Si4410DY
Si4410DY Rev. B
Si4410DY*
Single N-Channel Logic Level PowerTrench MOSFET
General Description
This N-Channel Logic Level MOSFET is produced using
Fairchild Semiconductor's advanced PowerTrench process
that has been especially tailored to minimize on-state
resistance and yet maintain superior switching
performance.
This device is well suited for low voltage and battery
powered applications where low in-line power loss and
fast switching are required.
Applications
Battery switch
Load switch
Motor controls
May 1999
Features
10 A, 30 V. RDS(ON) = 0.0135 Ω @ VGS = 10 V
RDS(ON) = 0.020 Ω @ VGS = 4.5 V
Low gate charge.
Fast switching speed.
High performance trench technology for extremely
low RDS(ON).
High power and current handling capability.
1999 Fairchild Semiconductor Corporation
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Notes:
1: RθJA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the
drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
Scale 1 : 1 on letter size paper
2: Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
a) 50° C/W when
mounted on a 1 in2
pad of 2 oz. copper.
b) 105° C/W when
mounted on a 0.04 in2
pad of 2 oz. copper.
c) 125° C/W on a minimum
mounting
pad.
SOIC(8ld s) Packaging
Configuration: Figure 1.0
Components Leader Tape
1680mm minimum or
210 empty poc kets
Tr ailer Tape
640mm min imum or
80 empty poc kets
SOIC(8ld s) Tape Leader and Trailer
Configuration: Figure 2.0
Cover Tape
Carrier Tape
Note/Comments
Packaging Option
SOIC (8lds) Packaging Information
Standard
(no flow code) L86Z F011
Packaging type
Reel Size
TNR
13" Dia
Rail/Tube
-
TNR
13" Dia
Qty per Reel/Tube/Ba g 2,500 95 4,000
Box Dimension (mm) 355x333x40 530x130x83 355x333x40
Max qty per Box 5,000 30,000 8,000
D84Z
TNR
7" Dia
500
193x183x80
2,000
Weig ht pe r un it (gm) 0.0774 0.0774 0.0774 0.0774
Weig ht pe r Reel (kg) 0.6060 -0.9696 0.1182
F63TNR Label sample
LOT: CBVK741B019
FSID: FDS9953A
D/C1: Z9842AB Q TY1: SPEC REV:
SPEC:
QTY: 2500
D/C2: Q TY2: CPN: N/F: F (F63TNR)3
F
852
NDS
9959
SOIC-8 Unit Orientation
F
852
NDS
9959
Pi n 1
Static Dissipative
Embossed Carrier Tape
F63TNR
Label
Antistatic Cover Tape
Customized
Label
Packaging Description:
SOIC-8 parts are shipped in tape. The carrier tape is
made from a dissipative (carbon filled) polycarbonate
resin. The cover tape is a multilayer film (H eat Activated
Adhesive in nature) primarily composed of polyester film,
adhesive layer, sealant, and anti-static sprayed agent.
These reeled parts in standard option are shipped with
2,5 00 uni t s pe r 13" o r 33 0c m d ia met er re el . Th e re el s are
dark blue in color and is made of polystyrene plastic (anti-
static coated). Other option comes in 500 units per 7" or
177cm diameter reel. This and some other options are
further described in the Packaging Information table.
These full reels are individually barcode labeled and
placed inside a standard intermediate box (illustrated in
figure 1.0) made of recyclable corrugated brown paper.
One box contains two reels maximum. And these boxes
are placed inside a barcode labeled shipping box which
com e s in di ffe re nt s iz es depe ndin g on th e nu mbe r of part s
shipped.
F
852
NDS
9959
F
852
NDS
9959
F
852
NDS
9959
Embossed ESD Marking
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
SENSITIVE
DEVICES
Embossed ESD Marking
ATTENTION
OBSERVE
FOR HANDLING
ELECTROSTATIC
SENSITIVE
DEVICES
ATTENTION
OBSERVE
FOR HANDLING
ELECTROSTATIC
SENSITIVE
DEVICES
ATTENTION
OBSERVE
FOR HANDLING
ATTENTION
OBSERVE
FOR HANDLING
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
SENSITIVE
DEVICES
193mm x 183mm x 80mm
Pizza Box for Standard Option
Barcode
Label
Barcode
Label
Barcode Label
355mm x 333mm x 40mm
Intermediate container for 13” reel option
SOIC-8 Tape and Reel Data
January 2001, Rev. C
©2001 Fairchild Semiconductor Corporation
1998 Fairchild Semiconductor Corporation
Dimensions are in millimeter
Pkg type
A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc
SOIC(8lds)
(12mm)
5.30
+/-0.10 6.50
+/-0.10 12.0
+/-0.3 1.55
+/-0.05 1.60
+/-0.10 1.75
+/-0.10 10.25
min 5.50
+/-0.05 8.0
+/-0.1 4.0
+/-0.1 2.1
+/-0.10
0.450
+/-
0.150
9.2
+/-0.3 0.06
+/-0.02
P1
A0 D1
P0
F
W
E1
D0
E2
B0
Tc
Wc
K0
T
Dimensions are in inches and millimeters
Tape Siz e Reel
Option Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL)
12m m 7" Dia 7.00
177.8 0.059
1.5 512 +0.020/-0. 008
13 +0.5/-0.2 0.795
20.2 2.165
55 0.488 +0.078/-0.000
12.4 +2/0 0.724
18.4 0.469 – 0.606
11.9 – 15.4
12m m 13" Dia 13.00
330 0.059
1.5 512 +0.020/-0. 008
13 +0.5/-0.2 0.795
20.2 7.00
178 0.488 +0.078/-0.000
12.4 +2/0 0.724
18.4 0.469 – 0.606
11.9 – 15.4
See detail AA
Dim A
max
13" Diameter Option
7" Diameter Option
Dim A
Max
See detail AA
W3
W2 max Measured at Hub
W1 Measured at Hub
Dim N
Dim D
min
Dim C
B Min
DETAIL AA
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum component rotation
0.5mm
maximum
0.5mm
maximum
Sketch C (Top View)
Component lateral movement
Typical
component
cavity
center line
20 deg maxi mum
Typical
component
center line
B0
A0
Sketch B (Top View)
Component Rotation
Sketch A (Side or Front Sectional View)
Component Rotation
User Direction of Feed
SOIC(8ld s) Embossed Carrier Tape
Configuration: Figure 3.0
SOIC(8ld s) Reel Confi gu rat ion: Figure 4.0
SOIC-8 Tape and Reel Data, continued
January 2001, Rev. C
SOIC-8 (FS PKG Code S1)
1 : 1
Scale 1: 1 on letter size paper
D i m ens i ons shown belo w ar e i n:
inches [millimeters ]
Part Weight per unit (gram): 0.0774
SOIC-8 Package Dimensions
September 1998, Rev. A
9
©2000 Fairchild Semiconductor International
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The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF FAIRCHILD SEMICONDUCTOR CORPORA TION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT ST A TUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
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DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
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