to +150ºC

Impedance (Nominal) 50 Ohms

PHYSICAL DIMENSIONS

EXAMPLE: Typical Model No.

NPC T 100-200A XG

Prefix

Tinning (Optional)

Size

Terminal type

Ohmic Value

50R0

KAC Z

H = Sn96

T = Sn63

Tolerance, G = 2% (Standard)

PERFORMANCE SPECIFICATIONS

W L T A B C Power Frequency

Model Prefix in (mm) in (mm) in (mm) in (mm) in (mm) in (mm) VSWR CW GHz

KAC 60 – 120A 0.060 (1,52) 0.120 (3,05) 0.025 (0,64) 0.054 (1,37) 0.026 (0,66) 0.013 (0,33) 1.25 10 DC – 4.0

KAC 100 – 200A 0.100 (2,5) 0.200 (5,1) 0.040 (1,02) 0.050 (1.27) 0.025 (0,64) 0.035 (0,89) 1.25 20 DC – 2.5

KAC 250 – 250A 0.250 (6,4) 0.250 (6,4) 0.040 (1,02) 0.040 (1,02) 0.043 (1,09) 0.020 (0,51) 1.25 75 DC – 4.0

KAC 250 – 375A 0.250 (6,4) 0.375 (9,5) 0.040 (1,02) 0.135 (3,43) 0.058

KAC 375 – 375A 0.375 (9,5) 0.375 (9,5) 0.040 (1,02) 0.125 (3,18) 0.057

(1,47) 0.060 (1,52) 1.25 100 DC – 3.0

(1,48) 0.030 (0,76) 1.25 150 DC – 3.0

REV 04/11

300 Dino Drive, Ann Arbor, MI 48103

Tel: 888-244-6638 or 734-426-5553 •Fax: 734-426-5557

www.aeroflex.com/inmet •inmetsales@aeroflex.com

KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]

GENERAL INFORMATION

The PCX Series High Power Terminations are designed to

dissipate RF power when mounted to a heat sink or chill plate.

Power levels up to 500 watts in 50 ohm impedance are avail-

able in units with SMA or Type N, male or female connectors.

High stability thin film resistive elements on beryllium oxide

substrates are used to insure stable VSWR performance over

temperature and environmental conditions.

SERIES PCX

HIGH POWER COAXIALTERMINATIONS

DC to 6 GHz

NOTES

1. Input power ratings based on case temperature of 85°C maximum.

2. Connectors: SMA - Stainless Steel Passivated per MIL-C-39012,

Type N - Nickel Plated Brass per MIL-C-39012

3. Housing: Copper, Nickel Plated per QQ-N-290

PHYSICAL DIMENSIONS

1.375

[34.93]

.120 [3.05] DIA.

4 HOLES

.125 [3.18]

.960[24.38]

.625

[15.88]

"X"

1.25

[31.8]

"Y"

.090

[2.29]

"Z"

1.25

[31.8]

1.625

[41.28]

2.000

[50.8]

1.250

[31.8]

.215 [5.46] DIA.

4 HOLES

.187 [4.75]

1.625

[41.28]

.875

[22.23]

"X"

.375

[9.53]

1.060

[26.92]

.180

[4.57]

"Y"

OUTLINE A (Shown with SMA)

OUTLINE B (Shown with TYPE N)

MODEL "X" "Y" "Z"

PCX050-F-50 .375 .560 .260

[9.53] [14.22] [6.60]

PCX050-M-50 .507 .560 .260

[12.88] [14.22] [6.60]

PCX050-F-100 .375 .560 .260

[9.53] [14.22] [6.60]

PCX050-M-100 .507 .560 .260

[12.88] [14.22] [6.60]

MODEL "X" "Y"

PCX050-F-150, 250 .375 .515

[9.53] [13.08]

PCX050-M-150, 250 .375 .515

[9.53] [13.08]

PCX100-F-150, 250, 500 .736 .508

[18.69] [12.9]

PCX100-M-150, 250, 500 .819 .508

[20.8] [12.9]

Part Number Input Power (Watts) Frequency Connector Type VSWR Outline

(Note 1) Range (Note 2) (Typical)

PCX050-F-50 50 DC - 6 GHz SMA Female DC-3 GHz: 1.25:1 A

PCX050-M-50 SMA Male 3 - 6 GHz: 1.35:1

PCX050-F-100 100 DC - 3 GHz SMA Female DC- 3 GHz: 1.25:1 A

PCX050-M-100

PCX050-F-150 150 DC - 2 GHz SMA Female DC - 1 GHz: 1.15:1 B

PCX050-M-150 SMA Male

SMA Male

1 - 2 GHz: 1.40:1

PCX100-F-150

PCX100-M-150

PCX050-F-250 250 DC -800 MHz SMA Female DC - 200 MHz: 1.15:1 B

PCX050-M-250 SMA Male 200 - 400 MHz: 1.40:1

PCX100-F-250 N Female

N Female

N Male

400-800 MHz: 1.30:1

PCX100-M-250

PCX100-M-500 500 DC - 200 MHz N Male DC - 200 MHz: 1.15:1 B

PERFORMANCE SPECIFICATIONS

SMA 50 & 100 WATTS

SMA OR N CONNECTORS

150, 250 & 500 WATTS

REV 04/11

300 Dino Drive, Ann Arbor, MI 48103

Tel: 888-244-6638 or 734-426-5553 •Fax: 734-426-5557

www.aeroflex.com/inmet •inmetsales@aeroflex.com

KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]

GENERAL INFORMATION

When mounted on an appropriate heat sink, these chip devices

provide high power dissipation in terminations and as balancing

resistors in Wilkinson power divider networks. Laser trimming

provides maximum peak and average RF power capability.

ORDERING INFORMATION

SERIES PPC, NPC

RESISTORS, TERMINATIONS

High Power Chip – 50 & 100 Ohms

NOTES

1. The “L” and “T” dimensions are for the substrate only and do not include

terminal thickness or optional tinning thickness.

2. Thermal Resistance (R°) is measured in °C/W between resistive film and

mounting surface.

3. The CW power rating is based on maximum film temperature of +150°C and with

maximum heatsink temperature of +100°C. Power is based on infinite and ideal

heatsink. Type “W” termination style does not have full back plane metallization

and typically handles 1/10 the rated power.

4. Tinnning with Sn96 “Lead Free” high temperature solder will maintain RoHS

compliance.

GENERAL SPECIFICATIONS

Solderable Terminals Electroplated Silver over Nickel (PPC)

Gold over Nickel alloy (NPC)

Substrate Beryllium Oxide Ceramic

Resistive Element Thin Film and Thick Film*

EXAMPLE: Typical Model No.

NPC T 25-50 XJ

Prefix

Tinning (see Note 4)

H = Sn96

T = Sn63

Size

Terminal type (X, W or G)

Ohmic Value (Note A)

50R0

1000

PPC

NPC X

Tolerance Key

F= 1%

G = 2%

J = 5% (Standard)

(See Note A Below)

WL TB RØ

Model (Note 1) (Note 1) Capacitance C/W Max. C/W Freq.

Prefix in [mm] in [mm] in [mm] in [mm] (pF) Typical (Note 2) Power GHz (**)

*PPC 100-200A 0.100 [2,5] 0.200 [5,1] 0.040 [1,02] 0.030 [0,76] 0.8 0.80 20W DC-4.0

*PPC 250-250A 0.250 [6,4] 0.250 [6,4] 0.040 [1,02] 0.050 [1,27] 1.2 0.30 40W DC-2.5

*PPC 250-375A 0.250 [6,4] 0.375 [9,53] 0.040 [1,02] 0.050 [1,27] 3.5 0.15 150W DC-1.0

NPC 25-50 0.025 [0,64] 0.050 [1,27] 0.010 [0,25] 0.012 [0,305] 0.3 3.90 3W DC-12.4

*NPC 50-50 0.050 [1,27] 0.050 [1,27] 0.010 [0,25] 0.012 [0,305] 0.5 1.90 5W DC-10

*NPC 50-100 0.050 [1,27] 0.100 [2,5] 0.010 [0,25] 0.017 [0,43] 1.0 0.72 10W DC-4.0

NPC 75-150 0.075 [1,91] 0.150 [3,8] 0.010 [0,25] 0.020 [0,51] 1.8 0.29 15W DC-4.0

PERFORMANCE SPECIFICATIONS

NOTE A

Resistance value is expressed using military 4-digit call-out.

50R0 = 50 Ohms

1000 = 100 Ohms

Other values from 10–500 Ohms may be available as special order.

Contact factory for availability.

Physical Dimensions

TOP

VIEW W

TYPE X

TYPE G

50 Ohms

100 Ohms

50 Ohms

ONLY

50 Ohms

100 Ohms

TYPE W

(Note 3)

0.005[0.13] MAX

* Low cost thick film models available on these sizes. Consult factory for specifications.

** Typical VSWR for all terminations is 1.25:1

REV 04/11

300 Dino Drive, Ann Arbor, MI 48103

Tel: 888-244-6638 or 734-426-5553 •Fax: 734-426-5557

www.aeroflex.com/inmet •inmetsales@aeroflex.com

The Aeroflex/Inmet PPA Series of attenuators utilize a Beryllium

Oxide chip and thin film technology to provide devices which

can dissipate up to 100 Watts of RF power. The PPA series

must be thermally bonded to a heat sink, using the mounting

holes provided, in order to operate within the temperature

rating indicated. The flange temperatures must not exceed

100°C under rated power conditions.

ORDERING INFORMATION

The Power Attenuators listed are available in 1 dB increments

from 1 thru 20 dB. Specify by selecting any of the series listed

and add the attenuation value desired to the basic series

designation. (See Note 3)

SERIES PPA

ATTENUATORS

High Power – DC-4 GHz

GENERAL SPECIFICATIONS

Impedance 50 Ohms

Operating Temp. –55 °C to +150°C

Attenuation Stability 0.0001 dB/dB/°C

Substrate Beryllium Oxide Ceramic

Resistive Element Proprietary Thin Film

Flange Copper, Nickel Plated per QQ-N-290

Tabs Beryllium Copper, Gold Plated per MIL-G-45204

Cover Alumina Ceramic

.062 [1.58]

.040 [1.02] x

.005 .001 THK±

[0.13 0.03]±

.300 [7.62]

.160 [4.06] MAX.

.105 [2.67]

.100 [2.54] .100 [2.54]

.200 [5.08]

.125 [3.18] MIN.

TYP

PPA10 OUTLINE

.116 [2.95] DIA.

.062 [1.58]

.060 [1.52] x

.003 .001 THK±

[0.08 0.03]±

.515 [13.08]

.150 [3.81] MAX.

.105 [2.67]

.250 [6.35]

.125 [3.18] .125 [3.18]

.250 [6.35] MIN.

TYP

PPA20 OUTLINE

.250 [6.35]

MIN

.116 [2.95] DIA.

.003 .001 [0.08 0.03±±]

.110 [2.79]

.125 [3.18]

.725 [18.42]

.975 [24.77]

.175 [4.45]

.060 [1.52] TYP

.375 [9.52]

.375 [9.53]

.250 [6.35]

MIN TYP

PPA50 OUTLINE

.171 [4.34]

.200 [5.08]

MAX

.125 [3.18]

THRU 2 PLS

.003 .001 [0.08 0.03±±]

.210 [5.33]

MAX

.125 [3.18]

.250 [6.35]

MIN TYP

.500 [12.70]

.060 [1.52] TYP

1.250 [31.75]

.875 [22.23]

.188 [4.76]

.405 [10.29]

.250 [6.35]

.500 [12.70]

PPA100 OUTLINE

.171 [4.34]

.160 [4.06]

THRU PLS

PHYSICAL DIMENSIONS

Attenuation(1) Input Attenuation Accuracy (1)

1 dB Increments Frequency(1) Power (dB) VSWR

Model (dB) Range (Watts) dB DC-1 GHz 1-2.5 GHz 2.5-4 GHz (Typical)

PPA 10 1-20 DC-4 GHz 10 1-10

±0.5 ±0.5 ±1.0 1.3:1

11 - 2 0 ±1.0 ±2.0 ±3.0

PPA 20 1-20 DC-4 GHz 20 1-5 ±0.5 ±0.5 ±0.5

6-9 ±0.5 ±0.5 ±1.0 1.15:1 – DC-1.0 GHz

10-15 ±0.75 ±1.0 ±1.5 1.35:1 – 1.0-2.5 GHz

16-20 ±1.0 ±2.0 ±3.0 1.50:1 – 2.5-4.0 GHz

PPA 50 1-20 DC-1 GHz 50 ±0.3 DC-500 MHz 1.25:1 – DC-500 MHz

±0.5 500 MHz-1 GHz 1.50:1 – 500 MHz–1 GHz

PPA 100 1-20 DC-500 MHz 100 ±0.5 1.25:1 – DC-200 MHz

1.50:1 – 200-500 MHz

PERFORMANCE SPECIFICATIONS

PPA 20-10

Desired dB

Value

Basic

Series PPA Power

NOTES

1. Custom products

are available

at higher

frequencies

with optimized

VSWR and

attenuation

accuracy over

narrow frequency

bandwidths.

2. VSWR as measured

in a 0.125” ground

plane stripline circuit.

3. Standard values

1, 2, 3, 4, 5, 6, 10, 20 dB.

Non-std values available

as special order.

REV 04/11

300 Dino Drive, Ann Arbor, MI 48103

Tel: 888-244-6638 or 734-426-5553 •Fax: 734-426-5557

www.aeroflex.com/inmet •inmetsales@aeroflex.com

KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]

FEATURES

•Laser Trimmed

•Temperature Stable

GENERAL INFORMATION

The PCA and PCAA Series consists of a laser trimmed distrib-

uted thin film element on an alumina ceramic substrate with

solderable terminals. Two sizes are available. The PCA size

operates to 12.4 GHz and the PCAA size operates to 18.0 GHz.

Both sizes are available with leads and wrap around conduc-

tors for ease of installation. The PCAF and PCAAF options are

designed for “flip-chip” application in lower frequency circuits.

PCA & PCAA SERIES DATA

•Substrate: 96% Alumina

•Solderable Terminals: Electroplated Silver over Nickel

•Resistive Element: Proprietary Thin Film

•Wrap around Ground Terminal available, “W” option

•Wrap around-all terminals—“F” option

•Standard values 1, 2, 3, 4, 5, 6, 10, 20 dB

•Non-std. values available as special order

ORDERING INFORMATION

The attenuators listed are available in 1 dB increments from 1

through 20 dB. When ordering, to specify the correct part num-

ber for the desired attenuation value, select any of the series

listed and add the attenuation value desired to the basic series

designation.

Options (Note 4)

L = Lead/Tab (Gold Plated BeCu)

W = Wrap around ground only

F = Wrap around all terminals (flip-chip)

T = Tinned terminals (any terminal type) Sn63

H = Tinned terminals (any terminal type) Sn96

G = Gold plated terminals

SERIES PCA, PCAA

ATTENUATORS, CHIP

Low Power – DC-18 GHz

NOTES

1. Performance of other dB values vary dependent on attenuation.

Contact factory for specifications for fractional dB values.

2. Performance is based on device mounted in matched 50 Ohm line.

3. Rated power 1.5 Watts input PCA, 100 mw PCAA.

4. Tinning with Sn96 “Lead Free” high temperature solder will maintain RoHS

compliance.

GENERAL SPECIFICATIONS

Impedance 50 Ohms

Operating Temperature –55°C to +150°C

Attenuation Stability 0.0001 dB/dB/°C

EXAMPLE:

EXAMPLES:

PCA

PCAA (x)

Option(s)

Basic

Series

PCAW-T3

PCAAF-G3

(x)

Option(s)

Value

AVERAGE POWER DERATING CURVE

100

85 150°C

POWER DERATING

% OF RATED POWER

Attenuation Accuracy (dB) Note 2 VSWR (Typical) Note 2

Increments DC - 4 GHz 4 - 8 GHz 8 - 12.4 GHz 12.4 - 18 GHz DC - 4 GHz 4 - 8 GHz 8 - 12.4 GHz 12.4 - 18 GHz

(dB) PCA, PCAA PCA, PCAA PCA, PCAA PCAA PCA, PCAA PCA, PCAA PCA, PCAA PCAA

Note 1 Series Series Series Series Only Series Series Series Series Only

1 - 3 0.5 0.5 0.5 0.5 1.25 1.35 1.50 1.50

4 - 6 0.5 0.5 0.5 0.75 1.25 1.35 1.50 1.50

7 - 10 0.5 0.5 0.75 1.0 1.25 1.35 1.50 1.50

11 - 15 0.75 +0.5 +0.5 — 1.25 1.35 1.50 —

-3.0 -4.0

16 - 20 1.0 +0.5 — — 1.25 1.35 — —

-4.0

PERFORMANCE SPECIFICATIONS

KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]

SERIES PCA, PCAA

ATTENUATORS, CHIP

Low Power – DC-18 GHz

KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]

PHYSICAL DIMENSIONS

PCA

PCAA

PCAAL (LEAD/COVER)

PCAL (LEAD/COVER)

PCAW

(WRAP AROUND GROUND TERMINAL ONLY)

PCAF (WRAP AROUND ALL TERMINALS)

PCAAF (WRAP AROUND ALL TERMINALS)

PCAAW

(WRAP AROUND GROUND TERMINAL ONLY)

.025[0.64]

MIN

.060 [1.52]

TYP.

.015[0.38] MIN

.150

[3.8]

.010

[0.25]

GROUND

.125

[3.18]

.150

[3.8]

.125

[3.18]

.250 [6.4]

MIN

.060±.003

[1.52±0.08]

TYP.

.003±.001

[0.08±0.03]

.040 [1.02]

MAX

.060[1.52]

TYP.

.015[0.38]

MIN

.150

[3.8]

.125

[3.18]

.010

[0.25]

.025[0.64]

MIN

.125

[3.18]

.025 MIN

[0.64]

.060 [1.52]

TYP.

.015 [0.38]

MIN

.150

[3.8]

.010

[0.25]

WRAP AROUND GROUND

(SIDE WRAP OPTIONAL)

WRAP AROUND GROUND

MAXIMUM

FREQUENCY

4 GHz

MAXIMUM

FREQUENCY

8 GHz

.025 [0.64]

TYP.

.015[0.38] MIN

.075

[1.9]

.010

[0.25]

GROUND

.060

[1.52]

.020[0.5] TYP..020 [0.5] TYP.

.025 [0.64]

TYP.

.015 [0.38] MIN

.075

[1.9]

.010

[0.25]

WRAP AROUND GROUND

.060

[1.52]

.020 [0.5] TYP.

.025 [0.64]

TYP.

.015 [0.38] MIN

.075

[1.9]

.010

[0.25]

WRAP AROUND GROUND

(SIDE WRAP OPTIONAL)

.060

[1.52]

.075

[1.9]

.060

[1.52]

.250 [6.4]

MIN

.020±.003

[0.5±0.08]

TYP.

.003±.001

[0.08±0.03]

.040 [1.02]

MAX

WRAP

AROUND

TERM TYP

(SIDE WRAP

OPTIONAL)

WRAP AROUND TERM TYP

(SIDE WRAP OPTIONAL)

REV 04/11

300 Dino Drive, Ann Arbor, MI 48103

Tel: 888-244-6638 or 734-426-5553 •Fax: 734-426-5557

www.aeroflex.com/inmet •inmetsales@aeroflex.com

PPT 300-10-3 — 10 WATTS

Flange Mounted

PPR 300-10-3 — 10 WATTS

Flange Mounted

FIG. 1

.062 [1.57]

.100 [2.54]

.200 [5.08]

.300 [7.62]

.200 [5.08]

.005 .001 [0.13 0.03]±±

.110 [2.79]

.030 [0.76]

.040 [1.02]

.125 [3.17] MIN

.160 [4.06]

MAX

.116 [ 2.95]

REV 4/11

KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]

SERIES PPR, PPT

RESISTORS & TERMINATIONS

High Power, Thin Film, Drop-in – 10-650 Watts, DC-4 GHz

NOTES

1. Input power ratings are based on flange temperature of 100° C maximum.

2. 50 and 100 Ohms standard. Other values from 10-500 Ohms available on

special order. Contact factory for details. Standard tolerance ±5%.

Specify resistance value when ordering.

3. VSWR applies to termination style only.

GENERAL SPECIFICATIONS

Resistive Element Thin Film and Thick Film*

Substrate Beryllium Oxide Ceramic

Cover Alumina Ceramic

Mounting Flange Copper,Nickel Plated per QQ-N-290

Tab Beryllium Copper,Gold Plated per MIL-G-45204

AVERAGE POWER DERATING CURVE

FLANGE TEMPERATURE — °C

POWER DERATING

% OF RATED POWER

100

100 125 150

Frequency Input Power VSWR (Typical) Capacitance Figure

Model Range (Watts Avg.) (Note 3) (pF) (Typ.) No.

PPR & PPT 300-10-3* DC-4.0 GHz 10 1.35:1 —DC-4.0 GHz 0.8 1

PPR & PPT 515-20-3* DC-2.0 GHz 20 1.10:1 —DC-1.0 GHz 0.8 2

1.25:1 —1.0-2.0 GHz

PPT 515-30-4 DC-4.0 GHz 30 1.20:1 —DC-40 GHz 1.2 3

PPR & PPT 515-30* DC-2.0 GHz 30 1.10:1 —DC-1.0 GHz 0.8 4

1.25:1 —1.0-2.0 GHz

PPR & PPT 800-40-3 DC-4.0 GHz 40 1.25:1 —DC-4.0 GHz 1.4

PPT 800-100A DC-2.0 GHz 100 1.25:1 —DC-2.0 GHz 1.4 6

PPR & PPT 870-150-3* DC-1.0 GHz 15 0 1.20:1 —DC-500 MHz 3.5 7

1.35:1 —500-1000 MHz

PPR & PPT 975-250-3 DC-1.0 GHz 250 1.25:1 —DC-500 MHz 5.0 8

1.35:1 —500-1000 MHz

PPR & PPT 1250-400 DC-500 MHz 400 1.50:1 —DC-500 MHz 7.0 9

PPR &PPT 1900-800 DC-500 MHz 650 1.25:1 —DC-200 MHz 10.2 10

1.50:1 —200-500 MHz

PERFORMANCE SPECIFICATIONS

GENERAL INFORMATION

These high power devices are designed to dissipate power in

circuits when mounted to an appropriate heat sink. The ter-

minations provide a low VSWR under maximum power condi-

tions. The resistor configurations are typically used in

“Wilkinson” type power divider networks, or to terminate 3 dB

stripline or microstrip hybrids.

* Low cost thick film models available on some sizes.Consult Factory for specifications.

PHYSICAL DIMENSIONS

TERMINATIONS (PPT) SERIES RESISTORS (PPR) SERIES FIGURES

FIG. 2PPT 515-20-3 — 20 WATTS

Flange Mounted

PPR 515-20-3 — 20 WATTS

Flange Mounted

FIG. 4PPT 515-30 — 30 WATTS

Flange Mounted

PPR 515-30 — 30 WATTS

Flange Mounted

FIG. 3PPT 515-30-4 — 30 WATTS

Flange Mounted

Offered as a

Termination Only!

.005 .001 [0.13 0.03]±±

TAB THICKNESS

.040 [1.02]

.560 [14.22]

.800 [20.32]

.108 [2.74]

.060 [1.52]

.150 [3.81] MAX

.150 [3.81] MIN

.400 [10.16]

.120 [3.05]

.115 [2.92]

.230 [5.84]

.130 [3.30]

THRU 2 PLS

PPT 800-40-3 — 40 WATTS

Flange Mounted

PPR 800-40-3 — 40 WATTS

Flange Mounted

PHYSICAL DIMENSIONS

.003 .001±

[0.08 0.03]±

.130 [3.30]

.062 [1.57]

.160 [4.06]

MAX

.250 [6.35]

.125 [3.18]

.060 [1.52] TYP

.095 [2.41]

.250 [6.35]

MIN

.515

[13.08]

.250 [6.35]

MIN

.116 [2.95]

.003 .001±

[0.08 0.03]±

.130 [3.30]

.062 [1.57]

.160 [4.06]

MAX

.250 [6.35]

.125 [3.18]

.060 [1.52] TYP

.095 [2.41]

.250 [6.35]

MIN

.515

(13.08)

.250 [6.35]

MIN

.116 [2.95]

.003 .001±

[0.08 0.03]±

.110 [2.79]

.062 [1.57]

.150 [3.81]

MAX

.250 [6.35]

.125 [3.18]

.060 [1.52] TYP

.095 [2.41]

.250 [6.35]

MIN

.515

[13.08]

.250 [6.35]

MIN

.116 [2.95]

SERIES PPR, PPT

RESISTORS & TERMINATIONS

KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]

FIG. 5

TERMINATIONS (PPT) SERIES RESISTORS (PPR) SERIES FIGURES

.003 .001 [0.08 0.03]±±

.062 [1.57]

.155 [3.94]

.160 [4.06] MAX

.187 [4.76]

.375 [9.52]

.120 [3.05]

.250 [6.35]

.560 [14.22]

.870 [22.10]

.125 [3.18] MIN

.108 [2.74]

.161 [4.09]

THRU 2 PLS

PHYSICAL DIMENSIONS

FIG. 7

FIG. 8

PPT 870-150-3 — 150 WATTS

Flange Mounted

PPR 870-150-3 — 150 WATTS

Flange Mounted

PPT 975-250-3 — 250 WATTS

Flange Mounted

PPR 975-250-3 — 250 WATTS

Flange Mounted

PPT 1250-400 — 400 WATTS

Flange Mounted

PPR 1250-400 — 400 WATTS

Flange Mounted

FIG. 9

.005 .001 [0.13 0.03]±±

TAB THICKNESS

.040 [1.02]

.560 [14.22]

.800 [20.32]

.108 [2.74]

.060 [1.52]

.150 [3.81] MAX

.150 [3.81] MIN

.400 [10.16]

.120 [3.05]

.115 [2.92]

.230 [5.84]

.130 [3.30]

THRU 2 PLS

FIG. 6

Offered as a

Termination Only!

PPT 800-100A — 100 WATTS

Flange Mounted

.200 [5.08] MAX

.375 [9.53]

.110 [2.79]

.300 [7.62]

.125 [3.18] MIN

.975 [24.77]

.375 [9.52]

.725 [18.41]

.120 [3.05]

.125 [3.17]

.171 [4.34]

.125 [3.17]

THRU 2 PLS

.188 [4.76]

.003 .001 [0.08 0.03]±±

.500

[12.7]

1.250[31.8]

.125

[3.18]

MIN.

500[12.7]

.250[6.4]

.875

[22.23]

.120[3.05]

TYP. .160[4.06]

DIA TYP.

.125[3.18]

.210[5.33]

MAX.

.171[4.34]

.003 .001±

[0.08 0.03]±

SERIES PPR, PPT

RESISTORS & TERMINATIONS

KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]

TERMINATIONS (PPT) SERIES RESISTORS (PPR) SERIES FIGURES

Flange Mounted Flange Mounted

.125 [3.18] MIN

.250 [6.35]

1.550 [39.37]

1.000 [25.40]

1.900 [48.26]

1.040

[26.42]

.175 [4.45]

.500 [12.70]

.270 [6.86]

.195 [4.95]

.125 [3.18]

.166 [4.22]

THRU 4 PLS

.005 .001 [0.13 0.03]±±

.250 [6.35]

MAX

PHYSICAL DIMENSIONS

SERIES PPR, PPT

RESISTORS & TERMINATIONS

KEY: Inches [Millimeters] .XX ±.03 .XXX ±.010 [.X ±0.8 .XX ±0.25]

300 Dino Drive, Ann Arbor, MI 48103

Tel: 888-244-6638 or 734-426-5553 •Fax: 734-426-5557

www.aeroflex.com/inmet •inmetsales@aeroflex.com

FIG. 10PPT 1900-800 — 650 WATTS PPR 1900-800 — 650 WATTS

TERMINATIONS (PPT) SERIES RESISTORS (PPR) SERIES FIGURES

When mounting High Power Flange Devices

in a circuit, there are several key issues that

should be taken into account.

Heat Sink Design

The heat sink the device is mounted to must

be designed to maintain the temperature

(design) while it is dissipating the power

(heat) given it by the device. (The derating

specifications are given in the applicable

data sheets.)

Flatness of mating surfaces

Flatness of the heat sink and of the mount-

ing area of the device (flange) should be

0.001” maximum. The idea is to have the

best possible contact between the heat sink

and the device.

Thermal Compound

To fill any microscopic voids or air gaps the

use of thermal compound is recommended

to a thickness of 0.002” maximum.

Stress Relief on Tab

Although it is not always possible in High

Frequency applications a small loop for

stress relief on the solder tab is recom-

mended. This reduces any mechanical

stress on the joints.

Mounting Application Notes

This application note covers the recom-

mended mounting techniques for the proper

conduction cooling and RF performance

of a surface mounted (flangeless) chip

attenuator, termination or resistor.

Initial Considerations

There are two primary considerations for

a surface mounted power device; Power

Dissipation and RF Performance. In order

to remove the dissipated power from this

type chip they must be provided with

adequate conductive cooling. This will

prevent excessive chip temperatures

leading to damage and early failure of the

device. RF performance is also dependent

on proper mounting. Since these devices

are being mounted to a circuit board,

inductance to ground is introduced by the

vias to the ground plane. To reduce this

effect and lower the thermal resistance

between the component and ground plane,

the following items are recommended:

1. Maximize the use of thermally conduc-

tive vias around and under the device.

2. Use of heavy copper cladding (2 oz.) on

the circuit board as a heat spreader.

Solders

Aeroflex / Inmet recommends the use of the

solders in the chart below when installing a

surface mount chip. Also listed are recom-

mended platings for the heatsink/baseplate

that a device might be mounted to instead

of a circuit board.

Mounting

The first step when mounting a chip device

to the circuit board is to determine the

proper size and location of the solder

pads. Aeroflex / Inmet recommends providing

pads that are 0.010” to 0.020” over the

device’s termination size and are centered

on the axis of the chip. This allows for self-

centering of the chip and a proper solder

fillet formation. Skewing and “tombstoning”

can occur if this is not followed. See Figure 2

Apply a small amount of thermal

compound to the mounting area of

the flange of the device. Spread it

completely on the flange using a razor

blade or other smooth tool. When seating

the device, align the tab/tabs over the

corresponding area on the circuit board.

Screw down the device using the recom-

mended torque for the appropriate screw

size in the table below. Aeroflex / Inmet

recommends the use of a lock washer

and a flat washer in the installation.

See Figure 1

Solder the tab/tabs using SN63 (179° C

eutectic) solder and a small amount of

RMA flux. After all the solder is complete

all of the flux must now be removed using

a cleaning agent.

TAB WITH STRESS RELIEF

THERMAL COMPOUND

DEVICE

HEATSINK

SUBSTRATE

Figure 1: High Power Flange Device Mounting

Thread Size Torque Setting

2-56 4 inch-pounds

4-40 6 inch pounds

6-32 8 inch pounds

8-32 12 inch pounds

10-32 18 inch pounds

Mounting of High Power Flange Devices Mounting of Chip Devices

Preparation

1. Before any solder attachment, parts and

circuit boards must be free of any oils

or dirt. Isopropyl alcohol can be used

for this task.

2. Apply a small amount of RMA flux (MIL-

F-14256) to the areas to be soldered.

3. SN63 solder is generally recommended

for use. This may be a preform, solder

paste or wire. If preforms are used,

select a size that is 0.005”to 0.010”

larger than the size of the pad.

4. When soldering is complete the circuit

board must be cleaned to remove any

flux residue. This can be done in an

ultrasonic cleaner or vapor degreaser.

Flux manufacturers have recommended

solvents or cleaning solutions for their

products.

Pretinning

Pretinning can be done with either a solder

pot or by depositing and reflowing solder

on the device. (Aeroflex-Inmet can supply

pretinned devices, SN63 or SN96).

Tabs

When attaching tabs to a device we

recommend using SN96 (221° C) to attach

the tab to the chip. Then, solder the tab to

the circuit board using SN63 (183 ° C).

Wire Bonding

Attach the device to the circuit board

using solder as described above. Clean

and remove any flux residues. Ultrasonically

bond wire or ribbon to gold termination

pads using a wedge or ball bonder.

NOTE: Gold plated chips are required

for this method.

Tuning

Maximum VSWR, as specified on the data

sheet, can be achieved without additional

tuning. Lower VSWR can be achieved

with stub or lumped element tuning.

However, this can result in a narrower

useable bandwidth.

TAB WITH STRESS RELIEF

DEVICE

PCB PADS

SURFACE MOUNT

OPENING IS

APPROXIMATELY

THE FILM AREA

OF THE CHIP

HEATSINK

SUBSTRATE

Figure 2: Proper Mounting Techniques

Solder Type Liquidous Temp. (degrees C.) Recommended Platings for Heatsink/Baseplates

SN63 183 eutectic Nickel, Silver

SN96 221 eutectic Nickel, Silver

80Au/20Sn 280 eutectic Gold over Nickel

300 Dino Drive, Ann Arbor, MI 48103

Tel: 888-244-6638 or 734-426-5553 •Fax: 734-426-5557

www.aeroflex.com/inmet •inmetsales@aeroflex.com

REV 5/11