1
Motorola Small–Signal Transistors, FETs and Diodes Device Data
Designed primarily for UHF mixer applications but suitable also for use in detector
and ultra–fast switching circuits. Supplied in an inexpensive plastic package for
low–cost, high–volume consumer requirements. Also available in Surface Mount
package.
•Low Noise Figure — 6.0 dB Typ @ 1.0 GHz
•Very Low Capacitance — Less Than 1.0 pF @ Zero Volts
•High Forward Conductance — 0.5 Volts (Typ) @ IF = 10 mA
MAXIMUM RATINGS
MBD101 MMBD101LT1
Rating Symbol Value Unit
Reverse Voltage VR7.0 Volts
Forward Power Dissipation
@ TA = 25°C
Derate above 25°C
PF280
2.2 225
1.8 mW
mW/°C
Junction Temperature TJ+150 °C
Storage Temperature Range Tstg –55 to +150 °C
DEVICE MARKING
MMBD101LT1 = 4M
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Reverse Breakdown Voltage
(IR = 10 µAdc) V(BR)R 7.0 10 — Volts
Diode Capacitance
(VR = 0, f = 1.0 MHz, Note 1) CT— 0.88 1.0 pF
Forward Voltage(1)
(IF = 10 mAdc) VF— 0.5 0.6 Volts
Reverse Leakage
(VR = 3.0 Vdc) IR— 0.02 0.25 µAdc
NOTE: MMBD101LT1 is also available in bulk packaging. Use MMBD101L as the device title to order this device in bulk.
Preferred devices are Motorola recommended choices for future use and best overall value.
Thermal Clad is a registered trademark of the Berquist Company.
Order this document
by MBD101/D
SEMICONDUCTOR TECHNICAL DATA
Motorola Preferred Devices
CASE 182–02, STYLE 1
(TO–226AC)
CASE 318–08, STYLE 8
SOT–23 (TO–236AB)
12
3
12
SILICON SCHOTTKY
BARRIER DIODES
Motorola, Inc. 1997
3
CATHODE 1
ANODE
2
CATHODE 1
ANODE
2 Motorola Small–Signal Transistors, FETs and Diodes Device Data
TYPICAL CHARACTERISTICS
(TA = 25°C unless noted)
Figure 1. Reverse Leakage
TA, AMBIENT TEMPERATURE (
°
C)
Figure 2. Forward Voltage
VF, FORWARD VOLTAGE (VOLTS)
Figure 3. Capacitance
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Noise Figure
PLO, LOCAL OSCILLATOR POWER (mW)
, FORWARD CURRENT (mA)IF
, REVERSE LEAKAGE ( A)IR
m
0.1 0.2 0.5 2.01.0 10
11
3.0
0 1.0 2.0 3.0 4.0
1.0
0.9
0.8
0.7
0.6
0.3 0.4
100
0.1
30 40 50 60 70 80 100
0.1
130110 12090
0.07
0.05
0.02
1.0
2.0
0.5 0.6 0.7
0.01
1.0
0.7
0.5
10
1.0
Figure 5. Noise Figure Test Circuit
UHF
NOISE SOURCE
H.P. 349A
DIODE IN
TUNED
MOUNT
LOCAL
OSCILLATOR
IF AMPLIFIER
NF = 1.5 dB
f = 30 MHz
NOISE
FIGURE METER
H.P. 342A
NOTES ON TESTING AND SPECIFICATIONS
Note 1 — CC and CT are measured using a capacitance bridge
(Boonton Electronics Model 75A or equivalent).
Note 2 — Noise figure measured with diode under test in tuned
diode mount using UHF noise source and local
oscillator (LO) frequency of 1.0 GHz. The LO power
is adjusted for 1.0 mW . IF amplifier NF = 1.5 dB, f =
30 MHz, see Figure 5.
Note 3 — LS is measured on a package having a short instead
of a die, using an impedance bridge (Boonton Radio
Model 250A RX Meter).
0.2
VR = 3.0 Vdc
C, CAPACITANCE (pF)
5.0
4.0
7.0
6.0
9.0
8.0
10 LOCAL OSCILLAT OR FREQUENCY = 1.0 GHz
(TEST CIRCUIT IN FIGURE 5)
5.0
TA = 25
°
C
TA = –40
°
C
TA = 85
°
C
NF, NOISE FIGURE (dB)
3
Motorola Small–Signal Transistors, FETs and Diodes Device Data
INFORMATION FOR USING THE SOT–23 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
SOT–23
mm
inches
0.037
0.95
0.037
0.95
0.079
2.0
0.035
0.9
0.031
0.8
SOT–23 POWER DISSIPATION
The power dissipation of the SOT–23 is a function of the
drain pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined
by TJ(max), the maximum rated junction temperature of the
die, RθJA, the thermal resistance from the device junction to
ambient, and the operating temperature, TA. Using the
values provided on the data sheet for the SOT–23 package,
PD can be calculated as follows:
PD = TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature T A of 25°C, one can
calculate the power dissipation of the device which in this
case is 225 milliwatts.
PD = 150°C – 25°C
556°C/W = 225 milliwatts
The 556°C/W for the SOT–23 package assumes the use
of the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 225 milliwatts. There
are other alternatives to achieving higher power dissipation
from the SOT–23 package. Another alternative would be to
use a ceramic substrate or an aluminum core board such as
Thermal Clad. Using a board material such as Thermal
Clad, an aluminum core board, the power dissipation can be
doubled using the same footprint.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
•Always preheat the device.
•The delta temperature between the preheat and
soldering should be 100°C or less.*
•When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10°C.
•The soldering temperature and time shall not exceed
260°C for more than 10 seconds.
•When shifting from preheating to soldering, the
maximum temperature gradient shall be 5°C or less.
•After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
•Mechanical stress or shock should not be applied during
cooling.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
4 Motorola Small–Signal Transistors, FETs and Diodes Device Data
PACKAGE DIMENSIONS
ÉÉ
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND ZONE R IS
UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSIONS D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIM K MINIMUM.
STYLE 1:
PIN 1. ANODE
2. CATHODE
CASE 182–02
ISSUE H
(TO–226AC)
A
L
K
B
R
F
P
D
HG
XX
SEATING
PLANE
12
V
N
C
N
SECTION X–X
D
J
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.175 0.205 4.45 5.21
B0.170 0.210 4.32 5.33
C0.125 0.165 3.18 4.49
D0.016 0.022 0.41 0.56
F0.016 0.019 0.407 0.482
G0.050 BSC 1.27 BSC
H0.100 BSC 3.54 BSC
J0.014 0.016 0.36 0.41
K0.500 ––– 12.70 –––
L0.250 ––– 6.35 –––
N0.080 0.105 2.03 2.66
P––– 0.050 ––– 1.27
R0.115 ––– 2.93 –––
V0.135 ––– 3.43 –––
CASE 318–08
ISSUE AF
SOT–23 (TO–236AB)
STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
DJ
K
L
A
C
BS
H
GV
3
12DIM
AMIN MAX MIN MAX
MILLIMETERS
0.1102 0.1197 2.80 3.04
INCHES
B0.0472 0.0551 1.20 1.40
C0.0350 0.0440 0.89 1.11
D0.0150 0.0200 0.37 0.50
G0.0701 0.0807 1.78 2.04
H0.0005 0.0040 0.013 0.100
J0.0034 0.0070 0.085 0.177
K0.0140 0.0285 0.35 0.69
L0.0350 0.0401 0.89 1.02
S0.0830 0.1039 2.10 2.64
V0.0177 0.0236 0.45 0.60
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Af firmative Action Employer .
Mfax is a trademark of Motorola, Inc.
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MBD101/D
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