2 Maxim Integrated
Dual Automotive, Audio Line Drivers
with I2C Control and Diagnostic
MAX13325/MAX13326
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
VDD to PGND ........................................................-0.3V to +28V
CHOLD ................................................................. -0.3V to +28V
VL to GND ...............................................................-0.3V to +6V
GND, PGND ........................................................-0.3V to +0.3V
OUT_ to PGND ........................................................ -0.3V to 28V
IN_, BIAS to AGND ..................................-0.3V to (VDD + 0.3V)
SCL, SDA, ADD0, ADD1, MUTE, SHDN,
FLAG to GND ..........................................................-0.3V to +6V
OUT_ Short Circuit to PGND or VDD ......................... Continuous
Short Circuits Between Any OUT_ ............................Continuous
Continuous Power Dissipation (TA = +70NC) (multilayer board)
28-Pin TSSOP (derate 27mW/NC above +70NC) ..... 2162.2mW
Operating Temperature Range ........................ -40NC to +105NC
Storage Temperature Range ............................ -65NC to +150NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VDD = 14.4V, VL = 5V, RL = J, load impedance from OUT_+ to OUT_-, TA = TJ = -40NC to +105NC, typical values are TA = +25NC,
unless otherwise noted.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Junction-to-Ambient Thermal Resistance (qJA) ..........37°C/W
Junction-to-Case Thermal Resistance (qJC) .................2°C/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
AMPLIFIER DC CHARACTERISTICS
Transient Supply Voltage
(Load Dump) VDDMAX Using external nMOS-RTR020N05, 300ms
duration 50 V
Operating Supply Voltage Range VDD 4.5 18 V
VL2.7 5.5
VDD OVLO Threshold VDDOV Rising edge 18.5 19.2 V
VDD UVLO Threshold VDDUV Falling edge 3.3 3.5 V
VL UVLO Threshold VLUV Falling edge 2.2 2.4 V
Supply Current IDD TA = +25NC, no load 39 mA
TA = -40NC to +105NC, no load 50 mA
Logic Supply Current ILVL = 5V 1.7 mA
Shutdown Supply Current ISHDN IDD TA = +25NC 0.5 10 FA
TA = -40NC to +105NC 0.5
IL< 0.1 2 FA
Turn-On Time (from Shutdown) MUTE = VL 220 ms
Turn-On Time (from Mute) SHDN = VL, CCSS = 220nF 6 ms
Differential Input Resistance RINDIF Measure across input 18 24 30 kI
Single-Ended Input Impedance RIN
Each input to ground (MAX13325) 15 20 25 kI
Each input to ground (MAX13326) 12 16 20
Signal-Path Gain (Note 3) AVMAX13325 11.8 12 12.2 dB
MAX13326 -0.2 0 +0.2